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Venues (Conferences, Journals, ...)
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GrowBag graphs for keyword ? (Num. hits/coverage)
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The graphs summarize 682 occurrences of 533 keywords
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Results
Found 1665 publication records. Showing 1665 according to the selection in the facets
Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
14 | Yuxuan Lu 0001, Qian Qi, Xi Chen |
A Framework of Transaction Packaging in High-throughput Blockchains. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CoRR ![In: CoRR abs/2301.10944, 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Markus Völk, Kilian Kleeberger, Werner Kraus, Richard Bormann |
Towards Packaging Unit Detection for Automated Palletizing Tasks. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CoRR ![In: CoRR abs/2308.06306, 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Federico Botta, Robin Lovelace, Laura Gilbert, Arthur E. Turrell |
Packaging code for reproducible research in the public sector. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CoRR ![In: CoRR abs/2305.16205, 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Sriharini Krishnakumar, Inna Partin-Vaisband |
Vertical Power Delivery for Emerging Packaging and Integration Platforms - Power Conversion and Distribution. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CoRR ![In: CoRR abs/2309.10141, 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Eveline Drijver, Rodrigo Pérez-Dattari, Jens Kober, Cosimo Della Santina, Zlatan Ajanovic |
Robotic Packaging Optimization with Reinforcement Learning. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CoRR ![In: CoRR abs/2303.14693, 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Hung-Kai Wang, Yu-Chun Lin, Che-Jung Liang, Ya-Han Wang |
Multi-subpopulation parallel computing genetic algorithm for the semiconductor packaging scheduling problem with auxiliary resource constraints. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Appl. Soft Comput. ![In: Appl. Soft Comput. 142, pp. 110349, 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Ling-Jing Kao, Chih-Chou Chiu, Cheng-Chin Lu, Chung-Yi Wu |
Identification and Rating of Workforce Competencies for Manufacturing Process Engineers: Case Study of an IC Packaging Process Engineer. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Engineering Management ![In: IEEE Trans. Engineering Management 70(1), pp. 196-208, 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Jin Fan |
Intelligent colour selection method for product packaging design based on particle swarm optimisation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Int. J. Manuf. Technol. Manag. ![In: Int. J. Manuf. Technol. Manag. 37(2), pp. 162-172, 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Xiao Li 0003, Chengke Wu 0003, Zhile Yang, Yuanjun Guo, Rui Jiang |
Knowledge graph-enabled adaptive work packaging approach in modular construction. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Knowl. Based Syst. ![In: Knowl. Based Syst. 260, pp. 110115, 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Davide Dalle Pezze, Denis Deronjic, Chiara Masiero, Diego Tosato, Alessandro Beghi, Gian Antonio Susto |
A multi-label Continual Learning framework to scale deep learning approaches for packaging equipment monitoring. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Eng. Appl. Artif. Intell. ![In: Eng. Appl. Artif. Intell. 124, pp. 106610, 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Nina Kasyanenko, Andrei Baryshev, Daria Artamonova, Petr Sokolov |
Packaging of DNA Integrated with Metal Nanoparticles in Solution. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Entropy ![In: Entropy 25(7), pp. 1052, July 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Takuya Wadatsumi, Kohei Kawai, Rikuu Hasegawa, Kikuo Muramatsu, Hiromu Hasegawa, Takuya Sawada, Takahito Fukushima, Hisashi Kondo, Takuji Miki, Makoto Nagata |
Experimental Exploration of the Backside ESD Impacts on an IC Chip in Flip Chip Packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEICE Trans. Electron. ![In: IEICE Trans. Electron. 106(10), pp. 556-564, October 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Makoto Nagata |
Design of Circuits and Packaging Systems for Security Chips. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEICE Trans. Electron. ![In: IEICE Trans. Electron. 106(7), pp. 345-351, July 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Lungtai Chen, Chinsheng Chang, Liangju Chien, Borshiun Lee, Wenlo Shieh |
A Novel Packaging of the MEMS Gas Sensors Used for Harsh Outdoor and Human Exhale Sampling Applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 23(11), pp. 5087, 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Claudia Gonzalez Viejo, Damir D. Torrico, Sigfredo Fuentes |
