Search results for "packaging"

Hits ?▲	Authors	Title	Venue	Year	Link
14	Yuxuan Lu 0001, Qian Qi, Xi Chen	A Framework of Transaction Packaging in High-throughput Blockchains.	CoRR	2023	DBLP DOI BibTeX RDF
14	Markus Völk, Kilian Kleeberger, Werner Kraus, Richard Bormann	Towards Packaging Unit Detection for Automated Palletizing Tasks.	CoRR	2023	DBLP DOI BibTeX RDF
14	Federico Botta, Robin Lovelace, Laura Gilbert, Arthur E. Turrell	Packaging code for reproducible research in the public sector.	CoRR	2023	DBLP DOI BibTeX RDF
14	Sriharini Krishnakumar, Inna Partin-Vaisband	Vertical Power Delivery for Emerging Packaging and Integration Platforms - Power Conversion and Distribution.	CoRR	2023	DBLP DOI BibTeX RDF
14	Eveline Drijver, Rodrigo Pérez-Dattari, Jens Kober, Cosimo Della Santina, Zlatan Ajanovic	Robotic Packaging Optimization with Reinforcement Learning.	CoRR	2023	DBLP DOI BibTeX RDF
14	Hung-Kai Wang, Yu-Chun Lin, Che-Jung Liang, Ya-Han Wang	Multi-subpopulation parallel computing genetic algorithm for the semiconductor packaging scheduling problem with auxiliary resource constraints.	Appl. Soft Comput.	2023	DBLP DOI BibTeX RDF
14	Ling-Jing Kao, Chih-Chou Chiu, Cheng-Chin Lu, Chung-Yi Wu	Identification and Rating of Workforce Competencies for Manufacturing Process Engineers: Case Study of an IC Packaging Process Engineer.	IEEE Trans. Engineering Management	2023	DBLP DOI BibTeX RDF
14	Jin Fan	Intelligent colour selection method for product packaging design based on particle swarm optimisation.	Int. J. Manuf. Technol. Manag.	2023	DBLP DOI BibTeX RDF
14	Xiao Li 0003, Chengke Wu 0003, Zhile Yang, Yuanjun Guo, Rui Jiang	Knowledge graph-enabled adaptive work packaging approach in modular construction.	Knowl. Based Syst.	2023	DBLP DOI BibTeX RDF
14	Davide Dalle Pezze, Denis Deronjic, Chiara Masiero, Diego Tosato, Alessandro Beghi, Gian Antonio Susto	A multi-label Continual Learning framework to scale deep learning approaches for packaging equipment monitoring.	Eng. Appl. Artif. Intell.	2023	DBLP DOI BibTeX RDF
14	Nina Kasyanenko, Andrei Baryshev, Daria Artamonova, Petr Sokolov	Packaging of DNA Integrated with Metal Nanoparticles in Solution.	Entropy	2023	DBLP DOI BibTeX RDF
14	Takuya Wadatsumi, Kohei Kawai, Rikuu Hasegawa, Kikuo Muramatsu, Hiromu Hasegawa, Takuya Sawada, Takahito Fukushima, Hisashi Kondo, Takuji Miki, Makoto Nagata	Experimental Exploration of the Backside ESD Impacts on an IC Chip in Flip Chip Packaging.	IEICE Trans. Electron.	2023	DBLP DOI BibTeX RDF
14	Makoto Nagata	Design of Circuits and Packaging Systems for Security Chips.	IEICE Trans. Electron.	2023	DBLP DOI BibTeX RDF
14	Lungtai Chen, Chinsheng Chang, Liangju Chien, Borshiun Lee, Wenlo Shieh	A Novel Packaging of the MEMS Gas Sensors Used for Harsh Outdoor and Human Exhale Sampling Applications.	Sensors	2023	DBLP DOI BibTeX RDF
14	Claudia Gonzalez Viejo, Damir D. Torrico, Sigfredo Fuentes	Novel Contactless Sensors for Food, Beverage and Packaging Evaluation.	Sensors	2023	DBLP DOI BibTeX RDF
14	Antonios Georgas, Lampros Nestoras, Aris Ioannis Kanaris, Spyridon Angelopoulos, Angelo Ferraro, Evangelos Hristoforou	Packaging and Optimization of a Capacitive Biosensor and Its Readout Circuit.	Sensors	2023	DBLP DOI BibTeX RDF
