Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
88 | Anatole Lécuyer, Jean-Marie Burkhardt, Chee-Hian Tan |
A study of the modification of the speed and size of the cursor for simulating pseudo-haptic bumps and holes. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ACM Trans. Appl. Percept. ![In: ACM Trans. Appl. Percept. 5(3), pp. 14:1-14:21, 2008. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
control/display ratio, texture, size, speed, cursor, hole, Pseudo-haptic, bump |
71 | Stephen Coombes |
Waves, bumps, and patterns in neural field theories. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Biol. Cybern. ![In: Biol. Cybern. 93(2), pp. 91-108, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
Neural field theories, Evans functions, Integral equations, Waves, Bumps |
55 | Anatole Lécuyer, Jean-Marie Burkhardt, Laurent Étienne |
Feeling bumps and holes without a haptic interface: the perception of pseudo-haptic textures. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CHI ![In: Proceedings of the 2004 Conference on Human Factors in Computing Systems, CHI 2004, Vienna, Austria, April 24 - 29, 2004, pp. 239-246, 2004, ACM, 1-58113-702-8. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
bump and hole, control/display ratio, texture, pseudo-haptic |
49 | Marc Olano, Dan Baker |
LEAN mapping. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SI3D ![In: Proceedings of the 2010 Symposium on Interactive 3D Graphics, SI3D 2010, February 19-21, 2010, Washington, DC, USA, pp. 181-188, 2010, ACM, 978-1-60558-939-8. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
MIP mapping, texture filtering, bump maps, shading models |
49 | Hsiu-Ming Chang 0001, Jiun-Lang Huang, Ding-Ming Kwai, Kwang-Ting (Tim) Cheng, Cheng-Wen Wu |
An error tolerance scheme for 3D CMOS imagers. ![Search on Bibsonomy](Pics/bibsonomy.png) |
DAC ![In: Proceedings of the 47th Design Automation Conference, DAC 2010, Anaheim, California, USA, July 13-18, 2010, pp. 917-922, 2010, ACM, 978-1-4503-0002-5. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
image sensor, error tolerance, 3D IC |
33 | Jun Ohta, Takahashi Tokuda, Keiichiro Kagawa, Akihiro Uehara, Yasuo Terasawa, Kazuaki Nakauchi, Takashi Fujikado, Yasuo Tano |
A multi-microchip retinal stimulator for in vitro / in vivo experiments. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISCAS ![In: International Symposium on Circuits and Systems (ISCAS 2007), 27-20 May 2007, New Orleans, Louisiana, USA, pp. 2024-2027, 2007, IEEE, 1-4244-0920-9. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
33 | Christopher P. Fall, Timothy J. Lewis, John Rinzel |
Background-activity-dependent properties of a network model for working memory that incorporates cellular bistability. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Biol. Cybern. ![In: Biol. Cybern. 93(2), pp. 109-118, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
|
33 | Paul C. Bressloff |
Spontaneous symmetry breaking in self-organizing neural fields. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Biol. Cybern. ![In: Biol. Cybern. 93(4), pp. 256-274, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
|
33 | Thomas Pietrzak, Benoît Martin, Isabelle Pecci |
Affichage d'informations par des impulsions haptiques. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IHM ![In: Proceedings of the 17th international conference on Francophone sur l'Interaction Homme-Machine, IHM 2005, Toulouse, France, September 27-30, 2005, pp. 223-226, 2005, ACM, 1-59593-192-9. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
force feedback, multi-modality, information display |
33 | Aoying Zhou, Shouke Qin, Weining Qian |
Adaptively Detecting Aggregation Bursts in Data Streams. ![Search on Bibsonomy](Pics/bibsonomy.png) |
DASFAA ![In: Database Systems for Advanced Applications, 10th International Conference, DASFAA 2005, Beijing, China, April 17-20, 2005, Proceedings, pp. 435-446, 2005, Springer, 3-540-25334-3. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
|
33 | Vijay Karamcheti, Davi Geiger, Zvi M. Kedem, S. Muthukrishnan 0001 |
Detecting malicious network traffic using inverse distributions of packet contents. ![Search on Bibsonomy](Pics/bibsonomy.png) |
