Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
14 | Jianzheng Hu, Lianqiao Yang, Moo Whan Shin |
Mechanism and thermal effect of delamination in light-emitting diode packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. J. ![In: Microelectron. J. 38(2), pp. 157-163, 2007. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
14 | S. Manjit Sidhu |
Design approaches and comparison of TAPS packages for engineering. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Interact. Technol. Smart Educ. ![In: Interact. Technol. Smart Educ. 4(3), pp. 127-137, 2007. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
14 | Chang-Lin Yeh, Tsung-Yueh Tsai, Yi-Shao Lai |
Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 47(12), pp. 2188-2196, 2007. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
14 | Andy Perkins, Suresh K. Sitaraman |
Universal fatigue life prediction equation for ceramic ball grid array (CBGA) packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 47(12), pp. 2260-2274, 2007. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
14 | Shiang-Yu Teng, Sheng-Jye Hwang |
Predicting the process induced warpage of electronic packages using the P-V-T-C equation and the Taguchi method. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 47(12), pp. 2231-2241, 2007. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
14 | Yoshikuni Nakadaira, Seyoung Jeong, Jongbo Shim, Jaiseok Seo, Sunhee Min, Taeje Cho, Sayoon Kang, Seyong Oh |
Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 47(12), pp. 1928-1949, 2007. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
14 | Yi-Shao Lai, Tong Hong Wang, Han-Hui Tsai, Ming-Hwa R. Jen |
Cyclic bending reliability of wafer-level chip-scale packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 47(1), pp. 111-117, 2007. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
14 | Jinlin Wang |
The effects of rheological and wetting properties on underfill filler settling and flow voids in flip chip packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 47(12), pp. 1958-1966, 2007. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
14 | Willem D. van Driel, Dao-Guo Yang, Cadmus A. Yuan, M. van Kleef, G. Q. (Kouchi) Zhang |
Mechanical reliability challenges for MEMS packages: Capping. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 47(9-11), pp. 1823-1826, 2007. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
14 | Bart Vandevelde, Mario Gonzalez, Paresh Limaye, Petar Ratchev, Eric Beyne |
Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 47(2-3), pp. 259-265, 2007. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
14 | Marcel A. J. van Gils, W. D. van Driel, G. Q. Zhang, H. J. L. Bressers, Richard B. R. van Silfhout, X. J. Fan, J. H. J. Janssen |
Virtual qualification of moisture induced failures of advanced packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 47(2-3), pp. 273-279, 2007. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
14 | Yi-Shao Lai, Tong Hong Wang |
Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 47(1), pp. 104-110, 2007. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
14 | Georgiana Macariu, Marc Frîncu, Alexandru Cârstea, Dana Petcu, Andrei Eckstein |
Redesigning Parallel Symbolic Computations Packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
PACT ![In: 16th International Conference on Parallel Architectures and Compilation Techniques (PACT 2007), Brasov, Romania, September 15-19, 2007, pp. 417, 2007, IEEE Computer Society, 0-7695-2944-5. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
14 | David Crombie, George T. Ioannidis, Neil McKenzie |
Multimedia Modular Training Packages by EUAIN. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ELPUB ![In: Openness in Digital Publishing: Awareness, Discovery and Access - Proceedings of the 11th International Conference on Electronic Publishing held in Vienna - ELPUB 2007, Vienna, Austria, June 13-15, 2007. Proceedings, pp. 91-100, 2007, 978-3-85437-292-9. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP BibTeX RDF |
|
14 | James J. Nutaro, Phani Teja Kuruganti, Mallikarjun Shankar |
Seamless Simulation of Hybrid Systems with Discrete Event Software Packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Annual Simulation Symposium ![In: Proceedings 40th Annual Simulation Symposium (ANSS-40 2007), 26-28 March 2007, Norfolk, Virginia, USA, pp. 81-87, 2007, IEEE Computer Society, 978-0-7695-2814-4. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
14 | Kwang Moon Cho |
Management of Access Control for Content Packages by Using XML Subject-Based Encryption. ![Search on Bibsonomy](Pics/bibsonomy.png) |
FGCN (2) ![In: Future Generation Communication and Networking, FGCN 2007, Ramada Plaza Jeju, Jeju-Island, Korea, December 6-8, 2007, Proceedings, pp. 453-457, 2007, IEEE Computer Society. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
