Search results for "packages"

Hits ?▲	Authors	Title	Venue	Year	Link	Author keywords
14	Jianzheng Hu, Lianqiao Yang, Moo Whan Shin	Mechanism and thermal effect of delamination in light-emitting diode packages.	Microelectron. J.	2007	DBLP DOI BibTeX RDF
14	S. Manjit Sidhu	Design approaches and comparison of TAPS packages for engineering.	Interact. Technol. Smart Educ.	2007	DBLP DOI BibTeX RDF
14	Chang-Lin Yeh, Tsung-Yueh Tsai, Yi-Shao Lai	Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition.	Microelectron. Reliab.	2007	DBLP DOI BibTeX RDF
14	Andy Perkins, Suresh K. Sitaraman	Universal fatigue life prediction equation for ceramic ball grid array (CBGA) packages.	Microelectron. Reliab.	2007	DBLP DOI BibTeX RDF
14	Shiang-Yu Teng, Sheng-Jye Hwang	Predicting the process induced warpage of electronic packages using the P-V-T-C equation and the Taguchi method.	Microelectron. Reliab.	2007	DBLP DOI BibTeX RDF
14	Yoshikuni Nakadaira, Seyoung Jeong, Jongbo Shim, Jaiseok Seo, Sunhee Min, Taeje Cho, Sayoon Kang, Seyong Oh	Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling.	Microelectron. Reliab.	2007	DBLP DOI BibTeX RDF
14	Yi-Shao Lai, Tong Hong Wang, Han-Hui Tsai, Ming-Hwa R. Jen	Cyclic bending reliability of wafer-level chip-scale packages.	Microelectron. Reliab.	2007	DBLP DOI BibTeX RDF
14	Jinlin Wang	The effects of rheological and wetting properties on underfill filler settling and flow voids in flip chip packages.	Microelectron. Reliab.	2007	DBLP DOI BibTeX RDF
14	Willem D. van Driel, Dao-Guo Yang, Cadmus A. Yuan, M. van Kleef, G. Q. (Kouchi) Zhang	Mechanical reliability challenges for MEMS packages: Capping.	Microelectron. Reliab.	2007	DBLP DOI BibTeX RDF
14	Bart Vandevelde, Mario Gonzalez, Paresh Limaye, Petar Ratchev, Eric Beyne	Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages.	Microelectron. Reliab.	2007	DBLP DOI BibTeX RDF
14	Marcel A. J. van Gils, W. D. van Driel, G. Q. Zhang, H. J. L. Bressers, Richard B. R. van Silfhout, X. J. Fan, J. H. J. Janssen	Virtual qualification of moisture induced failures of advanced packages.	Microelectron. Reliab.	2007	DBLP DOI BibTeX RDF
14	Yi-Shao Lai, Tong Hong Wang	Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages.	Microelectron. Reliab.	2007	DBLP DOI BibTeX RDF
14	Georgiana Macariu, Marc Frîncu, Alexandru Cârstea, Dana Petcu, Andrei Eckstein	Redesigning Parallel Symbolic Computations Packages.	PACT	2007	DBLP DOI BibTeX RDF
14	David Crombie, George T. Ioannidis, Neil McKenzie	Multimedia Modular Training Packages by EUAIN.	ELPUB	2007	DBLP BibTeX RDF
14	James J. Nutaro, Phani Teja Kuruganti, Mallikarjun Shankar	Seamless Simulation of Hybrid Systems with Discrete Event Software Packages.	Annual Simulation Symposium	2007	DBLP DOI BibTeX RDF
14	Kwang Moon Cho	Management of Access Control for Content Packages by Using XML Subject-Based Encryption.	FGCN (2)	2007	DBLP DOI BibTeX RDF
14	Fabiana Lorenzi, Ana L. C. Bazzan, Mara Abel	Recommending Travel Packages Upon Distributed Knowledge.	AAAI	2007	DBLP BibTeX RDF
14	Pasquale Ardimento, Maria Teresa Baldassarre, Marta Cimitile, Giuseppe Visaggio	Empirical Experimentation for Validating the Usability of Knowledge Packages in Transferring Innovations.	ICSOFT/ENASE (Selected Papers)	2007	DBLP DOI BibTeX RDF
14	Tay Jin Chua, Tian Xiang Cai, Xiao-Feng Yin	A heuristic approach for scheduling multi-chip packages for semiconductor backend assembly.	ETFA	2007	DBLP DOI BibTeX RDF
14	Prateeti Mohapatra, Howard Michel	A Discrete-Event Simulation Model for Dynamic Function Personalization in Generalized Software Packages.	IC-AI	2007	DBLP BibTeX RDF
14	R. M. C. B. Ratnayake, Craig Hicks, M. A. Akbari	A SVM Based Method to Detect Color Shift Defects in IC Packages.	MVA	2007	DBLP BibTeX RDF