MineNet ![In: Proceedings of the 1st Annual ACM Workshop on Mining Network Data, MineNet 2005, Philadelphia, Pennsylvania, USA, August 26, 2005, pp. 165-170, 2005, ACM, 1-59593-026-4. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
inverse distribution, worms, content analysis |
33 | Koichi Onoue, Nelson Max, Tomoyuki Nishita |
Real-Time Rendering of Bumpmap Shadows Taking Account of Surface Curvature. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CW ![In: 3rd International Conference on Cyberworlds (CW 2004), 18-20 November 2004, Tokyo, Japan, pp. 312-318, 2004, IEEE Computer Society, 0-7695-2140-1. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
horizon map, graphics hardware, shadows, curvature, bump-mapping |
33 | Chirag S. Patel |
Silicon carrier for computer systems. ![Search on Bibsonomy](Pics/bibsonomy.png) |
DAC ![In: Proceedings of the 43rd Design Automation Conference, DAC 2006, San Francisco, CA, USA, July 24-28, 2006, pp. 857-862, 2006, ACM, 1-59593-381-6. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
chip-package co-design, electrical modeling, micro-bumps, silicon carrier, computer system, CMOS scaling, system on package |
22 | Heather L. Cihak, Zachary P. Kilpatrick |
Multiscale Motion and Deformation of Bumps in Stochastic Neural Fields with Dynamic Connectivity. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Multiscale Model. Simul. ![In: Multiscale Model. Simul. 22(1), pp. 178-203, March 2024. The full citation details ...](Pics/full.jpeg) |
2024 |
DBLP DOI BibTeX RDF |
|
22 | Ruochen Wang, Xiaoguo Luo, Qing Ye, Yu Jiang, Wei Liu 0109 |
Research on Visual Perception of Speed Bumps for Intelligent Connected Vehicles Based on Lightweight FPNet. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 24(7), pp. 2130, April 2024. The full citation details ...](Pics/full.jpeg) |
2024 |
DBLP DOI BibTeX RDF |
|
22 | Mirai Azechi, Shogo Okamoto |
Bumps and Dents are Not Perceptually Opposite When Exploring With Lateral Force Cues. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Haptics ![In: IEEE Trans. Haptics 17(1), pp. 52-57, January - March 2024. The full citation details ...](Pics/full.jpeg) |
2024 |
DBLP DOI BibTeX RDF |
|
22 | Amir Salman, Adnan Noor Mian |
Deep learning based speed bumps detection and characterization using smartphone sensors. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Pervasive Mob. Comput. ![In: Pervasive Mob. Comput. 92, pp. 101805, 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
22 | Melvin Mokhtari, Amirreza Hosseini, Alireza Habibi, Adel Karshenas, Ali Amoomahdi |
Intelligent Traffic Control with Smart Speed Bumps. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CoRR ![In: CoRR abs/2307.00433, 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
22 | Sai Pentapati, Anthony Agnesina, Moritz Brunion, Yen-Hsiang Huang, Sung Kyu Lim |
On Legalization of Die Bonding Bumps and Pads for 3D ICs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISPD ![In: Proceedings of the 2023 International Symposium on Physical Design, ISPD 2023, Virtual Event, USA, March 26-29, 2023, pp. 62-70, 2023, ACM, 978-1-4503-9978-4. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
22 | Akemi Gálvez, Iztok Fister Jr., Lihua You, Iztok Fister 0001, Andrés Iglesias 0001 |
Artificial Immune Systems Approach for Surface Reconstruction of Shapes with Large Smooth Bumps. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCS (4) ![In: Computational Science - ICCS 2023 - 23rd International Conference, Prague, Czech Republic, July 3-5, 2023, Proceedings, Part IV, pp. 297-310, 2023, Springer, 978-3-031-36026-8. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
22 | Ayaka Ishii, Kentaro Yasu |
FluxTangible: Simple and Dynamic Haptic Tangible with Bumps and Vibrations. ![Search on Bibsonomy](Pics/bibsonomy.png) |
UIST (Adjunct Volume) ![In: Adjunct Proceedings of the 36th Annual ACM Symposium on User Interface Software and Technology, UIST 2023, San Francisco, CA, USA, 29 October 2023- 1 November 2023, pp. 63:1-63:3, 2023, ACM. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
22 | Xuan Xiao, Ruipeng Gao, Weiwei Xing, Chi Li, Lei Liu |
How Many Bumps in Your City? Personalized Bump Seeker With Mobile Crowdsensing. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Instrum. Meas. ![In: IEEE Trans. Instrum. Meas. 71, pp. 1-12, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
