Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
88 | Anatole Lécuyer, Jean-Marie Burkhardt, Chee-Hian Tan |
A study of the modification of the speed and size of the cursor for simulating pseudo-haptic bumps and holes. |
ACM Trans. Appl. Percept. |
2008 |
DBLP DOI BibTeX RDF |
control/display ratio, texture, size, speed, cursor, hole, Pseudo-haptic, bump |
71 | Stephen Coombes |
Waves, bumps, and patterns in neural field theories. |
Biol. Cybern. |
2005 |
DBLP DOI BibTeX RDF |
Neural field theories, Evans functions, Integral equations, Waves, Bumps |
55 | Anatole Lécuyer, Jean-Marie Burkhardt, Laurent Étienne |
Feeling bumps and holes without a haptic interface: the perception of pseudo-haptic textures. |
CHI |
2004 |
DBLP DOI BibTeX RDF |
bump and hole, control/display ratio, texture, pseudo-haptic |
49 | Marc Olano, Dan Baker |
LEAN mapping. |
SI3D |
2010 |
DBLP DOI BibTeX RDF |
MIP mapping, texture filtering, bump maps, shading models |
49 | Hsiu-Ming Chang 0001, Jiun-Lang Huang, Ding-Ming Kwai, Kwang-Ting (Tim) Cheng, Cheng-Wen Wu |
An error tolerance scheme for 3D CMOS imagers. |
DAC |
2010 |
DBLP DOI BibTeX RDF |
image sensor, error tolerance, 3D IC |
33 | Jun Ohta, Takahashi Tokuda, Keiichiro Kagawa, Akihiro Uehara, Yasuo Terasawa, Kazuaki Nakauchi, Takashi Fujikado, Yasuo Tano |
A multi-microchip retinal stimulator for in vitro / in vivo experiments. |
ISCAS |
2007 |
DBLP DOI BibTeX RDF |
|
33 | Christopher P. Fall, Timothy J. Lewis, John Rinzel |
Background-activity-dependent properties of a network model for working memory that incorporates cellular bistability. |
Biol. Cybern. |
2005 |
DBLP DOI BibTeX RDF |
|
33 | Paul C. Bressloff |
Spontaneous symmetry breaking in self-organizing neural fields. |
Biol. Cybern. |
2005 |
DBLP DOI BibTeX RDF |
|
33 | Thomas Pietrzak, Benoît Martin, Isabelle Pecci |
Affichage d'informations par des impulsions haptiques. |
IHM |
2005 |
DBLP DOI BibTeX RDF |
force feedback, multi-modality, information display |
33 | Aoying Zhou, Shouke Qin, Weining Qian |
Adaptively Detecting Aggregation Bursts in Data Streams. |
DASFAA |
2005 |
DBLP DOI BibTeX RDF |
|
33 | Vijay Karamcheti, Davi Geiger, Zvi M. Kedem, S. Muthukrishnan 0001 |
Detecting malicious network traffic using inverse distributions of packet contents. |
MineNet |
2005 |
DBLP DOI BibTeX RDF |
inverse distribution, worms, content analysis |
33 | Koichi Onoue, Nelson Max, Tomoyuki Nishita |
Real-Time Rendering of Bumpmap Shadows Taking Account of Surface Curvature. |
CW |
2004 |
DBLP DOI BibTeX RDF |
horizon map, graphics hardware, shadows, curvature, bump-mapping |
33 | Chirag S. Patel |
Silicon carrier for computer systems. |
DAC |
2006 |
DBLP DOI BibTeX RDF |
chip-package co-design, electrical modeling, micro-bumps, silicon carrier, computer system, CMOS scaling, system on package |
22 | Heather L. Cihak, Zachary P. Kilpatrick |
Multiscale Motion and Deformation of Bumps in Stochastic Neural Fields with Dynamic Connectivity. |
Multiscale Model. Simul. |
2024 |
DBLP DOI BibTeX RDF |
|
22 | Ruochen Wang, Xiaoguo Luo, Qing Ye, Yu Jiang, Wei Liu 0109 |
Research on Visual Perception of Speed Bumps for Intelligent Connected Vehicles Based on Lightweight FPNet. |
Sensors |