Novel Contactless Sensors for Food, Beverage and Packaging Evaluation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 23(19), pp. 8082, October 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Antonios Georgas, Lampros Nestoras, Aris Ioannis Kanaris, Spyridon Angelopoulos, Angelo Ferraro, Evangelos Hristoforou |
Packaging and Optimization of a Capacitive Biosensor and Its Readout Circuit. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 23(2), pp. 765, January 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Yu-Sin You, Yu-Shiang Lin |
A Novel Two-Stage Induced Deep Learning System for Classifying Similar Drugs with Diverse Packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 23(16), pp. 7275, August 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Xiu Cheng, Jiameng Yang, Linling Zhang |
Express packaging waste recycling: Stakeholders' dynamic behavioral changes based on a computational evolutionary game theoretic approach. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Comput. Ind. Eng. ![In: Comput. Ind. Eng. 183, pp. 109519, September 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Elham Zafarani, Mahsa Ghandehari |
A game theoretic framework for post-consumer recycled and new packaging industries. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Comput. Ind. Eng. ![In: Comput. Ind. Eng. 181, pp. 109305, July 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Michael Simonis, Stefan Nickel |
A simulation-optimization approach for a cyclic production scheme in a tablets packaging process. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Comput. Ind. Eng. ![In: Comput. Ind. Eng. 181, pp. 109304, July 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Tommaso Schettini, Federico Malucelli, Helena Ramalhinho |
Scheduling a pick and place packaging line. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Sched. ![In: J. Sched. 26(2), pp. 113-136, 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Rafael García-Jiménez, J. Carlos García-Díaz, Alexander D. Pulido-Rojano |
Bicriteria food packaging process optimization in double-layered upright and diagonal multihead weighers. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Comput. Appl. Math. ![In: J. Comput. Appl. Math. 428, pp. 115168, August 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Li Quan |
Quality evaluation method of agricultural product packaging image based on structural similarity and MTF. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Clust. Comput. ![In: Clust. Comput. 26(1), pp. 1-12, February 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Hwee Ling Siek, Yek Ming Liew, Kay Hooi Keoy, Aswani Kumar Cherukuri |
A Study of the Corporate Design Packaging of Malaysia's Processed Food. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Inf. Knowl. Manag. ![In: J. Inf. Knowl. Manag. 22(5), pp. 2350026:1-2350026:19, October 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Maria Poli, Konstantinos Malagas, Spyridon Nomikos, Apostolos Papapostolou, Grigorios Vlassas |
The Interaction of People with Disabilities with the Intelligent Packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NiDS (2) ![In: Novel & Intelligent Digital Systems: Proceedings of the 3rd International Conference (NiDS 2023) - Volume 2, Athens, Greece, 28-29 September 2023, pp. 9-20, 2023, Springer, 978-3-031-44145-5. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Maria Poli, Konstantinos Malagas, Spyridon Nomikos |
The Interaction of Disabled People and New Forms of Packaging: A Holistic Approach. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NiDS (1) ![In: Novel & Intelligent Digital Systems: Proceedings of the 3rd International Conference (NiDS 2023) - Volume 1, Athens, Greece, 28-29 September 2023, pp. 304-315, 2023, Springer, 978-3-031-44096-0. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Jitender Madaan, Gulshan Kumar Gaur, Sachin Kumar Mangla, Sanjeev Gupta |
MCDM Approach for Prioritizing Barriers to Improve Performance of Sustainability-Focused Packaging Supply Chain. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SIET ![In: Proceedings of the 8th International Conference on Sustainable Information Engineering and Technology, SIET 2023, Badung, Bali, Indonesia, October 24-25, 2023, pp. 446-453, 2023, ACM. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Murshedul Arifeen, Andrei Petrovski 0001 |
Bayesian Optimized Autoencoder for Predictive Maintenance of Smart Packaging Machines. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICPS ![In: 6th IEEE International Conference on Industrial Cyber-Physical Systems, ICPS 2023, Wuhan, China, May 8-11, 2023, pp. 1-6, 2023, IEEE, 979-8-3503-1125-9. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Ouyang Li, Xiansi Zeng, Jie Ling |
Influence Factors of Green Packaging on Consumers' Willingness to Accept Festive Gifts. ![Search on Bibsonomy](Pics/bibsonomy.png) |