14	Navonil Mustafee	A grid computing framework for commercial simulation packages.		2007	RDF
14	Elodie Martin	Analyse de signaux ultrasonores, Formation d'Images de Cohérence - Application à la Microscopie Acoustique de circuits électroniques. (Ultrasonic Signals Processing, Coherent Imaging - Application to the Scanning Acoustic Microscopy of Microelectronic packages).		2007	RDF
14	Piotr Golonka, Borut Paul Kersevan, T. Pierzchala, Elzbieta Richter-Was, Zbigniew Was, Malgorzata Worek	The tauola-photos-F environment for the TAUOLA and PHOTOS packages, release II.	Comput. Phys. Commun.	2006	DBLP DOI BibTeX RDF
14	Fanis G. Kalatzis, Dimitris G. Papageorgiou, Ioannis N. Demetropoulos	A programmable optimization environment using the GAMESS-US and MERLIN/MCL packages. Applications on intermolecular interaction energies.	Comput. Phys. Commun.	2006	DBLP DOI BibTeX RDF
14	Ibrahim Baz, Abdurrahman Geymen	Automatic document preparation by interacting GIS software packages using office programs.	Adv. Eng. Softw.	2006	DBLP DOI BibTeX RDF
14	Jane Hunter 0001	Scientific Publication Packages - A Selective Approach to the Communication and Archival of Scientific Output.	Int. J. Digit. Curation	2006	DBLP DOI BibTeX RDF
14	E. J. Comeaux, Bhaba R. Sarker	Optimal inventory policy for specialty chemical products in multiple packages.	J. Oper. Res. Soc.	2006	DBLP DOI BibTeX RDF
14	Yoichi Tomioka, Atsushi Takahashi 0001	Routing of Monotonic Parallel and Orthogonal Netlists for Single-Layer Ball Grid Array Packages.	IEICE Trans. Fundam. Electron. Commun. Comput. Sci.	2006	DBLP DOI BibTeX RDF
14	Robert Elsässer, Burkhard Monien, Stefan Schamberger	Distributing Unit Size Workload Packages in Heterogeneous Networks.	J. Graph Algorithms Appl.	2006	DBLP DOI BibTeX RDF
14	Rainer Brüggemann, Guillermo Restrepo, Kristina Voigt	Structure-Fate Relationships of Organic Chemicals Derived from the Software Packages E4CHEM and WHASSE.	J. Chem. Inf. Model.	2006	DBLP DOI BibTeX RDF
14	Oriol Falivene, Pau Arbués, J. Howell, Oscar Fernández, Patricia Cabello, Josep Anton Muñoz, Lluís Cabrera	A FORTRAN program to introduce field-measured sedimentary logs into reservoir modelling packages.	Comput. Geosci.	2006	DBLP DOI BibTeX RDF
14	Jean-Guillaume Dumas, Thierry Gautier, Pascal Giorgi, Clément Pernet	Dense Linear Algebra over Finite Fields: the FFLAS and FFPACK packages	CoRR	2006	DBLP BibTeX RDF
14	Aleksandra Tesanovic, Mehdi Amirijoo, Jörgen Hansson	Providing Configurable QoS Management in Real-Time Systems with QoS Aspect Packages.	T. Aspect-Oriented Software Development	2006	DBLP DOI BibTeX RDF
14	Xia Liu, Valmiki K. Sooklal, Melody A. Verges, Michael C. Larson	Experimental study and life prediction on high cycle vibration fatigue in BGA packages.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
14	Amy S. Fleischer, Li-Hsin Chang, Barry C. Johnson	The effect of die attach voiding on the thermal resistance of chip level packages.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
14	Yi-Shao Lai, Chin-Li Kao	Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
14	Ming-Yi Tsai, W. C. Chiang, T. M. Liu, G. H. Hsu	Thermal deformation measurements and predictions of MAP-BGA electronic packages.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
14	Se Young Yang, Young-Doo Jeon, Soon-Bok Lee, Kyung-Wook Paik	Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
14	Fei Su, Kerm Sin Chian, Sung Yi	An optical characterization technique for hygroscopic expansion of polymers and plastic packages.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