2024 |
DBLP DOI BibTeX RDF |
|
22 | Mirai Azechi, Shogo Okamoto |
Bumps and Dents are Not Perceptually Opposite When Exploring With Lateral Force Cues. |
IEEE Trans. Haptics |
2024 |
DBLP DOI BibTeX RDF |
|
22 | Amir Salman, Adnan Noor Mian |
Deep learning based speed bumps detection and characterization using smartphone sensors. |
Pervasive Mob. Comput. |
2023 |
DBLP DOI BibTeX RDF |
|
22 | Melvin Mokhtari, Amirreza Hosseini, Alireza Habibi, Adel Karshenas, Ali Amoomahdi |
Intelligent Traffic Control with Smart Speed Bumps. |
CoRR |
2023 |
DBLP DOI BibTeX RDF |
|
22 | Sai Pentapati, Anthony Agnesina, Moritz Brunion, Yen-Hsiang Huang, Sung Kyu Lim |
On Legalization of Die Bonding Bumps and Pads for 3D ICs. |
ISPD |
2023 |
DBLP DOI BibTeX RDF |
|
22 | Akemi Gálvez, Iztok Fister Jr., Lihua You, Iztok Fister 0001, Andrés Iglesias 0001 |
Artificial Immune Systems Approach for Surface Reconstruction of Shapes with Large Smooth Bumps. |
ICCS (4) |
2023 |
DBLP DOI BibTeX RDF |
|
22 | Ayaka Ishii, Kentaro Yasu |
FluxTangible: Simple and Dynamic Haptic Tangible with Bumps and Vibrations. |
UIST (Adjunct Volume) |
2023 |
DBLP DOI BibTeX RDF |
|
22 | Xuan Xiao, Ruipeng Gao, Weiwei Xing, Chi Li, Lei Liu |
How Many Bumps in Your City? Personalized Bump Seeker With Mobile Crowdsensing. |
IEEE Trans. Instrum. Meas. |
2022 |
DBLP DOI BibTeX RDF |
|
22 | Patrick McLaughlin, Christopher Vagg |
A New Method of Vehicle Positioning Using Bumps and Road Surface Defects. |
IEEE Trans. Intell. Transp. Syst. |
2022 |
DBLP DOI BibTeX RDF |
|
22 | Raymond Wang, Louis Kang |
Multiple bumps can enhance robustness to noise in continuous attractor networks. |
PLoS Comput. Biol. |
2022 |
DBLP DOI BibTeX RDF |
|
22 | Xiaoying Sun, Chen Zhang, Guohong Liu |
Improved Tactile Perception of 3D Geometric Bumps Using Coupled Electrovibration and Mechanical Vibration Stimuli. |
Comput. J. |
2022 |
DBLP DOI BibTeX RDF |
|
22 | Fengwei Dai, David Wei Zhang, Yangyang Yan, Guojun Wang 0001, Liqiang Cao |
Research on Ni3Sn4 intermetallic compound for 5μm diameter Cu/Ni/Sn-3.0Ag micro bumps. |
IEICE Electron. Express |
2022 |
DBLP DOI BibTeX RDF |
|
22 | Yahui Sun 0001, Shuai Ma 0001, Bin Cui 0001 |
Hunting Temporal Bumps in Graphs with Dynamic Vertex Properties. |
SIGMOD Conference |
2022 |
DBLP DOI BibTeX RDF |
|
22 | Mirai Azechi, Shogo Okamoto |
Combined virtual bumps and textures on electrostatic friction tactile displays. |
GCCE |
2022 |
DBLP DOI BibTeX RDF |
|
22 | Manuel Ricardo Carlos, Luis Carlos González-Gurrola, Johan Wahlström, Raymundo Cornejo, Fernando Martínez-Reyes |
Becoming Smarter at Characterizing Potholes and Speed Bumps from Smartphone Data - Introducing a Second-Generation Inference Problem. |
IEEE Trans. Mob. Comput. |
2021 |
DBLP DOI BibTeX RDF |
|
22 | |
Designing an IoT based autonomous vehicle meant for detecting speed bumps and lanes on roads. |
J. Ambient Intell. Humaniz. Comput. |
2021 |
DBLP DOI BibTeX RDF |
|
22 | Tamara Lopez, Helen Sharp, Marian Petre, Bashar Nuseibeh |
Bumps in the Code: Error Handling During Software Development. |
IEEE Softw. |
2021 |
DBLP DOI BibTeX RDF |
|
22 | Zhe Shu, Michael Fechtig, Florian Lombeck, Matthias Breitwieser, Roland Zengerle, Peter Koltay |