HCI (46) ![In: HCI International 2023 Posters - 25th International Conference on Human-Computer Interaction, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part IV, pp. 360-368, 2023, Springer, 978-3-031-36000-8. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Dingwei Zhang, Jingwen Tian, Hongtao Zhou |
Research on Interactive Packaging Design Based on User's Emotional Experience. ![Search on Bibsonomy](Pics/bibsonomy.png) |
HCI (46) ![In: HCI International 2023 Posters - 25th International Conference on Human-Computer Interaction, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part IV, pp. 678-686, 2023, Springer, 978-3-031-36000-8. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Ouyang Li, Xiansi Zeng, Yue Zhao, Han Li |
Analysis and Exploration of Sustainable Design of Packaging Structure Based on Pentaward and Dieline Award-Winning Cases. ![Search on Bibsonomy](Pics/bibsonomy.png) |
HCI (12) ![In: Cross-Cultural Design - 15th International Conference, CCD 2023, Held as Part of the 25th International Conference, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part I, pp. 380-391, 2023, Springer, 978-3-031-35935-4. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Rattana Ceesay, Thapana Boonchoo, Prapaporn Rattanatamrong |
Machine Learning Approaches for Quality Control in Pulp Packaging Manufacturers. ![Search on Bibsonomy](Pics/bibsonomy.png) |
JCSSE ![In: 20th IEEE International Joint Conference on Computer Science and Software Engineering, JCSSE 2023, Phitsanulok, Thailand, June 28 - July 1, 2023, pp. 385-390, 2023, IEEE, 979-8-3503-0050-5. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Markus Völk, Kilian Kleeberger, Werner Kraus, Richard Bormann |
Towards Packaging Unit Detection for Automated Palletizing Tasks. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IROS ![In: IROS, pp. 8310-8317, 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Chi-Wei Wang, Che-Pei Chang, Chang-Chun Lee |
Demonstration on Warpage Estimation Approach Utilized in Fan-Out Panel-Level Packaging Enabled by Multi-Scale Process-Oriented Simulation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2023, Monterey, CA, USA, March 26-30, 2023, pp. 1-4, 2023, IEEE, 978-1-6654-5672-2. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Jorge Mendoza, Jimmy-Bao Le, Choong-Un Kim, Hung-Yun Lin |
Advanced Methods of Detecting Physical Damages in Packaging and BEOL Interconnects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2023, Monterey, CA, USA, March 26-30, 2023, pp. 1-6, 2023, IEEE, 978-1-6654-5672-2. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Celine Kelma Carranza, Alvaro Lizardo Eyzaguirre, Fernando Maradiegue |
Inventory Management Model for The Packaging Process of Perishable Foods for Export in Latin America. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICIBE ![In: Proceedings of the 2023 9th International Conference on Industrial and Business Engineering, ICIBE 2023, Beijing, China, September 22-24, 2023, pp. 228-234, 2023, ACM. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Wenchao Fang |
A Game Study on Green Packaging of Takeaway Food Considering Government Regulation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICIBE ![In: Proceedings of the 2023 9th International Conference on Industrial and Business Engineering, ICIBE 2023, Beijing, China, September 22-24, 2023, pp. 334-338, 2023, ACM. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Lukang Wang, You Zhao, Yu Yang, Yabing Wang, Yulong Zhao |
High Temperature Characteristics of Piezoresistive Silicon Carbide Pressure Sensors Implemented by Leadless Packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SENSORS ![In: 2023 IEEE SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023, pp. 1-3, 2023, IEEE, 979-8-3503-0387-2. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Mingyue Li, Xiaojia Zhang, Yanrou Mi, Fangyunhao Long, Jinyu Ma, Xin Zhao, Bo Cheng, Haobo Zhang, Yongmin Cao, Pengtao Li |
Express packaging cycle machine based on artificial intelligence. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IoTAAI ![In: Proceedings of the 5th International Conference on Internet of Things, Automation and Artificial Intelligence, IoTAAI 2023, Nanchang, China, November 24-26, 2023, pp. 626-630, 2023, ACM. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Cheng Li, Na Lu, Yang Li, Yao Wei, Ning Jin |
Innovative Solutions and Applications of 5G Smart Factory for Chip Packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IWCMC ![In: International Wireless Communications and Mobile Computing, IWCMC 2023, Marrakesh, Morocco, June 19-23, 2023, pp. 717-721, 2023, IEEE, 979-8-3503-3339-8. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
14 | Jiajun Chen, Hongpeng Yin, Yan Qin, Dandan Zhao, Weijie Jiang |
A Supervised Contrast Focus Neural Network for LED packaging defects classification. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SAFEPROCESS ![In: CAA Symposium on Fault Detection, Supervision and Safety for Technical Processes, SAFEPROCESS 2023, Yibin, China, September 22-24, 2023, pp. 1-6, 2023, IEEE, 979-8-3503-3775-4. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Haiqiao Gu, Hao He 0012, Minghui Zhou 0001 |