14	Yu-Sin You, Yu-Shiang Lin	A Novel Two-Stage Induced Deep Learning System for Classifying Similar Drugs with Diverse Packaging.	Sensors	2023	DBLP DOI BibTeX RDF
14	Xiu Cheng, Jiameng Yang, Linling Zhang	Express packaging waste recycling: Stakeholders' dynamic behavioral changes based on a computational evolutionary game theoretic approach.	Comput. Ind. Eng.	2023	DBLP DOI BibTeX RDF
14	Elham Zafarani, Mahsa Ghandehari	A game theoretic framework for post-consumer recycled and new packaging industries.	Comput. Ind. Eng.	2023	DBLP DOI BibTeX RDF
14	Michael Simonis, Stefan Nickel	A simulation-optimization approach for a cyclic production scheme in a tablets packaging process.	Comput. Ind. Eng.	2023	DBLP DOI BibTeX RDF
14	Tommaso Schettini, Federico Malucelli, Helena Ramalhinho	Scheduling a pick and place packaging line.	J. Sched.	2023	DBLP DOI BibTeX RDF
14	Rafael García-Jiménez, J. Carlos García-Díaz, Alexander D. Pulido-Rojano	Bicriteria food packaging process optimization in double-layered upright and diagonal multihead weighers.	J. Comput. Appl. Math.	2023	DBLP DOI BibTeX RDF
14	Li Quan	Quality evaluation method of agricultural product packaging image based on structural similarity and MTF.	Clust. Comput.	2023	DBLP DOI BibTeX RDF
14	Hwee Ling Siek, Yek Ming Liew, Kay Hooi Keoy, Aswani Kumar Cherukuri	A Study of the Corporate Design Packaging of Malaysia's Processed Food.	J. Inf. Knowl. Manag.	2023	DBLP DOI BibTeX RDF
14	Maria Poli, Konstantinos Malagas, Spyridon Nomikos, Apostolos Papapostolou, Grigorios Vlassas	The Interaction of People with Disabilities with the Intelligent Packaging.	NiDS (2)	2023	DBLP DOI BibTeX RDF
14	Maria Poli, Konstantinos Malagas, Spyridon Nomikos	The Interaction of Disabled People and New Forms of Packaging: A Holistic Approach.	NiDS (1)	2023	DBLP DOI BibTeX RDF
14	Jitender Madaan, Gulshan Kumar Gaur, Sachin Kumar Mangla, Sanjeev Gupta	MCDM Approach for Prioritizing Barriers to Improve Performance of Sustainability-Focused Packaging Supply Chain.	SIET	2023	DBLP DOI BibTeX RDF
14	Murshedul Arifeen, Andrei Petrovski 0001	Bayesian Optimized Autoencoder for Predictive Maintenance of Smart Packaging Machines.	ICPS	2023	DBLP DOI BibTeX RDF
14	Ouyang Li, Xiansi Zeng, Jie Ling	Influence Factors of Green Packaging on Consumers' Willingness to Accept Festive Gifts.	HCI (46)	2023	DBLP DOI BibTeX RDF
14	Dingwei Zhang, Jingwen Tian, Hongtao Zhou	Research on Interactive Packaging Design Based on User's Emotional Experience.	HCI (46)	2023	DBLP DOI BibTeX RDF
14	Ouyang Li, Xiansi Zeng, Yue Zhao, Han Li	Analysis and Exploration of Sustainable Design of Packaging Structure Based on Pentaward and Dieline Award-Winning Cases.	HCI (12)	2023	DBLP DOI BibTeX RDF
14	Rattana Ceesay, Thapana Boonchoo, Prapaporn Rattanatamrong	Machine Learning Approaches for Quality Control in Pulp Packaging Manufacturers.	JCSSE	2023	DBLP DOI BibTeX RDF
14	Markus Völk, Kilian Kleeberger, Werner Kraus, Richard Bormann	Towards Packaging Unit Detection for Automated Palletizing Tasks.	IROS	2023	DBLP DOI BibTeX RDF
14	Chi-Wei Wang, Che-Pei Chang, Chang-Chun Lee	Demonstration on Warpage Estimation Approach Utilized in Fan-Out Panel-Level Packaging Enabled by Multi-Scale Process-Oriented Simulation.	IRPS	2023	DBLP DOI BibTeX RDF