Direct Drop-on-Demand Printing of Molten Solder Bumps on ENIG Finishing at Ambient Conditions Through StarJet Technology. |
IEEE Access |
2020 |
DBLP DOI BibTeX RDF |
|
22 | Tomoya Fujihashi, Fumitoshi Suga, Ryoma Araki, Jyun Kido, Takashi Abe, Masayuki Sohgawa |
Tactile Sensor with High-Density Microcantilever and Multiple PDMS Bumps for Contact Detection. |
J. Robotics Mechatronics |
2020 |
DBLP DOI BibTeX RDF |
|
22 | Olaide Ayodeji Agbolade |
Radio Frequency Speed Bumps for Near-Zero Speed Zone Control in Nigeria. |
CoRR |
2020 |
DBLP BibTeX RDF |
|
22 | Benjamin Kunsberg, Steven W. Zucker |
From Boundaries to Bumps: when closed (extremal) contours are critical. |
CoRR |
2020 |
DBLP BibTeX RDF |
|
22 | Yahui Sun 0001, Jun Luo 0001, Theodoros Lappas, Xiaokui Xiao, Bin Cui 0001 |
Hunting multiple bumps in graphs. (PDF / PS) |
Proc. VLDB Endow. |
2020 |
DBLP DOI BibTeX RDF |
|
22 | Ganesh Mani, Tom Hope |
Viral Science: Masks, Speed Bumps, and Guard Rails. |
Patterns |
2020 |
DBLP DOI BibTeX RDF |
|
22 | Jyun-Ru Jiang, Yun-Chih Kuo, Simon Yi-Hung Chen, Hung-Ming Chen |
On Pre-Assignment Route Prototyping for Irregular Bumps on BGA Packages. |
DATE |
2020 |
DBLP DOI BibTeX RDF |
|
22 | Takaya Ishimaru, Satoshi Saga |
Virtual bumps display based on electrical muscle stimulation. |
HAPTICS |
2020 |
DBLP DOI BibTeX RDF |
|
22 | Manish Saggar, Hua Xie, Roger E. Beaty, Atanas D. Stankov, Meredith Schreier, Allan L. Reiss |
Creativity slumps and bumps: Examining the neurobehavioral basis of creativity development during middle childhood. |
NeuroImage |
2019 |
DBLP DOI BibTeX RDF |
|
22 | Tamara Peyton |
Boxes, Bumps & Breakfast: Object Lessons for Teaching Undergraduates the Importance of Human-Centered Research & Analysis. |
SIGCSE |
2019 |
DBLP DOI BibTeX RDF |
|
22 | Irma Kveladze, Niels Agerholm |
Visual analysis of speed bumps using floating car dataset. |
J. Locat. Based Serv. |
2018 |
DBLP DOI BibTeX RDF |
|
22 | Marc van Veenhuizen |
Void detection in solder bumps with deep learning. |
Microelectron. Reliab. |
2018 |
DBLP DOI BibTeX RDF |
|
22 | Ariel Monteserin |
Potholes vs. Speed Bumps: A Multivariate Time Series Classification Approach. |
UMCit@KDD |
2018 |
DBLP BibTeX RDF |
|
22 | Sven Mayer, Huy Viet Le, Alessandro Nesti, Niels Henze, Heinrich H. Bülthoff, Lewis L. Chuang |
The Effect of Road Bumps on Touch Interaction in Cars. |
AutomotiveUI |
2018 |
DBLP DOI BibTeX RDF |
|
22 | Daniel P. Bliss, Mark D'Esposito |
Characterizing the peripheral bumps of serial dependence in visual working memory. |
CogSci |
2018 |
DBLP BibTeX RDF |
|
22 | Ji Hoon Hyun, Nan Chen 0005, Dong Sam Ha |
Energy Harvesting Circuit for Road Speed Bumps Using a Piezoelectric Cantilever. |
IECON |
2018 |
DBLP DOI BibTeX RDF |
|
22 | Jin-Tai Yan, Chia-Heng Yen |
Feasible Assignment of Micro-Bumps in 3D ICs. |
NEWCAS |
2018 |
DBLP DOI BibTeX RDF |
|
22 | Nak-Hwe Kim, Jun-Ho Huh |
A Study on the Bumps at the Leading Edge of the Wing Used by Hovering Birds. |
MUE/FutureTech |
2018 |
DBLP DOI BibTeX RDF |
|
22 | Fan Liu, Lei Su, Mengying Fan, Jian Yin 0011, Zhenzhi He, Xiangning Lu |
Using scanning acoustic microscopy and LM-BP algorithm for defect inspection of micro solder bumps. |