14 | Fabiana Lorenzi, Ana L. C. Bazzan, Mara Abel |
Recommending Travel Packages Upon Distributed Knowledge. ![Search on Bibsonomy](Pics/bibsonomy.png) |
AAAI ![In: Proceedings of the Twenty-Second AAAI Conference on Artificial Intelligence, July 22-26, 2007, Vancouver, British Columbia, Canada, pp. 1886-1887, 2007, AAAI Press, 978-1-57735-323-2. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP BibTeX RDF |
|
14 | Pasquale Ardimento, Maria Teresa Baldassarre, Marta Cimitile, Giuseppe Visaggio |
Empirical Experimentation for Validating the Usability of Knowledge Packages in Transferring Innovations. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICSOFT/ENASE (Selected Papers) ![In: Software and Data Technologies - Second International Conference, ICSOFT/ENASE 2007, Barcelona, Spain, July 22-25, 2007, Revised Selected Papers, pp. 357-370, 2007, Springer, 978-3-540-88654-9. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
14 | Tay Jin Chua, Tian Xiang Cai, Xiao-Feng Yin |
A heuristic approach for scheduling multi-chip packages for semiconductor backend assembly. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ETFA ![In: Proceedings of 12th IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2007, September 25-28, 2007, Patras, Greece, pp. 1024-1030, 2007, IEEE, 978-1-4244-0825-2. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
14 | Prateeti Mohapatra, Howard Michel |
A Discrete-Event Simulation Model for Dynamic Function Personalization in Generalized Software Packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IC-AI ![In: Proceedings of the 2007 International Conference on Artificial Intelligence, ICAI 2007, Volume II, June 25-28, 2007, Las Vegas, Nevada, USA, pp. 737-744, 2007, CSREA Press, 1-60132-024-8. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP BibTeX RDF |
|
14 | R. M. C. B. Ratnayake, Craig Hicks, M. A. Akbari |
A SVM Based Method to Detect Color Shift Defects in IC Packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
MVA ![In: Proceedings of the IAPR Conference on Machine Vision Applications (IAPR MVA 2007), May 16-18, 2007, Tokyo, Japan, pp. 138-141, 2007, 978-4-901122-07-8. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP BibTeX RDF |
|
14 | Navonil Mustafee |
A grid computing framework for commercial simulation packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
|
2007 |
RDF |
|
14 | Elodie Martin |
Analyse de signaux ultrasonores, Formation d'Images de Cohérence - Application à la Microscopie Acoustique de circuits électroniques. (Ultrasonic Signals Processing, Coherent Imaging - Application to the Scanning Acoustic Microscopy of Microelectronic packages). ![Search on Bibsonomy](Pics/bibsonomy.png) |
|
2007 |
RDF |
|
14 | Piotr Golonka, Borut Paul Kersevan, T. Pierzchala, Elzbieta Richter-Was, Zbigniew Was, Malgorzata Worek |
The tauola-photos-F environment for the TAUOLA and PHOTOS packages, release II. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Comput. Phys. Commun. ![In: Comput. Phys. Commun. 174(10), pp. 818-835, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Fanis G. Kalatzis, Dimitris G. Papageorgiou, Ioannis N. Demetropoulos |
A programmable optimization environment using the GAMESS-US and MERLIN/MCL packages. Applications on intermolecular interaction energies. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Comput. Phys. Commun. ![In: Comput. Phys. Commun. 175(5), pp. 359-371, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Ibrahim Baz, Abdurrahman Geymen |
Automatic document preparation by interacting GIS software packages using office programs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Adv. Eng. Softw. ![In: Adv. Eng. Softw. 37(11), pp. 763-769, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Jane Hunter 0001 |
Scientific Publication Packages - A Selective Approach to the Communication and Archival of Scientific Output. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Int. J. Digit. Curation ![In: Int. J. Digit. Curation 1, pp. 33-52, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | E. J. Comeaux, Bhaba R. Sarker |
Optimal inventory policy for specialty chemical products in multiple packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Oper. Res. Soc. ![In: J. Oper. Res. Soc. 57(4), pp. 357-366, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Yoichi Tomioka, Atsushi Takahashi 0001 |
Routing of Monotonic Parallel and Orthogonal Netlists for Single-Layer Ball Grid Array Packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci. ![In: IEICE Trans. Fundam. Electron. Commun. Comput. Sci. 89-A(12), pp. 3551-3559, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Robert Elsässer, Burkhard Monien, Stefan Schamberger |