Self-Admitted Library Migrations in Java, JavaScript, and Python Packaging Ecosystems: A Comparative Study. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SANER ![In: IEEE International Conference on Software Analysis, Evolution and Reengineering, SANER 2023, Taipa, Macao, March 21-24, 2023, pp. 627-638, 2023, IEEE, 978-1-6654-5278-6. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | J. M. Tharinda Rangana Jayawickrama, Subramaniam Thayaparan |
Use of SerDes to Reduce the Cost of Packaging of VLSIs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICIIS ![In: 17th IEEE International Conference on Industrial and Information Systems, ICIIS 2023, Peradeniya, Sri Lanka, August 25-26, 2023, pp. 1-3, 2023, IEEE, 979-8-3503-2362-7. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Yulong Chen, Xiewen Wen, King-Ning Tu, Yingxia Liu |
Fast and Accurate Alignment and Bonding System Based on Advanced Packaging Technology. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICTA ![In: IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2023, Hefei, China, October 27-29, 2023, pp. 1-2, 2023, IEEE, 979-8-3503-4428-8. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Marco Calamo, Adriano De Franceschi, Gabriele De Santis, Francesco Leotta, Civita Mazzaroppi, Jerin George Mathew, Massimo Mecella, Flavia Monti, Claudio Sabatino, Luca Visani, Marco Visani |
TopKontrol: a monitoring and quality control system for the packaging production. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CAiSE Research Projects Exhibition ![In: Proceedings of the Research Projects Exhibition Papers Presented at the 35th International Conference on Advanced Information Systems Engineering (CAiSE 2023), Zaragoza, Spain, June 12-16, 2023., pp. 68-75, 2023, CEUR-WS.org. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP BibTeX RDF |
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14 | Eveline Drijver, Rodrigo Pérez-Dattari, Jens Kober, Cosimo Della Santina, Zlatan Ajanovic |
Robotic Packaging Optimization with Reinforcement Learning. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CASE ![In: 19th IEEE International Conference on Automation Science and Engineering, CASE 2023, Auckland, New Zealand, August 26-30, 2023, pp. 1-7, 2023, IEEE, 979-8-3503-2069-5. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Thi-Thu-Huyen Vu, Dinh-Lam Pham, Tai-Woo Chang |
A YOLO-based Real-time Packaging Defect Detection System. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISM ![In: Proceedings of the 4th International Conference on Industry 4.0 and Smart Manufacturing (ISM 2023), Lisbon, Portugal, 22-24 November 2023., pp. 886-894, 2023, Elsevier. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Raja Swaminathan, Michael J. Schulte, Brett Wilkerson, Gabriel H. Loh, Alan Smith, Norman James |
AMD InstinctTM MI250X Accelerator enabled by Elevated Fanout Bridge Advanced Packaging Architecture. ![Search on Bibsonomy](Pics/bibsonomy.png) |
VLSI Technology and Circuits ![In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan, June 11-16, 2023, pp. 1-2, 2023, IEEE, 978-4-86348-806-9. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Surya Bhattacharya, Vempati Srinivasa Rao |
Multi-Chiplet Heterogeneous Integration Packaging for Semiconductor System Scaling. ![Search on Bibsonomy](Pics/bibsonomy.png) |
VLSI Technology and Circuits ![In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan, June 11-16, 2023, pp. 1-4, 2023, IEEE, 978-4-86348-806-9. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Jochen Wessner |
Sustainability, TRIZ and Packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
TFC ![In: Towards AI-Aided Invention and Innovation - 23rd International TRIZ Future Conference, TFC 2023, Offenburg, Germany, September 12-14, 2023, Proceedings, pp. 175-186, 2023, Springer, 978-3-031-42531-8. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Shaoxiao Nie, Yilong Hao, Fanrui Meng, Chenhchen Gao, Zhenchuan Yang |
A micro and low-cost packaging technology of high accuracy piezoresistive pressure sensors with Parylene coating. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NEMS ![In: 18th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2023, Jeju Island, Korea, Republic of, May 14-17, 2023, pp. 128-131, 2023, IEEE, 979-8-3503-3348-0. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Rong Cao, Guandong Liu, Jie Li, Weihao Wang, Chuanzhi Wang, Lingling Liu, Yuanxing Duan |
Research on the Cooling System for the System-on-Wafer Packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NEMS ![In: 18th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2023, Jeju Island, Korea, Republic of, May 14-17, 2023, pp. 33-36, 2023, IEEE, 979-8-3503-3348-0. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Zejingqiu Chen, Muyang Zhang, Haonan Li, Weijin Guo |