Microelectron. Reliab. |
2017 |
DBLP DOI BibTeX RDF |
|
22 | Hua-Chiang Wen, Wu-Ching Chou, Shiuan Huei Lin, Don Son Jiang |
Nanomechanical properties of Ag solder bumps doped with Pd and Au. |
Microelectron. Reliab. |
2017 |
DBLP DOI BibTeX RDF |
|
22 | Philip E. Brown, Tamraparni Dasu, Yaron Kanza, Divesh Srivastava |
Mind the Gaps (and Bumps): Statistical Smoothing of Spatiotemporal Streams. |
IWGS@SIGSPATIAL |
2017 |
DBLP DOI BibTeX RDF |
|
22 | Huyen T. Le, G. R. Boynton, Yelena Mejova, Zubair Shafiq, Padmini Srinivasan |
Bumps and Bruises: Mining Presidential Campaign Announcements on Twitter. |
HT |
2017 |
DBLP DOI BibTeX RDF |
|
22 | Carlo R. Laing |
Bumps in Small-World Networks. |
Frontiers Comput. Neurosci. |
2016 |
DBLP DOI BibTeX RDF |
|
22 | Javad Fakhraei, H. M. Khanlo, M. Ghayour, Kh. Faramarzi |
The Influence of Road Bumps Characteristics on the Chaotic Vibration of a Nonlinear Full-Vehicle Model with Driver. |
Int. J. Bifurc. Chaos |
2016 |
DBLP DOI BibTeX RDF |
|
22 | Mengying Fan, Li Wei, Zhenzhi He, Wei Wei, Xiangning Lu |
Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm. |
Microelectron. Reliab. |
2016 |
DBLP DOI BibTeX RDF |
|
22 | Yi Gao, Lawrence W. Ver Hoef |
The bumps on the hippocampus. |
Medical Imaging: Image Processing |
2016 |
DBLP DOI BibTeX RDF |
|
22 | Xiaoyong Yuan, Min Li 0012, Sudeep Gaddam, Xiaolin Li 0001, Yinan Zhao, Jingzhe Ma, Jian Ge |
DeepSky: Identifying Absorption Bumps via Deep Learning. |
BigData Congress |
2016 |
DBLP DOI BibTeX RDF |
|
22 | Muhammad Salman Al Farisi, Hideki Hirano, Shuji Tanaka |
Wafer-level vacuum packaging for hetero-integration by thermo-compression bonding using planarized-electroplated gold bumps. |
NEMS |
2016 |
DBLP DOI BibTeX RDF |
|
22 | Tomokazu Takahashi, Masato Suzuki, Seiji Aoyagi |
Octopus bioinspired vacuum gripper with micro bumps. |
NEMS |
2016 |
DBLP DOI BibTeX RDF |
|
22 | Motoaki Mouri, Hiroshi Yasukawa, Ichi Takumi |
Incorporation of blind source separation in X-ray energy subtraction for extracting solder bumps. |
ISIE |
2016 |
DBLP DOI BibTeX RDF |
|
22 | Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage, Bernard Plano |
Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps. |
Microelectron. Reliab. |
2015 |
DBLP DOI BibTeX RDF |
|
22 | Masahisa Fujino, Ikuo Soga, Daiyu Kondo, Yoshikatsu Ishizuki, Taisuke Iwai, Tadatomo Suga |
Fast atom bombardment onto vertically aligned multi-walled carbon nanotube bumps to achieve low interconnect resistance with Au layer. |
Microelectron. Reliab. |
2015 |
DBLP DOI BibTeX RDF |
|
22 | Kyoung-Moo Harr, Sun-Chul Kim, Young-Min Kim, Young-Ho Kim |
Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive. |
Microelectron. Reliab. |
2015 |
DBLP DOI BibTeX RDF |
|
22 | Guanglan Liao, Li Du, Lei Su 0002, Miao Zeng, Lei Nie, Tielin Shi |
Using RBF networks for detection and prediction of flip chip with missing bumps. |
Microelectron. Reliab. |
2015 |
DBLP DOI BibTeX RDF |
|
22 | Daniel B. Poll, Zachary P. Kilpatrick |
Stochastic Motion of Bumps in Planar Neural Fields. |
SIAM J. Appl. Math. |
2015 |
DBLP DOI BibTeX RDF |
|
22 | Devin J. Pohly, Charles Sestito, Patrick D. McDaniel |
Adaptive protocol switching using Dynamically Insertable Bumps in the stack. |