22 | Patrick McLaughlin, Christopher Vagg |
A New Method of Vehicle Positioning Using Bumps and Road Surface Defects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Intell. Transp. Syst. ![In: IEEE Trans. Intell. Transp. Syst. 23(8), pp. 13655-13665, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
22 | Raymond Wang, Louis Kang |
Multiple bumps can enhance robustness to noise in continuous attractor networks. ![Search on Bibsonomy](Pics/bibsonomy.png) |
PLoS Comput. Biol. ![In: PLoS Comput. Biol. 18(10), pp. 1010547, October 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
22 | Xiaoying Sun, Chen Zhang, Guohong Liu |
Improved Tactile Perception of 3D Geometric Bumps Using Coupled Electrovibration and Mechanical Vibration Stimuli. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Comput. J. ![In: Comput. J. 65(3), pp. 621-630, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
22 | Fengwei Dai, David Wei Zhang, Yangyang Yan, Guojun Wang 0001, Liqiang Cao |
Research on Ni3Sn4 intermetallic compound for 5μm diameter Cu/Ni/Sn-3.0Ag micro bumps. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEICE Electron. Express ![In: IEICE Electron. Express 19(2), pp. 20210453, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
22 | Yahui Sun 0001, Shuai Ma 0001, Bin Cui 0001 |
Hunting Temporal Bumps in Graphs with Dynamic Vertex Properties. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SIGMOD Conference ![In: SIGMOD '22: International Conference on Management of Data, Philadelphia, PA, USA, June 12 - 17, 2022, pp. 874-888, 2022, ACM, 978-1-4503-9249-5. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
22 | Mirai Azechi, Shogo Okamoto |
Combined virtual bumps and textures on electrostatic friction tactile displays. ![Search on Bibsonomy](Pics/bibsonomy.png) |
GCCE ![In: 11th IEEE Global Conference on Consumer Electronics, GCCE 2022, Osaka, Japan, October 18-21, 2022, pp. 315-317, 2022, IEEE, 978-1-6654-9232-4. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
22 | Manuel Ricardo Carlos, Luis Carlos González-Gurrola, Johan Wahlström, Raymundo Cornejo, Fernando Martínez-Reyes |
Becoming Smarter at Characterizing Potholes and Speed Bumps from Smartphone Data - Introducing a Second-Generation Inference Problem. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Mob. Comput. ![In: IEEE Trans. Mob. Comput. 20(2), pp. 366-376, 2021. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
22 | |
Designing an IoT based autonomous vehicle meant for detecting speed bumps and lanes on roads. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Ambient Intell. Humaniz. Comput. ![In: J. Ambient Intell. Humaniz. Comput. 12(7), pp. 7417-7426, 2021. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
22 | Tamara Lopez, Helen Sharp, Marian Petre, Bashar Nuseibeh |
Bumps in the Code: Error Handling During Software Development. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Softw. ![In: IEEE Softw. 38(3), pp. 26-34, 2021. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
22 | Zhe Shu, Michael Fechtig, Florian Lombeck, Matthias Breitwieser, Roland Zengerle, Peter Koltay |
Direct Drop-on-Demand Printing of Molten Solder Bumps on ENIG Finishing at Ambient Conditions Through StarJet Technology. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Access ![In: IEEE Access 8, pp. 210225-210233, 2020. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
22 | Tomoya Fujihashi, Fumitoshi Suga, Ryoma Araki, Jyun Kido, Takashi Abe, Masayuki Sohgawa |
Tactile Sensor with High-Density Microcantilever and Multiple PDMS Bumps for Contact Detection. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Robotics Mechatronics ![In: J. Robotics Mechatronics 32(2), pp. 297-304, 2020. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
22 | Olaide Ayodeji Agbolade |
Radio Frequency Speed Bumps for Near-Zero Speed Zone Control in Nigeria. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CoRR ![In: CoRR abs/2009.00869, 2020. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP BibTeX RDF |
|
22 | Benjamin Kunsberg, Steven W. Zucker |
From Boundaries to Bumps: when closed (extremal) contours are critical. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CoRR ![In: CoRR abs/2005.08116, 2020. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP BibTeX RDF |