14	Jorge Mendoza, Jimmy-Bao Le, Choong-Un Kim, Hung-Yun Lin	Advanced Methods of Detecting Physical Damages in Packaging and BEOL Interconnects.	IRPS	2023	DBLP DOI BibTeX RDF
14	Celine Kelma Carranza, Alvaro Lizardo Eyzaguirre, Fernando Maradiegue	Inventory Management Model for The Packaging Process of Perishable Foods for Export in Latin America.	ICIBE	2023	DBLP DOI BibTeX RDF
14	Wenchao Fang	A Game Study on Green Packaging of Takeaway Food Considering Government Regulation.	ICIBE	2023	DBLP DOI BibTeX RDF
14	Lukang Wang, You Zhao, Yu Yang, Yabing Wang, Yulong Zhao	High Temperature Characteristics of Piezoresistive Silicon Carbide Pressure Sensors Implemented by Leadless Packaging.	SENSORS	2023	DBLP DOI BibTeX RDF
14	Mingyue Li, Xiaojia Zhang, Yanrou Mi, Fangyunhao Long, Jinyu Ma, Xin Zhao, Bo Cheng, Haobo Zhang, Yongmin Cao, Pengtao Li	Express packaging cycle machine based on artificial intelligence.	IoTAAI	2023	DBLP DOI BibTeX RDF
14	Cheng Li, Na Lu, Yang Li, Yao Wei, Ning Jin	Innovative Solutions and Applications of 5G Smart Factory for Chip Packaging.	IWCMC	2023	DBLP DOI BibTeX RDF
14	Jiajun Chen, Hongpeng Yin, Yan Qin, Dandan Zhao, Weijie Jiang	A Supervised Contrast Focus Neural Network for LED packaging defects classification.	SAFEPROCESS	2023	DBLP DOI BibTeX RDF
14	Haiqiao Gu, Hao He 0012, Minghui Zhou 0001	Self-Admitted Library Migrations in Java, JavaScript, and Python Packaging Ecosystems: A Comparative Study.	SANER	2023	DBLP DOI BibTeX RDF
14	J. M. Tharinda Rangana Jayawickrama, Subramaniam Thayaparan	Use of SerDes to Reduce the Cost of Packaging of VLSIs.	ICIIS	2023	DBLP DOI BibTeX RDF
14	Yulong Chen, Xiewen Wen, King-Ning Tu, Yingxia Liu	Fast and Accurate Alignment and Bonding System Based on Advanced Packaging Technology.	ICTA	2023	DBLP DOI BibTeX RDF
14	Marco Calamo, Adriano De Franceschi, Gabriele De Santis, Francesco Leotta, Civita Mazzaroppi, Jerin George Mathew, Massimo Mecella, Flavia Monti, Claudio Sabatino, Luca Visani, Marco Visani	TopKontrol: a monitoring and quality control system for the packaging production.	CAiSE Research Projects Exhibition	2023	DBLP BibTeX RDF
14	Eveline Drijver, Rodrigo Pérez-Dattari, Jens Kober, Cosimo Della Santina, Zlatan Ajanovic	Robotic Packaging Optimization with Reinforcement Learning.	CASE	2023	DBLP DOI BibTeX RDF
14	Thi-Thu-Huyen Vu, Dinh-Lam Pham, Tai-Woo Chang	A YOLO-based Real-time Packaging Defect Detection System.	ISM	2023	DBLP DOI BibTeX RDF
14	Raja Swaminathan, Michael J. Schulte, Brett Wilkerson, Gabriel H. Loh, Alan Smith, Norman James	AMD InstinctTM MI250X Accelerator enabled by Elevated Fanout Bridge Advanced Packaging Architecture.	VLSI Technology and Circuits	2023	DBLP DOI BibTeX RDF
14	Surya Bhattacharya, Vempati Srinivasa Rao	Multi-Chiplet Heterogeneous Integration Packaging for Semiconductor System Scaling.	VLSI Technology and Circuits	2023	DBLP DOI BibTeX RDF
14	Jochen Wessner	Sustainability, TRIZ and Packaging.	TFC	2023	DBLP DOI BibTeX RDF
14	Shaoxiao Nie, Yilong Hao, Fanrui Meng, Chenhchen Gao, Zhenchuan Yang	A micro and low-cost packaging technology of high accuracy piezoresistive pressure sensors with Parylene coating.	NEMS	2023	DBLP DOI BibTeX RDF
14	Rong Cao, Guandong Liu, Jie Li, Weihao Wang, Chuanzhi Wang, Lingling Liu, Yuanxing Duan	Research on the Cooling System for the System-on-Wafer Packaging.	NEMS	2023	DBLP DOI BibTeX RDF