Distributing Unit Size Workload Packages in Heterogeneous Networks. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Graph Algorithms Appl. ![In: J. Graph Algorithms Appl. 10(1), pp. 51-68, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Rainer Brüggemann, Guillermo Restrepo, Kristina Voigt |
Structure-Fate Relationships of Organic Chemicals Derived from the Software Packages E4CHEM and WHASSE. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Chem. Inf. Model. ![In: J. Chem. Inf. Model. 46(2), pp. 894-902, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Oriol Falivene, Pau Arbués, J. Howell, Oscar Fernández, Patricia Cabello, Josep Anton Muñoz, Lluís Cabrera |
A FORTRAN program to introduce field-measured sedimentary logs into reservoir modelling packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Comput. Geosci. ![In: Comput. Geosci. 32(9), pp. 1519-1522, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Jean-Guillaume Dumas, Thierry Gautier, Pascal Giorgi, Clément Pernet |
Dense Linear Algebra over Finite Fields: the FFLAS and FFPACK packages ![Search on Bibsonomy](Pics/bibsonomy.png) |
CoRR ![In: CoRR abs/cs/0601133, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP BibTeX RDF |
|
14 | Aleksandra Tesanovic, Mehdi Amirijoo, Jörgen Hansson |
Providing Configurable QoS Management in Real-Time Systems with QoS Aspect Packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
T. Aspect-Oriented Software Development ![In: Transactions on Aspect-Oriented Software Development II, pp. 256-288, 2006, Springer, 3-540-48890-1. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Xia Liu, Valmiki K. Sooklal, Melody A. Verges, Michael C. Larson |
Experimental study and life prediction on high cycle vibration fatigue in BGA packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(7), pp. 1128-1138, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Amy S. Fleischer, Li-Hsin Chang, Barry C. Johnson |
The effect of die attach voiding on the thermal resistance of chip level packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(5-6), pp. 794-804, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Yi-Shao Lai, Chin-Li Kao |
Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(8), pp. 1357-1368, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Ming-Yi Tsai, W. C. Chiang, T. M. Liu, G. H. Hsu |
Thermal deformation measurements and predictions of MAP-BGA electronic packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(2-4), pp. 476-486, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Se Young Yang, Young-Doo Jeon, Soon-Bok Lee, Kyung-Wook Paik |
Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(2-4), pp. 512-522, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Fei Su, Kerm Sin Chian, Sung Yi |
An optical characterization technique for hygroscopic expansion of polymers and plastic packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(2-4), pp. 600-609, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Changsoo Jang, Seongyoung Han, Hangyu Kim, Sayoon Kang |
A numerical failure analysis on lead breakage issues of ultra fine pitch flip chip-on-flex and tape carrier packages during chip/film assembly process. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(2-4), pp. 487-495, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Yi-Ming Jen, Ying-Lung Wu, Chih-Kai Fang |
Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(2-4), pp. 386-399, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Reza Ghaffarian |
CCGA packages for space applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(12), pp. 2006-2024, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Michael C. Larson, Melody A. Verges, Xia Liu |
Residual compression in area array packages induced by underfill shrinkage. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(2-4), pp. 496-502, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Desmond Y. R. Chong, F. X. Che, John H. L. Pang, Kellin Ng, Jane Y. N. Tan, Patrick T. H. Low |
Drop impact reliability testing for lead-free and lead-based soldered IC packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(7), pp. 1160-1171, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Kuo-Ming Chen, Kuo-Hsiung Houng, Kuo-Ning Chiang |
Thermal resistance analysis and validation of flip chip PBGA packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(2-4), pp. 440-448, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Yi-Shao Lai, Ping-Feng Yang, Chang-Lin Yeh |
Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(2-4), pp. 645-650, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | W. D. van Driel, Olaf van der Sluis, Dao-Guo Yang, R. L. J. M. Ubachs, C. Zenz, G. Aflenzer, G. Q. Zhang |
Reliability modelling for packages in flexible end-products. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(9-11), pp. 1880-1885, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Jamil A. Wakil |
Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(2-4), pp. 380-385, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Chang-Lin Yeh, Yi-Shao Lai, Chin-Li Kao |
Evaluation of board-level reliability of electronic packages under consecutive drops. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(7), pp. 1172-1182, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Hua Lu 0006, Helen Shi, Ming Zhou |
Thermally induced deformation of solder joints in real packages: Measurement and analysis. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(7), pp. 1148-1159, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Bruno Foucher, J. Tomas, F. Mounsi, M. Jeremias |
Life margin assessment with Physics of Failure Tools application to BGA packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(5-6), pp. 1013-1018, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Donna M. Rizzo, Paula J. Mouser, David H. Whitney, Charles D. Mark, Roger D. Magarey, Alexey A. Voinov |
The comparison of four dynamic systems-based software packages: Translation and sensitivity analysis. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Environ. Model. Softw. ![In: Environ. Model. Softw. 21(10), pp. 1491-1502, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Yoichi Tomioka, Atsushi Takahashi 0001 |
Monotonic parallel and orthogonal routing for single-layer ball grid array packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ASP-DAC ![In: Proceedings of the 2006 Conference on Asia South Pacific Design Automation: ASP-DAC 2006, Yokohama, Japan, January 24-27, 2006, pp. 642-647, 2006, IEEE, 0-7803-9451-8. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Lahcen Oubahssi, Monique Grandbastien |
From Learner Information Packages to Student Models: Which Continuum?. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Intelligent Tutoring Systems ![In: Intelligent Tutoring Systems, 8th International Conference, ITS 2006, Jhongli, Taiwan, June 26-30, 2006, Proceedings, pp. 288-297, 2006, Springer, 3-540-35159-0. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Navonil Mustafee, Simon J. E. Taylor, Korina Katsaliaki, Sally C. Brailsford |
Distributed simulation with COTS simulation packages: a case study in health care supply chain simulation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
WSC ![In: Proceedings of the Winter Simulation Conference WSC 2006, Monterey, California, USA, December 3-6, 2006, pp. 1136-1142, 2006, IEEE Computer Society, 1-4244-0501-7. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Oliver Skroch |
Integration assessment of an individually developed application vs. software packages from the market - an experience report. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Data Warehousing ![In: Integration, Informationslogistik und Architektur, DW 2006, 21.-22.09.2006, Friedrichshafen, Germany, pp. 329-339, 2006, GI, 978-3-88579-184-3. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP BibTeX RDF |
|
14 | Manoel G. Mendonça, Daniela S. Cruzes, Josemeire Dias, Maria Cristina Ferreira de Oliveira |
Using observational pilot studies to test and improve lab packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISESE ![In: 2006 International Symposium on Empirical Software Engineering (ISESE 2006), September 21-22, 2006, Rio de Janeiro, Brazil, pp. 48-57, 2006, ACM, 1-59593-218-6. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
inspection techniques, lab package, empirical studies, mining, visual data |
14 | Krishna Srinivasan, P. Muthana, Rohan Mandrekar, Ege Engin, Jinwoo Choi, Madhavan Swaminathan |
Enhancement of Signal Integrity and Power Integrity with Embedded Capacitors in High-Speed Packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISQED ![In: 7th International Symposium on Quality of Electronic Design (ISQED 2006), 27-29 March 2006, San Jose, CA, USA, pp. 284-291, 2006, IEEE Computer Society, 0-7695-2523-7. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Tae-Hyoung Kim, Chi-Hwa Song, Won Don Lee, Jae-Cheol Ryou 0001 |
Building a Packages Delivery Schedule Using Extended Simulated Annealing. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IJCNN ![In: Proceedings of the International Joint Conference on Neural Networks, IJCNN 2006, part of the IEEE World Congress on Computational Intelligence, WCCI 2006, Vancouver, BC, Canada, 16-21 July 2006, pp. 2691-2695, 2006, IEEE, 0-7803-9490-9. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Yuxin Wang, Martin Margala |
New Embedded Core Testing for System-on-Chips and System-in-Packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CCECE ![In: Proceedings of the Canadian Conference on Electrical and Computer Engineering, CCECE 2006, May 7-10, 2006, Ottawa Congress Centre, Ottawa, Canada, pp. 1897-1900, 2006, IEEE, 1-4244-0038-4. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