A Novel Method for Packaging Microfluidic Thread-based Analytical Devices by Encapsulating Threads into Thermal Contraction Tubes. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NEMS ![In: 18th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2023, Jeju Island, Korea, Republic of, May 14-17, 2023, pp. 112-115, 2023, IEEE, 979-8-3503-3348-0. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Chen Zhang 0015, Rui Chen, Wenliya Luo, Yu Xie, Wei Zhou, Tao Luo |
Batch Fabrication of Flexible Paper-Based Pressure Sensors via Thermoplastic Self-Packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NEMS ![In: 18th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2023, Jeju Island, Korea, Republic of, May 14-17, 2023, pp. 37-40, 2023, IEEE, 979-8-3503-3348-0. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Jacob Dawes, Tzu-Hsuan Chou, Matthew L. Johnston |
Lab-on-CMOS Packaging using Wafer-Level Molding and Direct-Write 3D-Printed Interconnects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
BioCAS ![In: IEEE Biomedical Circuits and Systems Conference, BioCAS 2023, Toronto, ON, Canada, October 19-21, 2023, pp. 1-5, 2023, IEEE, 979-8-3503-0026-0. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Meidan Deng, Di Wang, Shanglu Zhao, Biyun Zhu |
The Development of a University Express Packaging Recycling System Based on Service Design. ![Search on Bibsonomy](Pics/bibsonomy.png) |
DSIE ![In: Design Studies and Intelligence Engineering - Proceedings of DSIE 2023, Hangzhou, China, 28-29 October 2023, pp. 940-947, 2023, IOS Press, 978-1-64368-488-8. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Fauzi Khair, Maria Loura Christhia, Rahmat Sabani, Gesang Catur Pribadi |
Fast-Moving Consumer Goods (FMCG) Sustainable Strategies: Minimizing Waste in Cereal Packaging Process. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICIMTech ![In: International Conference on Information Management and Technology, ICIMTech 2023, Malang, Indonesia, August 24-25, 2023, pp. 579-584, 2023, IEEE, 979-8-3503-2609-3. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Tomasz Trojanowski |
Food companies' innovations in creating sustainable product packaging on the Polish market. ![Search on Bibsonomy](Pics/bibsonomy.png) |
KES ![In: Knowledge-Based and Intelligent Information & Engineering Systems: Proceedings of the 27th International Conference KES-2023, Athens, Greece, 6-8 September 2023., pp. 720-727, 2023, Elsevier. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Ayoub Chakroun, Yasmina Hani, Sadok Turki, Nidhal Rezg, Abderrahmane El Mhamedi |
Development of Predictive Maintenance Models for a Packaging Robot Based on Machine Learning. ![Search on Bibsonomy](Pics/bibsonomy.png) |
APMS (2) ![In: Advances in Production Management Systems. Production Management Systems for Responsible Manufacturing, Service, and Logistics Futures - IFIP WG 5.7 International Conference, APMS 2023, Trondheim, Norway, September 17-21, 2023, Proceedings, Part II, pp. 674-688, 2023, Springer, 978-3-031-43665-9. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Noma Asako, Naoki Takahashi, Toru Nakata, Takashi Sakamoto, Toshikazu Kato |
Suitable Typefaces for Food Packaging to Express Taste: A Comparative Study of Chinese and Japanese Cultures. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IWCIA ![In: 13th IEEE International Workshop on Computational Intelligence and Applications, IWCIA 2023, Hiroshima, Japan, November 11-12, 2023, pp. 1-6, 2023, IEEE, 979-8-3503-0554-8. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Cristian Muñoz, Ben Dolezal, César Torres 0001 |
Proto-Pack: A Procedural Modular Prototyping Toolkit for Sustainable Packaging Design. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Creativity & Cognition ![In: Creativity and Cognition, C&C 2023, Virtual Event, USA, June 19-21, 2023, pp. 342-345, 2023, ACM. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Yasumitsu Orii |
Semiconductor Packaging Revolution in the Era of Chiplets : Keynote 1. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ITC-Asia ![In: IEEE International Test Conference in Asia, ITC-Asia 2023, Matsue, Japan, September 12-14, 2023, pp. 1, 2023, IEEE, 979-8-3503-1281-2. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Sriharini Krishnakumar, Inna Partin-Vaisband |
Vertical Power Delivery for Emerging Packaging and Integration Platforms - Power Conversion and Distribution. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SOCC ![In: 36th IEEE International System-on-Chip Conference, SOCC 2023, Santa Clara, CA, USA, September 5-8, 2023, pp. 1-6, 2023, IEEE, 979-8-3503-0011-6. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Breno Renato Strüssmann, Lars Hvam |
The Modeling and Simulation of a Pharmaceutical Packaging Line: Balancing the Production Capabilities and Optimizing the Number of Operators. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEM ![In: IEEE International Conference on Industrial Engineering and Engineering Management, IEEM 2023, Singapore, December 18-21, 2023, pp. 198-202, 2023, IEEE, 979-8-3503-2315-3. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Daniel M. Kuchta |
