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Found 625 publication records. Showing 625 according to the selection in the facets
Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
1 | Chao Song, Minxuan Zhang |
Improved access pattern for ROB soft error rate mitigation based on 3D integration technology. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. TS8.20.1-TS8.20.5, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Benjamin Vianne, Alexis Farcy, Vincent Fiori, Cédrick Chappaz, Norbert Chevrier, G. Lobascio, Pascal Chausse, F. Ponthenier, A. Ruckly, Stephanie Escoubas, Olivier Thomas |
Stress management strategy to limit die curvature during silicon interposer integration. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. TS11.4.1-TS11.4.7, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Pornvitoo Rittinon, Ken Suzuki, Hideo Miura |
Thermal stability of electroplated copper thin-film interconnections. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. TS4.2.1-TS4.2.6, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Yuan Yuan Dai, Mei Zhen Ng, P. Anantha, Chee Lip Gan, Chuan Seng Tan |
Copper micro and nano particles mixture for 3D interconnections application. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. TS8.9.1-TS8.9.5, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Chung H. Lam |
Neuromorphic semiconductor memory. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. KN3.1-KN3.4, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Hiroshi Taka, Katsumasa Suzuki, Norihiro Tsujioka, Shoichi Murakami |
Development of high-quality low-temperature (≤ 120°C) PECVD-SiN films by organosilane. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. TS8.2.1-TS8.2.4, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Tomoharu Ogita |
Invited talk: Technology and overview of Sony's 3D stacked CMOS image sensor. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. TS9.1.1, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Yuuki Araga, Kikuchi Katsuya, Masahiro Aoyagi |
Guard-ring monitoring system for inspecting defects in TSV-based data buses. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. TS8.18.1-TS8.18.5, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Hiroaki Ikeda, Shigenobu Sekine, Ryuji Kimura, Koichi Shimokawa, Keiji Okada, Hiroaki Shindo, Tatsuya Ooi, Rei Tamaki, Makoto Nagata |
Nano-Function materials for TSV technologies. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. TS5.3.1-TS5.3.6, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Gamal Refai-Ahmed, Ivor Barber, Anthony Torza, Brian Philofsky |
A holistic view of chip-level thermal architecture from heterogeneous stacked dice to system level in telecoms applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. TS10.1.1-TS10.1.4, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Isao Sugaya, Hajime Mitsuishi, Hidehiro Maeda, Kazuya Okamoto |
New precision wafer bonding technologies for 3DIC. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. TS7.1.1-TS7.1.7, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Shuuichi Kariyazaki, Kenichi Kuboyama, Ryuichi Oikawa, Takuo Funaya |
New signal skew cancellation method for 2 Gbps transmission in glass and organic interposers to achieve 2.5D package employing next generation high bandwidth memory (HBM). ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. TS2.3.1-TS2.3.5, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | K. W. Lee, Chisato Nagai, Ai Nakamura, Hiroki Aizawa, Ji Chel Bea, Mitsumasa Koyanagi, Hideto Hashiguchi, Takafumi Fukushima, Tanaka Tanaka |
Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. TS1.2.1-TS1.2.4, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Susheela Narasimhan |
Power tile optimization and packaging for efficient temperature management of ASIC's in networking applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. TS8.36.1, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Arun Raghupathy, Hoa Do, Brian Philofsky, Gamal Refai-Ahmed |
Best engineering practice for thermal characterization of stacked dice FPGA devices. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. TS8.21.1-TS8.21.8, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Joungho Kim |
Active Si interposer for 3D IC integrations. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. TS11.1.1-TS11.1.3, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Cui Huang, Dong Wu, Liyang Pan, Zheyao Wang |
Air-gap/SiO2 liner TSVs with improved electrical performance. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. TS8.7.1-TS8.7.5, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Asisa Kumar Panigrahi, Satish Bonam, Tamal Ghosh, Siva Rama Krishna Vanjari, Shiv Govind Singh |
Long term efficacy of ultra-thin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. TS8.13.1-TS8.13.5, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Shogo Hachiya, Takahiro Onagi, Sheyang Ning, Ken Takeuchi |
Comprehensive comparison of 3D-TSV integrated solid-state drives (SSDs) with storage class memory and NAND flash memory. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. TS6.2.1-TS6.2.5, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Masahide Goto, Kei Hagiwara, Yoshinori Iguchi, Hiroshi Ohtake, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto |
Three-dimensional integrated circuits and stacked CMOS image sensors using direct bonding of SOI layers. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. TS9.2.1-TS9.2.4, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Dimitrios Velenis, Mikael Detalle, Geert Hellings, Mirko Scholz, Erik Jan Marinissen, Geert Van der Plas, Antonio La Manna, Andy Miller, Dimitri Linten, Eric Beyne |
Processing active devices on Si interposer and impact on cost. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. TS11.2.1-TS11.2.4, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Eric Beyne |
3D system integration research at IMEC. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. FS1.1, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Wei-Chung Lo |
3D research activities in ITRI. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. FS3.1, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Hisashi Kino, Hideto Hashiguchi, Seiya Tanikawa, Yohei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka |
Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. TS8.26.1-TS8.26.4, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Tadashi Kamada |
The issues of automated driving vehicle and the expectations for 3D integration technology. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. KN2.1-KN2.4, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Gaël Pillonnet, Nicolas Jeanniot, Pascal Vivet |
3D ICs: An opportunity for fully-integrated, dense and efficient power supplies. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. TS6.4.1-TS6.4.8, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka |
Novel local stress evaluation method in 3D IC using DRAM cell array with planar mOS capacitors. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. TS3.1.1-TS3.1.4, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | R. Ranga Reddy, Sugandh Tanna, Shiv Govind Singh, Om Krishna Singh |
TSV noise coupling in 3D IC using guard ring. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. TS8.35.1-TS8.35.5, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Mostafizur Rahman, Santosh Khasanvis, Jiajun Shi, Mingyu Li, Csaba Andras Moritz |
Fine-grained 3-D integrated circuit fabric using vertical nanowires. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. TS9.3.1-TS9.3.7, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Ryo Takigawa, Kohei Nitta, Akihiro Ikeda, Mitsuaki Kumazawa, Toshiharu Hirai, Michio Komatsu, Tanemasa Asano |
High-speed via hole filling using electrophoresis of Ag nanoparticles. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015, pp. TS5.4.1-TS5.4.4, 2015, IEEE, 978-1-4673-9385-0. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
1 | Yang Zhang, Thomas E. Sarvey, Muhannad S. Bakir |
Thermal challenges for heterogeneous 3D ICs and opportunities for air gap thermal isolation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-5, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Masayuki Watanabe, Masa-Aki Fukase, Masashi Imai, Nanako Niioka, Tetsuya Kobayashi, Rosely Karel, Atsushi Kurokawa |
Modeling of substrate contacts in TSV-based 3D ICs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-4, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Jing Tao, Alan Mathewson, Kafil M. Razeeb |
Bumpless interconnects formed with nanowire ACF for 3D applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-6, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Andrzej Kociubinski, M. Duk, Tomasz Bieniek, Grzegorz Janczyk, Michal Borecki |
Innovative SiC over Si photodiode based dual-band, 3D integrated detector. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-4, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Joeri De Vos, Vladimir Cherman, Mikael Detalle, Teng Wang, Abdellah Salahouelhadj, Robert Daily, Geert Van der Plas, Eric Beyne |
Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-7, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Yann Beilliard, Stéphane Moreau, Léa Di Cioccio, Perceval Coudrain, G. Romano, A. Nowodzinski, F. Aussenac, P.-H. Jouneau, E. Rolland, Thomas Signamarcheix |
Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-8, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
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1 | Youngwoo Kim, Jonghyun Cho, Kiyeong Kim, Heegon Kim, Joungho Kim, Srikrishna Sitaraman, Venky Sundaram, Rao R. Tummala |
Analysis and optimization of a power distribution network in 2.5D IC with glass interposer. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-4, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Sonda Chtourou, Mohamed Abid, Vinod Pangracious, Emna Amouri, Zied Marrakchi, Habib Mehrez |
Three-dimensional Mesh of Clusters: An alternative unified high performance interconnect architecture for 3D-FPGA implementation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-7, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | K. W. Lee, Chisato Nagai, Ai Nakamura, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tanaka Tanaka, Mitsumasa Koyanagi |
Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-4, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
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1 | Qiaosha Zou, Jia Zhan, Fen Ge, Matt Poremba, Yuan Xie 0001 |
Designing vertical bandwidth reconfigurable 3D NoCs for many core systems. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-7, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Cristiano Santos, Pascal Vivet, Jean-Philippe Colonna, Perceval Coudrain, Ricardo Augusto da Luz Reis |