14 | Idoia Murua, Esteve Lladó, Bel Llodrà |
The Semantic Web for Improving Dynamic Tourist Packages Commercialisation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CE ![In: Leading the Web in Concurrent Engineering. Next Generation Concurrent Engineering, Proceedings of the 13th ISPE International Conference on Concurrent Engineering (ISPE CE 2006), September 18-22, 2006, Antibes, France., pp. 222-226, 2006, IOS Press, 978-1-58603-651-5. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP BibTeX RDF |
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14 | Djamel Mostefa, Marie-Neige Garcia, Khalid Choukri |
Evaluation of multimodal components within CHIL: The evaluation packages and results. ![Search on Bibsonomy](Pics/bibsonomy.png) |
LREC ![In: Proceedings of the Fifth International Conference on Language Resources and Evaluation, LREC 2006, Genoa, Italy, May 22-28, 2006., pp. 915-918, 2006, European Language Resources Association (ELRA). The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP BibTeX RDF |
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14 | Ammar Alkassar, Elena Andreeva 0001, Helger Lipmaa |
SLC: Efficient Authenticated Encryption for Short Packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sicherheit ![In: Sicherheit 2006: Sicherheit - Schutz und Zuverlässigkeit, Beiträge der 3. Jahrestagung des Fachbereichs Sicherheit der Gesellschaft für Informatik e.v. (GI), 20.-22. Februar 2006 in Magdeburg, pp. 270-278, 2006, GI, 3-88579-171-4. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP BibTeX RDF |
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14 | Xiaoguang Wang 0002 |
Synchronization issues in distributed simulation using Commercial Off-The-Shelf (COTS) simulation packages ![Search on Bibsonomy](Pics/bibsonomy.png) |
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2006 |
DOI RDF |
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14 | Rolf Drechsler, Dragan Jankovic, Radomir S. Stankovic |
Generic Implementation of Multi-Valued Logic Decision Diagram Packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Multiple Valued Log. Soft Comput. ![In: J. Multiple Valued Log. Soft Comput. 11(1-2), pp. 1-18, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP BibTeX RDF |
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14 | Yukiko Kubo, Atsushi Takahashi 0001 |
A Via Assignment and Global Routing Method for 2-Layer Ball Grid Array Packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci. ![In: IEICE Trans. Fundam. Electron. Commun. Comput. Sci. 88-A(5), pp. 1283-1289, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
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14 | Takeshi Yuasa, Tamotsu Nishino, Hideyuki Oh-Hashi |
Simple Design Formula for Parallel Plate Mode Suppression by Ground Via-Holes in Multi-Layered Packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEICE Trans. Electron. ![In: IEICE Trans. Electron. 88-C(7), pp. 1401-1405, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
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14 | Marlei Pozzebon, Alain Pinsonneault |
Global-local negotiations for implementing configurable packages: The power of initial organizational decisions. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Strateg. Inf. Syst. ![In: J. Strateg. Inf. Syst. 14(2), pp. 121-145, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
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14 | K. W. Tong, C. K. Kwong 0001, Ching-Yuen Chan |
Process design for transfer moulding of electronic packages using a case-based reasoning approach with fuzzy regression adaptation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Int. J. Comput. Integr. Manuf. ![In: Int. J. Comput. Integr. Manuf. 18(1), pp. 27-40, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
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14 | D. Charif, Jean Thioulouse, J. R. Lobry, Guy Perrière |
Online synonymous codon usage analyses with the ade4 and seqinR packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Bioinform. ![In: Bioinform. 21(4), pp. 545-547, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
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14 | Dante Del Corso, Emanuela Ovcin, Gaetano Morrone |
A teacher friendly environment to foster learner-centered customization in the development of interactive educational packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Educ. ![In: IEEE Trans. Educ. 48(4), pp. 574-579, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
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14 | Russell Housley |
Using Cryptographic Message Syntax (CMS) to Protect Firmware Packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