14	Zejingqiu Chen, Muyang Zhang, Haonan Li, Weijin Guo	A Novel Method for Packaging Microfluidic Thread-based Analytical Devices by Encapsulating Threads into Thermal Contraction Tubes.	NEMS	2023	DBLP DOI BibTeX RDF
14	Chen Zhang 0015, Rui Chen, Wenliya Luo, Yu Xie, Wei Zhou, Tao Luo	Batch Fabrication of Flexible Paper-Based Pressure Sensors via Thermoplastic Self-Packaging.	NEMS	2023	DBLP DOI BibTeX RDF
14	Jacob Dawes, Tzu-Hsuan Chou, Matthew L. Johnston	Lab-on-CMOS Packaging using Wafer-Level Molding and Direct-Write 3D-Printed Interconnects.	BioCAS	2023	DBLP DOI BibTeX RDF
14	Meidan Deng, Di Wang, Shanglu Zhao, Biyun Zhu	The Development of a University Express Packaging Recycling System Based on Service Design.	DSIE	2023	DBLP DOI BibTeX RDF
14	Fauzi Khair, Maria Loura Christhia, Rahmat Sabani, Gesang Catur Pribadi	Fast-Moving Consumer Goods (FMCG) Sustainable Strategies: Minimizing Waste in Cereal Packaging Process.	ICIMTech	2023	DBLP DOI BibTeX RDF
14	Tomasz Trojanowski	Food companies' innovations in creating sustainable product packaging on the Polish market.	KES	2023	DBLP DOI BibTeX RDF
14	Ayoub Chakroun, Yasmina Hani, Sadok Turki, Nidhal Rezg, Abderrahmane El Mhamedi	Development of Predictive Maintenance Models for a Packaging Robot Based on Machine Learning.	APMS (2)	2023	DBLP DOI BibTeX RDF
14	Noma Asako, Naoki Takahashi, Toru Nakata, Takashi Sakamoto, Toshikazu Kato	Suitable Typefaces for Food Packaging to Express Taste: A Comparative Study of Chinese and Japanese Cultures.	IWCIA	2023	DBLP DOI BibTeX RDF
14	Cristian Muñoz, Ben Dolezal, César Torres 0001	Proto-Pack: A Procedural Modular Prototyping Toolkit for Sustainable Packaging Design.	Creativity & Cognition	2023	DBLP DOI BibTeX RDF
14	Yasumitsu Orii	Semiconductor Packaging Revolution in the Era of Chiplets : Keynote 1.	ITC-Asia	2023	DBLP DOI BibTeX RDF
14	Sriharini Krishnakumar, Inna Partin-Vaisband	Vertical Power Delivery for Emerging Packaging and Integration Platforms - Power Conversion and Distribution.	SOCC	2023	DBLP DOI BibTeX RDF
14	Breno Renato Strüssmann, Lars Hvam	The Modeling and Simulation of a Pharmaceutical Packaging Line: Balancing the Production Capabilities and Optimizing the Number of Operators.	IEEM	2023	DBLP DOI BibTeX RDF
14	Daniel M. Kuchta	Developments of VCSEL-based transceivers for Co-Packaging.	OFC	2023	DBLP DOI BibTeX RDF
14	Kazuki Koyama, Koya Narumi, Ken Takaki, Yasushi Kawase, Ari Hautasaari, Yoshihiro Kawahara	Reusing Cardboard for Packaging Boxes with a Computational Design System.	UIST (Adjunct Volume)	2023	DBLP DOI BibTeX RDF
14	Yasumitsu Orii	Semiconductor Packaging Revolution in the Era of Chiplets.	ICICDT	2023	DBLP DOI BibTeX RDF
14	Rufael Mekuria, Mohamad Raad, Ali C. Begen	Redundant Encoding and Packaging for Segmented Live Media.	MHV	2023	DBLP DOI BibTeX RDF
14	William Woodruff	What Does it Look Like to Code-sign for an Entire Packaging Ecosystem?	SCORED@CCS	2023	DBLP DOI BibTeX RDF
14	María de Jesús García-Santiago, Fernando Sánchez-Vega, Adrián Pastor López-Monroy	Improving Transformer by Instance Packaging for Mental Illnesses Identification.	IberLEF@SEPLN	2023	DBLP BibTeX RDF