MILCOM |
2015 |
DBLP DOI BibTeX RDF |
|
22 | Junsung Ma, Sungdong Kim, Sarah Eunkyung Kim |
Characterization of flip chip bonded structure with Cu ABL power bumps. |
Microelectron. Reliab. |
2014 |
DBLP DOI BibTeX RDF |
|
22 | Kirsten Weide-Zaage, J. Schlobohm, R. T. H. Rongen, F. C. Voogt, R. Roucou |
Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core. |
Microelectron. Reliab. |
2014 |
DBLP DOI BibTeX RDF |
|
22 | Lionel Dantas de Morais, Sophie Chevalliez, Stephanie Mouleres |
Low temperature FIB cross section: Application to indium micro bumps. |
Microelectron. Reliab. |
2014 |
DBLP DOI BibTeX RDF |
|
22 | Myong-Hoon Roh, Jae Pil Jung, Won Joong Kim |
Microstructure, shear strength, and nanoindentation property of electroplated Sn-Bi micro-bumps. |
Microelectron. Reliab. |
2014 |
DBLP DOI BibTeX RDF |
|
22 | Jianxin Wang 0005, Hiroshi Nishikawa |
Impact strength of Sn-3.0Ag-0.5Cu solder bumps during isothermal aging. |
Microelectron. Reliab. |
2014 |
DBLP DOI BibTeX RDF |
|
22 | Jörg Dreybrodt, Yves Dupraz |
Study of the UBM to copper interface robustness of solder bumps in flip chip packages. |
Microelectron. Reliab. |
2014 |
DBLP DOI BibTeX RDF |
|
22 | Erik Jan Marinissen, Bart De Wachter, Ken Smith, Jorg Kiesewetter, Mottaqiallah Taouil, Said Hamdioui |
Direct probing on large-array fine-pitch micro-bumps of a wide-I/O logic-memory interface. |
ITC |
2014 |
DBLP DOI BibTeX RDF |
|
22 | Tomoko Yonezawa, Xiaoshun Meng, Naoto Yoshida, Yukari Nakatani |
Involuntary expression of embodied robot adopting goose bumps. |
HRI |
2014 |
DBLP DOI BibTeX RDF |
|
22 | Enes Celik, Muhammet Atalay, Harun Bayer |
Earthquake prediction using seismic bumps with Artificial Neural Networks and Support Vector Machines. |
SIU |
2014 |
DBLP DOI BibTeX RDF |
|
22 | Müjdat Soytürk, Fatih Dogan, Esma Sasmaz, Saban Boyuk |
Detection and analysis of holes and bumps on road surfaces. |
SIU |
2014 |
DBLP DOI BibTeX RDF |
|
22 | Zachary P. Kilpatrick, Bard Ermentrout |
Wandering Bumps in Stochastic Neural Fields. |
SIAM J. Appl. Dyn. Syst. |
2013 |
DBLP DOI BibTeX RDF |
|
22 | Cheoljon Jang, Jaehwan Kim, Byung-Gyu Ahn, Jongwha Chong |
Power bumps and through-silicon-vias placement with optimised power mesh structure for power delivery network in three-dimensional-integrated circuits. |
IET Comput. Digit. Tech. |
2013 |
DBLP DOI BibTeX RDF |
|
22 | Luca Bagnato, Antonio Punzo |
Finite mixtures of unimodal beta and gamma densities and the k-bumps algorithm. |
Comput. Stat. |
2013 |
DBLP DOI BibTeX RDF |
|
22 | Y. J. Chen, C. K. Chung, C. R. Yang, C. Robert Kao |
Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics. |
Microelectron. Reliab. |
2013 |
DBLP DOI BibTeX RDF |
|
22 | Qinghua Zhao, Anmin Hu, Ming Li, Jiangyan Sun |
Effect of electroplating layer structure on shear property and microstructure of multilayer electroplated Sn-3.5Ag solder bumps. |
Microelectron. Reliab. |
2013 |
DBLP DOI BibTeX RDF |
|
22 | Lei Su 0002, Tielin Shi, Zhensong Xu, Xiangning Lu, Guanglan Liao |
Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer. |
Sensors |
2013 |
DBLP DOI BibTeX RDF |
|
22 | Marek Sikora, Lukasz Wróbel |
seismic-bumps. |
|
2013 |
DOI RDF |
|