Developments of VCSEL-based transceivers for Co-Packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
OFC ![In: Optical Fiber Communications Conference and Exhibition, OFC 2023, San Diego, CA, USA, March 5-9, 2023, pp. 1-3, 2023, IEEE, 978-1-957171-18-0. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Kazuki Koyama, Koya Narumi, Ken Takaki, Yasushi Kawase, Ari Hautasaari, Yoshihiro Kawahara |
Reusing Cardboard for Packaging Boxes with a Computational Design System. ![Search on Bibsonomy](Pics/bibsonomy.png) |
UIST (Adjunct Volume) ![In: Adjunct Proceedings of the 36th Annual ACM Symposium on User Interface Software and Technology, UIST 2023, San Francisco, CA, USA, 29 October 2023- 1 November 2023, pp. 15:1-15:3, 2023, ACM. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Yasumitsu Orii |
Semiconductor Packaging Revolution in the Era of Chiplets. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICICDT ![In: International Conference on IC Design and Technology, ICICDT 2023, Tokyo, Japan, September 25-28, 2023, pp. ix, 2023, IEEE, 979-8-3503-1931-6. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Rufael Mekuria, Mohamad Raad, Ali C. Begen |
Redundant Encoding and Packaging for Segmented Live Media. ![Search on Bibsonomy](Pics/bibsonomy.png) |
MHV ![In: Proceedings of the 2nd Mile-High Video Conference, MHV 2023, Denver, CO, USA, May 7-10, 2023, pp. 133-134, 2023, ACM. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | William Woodruff |
What Does it Look Like to Code-sign for an Entire Packaging Ecosystem? ![Search on Bibsonomy](Pics/bibsonomy.png) |
SCORED@CCS ![In: Proceedings of the 2023 Workshop on Software Supply Chain Offensive Research and Ecosystem Defenses, SCORED 2023, Copenhagen, Denmark, 30 November 2023, pp. 27, 2023, ACM. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | María de Jesús García-Santiago, Fernando Sánchez-Vega, Adrián Pastor López-Monroy |
Improving Transformer by Instance Packaging for Mental Illnesses Identification. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IberLEF@SEPLN ![In: Proceedings of the Iberian Languages Evaluation Forum (IberLEF 2023) co-located with the Conference of the Spanish Society for Natural Language Processing (SEPLN 2023), Jaén, Spain, September 26, 2023., 2023, CEUR-WS.org. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP BibTeX RDF |
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14 | Christine P. Lee, Bengisu Cagiltay, Dakota Sullivan, Bilge Mutlu |
Demonstrating the Potential of Interactive Product Packaging for Enriching Human-Robot Interaction. ![Search on Bibsonomy](Pics/bibsonomy.png) |
HRI (Companion) ![In: Companion of the 2023 ACM/IEEE International Conference on Human-Robot Interaction, HRI 2023, Stockholm, Sweden, March 13-16, 2023., pp. 899-901, 2023, ACM, 978-1-4503-9970-8. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Yi Dong, Jinjun Duan, Yangjun Liu, Zhendong Dai, Poramate Manoonpong |
Robotic Shoe Packaging Strategies Based on a Single Soft-Gripper System and Extrinsic Resources. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICARM ![In: International Conference on Advanced Robotics and Mechatronics, ICARM 2023, Sanya, China, July 8-10, 2023, pp. 469-475, 2023, IEEE, 979-8-3503-0017-8. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Shuang Wang, Weiliang Chen, Xueqing Li, Leibo Liu, Huazhong Yang |
A 10TFLOPS Datacenter-Oriented GPU with 4-Corner Stacked 64GB Memory by The Means of 2.5D Packaging Technology. ![Search on Bibsonomy](Pics/bibsonomy.png) |
A-SSCC ![In: IEEE Asian Solid-State Circuits Conference, A-SSCC 2023, Haikou, China, November 5-8, 2023, pp. 1-3, 2023, IEEE, 979-8-3503-3003-8. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Tetiana Yemelianenko, Alain Trémeau, Iuliia Tkachenko |
Printed Packaging Authentication: Similarity Metric Learning for Rotogravure Manufacture Process Identification. ![Search on Bibsonomy](Pics/bibsonomy.png) |
VISIGRAPP (4: VISAPP) ![In: Proceedings of the 18th International Joint Conference on Computer Vision, Imaging and Computer Graphics Theory and Applications, VISIGRAPP 2023, Volume 4: VISAPP, Lisbon, Portugal, February 19-21, 2023., pp. 905-911, 2023, SCITEPRESS, 978-989-758-634-7. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Yoshi Malaise, Evan Cole, Beat Signer |
Codeschool in a Box: A Low-Barrier Approach to Packaging Programming Curricula. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CSEDU (1) ![In: Proceedings of the 15th International Conference on Computer Supported Education, CSEDU 2023, Volume 1, Prague - Czech Republic, April 21-23, 2023., pp. 281-288, 2023, SCITEPRESS, 978-989-758-641-5. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Gui-Hua Yang, Zhen-Sheng Wu |
Research on Defect Detection in Aluminum-Plastic Blister Packaging of Pharmaceutical Products Based on Multi-Layer Perceptron. ![Search on Bibsonomy](Pics/bibsonomy.png) |