14	Christine P. Lee, Bengisu Cagiltay, Dakota Sullivan, Bilge Mutlu	Demonstrating the Potential of Interactive Product Packaging for Enriching Human-Robot Interaction.	HRI (Companion)	2023	DBLP DOI BibTeX RDF
14	Yi Dong, Jinjun Duan, Yangjun Liu, Zhendong Dai, Poramate Manoonpong	Robotic Shoe Packaging Strategies Based on a Single Soft-Gripper System and Extrinsic Resources.	ICARM	2023	DBLP DOI BibTeX RDF
14	Shuang Wang, Weiliang Chen, Xueqing Li, Leibo Liu, Huazhong Yang	A 10TFLOPS Datacenter-Oriented GPU with 4-Corner Stacked 64GB Memory by The Means of 2.5D Packaging Technology.	A-SSCC	2023	DBLP DOI BibTeX RDF
14	Tetiana Yemelianenko, Alain Trémeau, Iuliia Tkachenko	Printed Packaging Authentication: Similarity Metric Learning for Rotogravure Manufacture Process Identification.	VISIGRAPP (4: VISAPP)	2023	DBLP DOI BibTeX RDF
14	Yoshi Malaise, Evan Cole, Beat Signer	Codeschool in a Box: A Low-Barrier Approach to Packaging Programming Curricula.	CSEDU (1)	2023	DBLP DOI BibTeX RDF
14	Gui-Hua Yang, Zhen-Sheng Wu	Research on Defect Detection in Aluminum-Plastic Blister Packaging of Pharmaceutical Products Based on Multi-Layer Perceptron.	EBIMCS	2023	DBLP DOI BibTeX RDF
14	Wenbin Wang, Xiulong Liu, Hao Xu, Wenyu Qu	An Effective and Robust Transaction Packaging Approach for Multi-leader BFT Blockchain Systems.	SRDS	2023	DBLP DOI BibTeX RDF
14	José V. C. Vargas, Sam Yang, Juan Carlos Ordonez, Luiz F. Rigatti, Pedro H. R. Peixoto, Wellington Balmant, Andre B. Mariano	Electronic packaging cabinets simplified modeling, simulation, and experimental validation for systems engineering.	Simul.	2022	DBLP DOI BibTeX RDF
14	Madjid Tavana, Akram Shaabani, Debora Di Caprio, Abbas Bonyani	A novel Interval Type-2 Fuzzy best-worst method and combined compromise solution for evaluating eco-friendly packaging alternatives.	Expert Syst. Appl.	2022	DBLP DOI BibTeX RDF
14	Hyosung Nam, Jihoon Kim, Jooyoung Jeon, Hee-Sauk Jhon, Junghyun Kim 0005	High-Performance RF Power Amplifier Module Using Optimum Chip-Level Packaging Structure.	IEEE Trans. Ind. Electron.	2022	DBLP DOI BibTeX RDF
14	Zhenjun Wang, Zhenxiang Yi, Run Tian, Ming Qin, Qing-An Huang, Zai-Fa Zhou, Kevin Long	Analysis and Compensation of Benchmark Drift of Micromachined Thermal Wind Sensor Caused by Packaging Asymmetry.	IEEE Trans. Ind. Electron.	2022	DBLP DOI BibTeX RDF
14	Byanca Porto de Lima, Aneirson Francisco da Silva, Fernando Augusto Silva Marins	New hybrid AHP-QFD-PROMETHEE decision-making support method in the hesitant fuzzy environment: an application in packaging design selection.	J. Intell. Fuzzy Syst.	2022	DBLP DOI BibTeX RDF
14	Siyuan Chen, Danfei Liu, Yumei Pu, Yunfei Zhong	Advances in deep learning-based image recognition of product packaging.	Image Vis. Comput.	2022	DBLP DOI BibTeX RDF
14	Kastriot Dermaku, Liridon Hoti, Selami Klaiqi, Hifoblina Dermaku	IP Packaging Filtering in Computer Networks Using Artificial Intelligence in the Regulatory Authority of Electronic and Communications Kosovo.	J. Commun.	2022	DBLP DOI BibTeX RDF
14	Serguei Stoukatch, Jean-François Fagnard, François Dupont, Philippe Laurent, Marc Debliquy, Jean-Michel Redouté	Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas Sensors.	IEEE Access	2022	DBLP DOI BibTeX RDF
14	Jian Long	Dynamic Analysis of Alternative Elements in an Automated Packaging System Based on 5G Internet of Things.	J. Sensors	2022	DBLP DOI BibTeX RDF