Thermal performance of 3D ICs: Analysis and alternatives. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-7, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Keiji Matsumoto, Hiroyuki Mori, Yasumitsu Orii |
Cooling from the bottom side (laminate (substrate) side) of a three-dimensional (3D) chip stack. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-6, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Daniel Nilsen Wright, Maaike M. Visser Taklo, Astrid-Sofie B. Vardøy, Helge Kristiansen |
Metal coated polymer spheres for compliant fine pitch ball grid arrays. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-7, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | James F. Rohan, Declan Casey, Monika Zygowska, Michael Moore, Brian Shanahan |
Electroless metal deposition for IC and TSV applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-3, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Masayuki Sato 0001, Ryusuke Egawa, Hiroyuki Takizawa, Hiroaki Kobayashi |
On-chip checkpointing with 3D-stacked memories. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-6, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
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1 | Paul D. Franzon, Eric Rotenberg, James Tuck 0001, Huiyang Zhou, W. Rhett Davis, Hongwen Dai, Joonmoo Huh, Sungkwan Ku, Steve Lipa, Chao Li 0004, Jong Beom Park, Joshua Schabel |
3D-enabled customizable embedded computer (3DECC). ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-3, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Randy Widialaksono, Wenxu Zhao, W. Rhett Davis, Paul D. Franzon |
Leveraging 3D-IC for on-chip timing uncertainty measurements. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-4, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
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1 | Cristiano Santos, Papa Momar Souare, François de Crecy, Perceval Coudrain, Jean-Philippe Colonna, Pascal Vivet, Andras Borbely, Ricardo Reis 0001, M. Haykel Ben Jamaa, Vincent Fiori, Alexis Farcy |
Using TSVs for thermal mitigation in 3D circuits: Wish and truth. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-8, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Robert Fischbach, Andy Heinig, Peter Schneider |
Design rule check and layout versus schematic for 3D integration and advanced packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-7, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Mariappan Murugesan, Takafumi Fukushima, Ji Chel Bea, K. W. Lee, Mitsu Koyanagi, Y. Imai, S. Kimura, Tetsu Tanaka |
Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-4, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Tomasz Bieniek, Grzegorz Janczyk, Magdalena Ekwinska, T. Budzynski, Piotr Gluszko, Piotr Grabiec, Andrzej Kociubinski |
Novel methodology for 3D MEMS-IC design and co-simulation on MEMS microphone smart system example. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-5, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | |
2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014 ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![IEEE, 978-1-4799-8472-5 The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP BibTeX RDF |
|
1 | Ricky Anthony, Santosh Kulkarni, Ningning Wang, Seán Cian O'Mathuna |
Advanced processing for high efficiency inductors for 2.5D/3D Power Supply in Package. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-4, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Armin Grünewald, Michael G. Wahl, Rainer Brück 0001 |
Manufacturing and test assistance for 3D-Integrated heterogeneous systems. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-6, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Severin Zimmermann, Thomas Brunschwiler, Brian R. Burg, Jonas Zuercher, Guo Hong, Dimos Poulikakos, Mario Baum, Christian Hofmann |
Characterization of particle beds in percolating thermal underfills based on centrifugation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-7, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Chaoqi Zhang 0001, Paragkumar Thadesar, Muneeb Zia, Thomas E. Sarvey, Muhannad S. Bakir |
Au-NiW Mechanically Flexible Interconnects (MFIs) and TSV integration for 3D interconnects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-4, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Wei Feng, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi |
Analysis of thermal stress distribution for TSV with novel structure. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-4, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Oded Raz, Pinxiang Duan, Harm J. S. Dorren |
Simple and low cost technique for stacking known good dies to create compact 3D stacked parallel optics assemblies. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-4, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Katsuya Kikuchi, Masahiro Aoyagi, Masaaki Ujiie, Shinya Takayama |
Ultrawideband ultralow PDN impedance of decoupling capacitor embedded interposers using narrow gap chip parts mounting technology for 3-D integrated LSI system. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-6, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Masaki Hashizume, Shoichi Umezu, Hiroyuki Yotsuyanagi, Shyue-Kung Lu |
A built-in supply current test circuit for electrical interconnect tests of 3D ICs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-6, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | X. Sun, Geert Van der Plas, Mikael Detalle, Eric Beyne |