|
22 | Yahui Sun 0001, Jun Luo 0001, Theodoros Lappas, Xiaokui Xiao, Bin Cui 0001 |
Hunting multiple bumps in graphs. (PDF / PS) ![Search on Bibsonomy](Pics/bibsonomy.png) |
Proc. VLDB Endow. ![In: Proc. VLDB Endow. 13(5), pp. 656-669, 2020. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
22 | Ganesh Mani, Tom Hope |
Viral Science: Masks, Speed Bumps, and Guard Rails. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Patterns ![In: Patterns 1(6), pp. 100101, 2020. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
22 | Jyun-Ru Jiang, Yun-Chih Kuo, Simon Yi-Hung Chen, Hung-Ming Chen |
On Pre-Assignment Route Prototyping for Irregular Bumps on BGA Packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
DATE ![In: 2020 Design, Automation & Test in Europe Conference & Exhibition, DATE 2020, Grenoble, France, March 9-13, 2020, pp. 1311-1314, 2020, IEEE, 978-3-9819263-4-7. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
22 | Takaya Ishimaru, Satoshi Saga |
Virtual bumps display based on electrical muscle stimulation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
HAPTICS ![In: 2020 IEEE Haptics Symposium, HAPTICS 2020, Crystal City, VA, USA, March 28-31, 2020, pp. 96-101, 2020, IEEE, 978-1-7281-0234-4. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
22 | Manish Saggar, Hua Xie, Roger E. Beaty, Atanas D. Stankov, Meredith Schreier, Allan L. Reiss |
Creativity slumps and bumps: Examining the neurobehavioral basis of creativity development during middle childhood. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NeuroImage ![In: NeuroImage 196, pp. 94-101, 2019. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP DOI BibTeX RDF |
|
22 | Tamara Peyton |
Boxes, Bumps & Breakfast: Object Lessons for Teaching Undergraduates the Importance of Human-Centered Research & Analysis. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SIGCSE ![In: Proceedings of the 50th ACM Technical Symposium on Computer Science Education, SIGCSE 2019, Minneapolis, MN, USA, February 27 - March 02, 2019, pp. 1255, 2019, ACM, 978-1-4503-5890-3. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP DOI BibTeX RDF |
|
22 | Irma Kveladze, Niels Agerholm |
Visual analysis of speed bumps using floating car dataset. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Locat. Based Serv. ![In: J. Locat. Based Serv. 12(2), pp. 119-139, 2018. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
22 | Marc van Veenhuizen |
Void detection in solder bumps with deep learning. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 88-90, pp. 315-320, 2018. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
22 | Ariel Monteserin |
Potholes vs. Speed Bumps: A Multivariate Time Series Classification Approach. ![Search on Bibsonomy](Pics/bibsonomy.png) |
UMCit@KDD ![In: Proceedings of the 1st Workshop on Knowledge Discovery and User Modelling for Smart Cities co-located with 24th ACM SIGKDD Conference on Knowledge Discovery and Data Mining, UMCit@KDD 2018, London, United Kingdom, August 20, 2018., pp. 36-40, 2018, CEUR-WS.org. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP BibTeX RDF |
|
22 | Sven Mayer, Huy Viet Le, Alessandro Nesti, Niels Henze, Heinrich H. Bülthoff, Lewis L. Chuang |
The Effect of Road Bumps on Touch Interaction in Cars. ![Search on Bibsonomy](Pics/bibsonomy.png) |
AutomotiveUI ![In: Proceedings of the 10th International Conference on Automotive User Interfaces and Interactive Vehicular Applications, AutomotiveUI 2018, Toronto, ON, Canada, September 23-25, 2018, pp. 85-93, 2018, ACM. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
22 | Daniel P. Bliss, Mark D'Esposito |
Characterizing the peripheral bumps of serial dependence in visual working memory. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CogSci ![In: Proceedings of the 40th Annual Meeting of the Cognitive Science Society, CogSci 2018, Madison, WI, USA, July 25-28, 2018, 2018, cognitivesciencesociety.org, 978-0-9911967-8-4. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP BibTeX RDF |
|
22 | Ji Hoon Hyun, Nan Chen 0005, Dong Sam Ha |
Energy Harvesting Circuit for Road Speed Bumps Using a Piezoelectric Cantilever. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IECON ![In: IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society, Washington, DC, USA, October 21-23, 2018, pp. 4219-4223, 2018, IEEE, 978-1-5090-6684-1. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