EBIMCS ![In: Proceedings of the 6th International Conference on E-Business, Information Management and Computer Science, EBIMCS 2023, Hong Kong, SAR, China, December 30-31, 2023, pp. 214-219, 2023, ACM. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | Wenbin Wang, Xiulong Liu, Hao Xu, Wenyu Qu |
An Effective and Robust Transaction Packaging Approach for Multi-leader BFT Blockchain Systems. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SRDS ![In: 42nd International Symposium on Reliable Distributed Systems, SRDS 2023, Marrakesh, Morocco, September 25-29, 2023, pp. 14-24, 2023, IEEE, 979-8-3503-2910-0. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
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14 | José V. C. Vargas, Sam Yang, Juan Carlos Ordonez, Luiz F. Rigatti, Pedro H. R. Peixoto, Wellington Balmant, Andre B. Mariano |
Electronic packaging cabinets simplified modeling, simulation, and experimental validation for systems engineering. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Simul. ![In: Simul. 98(8), pp. 711-725, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
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14 | Madjid Tavana, Akram Shaabani, Debora Di Caprio, Abbas Bonyani |
A novel Interval Type-2 Fuzzy best-worst method and combined compromise solution for evaluating eco-friendly packaging alternatives. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Expert Syst. Appl. ![In: Expert Syst. Appl. 200, pp. 117188, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
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14 | Hyosung Nam, Jihoon Kim, Jooyoung Jeon, Hee-Sauk Jhon, Junghyun Kim 0005 |
High-Performance RF Power Amplifier Module Using Optimum Chip-Level Packaging Structure. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Ind. Electron. ![In: IEEE Trans. Ind. Electron. 69(6), pp. 5660-5668, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
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14 | Zhenjun Wang, Zhenxiang Yi, Run Tian, Ming Qin, Qing-An Huang, Zai-Fa Zhou, Kevin Long |
Analysis and Compensation of Benchmark Drift of Micromachined Thermal Wind Sensor Caused by Packaging Asymmetry. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Ind. Electron. ![In: IEEE Trans. Ind. Electron. 69(1), pp. 950-959, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
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14 | Byanca Porto de Lima, Aneirson Francisco da Silva, Fernando Augusto Silva Marins |
New hybrid AHP-QFD-PROMETHEE decision-making support method in the hesitant fuzzy environment: an application in packaging design selection. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Intell. Fuzzy Syst. ![In: J. Intell. Fuzzy Syst. 42(4), pp. 2881-2897, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
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14 | Siyuan Chen, Danfei Liu, Yumei Pu, Yunfei Zhong |
Advances in deep learning-based image recognition of product packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Image Vis. Comput. ![In: Image Vis. Comput. 128, pp. 104571, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
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14 | Kastriot Dermaku, Liridon Hoti, Selami Klaiqi, Hifoblina Dermaku |
IP Packaging Filtering in Computer Networks Using Artificial Intelligence in the Regulatory Authority of Electronic and Communications Kosovo. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Commun. ![In: J. Commun. 17(2), pp. 134-142, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
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14 | Serguei Stoukatch, Jean-François Fagnard, François Dupont, Philippe Laurent, Marc Debliquy, Jean-Michel Redouté |
Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas Sensors. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Access ![In: IEEE Access 10, pp. 19242-19253, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
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14 | Jian Long |
Dynamic Analysis of Alternative Elements in an Automated Packaging System Based on 5G Internet of Things. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Sensors ![In: J. Sensors 2022, pp. 1-11, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
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14 | Zhenwen Sheng, Guiyun Wang |
Fast Method of Detecting Packaging Bottle Defects Based on ECA-EfficientDet. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Sensors ![In: J. Sensors 2022, pp. 1-9, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
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14 | V. S. N. Sitaramgupta V, Tushar Sakorikar, Hardik J. Pandya |
An MEMS-Based Force Sensor: Packaging and Proprioceptive Force Recognition Through Vibro-Haptic Feedback for Catheters. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Instrum. Meas. ![In: IEEE Trans. Instrum. Meas. 71, pp. 1-11, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