Analysis of 3D interconnect performance: Effect of the Si substrate resistivity. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-4, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Dorota S. Temple, Dean Malta, Erik P. Vick, Matthew R. Lueck, Scott H. Goodwin, Mark S. Muzilla, Christopher M. Masterjohn, Mark R. Skokan |
Advanced 3D mixed-signal processor for infrared focal plane arrays: Fabrication and test. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-7, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Emma Kowalczuk, Arnab Bhattacharya 0007, Ka Chung Lee, Jesse Alton, Martin Igarashi, Stephane Barbeau |
Fault localisation of defects using Electro Optical Terahertz Pulse Reflectometry and 3D EM modelling with Virtual Known Good Device. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-4, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Fumihiro Inoue, Harold Philipsen, Marleen H. van der Veen, Kevin Vandersmissen, Stefaan Van Huylenbroeck, Herbert Struyf, Tetsu Tanaka |
Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-4, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Bui Thanh Tung 0001, Xiaojin Cheng, Naoya Watanabe, Fumiki Kato, Katsuya Kikuchi, Masahiro Aoyagi |
Copper filled TSV formation with Parylene-HT insulator for low-temperature compatible 3D integration. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-4, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Takafumi Fukushima, Yuka Ito, Mariappan Murugesan, Jicheol Bea, Kang Wook Lee 0002, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi |
Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-4, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Mehdi Saedi, Kambiz Samadi, Arpit Mittal, Rajat Mittal |
Thermal implications of mobile 3D-ICs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-7, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Jubee Tada, Ryusuke Egawa, Hiroaki Kobayashi |
An impact of circuit scale on the performance of 3-D stacked arithmetic units. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-5, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Khadim Dieng, Philippe Artillan, Cédric Bermond, Olivier Guiller, Thierry Lacrevaz, Sylvain Joblot, Gregory Houzet, Alexis Farcy, Yann Lamy, Bernard Fléchet |
Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-8, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Yoriko Mizushima, Young-Suk Kim, Tomoji Nakamura, Shoichi Kodama, Nobuhide Maeda, Koji Fujimoto, Takayuki Ohba |
Impact of Thermomechanical Stresses on Ultra-thin Si Stacked Structure. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-5, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Naoya Watanabe, Masahiro Aoyagi, Daisuke Katagawa, Tsubasa Bandoh, Takahiko Mitsui, Eiichi Yamamoto |
Small-diameter TSV reveal process using direct Si/Cu grinding and metal contamination removal. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-5, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Young Sik Song, Yunho Han, Tai Hong Yim |
Conventional magnetron sputtering of metal seed layers on high aspect ratio vias with tilting. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-4, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | T. Robert Harris, Paul D. Franzon, W. Rhett Davis, Lee Wang |
Thermal effects of heterogeneous interconnects on InP / GaN / Si diverse integrated circuits. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-3, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi |
Fault detection and isolation of multiple defects in through silicon via (TSV) channel. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-5, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Qiaosha Zou, Matt Poremba, Yuan Xie 0001 |
A cost benefit analysis: The impact of defect clustering on the necessity of pre-bond tests. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-7, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Yuuki Araga, Kikuchi Katsuya, Masahiro Aoyagi |
Substrate monitoring system for inspecting defects in TSV-based data buses. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-5, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Jonghoon J. Kim, Bumhee Bae, Sukjin Kim, Sunkyu Kong, Heegon Kim, Daniel H. Jung, Joungho Kim |
Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014, pp. 1-6, 2014, IEEE, 978-1-4799-8472-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
1 | Hong-Yeol Lim, Min-Kwan Kee, Gi-Ho Park |
Phase detection based data prefetching for utilizing memory bandwidth of 3D integrated circuits. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-5, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
1 | Bei Zhang, Baohu Li, Vishwani D. Agrawal |
Yield analysis of a novel wafer manipulation method in 3D stacking. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-8, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
1 | Zhenqian Zhang, Brandon Noia, Krishnendu Chakrabarty, Paul D. Franzon |
Face-to-face bus design with built-in self-test in 3D ICs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-7, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
1 | Keiji Matsumoto, Soichiro Ibaraki, Kuniaki Sueoka, Katsuyuki Sakuma, Hidekazu Kikuchi, Hiroyuki Mori, Yasumitsu Orii, Fumiaki Yamada, Kohei Fujihara, Junichi Takamatsu, Koji Kondo |
Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-8, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
1 | Julia Hsin-Lin Lu, Wing-Fai Loke, Dimitrios Peroulis, Byunghoo Jung |