22 | Jin-Tai Yan, Chia-Heng Yen |
Feasible Assignment of Micro-Bumps in 3D ICs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NEWCAS ![In: 16th IEEE International New Circuits and Systems Conference, NEWCAS 2018, Montréal, QC, Canada, June 24-27, 2018, pp. 296-299, 2018, IEEE, 978-1-5386-4859-9. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
22 | Nak-Hwe Kim, Jun-Ho Huh |
A Study on the Bumps at the Leading Edge of the Wing Used by Hovering Birds. ![Search on Bibsonomy](Pics/bibsonomy.png) |
MUE/FutureTech ![In: Advanced Multimedia and Ubiquitous Engineering - MUE/FutureTech 2018, Salerno, Italy, 23-25 April 2018, pp. 819-824, 2018, Springer, 978-981-13-1327-1. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
22 | Fan Liu, Lei Su, Mengying Fan, Jian Yin 0011, Zhenzhi He, Xiangning Lu |
Using scanning acoustic microscopy and LM-BP algorithm for defect inspection of micro solder bumps. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 79, pp. 166-174, 2017. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
22 | Hua-Chiang Wen, Wu-Ching Chou, Shiuan Huei Lin, Don Son Jiang |
Nanomechanical properties of Ag solder bumps doped with Pd and Au. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 79, pp. 270-275, 2017. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
22 | Philip E. Brown, Tamraparni Dasu, Yaron Kanza, Divesh Srivastava |
Mind the Gaps (and Bumps): Statistical Smoothing of Spatiotemporal Streams. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IWGS@SIGSPATIAL ![In: Proceedings of the 8th ACM SIGSPATIAL Workshop on GeoStreaming, IWGS@SIGSPATIAL 2017, Redondo Beach, CA, USA, November 7, 2017, pp. 29-38, 2017, ACM, 978-1-4503-5492-9. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
22 | Huyen T. Le, G. R. Boynton, Yelena Mejova, Zubair Shafiq, Padmini Srinivasan |
Bumps and Bruises: Mining Presidential Campaign Announcements on Twitter. ![Search on Bibsonomy](Pics/bibsonomy.png) |
HT ![In: Proceedings of the 28th ACM Conference on Hypertext and Social Media, HT 2017, Prague, Czech Republic, July 4-7, 2017, pp. 215-224, 2017, ACM, 978-1-4503-4708-2. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
22 | Carlo R. Laing |
Bumps in Small-World Networks. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Frontiers Comput. Neurosci. ![In: Frontiers Comput. Neurosci. 10, pp. 53, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
22 | Javad Fakhraei, H. M. Khanlo, M. Ghayour, Kh. Faramarzi |
The Influence of Road Bumps Characteristics on the Chaotic Vibration of a Nonlinear Full-Vehicle Model with Driver. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Int. J. Bifurc. Chaos ![In: Int. J. Bifurc. Chaos 26(9), pp. 1650151:1-1650151:26, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
22 | Mengying Fan, Li Wei, Zhenzhi He, Wei Wei, Xiangning Lu |
Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 65, pp. 192-197, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
22 | Yi Gao, Lawrence W. Ver Hoef |
The bumps on the hippocampus. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Medical Imaging: Image Processing ![In: Medical Imaging 2016: Image Processing, San Diego, California, USA, February 27, 2016, pp. 97840I, 2016, SPIE, 978-1-5106-0019-5. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
22 | Xiaoyong Yuan, Min Li 0012, Sudeep Gaddam, Xiaolin Li 0001, Yinan Zhao, Jingzhe Ma, Jian Ge |
DeepSky: Identifying Absorption Bumps via Deep Learning. ![Search on Bibsonomy](Pics/bibsonomy.png) |
BigData Congress ![In: 2016 IEEE International Congress on Big Data, San Francisco, CA, USA, June 27 - July 2, 2016, pp. 214-221, 2016, IEEE Computer Society, 978-1-5090-2622-7. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
22 | Muhammad Salman Al Farisi, Hideki Hirano, Shuji Tanaka |
Wafer-level vacuum packaging for hetero-integration by thermo-compression bonding using planarized-electroplated gold bumps. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NEMS ![In: 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016, Sendai, Japan, April 17-20, 2016, pp. 573-577, 2016, IEEE, 978-1-5090-1947-2. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