22 | Katsuya Kikuchi, Fumiki Kato, Shunsuke Nemoto, Hiroshi Nakagawa, Masahiro Aoyagi, Youtaro Yasu, Kohji Koshiji |
Investigation of optimized high-density flip-chip interconnect design including micro Au bumps for 3-D stacked LSI packaging. |
3DIC |
2013 |
DBLP DOI BibTeX RDF |
|
22 | Masahiro Aoyagi, Naoya Watanabe, Motohiro Suzuki, Katsuya Kikuchi, Shunsuke Nemoto, Noriaki Arima, Misaki Ishizuka, Koji Suzuki, Toshio Shiomi |
New optical three dimensional structure measurement method of cone shape micro bumps used for 3D LSI chip stacking. |
3DIC |
2013 |
DBLP DOI BibTeX RDF |
|
22 | Ran Wang 0002, Krishnendu Chakrabarty, Bill Eklow |
Post-bond Testing of the Silicon Interposer and Micro-bumps in 2.5D ICs. |
Asian Test Symposium |
2013 |
DBLP DOI BibTeX RDF |
|
22 | Hermann Oppermann, Lothar Dietrich |
Nanoporous gold bumps for low temperature bonding. |
Microelectron. Reliab. |
2012 |
DBLP DOI BibTeX RDF |
|
22 | Eric Winsberg |
Bumps on the Road to Here (from Eternity). |
Entropy |
2012 |
DBLP DOI BibTeX RDF |
|
22 | Jamal Daafouz, José Claudio Geromel, Grace S. Deaecto |
A simple approach for switched control design with control bumps limitation. |
Syst. Control. Lett. |
2012 |
DBLP DOI BibTeX RDF |
|
22 | Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne, Bart Swinnen |
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. |
ICICDT |
2012 |
DBLP DOI BibTeX RDF |
|
22 | Mohammad Al-Fares, Rishi Kapoor, George Porter, Sambit Das, Hakim Weatherspoon, Balaji Prabhakar, Amin Vahdat |
NetBump: user-extensible active queue management with bumps on the wire. |
ANCS |
2012 |
DBLP DOI BibTeX RDF |
|
22 | Yao Lu, Yuzuru Sato, Shun-ichi Amari |
Traveling Bumps and Their Collisions in a Two-Dimensional Neural Field. |
Neural Comput. |
2011 |
DBLP DOI BibTeX RDF |
|
22 | Byeung-Gee Kim, Sang-Mok Lee, Yun-Song Jo, Sun-Chul Kim, Kyoung-Moo Harr, Young-Ho Kim |
Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives. |
Microelectron. Reliab. |
2011 |
DBLP DOI BibTeX RDF |
|
22 | Paul C. Bressloff, Zachary P. Kilpatrick |
Two-Dimensional Bumps in Piecewise Smooth Neural Fields with Synaptic Depression. |
SIAM J. Appl. Math. |
2011 |
DBLP DOI BibTeX RDF |
|
22 | Christopher J. Stanton, Edward Ratanasena, Sajjad Haider 0001, Mary-Anne Williams |
Perceiving Forces, Bumps, and Touches from Proprioceptive Expectations. |
RoboCup |
2011 |
DBLP DOI BibTeX RDF |
|
22 | Wei Zhao 0010, Mohammad Tehranipoor |
Peak power identification on power bumps during test application. |
IGCC |
2011 |
DBLP DOI BibTeX RDF |
|
22 | Stephen Ruth |
Bumps on the Road to the National Broadband Plan. |
IEEE Internet Comput. |
2010 |
DBLP DOI BibTeX RDF |
National Broadband Plan, Verizon/Google legislative proposal, Verizon, Federal Communications Commission, Google, public policy, FCC, net neutrality |
22 | Shinichiro Ohnuki, Ryuichi Ohsawa, Tsuneki Yamasaki |
Electromagnetic Scattering from Rectangular Cylinders with Various Wedge Cavities and Bumps. |
IEICE Trans. Electron. |
2010 |
DBLP DOI BibTeX RDF |
|
22 | Daisuke Inoue, Kazunori Ohno, Masashi Konyo, Satoshi Tadokoro |
Tracked-Vehicle Clutching Position Detectability on Bumps by Distributed Inclination Sensors. |
J. Robotics Mechatronics |
2010 |
DBLP DOI BibTeX RDF |
|