RFC ![In: RFC 4108, pp. 1-61, August 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
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14 | Masayuki Kitajima, Tadaaki Shono |
Reliability study of new SnZnAl lead-free solders used in CSP packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 45(7-8), pp. 1208-1214, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
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14 | L. Zhang, G. Subbarayan, B. C. Hunter, D. Rose |
Response surface models for efficient, modular estimation of solder joint reliability in area array packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 45(3-4), pp. 623-635, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
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14 | Kheng Chooi Lee, A. Vythilingam, Peter Alpern |
A simple moisture diffusion model for the prediction of optimal baking schedules for plastic SMD packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 45(9-11), pp. 1668-1671, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
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14 | Dolphin Abessolo-Bidzo, Patrick Poirier, Philippe Descamps, Bernadette Domengès |
Isolating failing sites in IC packages using time domain reflectometry: Case studies. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 45(9-11), pp. 1639-1644, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
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14 | Yi Tao 0003, Ajay P. Malshe |
Theoretical investigation on hermeticity testing of MEMS packages based on MIL-STD-883E. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 45(3-4), pp. 559-566, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
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14 | Kevin B. Wright |
Researching Internet-Based Populations: Advantages and Disadvantages of Online Survey Research, Online Questionnaire Authoring Software Packages, and Web Survey Services. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Comput. Mediat. Commun. ![In: J. Comput. Mediat. Commun. 10(3), 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
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14 | Asher Brenner, Mordechai Shacham, Michael B. Cutlip |
Applications of mathematical software packages for modelling and simulations in environmental engineering education. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Environ. Model. Softw. ![In: Environ. Model. Softw. 20(10), pp. 1307-1313, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
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14 | Julius Zilinskas |
Comparison of Packages for Interval Arithmetic. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Informatica ![In: Informatica 16(1), pp. 145-154, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP BibTeX RDF |
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14 | Paul Y. Oh, Darius Burschka |
From the guest editors - Software packages for vision-based motion control. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Robotics Autom. Mag. ![In: IEEE Robotics Autom. Mag. 12(4), pp. 3-4, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
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14 | Esteve Lladó, Idoia Murua, Bel Llodrà |
Metadata for improving dynamic tourist packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Dublin Core Conference ![In: Vocabularies in Practice: Proceedings of the 2005 International Conference on Dublin Core and Metadata Applications, DC 2005, Madrid, Spain, September 12-15, 2005, pp. 223-230, 2005, Dublin Core Metadata Initiative. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP BibTeX RDF |
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14 | Brock J. LaMeres, Sunil P. Khatri |
Broadband Impedance Matching for Inductive Interconnect in VLSI Packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCD ![In: 23rd International Conference on Computer Design (ICCD 2005), 2-5 October 2005, San Jose, CA, USA, pp. 683-688, 2005, IEEE Computer Society, 0-7695-2451-6. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
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14 | Michael Daniel Ryde |
A high usability transparency framework for model interoperability using COTS simulation packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
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2005 |
RDF |
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14 | Nicholas I. M. Gould, Jennifer A. Scott |
A numerical evaluation of HSL packages for the direct solution of large sparse, symmetric linear systems of equations. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ACM Trans. Math. Softw. ![In: ACM Trans. Math. Softw. 30(3), pp. 300-325, 2004. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