22 | Tomokazu Takahashi, Masato Suzuki, Seiji Aoyagi |
Octopus bioinspired vacuum gripper with micro bumps. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NEMS ![In: 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016, Sendai, Japan, April 17-20, 2016, pp. 508-511, 2016, IEEE, 978-1-5090-1947-2. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
22 | Motoaki Mouri, Hiroshi Yasukawa, Ichi Takumi |
Incorporation of blind source separation in X-ray energy subtraction for extracting solder bumps. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISIE ![In: 25th IEEE International Symposium on Industrial Electronics, ISIE 2016, Santa Clara, CA, USA, June 8-10, 2016, pp. 923-928, 2016, IEEE, 978-1-5090-0873-5. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
22 | Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage, Bernard Plano |
Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 55(1), pp. 192-200, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
22 | Masahisa Fujino, Ikuo Soga, Daiyu Kondo, Yoshikatsu Ishizuki, Taisuke Iwai, Tadatomo Suga |
Fast atom bombardment onto vertically aligned multi-walled carbon nanotube bumps to achieve low interconnect resistance with Au layer. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 55(12), pp. 2560-2564, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
22 | Kyoung-Moo Harr, Sun-Chul Kim, Young-Min Kim, Young-Ho Kim |
Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 55(8), pp. 1241-1247, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
22 | Guanglan Liao, Li Du, Lei Su 0002, Miao Zeng, Lei Nie, Tielin Shi |
Using RBF networks for detection and prediction of flip chip with missing bumps. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 55(12), pp. 2817-2825, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
22 | Daniel B. Poll, Zachary P. Kilpatrick |
Stochastic Motion of Bumps in Planar Neural Fields. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SIAM J. Appl. Math. ![In: SIAM J. Appl. Math. 75(4), pp. 1553-1577, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
22 | Devin J. Pohly, Charles Sestito, Patrick D. McDaniel |
Adaptive protocol switching using Dynamically Insertable Bumps in the stack. ![Search on Bibsonomy](Pics/bibsonomy.png) |
MILCOM ![In: 34th IEEE Military Communications Conference, MILCOM 2015, Tampa, FL, USA, October 26-28, 2015, pp. 342-347, 2015, IEEE, 978-1-5090-0073-9. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
22 | Junsung Ma, Sungdong Kim, Sarah Eunkyung Kim |
Characterization of flip chip bonded structure with Cu ABL power bumps. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 54(8), pp. 1598-1602, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
22 | Kirsten Weide-Zaage, J. Schlobohm, R. T. H. Rongen, F. C. Voogt, R. Roucou |
Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 54(6-7), pp. 1206-1211, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
22 | Lionel Dantas de Morais, Sophie Chevalliez, Stephanie Mouleres |
Low temperature FIB cross section: Application to indium micro bumps. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 54(9-10), pp. 1802-1805, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
22 | Myong-Hoon Roh, Jae Pil Jung, Won Joong Kim |
Microstructure, shear strength, and nanoindentation property of electroplated Sn-Bi micro-bumps. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 54(1), pp. 265-271, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
22 | Jianxin Wang 0005, Hiroshi Nishikawa |
Impact strength of Sn-3.0Ag-0.5Cu solder bumps during isothermal aging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 54(8), pp. 1583-1591, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
22 | Jörg Dreybrodt, Yves Dupraz |
Study of the UBM to copper interface robustness of solder bumps in flip chip packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 54(9-10), pp. 1969-1971, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
22 | Erik Jan Marinissen, Bart De Wachter, Ken Smith, Jorg Kiesewetter, Mottaqiallah Taouil, Said Hamdioui |
Direct probing on large-array fine-pitch micro-bumps of a wide-I/O logic-memory interface. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ITC ![In: 2014 International Test Conference, ITC 2014, Seattle, WA, USA, October 20-23, 2014, pp. 1-10, 2014, IEEE Computer Society, 978-1-4799-4722-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