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14 | Michela Borghetti, Edoardo Cantù, Andrea Ponzoni, Emilio Sardini, Mauro Serpelloni |
Aerosol Jet Printed and Photonic Cured Paper-Based Ammonia Sensor for Food Smart Packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Instrum. Meas. ![In: IEEE Trans. Instrum. Meas. 71, pp. 1-10, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
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14 | Stian Soiland-Reyes, Peter Sefton, Mercè Crosas, Leyla Jael Castro, Frederik Coppens, José María Fernández 0001, Daniel Garijo, Björn A. Grüning, Marco La Rosa, Simone Leo, Eoghan Ó Carragáin, Marc Portier, Ana Trisovic, RO-Crate Community, Paul Groth, Carole A. Goble |
Packaging research artefacts with RO-Crate. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Data Sci. ![In: Data Sci. 5(2), pp. 97-138, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
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14 | Chuanwu Liao, Xiaochuan Xia, Xiaofei Yang, Liang Zhang, Guotong Du |
A Novel Optical Path for Enhancing the Performance of High-Power Semiconductor Laser in Packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Symmetry ![In: Symmetry 14(8), pp. 1721, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
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14 | Irma Kremer, Tihomir Tomic, Zvonimir Katancic, Zlata Hrnjak-Murgic, Matko Erceg, Stefano Vecchio Ciprioti, Daniel Rolph Schneider |
Effect of Zeolite Catalyst on the Pyrolysis Kinetics of Multi-Layered Plastic Food Packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Symmetry ![In: Symmetry 14(7), pp. 1362, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
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14 | Ekaterina M. Lorits, Elena A. Gubar, Alexander S. Novikov 0002 |
Design of the Algorithm for Packaging of Water Molecules in a Fixed Volume. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Symmetry ![In: Symmetry 14(11), pp. 2453, November 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
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14 | Menghan Ding |
Application of visual elements in product paper packaging design: An example of the "squirrel" pattern. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Intell. Syst. ![In: J. Intell. Syst. 31(1), pp. 104-112, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
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14 | Gustave Coste, Arnaud Hélias |
PEFAP : Estimating the environmental footprint of food products from packaging data. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Open Source Softw. ![In: J. Open Source Softw. 7(73), pp. 3329, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
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14 | Min Miao, Danya Zhang, Xin Nie, Jingpeng Bu |
A compact and cost effective quasi-in-situ method to characterize broadband RF shielding effectiveness of materials for advanced microelectronic packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. J. ![In: Microelectron. J. 129, pp. 105582, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
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14 | Mohammed Alser, Sharon Waymost, Ram Ayyala, Brendan Lawlor, Richard J. Abdill, Neha Rajkumar, Nathan LaPierre, Jaqueline J. Brito, Andre M. Ribeiro-dos-Santos, Can Firtina, Nour Almadhoun, Varuni Sarwal, Eleazar Eskin, Qiyang Hu, Derek Strong, Byoung-Do Kim, Malak S. Abedalthagafi, Onur Mutlu, Serghei Mangul |
Packaging, containerization, and virtualization of computational omics methods: Advances, challenges, and opportunities. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CoRR ![In: CoRR abs/2203.16261, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
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14 | Naoya Yoshimura, Jaime Morales, Takuya Maekawa, Takahiro Hara |
OpenPack: A Large-scale Dataset for Recognizing Packaging Works in IoT-enabled Logistic Environments. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CoRR ![In: CoRR abs/2212.11152, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
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14 | Davide Dalle Pezze, Denis Deronjic, Chiara Masiero, Diego Tosato, Alessandro Beghi, Gian Antonio Susto |
A Multi-label Continual Learning Framework to Scale Deep Learning Approaches for Packaging Equipment Monitoring. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CoRR ![In: CoRR abs/2208.04227, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
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14 | Tianqi Tang 0001, Yuan Xie 0001 |
Cost-Aware Exploration for Chiplet-Based Architecture with Advanced Packaging Technologies. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CoRR ![In: CoRR abs/2206.07308, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
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