Implementing wireless communication links in 3-D ICs utilizing wide-band on-chip meandering microbump antenna. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-5, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
1 | Kouji Kiyoyama, Y. Sato, Hiroyuki Hashimoto, Kang Wook Lee 0002, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi |
A block-parallel ADC with digital noise cancelling for 3-D stacked CMOS image sensor. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-4, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
1 | Katsuya Kikuchi, Fumiki Kato, Shunsuke Nemoto, Hiroshi Nakagawa, Masahiro Aoyagi, Youtaro Yasu, Kohji Koshiji |
Investigation of optimized high-density flip-chip interconnect design including micro Au bumps for 3-D stacked LSI packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-4, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
1 | Tiantao Lu, Ankur Srivastava 0001 |
Detailed electrical and reliability study of tapered TSVs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-7, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
1 | William Wahby, Ashish Dembla, Muhannad S. Bakir |
Evaluation of 3DICs and fabrication of monolithic interlayer vias. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-6, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
1 | Thorbjorn Ebefors, Jessica Fredlund, Daniel Perttu, Raymond van Dijk, Lorenzo Cifola, Mikko Kaunisto, Pekka Rantakari, Tauno Vaha-Heikkila |
The development and evaluation of RF TSV for 3D IPD applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-8, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
1 | Zvi Or-Bach |
The monolithic 3D advantage: Monolithic 3D is far more than just an alternative to 0.7x scaling. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-7, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
1 | Hiroyuki Hashimoto, Takafumi Fukushima, Kang Wook Lee 0002, Mitsumasa Koyanagi, Tetsu Tanaka |
Highly efficient TSV repair technology for resilient 3-D stacked multicore processor system. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-5, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
1 | Zhenqian Zhang, Paul D. Franzon |
TSV-based, modular and collision detectable face-to-back shared bus design. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-5, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
1 | Nahid M. Hossain, MunEm Hossain, Abdul Hamid Bin Yousuf, Masud H. Chowdhury |
Thermal aware Graphene based Through Silicon Via design for 3D IC. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-4, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
1 | Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park |
Non-contact wafer-level TSV connectivity test methodology using magnetic coupling. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-4, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
1 | Mariappan Murugesan, Jichoel Bea, Kang Wook Lee 0002, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi, Yuji Sutou, H. Wang, J. Koike |
Effect of CVD Mn oxide layer as Cu diffusion barrier for TSV. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-4, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
1 | Rene Puschmann, Mathias Bottcher, Irene Bartusseck, Frank Windrich, Conny Fiedler, Peggy John, Charles Alix Manier, Kai Zoschke, Jurgen Grafe, Hermann Oppermann, Jürgen Wolf, K. Dieter Lang, Michael Ziesmann |
3D integration of standard integrated circuits. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-7, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
1 | Melanie Brocard, Cédric Bermond, Thierry Lacrevaz, Alexis Farcy, Patrick Le Maitre, P. Scheer, Patrick Leduc, Séverine Cheramy, Bernard Fléchet |
RF characterization of substrate coupling between TSV and MOS transistors in 3D integrated circuits. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-8, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
1 | Surajit Kumar Roy, Sobitri Chatterjee, Chandan Giri, Hafizur Rahaman 0001 |
Faulty TSVs identification and recovery in 3D stacked ICs during pre-bond testing. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-6, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
1 | Jason Chew, Uday Mahajan, Rajeev Bajaj, Iad Mirshad, Robert Newcomb 0002 |
Characterization and optimization of a TSV CMP reveal process using a novel wafer inspection technique for detecting sub-monolayer surface contamination. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-6, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
1 | Jason Chew, Uday Mahajan, Rajeev Bajaj, Iad Mirshad, Robert Newcomb 0002 |
Characterization and optimization of a TSV CMP reveal process using a novel wafer inspection technique for detecting sub-monolayer surface contamination. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-6, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
1 | Osamu Nukaga, Tatsuya Shioiri, Satoshi Yamamoto, Tatsuo Suemasu |
Glass interposer with high-density three-dimensional structured TGV for 3D system integration. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-4, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
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1 | Akihiro Ikeda, L. J. Qiu, K. Nakahara, Tanemasa Asano |
Surface passivation of Cu cone bump by self-assembled-monolayer for room temperature Cu-Cu bonding. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-4, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
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