22 | Tomoko Yonezawa, Xiaoshun Meng, Naoto Yoshida, Yukari Nakatani |
Involuntary expression of embodied robot adopting goose bumps. ![Search on Bibsonomy](Pics/bibsonomy.png) |
HRI ![In: ACM/IEEE International Conference on Human-Robot Interaction, HRI'14, Bielefeld, Germany, March 3-6, 2014, pp. 322-323, 2014, ACM, 978-1-4503-2658-2. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
22 | Enes Celik, Muhammet Atalay, Harun Bayer |
Earthquake prediction using seismic bumps with Artificial Neural Networks and Support Vector Machines. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SIU ![In: 2014 22nd Signal Processing and Communications Applications Conference (SIU), Trabzon, Turkey, April 23-25, 2014, pp. 730-733, 2014, IEEE, 978-1-4799-4874-1. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
22 | Müjdat Soytürk, Fatih Dogan, Esma Sasmaz, Saban Boyuk |
Detection and analysis of holes and bumps on road surfaces. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SIU ![In: 2014 22nd Signal Processing and Communications Applications Conference (SIU), Trabzon, Turkey, April 23-25, 2014, pp. 1897-1901, 2014, IEEE, 978-1-4799-4874-1. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
22 | Zachary P. Kilpatrick, Bard Ermentrout |
Wandering Bumps in Stochastic Neural Fields. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SIAM J. Appl. Dyn. Syst. ![In: SIAM J. Appl. Dyn. Syst. 12(1), pp. 61-94, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
22 | Cheoljon Jang, Jaehwan Kim, Byung-Gyu Ahn, Jongwha Chong |
Power bumps and through-silicon-vias placement with optimised power mesh structure for power delivery network in three-dimensional-integrated circuits. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IET Comput. Digit. Tech. ![In: IET Comput. Digit. Tech. 7(1), pp. 11-20, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
22 | Luca Bagnato, Antonio Punzo |
Finite mixtures of unimodal beta and gamma densities and the k-bumps algorithm. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Comput. Stat. ![In: Comput. Stat. 28(4), pp. 1571-1597, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
22 | Y. J. Chen, C. K. Chung, C. R. Yang, C. Robert Kao |
Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 53(1), pp. 47-52, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
22 | Qinghua Zhao, Anmin Hu, Ming Li, Jiangyan Sun |
Effect of electroplating layer structure on shear property and microstructure of multilayer electroplated Sn-3.5Ag solder bumps. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 53(2), pp. 321-326, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
22 | Lei Su 0002, Tielin Shi, Zhensong Xu, Xiangning Lu, Guanglan Liao |
Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 13(12), pp. 16281-16291, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
22 | Marek Sikora, Lukasz Wróbel |
seismic-bumps. ![Search on Bibsonomy](Pics/bibsonomy.png) |
|
2013 |
DOI RDF |
|
22 | Katsuya Kikuchi, Fumiki Kato, Shunsuke Nemoto, Hiroshi Nakagawa, Masahiro Aoyagi, Youtaro Yasu, Kohji Koshiji |
Investigation of optimized high-density flip-chip interconnect design including micro Au bumps for 3-D stacked LSI packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-4, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
22 | Masahiro Aoyagi, Naoya Watanabe, Motohiro Suzuki, Katsuya Kikuchi, Shunsuke Nemoto, Noriaki Arima, Misaki Ishizuka, Koji Suzuki, Toshio Shiomi |
New optical three dimensional structure measurement method of cone shape micro bumps used for 3D LSI chip stacking. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIC ![In: 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013, pp. 1-5, 2013, IEEE, 978-1-4673-6484-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
22 | Ran Wang 0002, Krishnendu Chakrabarty, Bill Eklow |
Post-bond Testing of the Silicon Interposer and Micro-bumps in 2.5D ICs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Asian Test Symposium ![In: 22nd Asian Test Symposium, ATS 2013, Yilan County, Taiwan, November 18-21, 2013, pp. 147-152, 2013, IEEE Computer Society, 978-0-7695-5080-0. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