14	Changsoo Jang, Seongyoung Han, Hangyu Kim, Sayoon Kang	A numerical failure analysis on lead breakage issues of ultra fine pitch flip chip-on-flex and tape carrier packages during chip/film assembly process.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
14	Yi-Ming Jen, Ying-Lung Wu, Chih-Kai Fang	Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
14	Reza Ghaffarian	CCGA packages for space applications.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
14	Michael C. Larson, Melody A. Verges, Xia Liu	Residual compression in area array packages induced by underfill shrinkage.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
14	Desmond Y. R. Chong, F. X. Che, John H. L. Pang, Kellin Ng, Jane Y. N. Tan, Patrick T. H. Low	Drop impact reliability testing for lead-free and lead-based soldered IC packages.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
14	Kuo-Ming Chen, Kuo-Hsiung Houng, Kuo-Ning Chiang	Thermal resistance analysis and validation of flip chip PBGA packages.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
14	Yi-Shao Lai, Ping-Feng Yang, Chang-Lin Yeh	Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
14	W. D. van Driel, Olaf van der Sluis, Dao-Guo Yang, R. L. J. M. Ubachs, C. Zenz, G. Aflenzer, G. Q. Zhang	Reliability modelling for packages in flexible end-products.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
14	Jamil A. Wakil	Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
14	Chang-Lin Yeh, Yi-Shao Lai, Chin-Li Kao	Evaluation of board-level reliability of electronic packages under consecutive drops.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
14	Hua Lu 0006, Helen Shi, Ming Zhou	Thermally induced deformation of solder joints in real packages: Measurement and analysis.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
14	Bruno Foucher, J. Tomas, F. Mounsi, M. Jeremias	Life margin assessment with Physics of Failure Tools application to BGA packages.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
14	Donna M. Rizzo, Paula J. Mouser, David H. Whitney, Charles D. Mark, Roger D. Magarey, Alexey A. Voinov	The comparison of four dynamic systems-based software packages: Translation and sensitivity analysis.	Environ. Model. Softw.	2006	DBLP DOI BibTeX RDF
14	Yoichi Tomioka, Atsushi Takahashi 0001	Monotonic parallel and orthogonal routing for single-layer ball grid array packages.	ASP-DAC	2006	DBLP DOI BibTeX RDF
14	Lahcen Oubahssi, Monique Grandbastien	From Learner Information Packages to Student Models: Which Continuum?.	Intelligent Tutoring Systems	2006	DBLP DOI BibTeX RDF
14	Navonil Mustafee, Simon J. E. Taylor, Korina Katsaliaki, Sally C. Brailsford	Distributed simulation with COTS simulation packages: a case study in health care supply chain simulation.	WSC	2006	DBLP DOI BibTeX RDF
14	Oliver Skroch	Integration assessment of an individually developed application vs. software packages from the market - an experience report.	Data Warehousing	2006	DBLP BibTeX RDF
14	Manoel G. Mendonça, Daniela S. Cruzes, Josemeire Dias, Maria Cristina Ferreira de Oliveira	Using observational pilot studies to test and improve lab packages.	ISESE	2006	DBLP DOI BibTeX RDF	inspection techniques, lab package, empirical studies, mining, visual data
14	Krishna Srinivasan, P. Muthana, Rohan Mandrekar, Ege Engin, Jinwoo Choi, Madhavan Swaminathan	Enhancement of Signal Integrity and Power Integrity with Embedded Capacitors in High-Speed Packages.	ISQED	2006	DBLP DOI BibTeX RDF
14	Tae-Hyoung Kim, Chi-Hwa Song, Won Don Lee, Jae-Cheol Ryou 0001	Building a Packages Delivery Schedule Using Extended Simulated Annealing.	IJCNN	2006	DBLP DOI BibTeX RDF
14	Yuxin Wang, Martin Margala	New Embedded Core Testing for System-on-Chips and System-in-Packages.	CCECE	2006	DBLP DOI BibTeX RDF