14	Zhenwen Sheng, Guiyun Wang	Fast Method of Detecting Packaging Bottle Defects Based on ECA-EfficientDet.	J. Sensors	2022	DBLP DOI BibTeX RDF
14	V. S. N. Sitaramgupta V, Tushar Sakorikar, Hardik J. Pandya	An MEMS-Based Force Sensor: Packaging and Proprioceptive Force Recognition Through Vibro-Haptic Feedback for Catheters.	IEEE Trans. Instrum. Meas.	2022	DBLP DOI BibTeX RDF
14	Michela Borghetti, Edoardo Cantù, Andrea Ponzoni, Emilio Sardini, Mauro Serpelloni	Aerosol Jet Printed and Photonic Cured Paper-Based Ammonia Sensor for Food Smart Packaging.	IEEE Trans. Instrum. Meas.	2022	DBLP DOI BibTeX RDF
14	Stian Soiland-Reyes, Peter Sefton, Mercè Crosas, Leyla Jael Castro, Frederik Coppens, José María Fernández 0001, Daniel Garijo, Björn A. Grüning, Marco La Rosa, Simone Leo, Eoghan Ó Carragáin, Marc Portier, Ana Trisovic, RO-Crate Community, Paul Groth, Carole A. Goble	Packaging research artefacts with RO-Crate.	Data Sci.	2022	DBLP DOI BibTeX RDF
14	Chuanwu Liao, Xiaochuan Xia, Xiaofei Yang, Liang Zhang, Guotong Du	A Novel Optical Path for Enhancing the Performance of High-Power Semiconductor Laser in Packaging.	Symmetry	2022	DBLP DOI BibTeX RDF
14	Irma Kremer, Tihomir Tomic, Zvonimir Katancic, Zlata Hrnjak-Murgic, Matko Erceg, Stefano Vecchio Ciprioti, Daniel Rolph Schneider	Effect of Zeolite Catalyst on the Pyrolysis Kinetics of Multi-Layered Plastic Food Packaging.	Symmetry	2022	DBLP DOI BibTeX RDF
14	Ekaterina M. Lorits, Elena A. Gubar, Alexander S. Novikov 0002	Design of the Algorithm for Packaging of Water Molecules in a Fixed Volume.	Symmetry	2022	DBLP DOI BibTeX RDF
14	Menghan Ding	Application of visual elements in product paper packaging design: An example of the "squirrel" pattern.	J. Intell. Syst.	2022	DBLP DOI BibTeX RDF
14	Gustave Coste, Arnaud Hélias	PEFAP : Estimating the environmental footprint of food products from packaging data.	J. Open Source Softw.	2022	DBLP DOI BibTeX RDF
14	Min Miao, Danya Zhang, Xin Nie, Jingpeng Bu	A compact and cost effective quasi-in-situ method to characterize broadband RF shielding effectiveness of materials for advanced microelectronic packaging.	Microelectron. J.	2022	DBLP DOI BibTeX RDF
14	Mohammed Alser, Sharon Waymost, Ram Ayyala, Brendan Lawlor, Richard J. Abdill, Neha Rajkumar, Nathan LaPierre, Jaqueline J. Brito, Andre M. Ribeiro-dos-Santos, Can Firtina, Nour Almadhoun, Varuni Sarwal, Eleazar Eskin, Qiyang Hu, Derek Strong, Byoung-Do Kim, Malak S. Abedalthagafi, Onur Mutlu, Serghei Mangul	Packaging, containerization, and virtualization of computational omics methods: Advances, challenges, and opportunities.	CoRR	2022	DBLP DOI BibTeX RDF
14	Naoya Yoshimura, Jaime Morales, Takuya Maekawa, Takahiro Hara	OpenPack: A Large-scale Dataset for Recognizing Packaging Works in IoT-enabled Logistic Environments.	CoRR	2022	DBLP DOI BibTeX RDF
14	Davide Dalle Pezze, Denis Deronjic, Chiara Masiero, Diego Tosato, Alessandro Beghi, Gian Antonio Susto	A Multi-label Continual Learning Framework to Scale Deep Learning Approaches for Packaging Equipment Monitoring.	CoRR	2022	DBLP DOI BibTeX RDF
14	Tianqi Tang 0001, Yuan Xie 0001	Cost-Aware Exploration for Chiplet-Based Architecture with Advanced Packaging Technologies.	CoRR	2022	DBLP DOI BibTeX RDF