22 | Hermann Oppermann, Lothar Dietrich |
Nanoporous gold bumps for low temperature bonding. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(2), pp. 356-360, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
22 | Eric Winsberg |
Bumps on the Road to Here (from Eternity). ![Search on Bibsonomy](Pics/bibsonomy.png) |
Entropy ![In: Entropy 14(3), pp. 390-406, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
22 | Jamal Daafouz, José Claudio Geromel, Grace S. Deaecto |
A simple approach for switched control design with control bumps limitation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Syst. Control. Lett. ![In: Syst. Control. Lett. 61(12), pp. 1215-1220, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
22 | Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne, Bart Swinnen |
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICICDT ![In: IEEE International Conference on IC Design & Technology, ICICDT 2012, Austin, TX, USA, May 30 - June 1, 2012, pp. 1-4, 2012, IEEE, 978-1-4673-0146-6. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
22 | Mohammad Al-Fares, Rishi Kapoor, George Porter, Sambit Das, Hakim Weatherspoon, Balaji Prabhakar, Amin Vahdat |
NetBump: user-extensible active queue management with bumps on the wire. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ANCS ![In: Symposium on Architecture for Networking and Communications Systems, ANCS '12, Austin, TX, USA - October 29 - 30, 2012, pp. 61-72, 2012, ACM, 978-1-4503-1685-9. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
22 | Yao Lu, Yuzuru Sato, Shun-ichi Amari |
Traveling Bumps and Their Collisions in a Two-Dimensional Neural Field. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Neural Comput. ![In: Neural Comput. 23(5), pp. 1248-1260, 2011. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
22 | Byeung-Gee Kim, Sang-Mok Lee, Yun-Song Jo, Sun-Chul Kim, Kyoung-Moo Harr, Young-Ho Kim |
Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 51(4), pp. 851-859, 2011. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
22 | Paul C. Bressloff, Zachary P. Kilpatrick |
Two-Dimensional Bumps in Piecewise Smooth Neural Fields with Synaptic Depression. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SIAM J. Appl. Math. ![In: SIAM J. Appl. Math. 71(2), pp. 379-408, 2011. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
22 | Christopher J. Stanton, Edward Ratanasena, Sajjad Haider 0001, Mary-Anne Williams |
Perceiving Forces, Bumps, and Touches from Proprioceptive Expectations. ![Search on Bibsonomy](Pics/bibsonomy.png) |
RoboCup ![In: RoboCup 2011: Robot Soccer World Cup XV [papers from the 15th Annual RoboCup International Symposium, Istanbul, Turkey, July 2011], pp. 377-388, 2011, Springer, 978-3-642-32059-0. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
22 | Wei Zhao 0010, Mohammad Tehranipoor |
Peak power identification on power bumps during test application. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IGCC ![In: 2011 International Green Computing Conference and Workshops, IGCC 2012, Orlando, FL, USA, July 25-28, 2011, pp. 1-3, 2011, IEEE Computer Society, 978-1-4577-1220-3. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
22 | Stephen Ruth |
Bumps on the Road to the National Broadband Plan. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Internet Comput. ![In: IEEE Internet Comput. 14(6), pp. 59-63, 2010. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
National Broadband Plan, Verizon/Google legislative proposal, Verizon, Federal Communications Commission, Google, public policy, FCC, net neutrality |
22 | Shinichiro Ohnuki, Ryuichi Ohsawa, Tsuneki Yamasaki |
Electromagnetic Scattering from Rectangular Cylinders with Various Wedge Cavities and Bumps. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEICE Trans. Electron. ![In: IEICE Trans. Electron. 93-C(1), pp. 77-80, 2010. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
22 | Daisuke Inoue, Kazunori Ohno, Masashi Konyo, Satoshi Tadokoro |
Tracked-Vehicle Clutching Position Detectability on Bumps by Distributed Inclination Sensors. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Robotics Mechatronics ![In: J. Robotics Mechatronics 22(3), pp. 293-300, 2010. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|