14	Idoia Murua, Esteve Lladó, Bel Llodrà	The Semantic Web for Improving Dynamic Tourist Packages Commercialisation.	CE	2006	DBLP BibTeX RDF
14	Djamel Mostefa, Marie-Neige Garcia, Khalid Choukri	Evaluation of multimodal components within CHIL: The evaluation packages and results.	LREC	2006	DBLP BibTeX RDF
14	Ammar Alkassar, Elena Andreeva 0001, Helger Lipmaa	SLC: Efficient Authenticated Encryption for Short Packages.	Sicherheit	2006	DBLP BibTeX RDF
14	Xiaoguang Wang 0002	Synchronization issues in distributed simulation using Commercial Off-The-Shelf (COTS) simulation packages		2006	DOI RDF
14	Rolf Drechsler, Dragan Jankovic, Radomir S. Stankovic	Generic Implementation of Multi-Valued Logic Decision Diagram Packages.	J. Multiple Valued Log. Soft Comput.	2005	DBLP BibTeX RDF
14	Yukiko Kubo, Atsushi Takahashi 0001	A Via Assignment and Global Routing Method for 2-Layer Ball Grid Array Packages.	IEICE Trans. Fundam. Electron. Commun. Comput. Sci.	2005	DBLP DOI BibTeX RDF
14	Takeshi Yuasa, Tamotsu Nishino, Hideyuki Oh-Hashi	Simple Design Formula for Parallel Plate Mode Suppression by Ground Via-Holes in Multi-Layered Packages.	IEICE Trans. Electron.	2005	DBLP DOI BibTeX RDF
14	Marlei Pozzebon, Alain Pinsonneault	Global-local negotiations for implementing configurable packages: The power of initial organizational decisions.	J. Strateg. Inf. Syst.	2005	DBLP DOI BibTeX RDF
14	K. W. Tong, C. K. Kwong 0001, Ching-Yuen Chan	Process design for transfer moulding of electronic packages using a case-based reasoning approach with fuzzy regression adaptation.	Int. J. Comput. Integr. Manuf.	2005	DBLP DOI BibTeX RDF
14	D. Charif, Jean Thioulouse, J. R. Lobry, Guy Perrière	Online synonymous codon usage analyses with the ade4 and seqinR packages.	Bioinform.	2005	DBLP DOI BibTeX RDF
14	Dante Del Corso, Emanuela Ovcin, Gaetano Morrone	A teacher friendly environment to foster learner-centered customization in the development of interactive educational packages.	IEEE Trans. Educ.	2005	DBLP DOI BibTeX RDF
14	Russell Housley	Using Cryptographic Message Syntax (CMS) to Protect Firmware Packages.	RFC	2005	DBLP DOI BibTeX RDF
14	Masayuki Kitajima, Tadaaki Shono	Reliability study of new SnZnAl lead-free solders used in CSP packages.	Microelectron. Reliab.	2005	DBLP DOI BibTeX RDF
14	L. Zhang, G. Subbarayan, B. C. Hunter, D. Rose	Response surface models for efficient, modular estimation of solder joint reliability in area array packages.	Microelectron. Reliab.	2005	DBLP DOI BibTeX RDF
14	Kheng Chooi Lee, A. Vythilingam, Peter Alpern	A simple moisture diffusion model for the prediction of optimal baking schedules for plastic SMD packages.	Microelectron. Reliab.	2005	DBLP DOI BibTeX RDF
14	Dolphin Abessolo-Bidzo, Patrick Poirier, Philippe Descamps, Bernadette Domengès	Isolating failing sites in IC packages using time domain reflectometry: Case studies.	Microelectron. Reliab.	2005	DBLP DOI BibTeX RDF
14	Yi Tao 0003, Ajay P. Malshe	Theoretical investigation on hermeticity testing of MEMS packages based on MIL-STD-883E.	Microelectron. Reliab.	2005	DBLP DOI BibTeX RDF
14	Kevin B. Wright	Researching Internet-Based Populations: Advantages and Disadvantages of Online Survey Research, Online Questionnaire Authoring Software Packages, and Web Survey Services.	J. Comput. Mediat. Commun.	2005	DBLP DOI BibTeX RDF
14	Asher Brenner, Mordechai Shacham, Michael B. Cutlip	Applications of mathematical software packages for modelling and simulations in environmental engineering education.	Environ. Model. Softw.	2005	DBLP DOI BibTeX RDF
14	Julius Zilinskas	Comparison of Packages for Interval Arithmetic.	Informatica	2005	DBLP BibTeX RDF