symmetric linear systems, software, sparse matrices, Gaussian elimination, Direct solvers |
14 | Erica L. Wagner, Sue Newell |
'Best' for whom?: the tension between 'best practice' ERP packages and diverse epistemic cultures in a university context. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Strateg. Inf. Syst. ![In: J. Strateg. Inf. Syst. 13(4), pp. 305-328, 2004. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
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14 | Jannis Kallinikos |
Deconstructing information packages: Organizational and behavioural implications of ERP systems. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Inf. Technol. People ![In: Inf. Technol. People 17(1), pp. 8-30, 2004. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
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14 | Paul S. Ho, Guotao Wang, Min Ding 0003, Jie-Hua Zhao, Xiang Dai |
Reliability issues for flip-chip packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 44(5), pp. 719-737, 2004. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
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14 | Ashish Batra, Pradeep Ramachandran, Poornima Sathyanarayanan, Susan Lu, Hari Srihari |
Reliability enhancement of electronic packages by design of optimal parameters. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 44(7), pp. 1157-1163, 2004. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
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14 | T. Y. Lin, B. Njoman, D. Crouthamel, K. H. Chua, S. Y. Teo, Y. Y. Ma |
The impact of moisture in mold compound preforms on the warpage of PBGA packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 44(4), pp. 603-609, 2004. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
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14 | Li Zhang, Vivek Arora, Luu Nguyen, Nikhil Kelkar |
Numerical and experimental analysis of large passivation opening for solder joint reliability improvement of micro SMD packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 44(3), pp. 533-541, 2004. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
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14 | Peter Alpern, Kheng Chooi Lee, Rainer Tilgner |
Effect of long and short Pb-free soldering profiles of IPC/JEDEC J-STD-020 on plastic SMD packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 44(9-11), pp. 1293-1297, 2004. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
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14 | Tong Yan Tee, Zhaowei Zhong |
Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 44(12), pp. 1957-1965, 2004. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
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14 | Xuejun Fan, Jiang Zhou, G. Q. Zhang |
Multi-physics modeling in virtual prototyping of electronic packages--combined thermal, thermo-mechanical and vapor pressure modeling. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 44(12), pp. 1967-1976, 2004. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
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14 | Y. P. Wu, M. O. Alam, Yan Cheong Chan, B. Y. Wu |
Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 44(2), pp. 295-302, 2004. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
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14 | Jason Y. L. Goh, Mark C. Pitter, Chung W. See, Michael G. Somekh, Daniel Vanderstraeten |
Sub-pixel image correlation: an alternative to SAM and dye penetrant for crack detection and mechanical stress localisation in semiconductor packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 44(2), pp. 259-267, 2004. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
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14 | Mathieu Paillard, C. Schaffauser, Claude Drevon, Jean Louis Cazaux, Hans Reinhard Schubach, F. Frese |
Non destructive control of flip chip packages for space applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 44(9-11), pp. 1355-1359, 2004. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
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14 | Jinlin Wang, H. K. Lim, H. S. Lew, Woon Theng Saw, Chew Hong Tan |
A testing method for assessing solder joint reliability of FCBGA packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 44(5), pp. 833-840, 2004. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
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14 | Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim, Eric Pek, Zhaowei Zhong |
Impact life prediction modeling of TFBGA packages under board level drop test. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 44(7), pp. 1131-1142, 2004. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
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