14	Paul Y. Oh, Darius Burschka	From the guest editors - Software packages for vision-based motion control.	IEEE Robotics Autom. Mag.	2005	DBLP DOI BibTeX RDF
14	Esteve Lladó, Idoia Murua, Bel Llodrà	Metadata for improving dynamic tourist packages.	Dublin Core Conference	2005	DBLP BibTeX RDF
14	Brock J. LaMeres, Sunil P. Khatri	Broadband Impedance Matching for Inductive Interconnect in VLSI Packages.	ICCD	2005	DBLP DOI BibTeX RDF
14	Michael Daniel Ryde	A high usability transparency framework for model interoperability using COTS simulation packages.		2005	RDF
14	Nicholas I. M. Gould, Jennifer A. Scott	A numerical evaluation of HSL packages for the direct solution of large sparse, symmetric linear systems of equations.	ACM Trans. Math. Softw.	2004	DBLP DOI BibTeX RDF	symmetric linear systems, software, sparse matrices, Gaussian elimination, Direct solvers
14	Erica L. Wagner, Sue Newell	'Best' for whom?: the tension between 'best practice' ERP packages and diverse epistemic cultures in a university context.	J. Strateg. Inf. Syst.	2004	DBLP DOI BibTeX RDF
14	Jannis Kallinikos	Deconstructing information packages: Organizational and behavioural implications of ERP systems.	Inf. Technol. People	2004	DBLP DOI BibTeX RDF
14	Paul S. Ho, Guotao Wang, Min Ding 0003, Jie-Hua Zhao, Xiang Dai	Reliability issues for flip-chip packages.	Microelectron. Reliab.	2004	DBLP DOI BibTeX RDF
14	Ashish Batra, Pradeep Ramachandran, Poornima Sathyanarayanan, Susan Lu, Hari Srihari	Reliability enhancement of electronic packages by design of optimal parameters.	Microelectron. Reliab.	2004	DBLP DOI BibTeX RDF
14	T. Y. Lin, B. Njoman, D. Crouthamel, K. H. Chua, S. Y. Teo, Y. Y. Ma	The impact of moisture in mold compound preforms on the warpage of PBGA packages.	Microelectron. Reliab.	2004	DBLP DOI BibTeX RDF
14	Li Zhang, Vivek Arora, Luu Nguyen, Nikhil Kelkar	Numerical and experimental analysis of large passivation opening for solder joint reliability improvement of micro SMD packages.	Microelectron. Reliab.	2004	DBLP DOI BibTeX RDF
14	Peter Alpern, Kheng Chooi Lee, Rainer Tilgner	Effect of long and short Pb-free soldering profiles of IPC/JEDEC J-STD-020 on plastic SMD packages.	Microelectron. Reliab.	2004	DBLP DOI BibTeX RDF
14	Tong Yan Tee, Zhaowei Zhong	Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages.	Microelectron. Reliab.	2004	DBLP DOI BibTeX RDF
14	Xuejun Fan, Jiang Zhou, G. Q. Zhang	Multi-physics modeling in virtual prototyping of electronic packages--combined thermal, thermo-mechanical and vapor pressure modeling.	Microelectron. Reliab.	2004	DBLP DOI BibTeX RDF
14	Y. P. Wu, M. O. Alam, Yan Cheong Chan, B. Y. Wu	Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages.	Microelectron. Reliab.	2004	DBLP DOI BibTeX RDF
14	Jason Y. L. Goh, Mark C. Pitter, Chung W. See, Michael G. Somekh, Daniel Vanderstraeten	Sub-pixel image correlation: an alternative to SAM and dye penetrant for crack detection and mechanical stress localisation in semiconductor packages.	Microelectron. Reliab.	2004	DBLP DOI BibTeX RDF
14	Mathieu Paillard, C. Schaffauser, Claude Drevon, Jean Louis Cazaux, Hans Reinhard Schubach, F. Frese	Non destructive control of flip chip packages for space applications.	Microelectron. Reliab.	2004	DBLP DOI BibTeX RDF
14	Jinlin Wang, H. K. Lim, H. S. Lew, Woon Theng Saw, Chew Hong Tan	A testing method for assessing solder joint reliability of FCBGA packages.	Microelectron. Reliab.	2004	DBLP DOI BibTeX RDF
14	Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim, Eric Pek, Zhaowei Zhong	Impact life prediction modeling of TFBGA packages under board level drop test.	Microelectron. Reliab.	2004	DBLP DOI BibTeX RDF