Search results for "soldering"

Hits ?▲	Authors	Title	Venue	Year	Link	Author keywords
46	Hao Ren 0003, Xinyu Wu 0001, Wanfeng Shang	Vision-based soldering process parameters calculation for Robotic soldering.	RCAR	2021	DBLP DOI BibTeX RDF
46	Zhancheng Wang, Weimin Li, Hang Tong, Yangsheng Xu	A Novel On-board Temperature Monitoring Approach in the Reflow Soldering Process.	IROS	2006	DBLP DOI BibTeX RDF
33	Erik Beckert, Thomas Burkhardt, Ramona Eberhardt, Andreas Tünnermann	Solder Bumping - A Flexible Joining Approach for the Precision Assembly of Optoelectronical Systems.	IPAS	2008	DBLP DOI BibTeX RDF	laser beam soldering, optics, microassembly, jetting, bumping
33	David W. Capson, Sai-Kit Eng	A Tiered-Color Illumination Approach for Machine Inspection of Solder Joints.	IEEE Trans. Pattern Anal. Mach. Intell.	1988	DBLP DOI BibTeX RDF	PCB inspection, tiered-color illumination, machine inspection, solder joints, color contours, colour vision, printed circuit manufacture, soldering, computer vision, statistical analysis, computerised pattern recognition, computerised pattern recognition, inspection, binary image, printed circuit boards, color vision, flaw detection
23	Daoyuan Liu, Yu Guo, Jian Xie, Hanpeng Gao, Shaohua Huang	Real-Time Quality Inspection Based on Transfer Learning and Feature Clustering for Wave Soldering.	IEEE Trans. Instrum. Meas.	2024	DBLP DOI BibTeX RDF
23	René Thierry Djoumessi, Pietro Lenarda, Alessio Gizzi, Simone Giusti, Pietro Alduini, Marco Paggi	Digital twin model of colon electromechanics for manometry prediction of laser tissue soldering.	CoRR	2024	DBLP DOI BibTeX RDF
23	Yuan Gao, Zhi Chen 0020, Jiahuang Lin, Xiang Li 0009, Yun-Hui Liu	Development of an automated system for the soldering of USB cables.	Robotics Comput. Integr. Manuf.	2023	DBLP DOI BibTeX RDF
23	Gaurav Dwivedi, Lavlesh Pensia, Viney Lohchab, Raj Kumar	Nondestructive Inspection and Quantification of Soldering Defects in PCB Using an Autofocusing Digital Holographic Camera.	IEEE Trans. Instrum. Meas.	2023	DBLP DOI BibTeX RDF
23	Bubu Xie, Cai Chen, Yihao Lin, Dong Chen, Wei Huang, Kailin Pan, Yubing Gong	Integrated Approach to Obtain Gas Flow Velocity in Convection Reflow Soldering Oven.	Symmetry	2023	DBLP DOI BibTeX RDF
23	Sik-Ho Tsang, Zhaoqing Suo, Tom Tak-Lam Chan, Huu-Thanh Nguyen 0003, Daniel Pak-Kong Lun	PCB Soldering Defect Inspection Using Multitask Learning under Low Data Regimes.	Adv. Intell. Syst.	2023	DBLP DOI BibTeX RDF
23	Kyohei Toyoshima, Chihiro Yukawa, Yuki Nagai, Yuma Yamashita, Tetsuya Oda, Leonard Barolli	A Motion Analysis System for Pointing and Calling Considering Safety Checks for Soldering Work.	3PGCIC	2023	DBLP DOI BibTeX RDF
23	Ching-Wen Ma, Yanwei Liu	DeepGD3: Unknown-Aware Deep Generative/Discriminative Hybrid Defect Detector for PCB Soldering Inspection.	UAI	2023	DBLP BibTeX RDF
23	Kyohei Toyoshima, Chihiro Yukawa, Yuki Nagai, Genki Moriya, Kei Tabuchi, Tetsuya Oda, Leonard Barolli	A Soldering Motion Analysis System for Monitoring Whole Body of People with Developmental Disabilities.	IMIS	2023	DBLP DOI BibTeX RDF
23	Gian Domenico Licciardo, Paola Vitolo, Stefano Bosco, Santo Pennino, Danilo Pau, Massimiliano Pesaturo, Luigi Di Benedetto, Rosalba Liguori	Ultra-Tiny Neural Network for Compensation of Post-soldering Thermal Drift in MEMS Pressure Sensors.	ISCAS	2023	DBLP DOI BibTeX RDF
23	Kyohei Toyoshima, Chihiro Yukawa, Yuki Nagai, Genki Moriya, Sora Asada, Tetsuya Oda, Leonard Barolli	A Fuzzy Inference and Posture Detection Based Soldering Motion Monitoring System.	AINA (2)	2023	DBLP DOI BibTeX RDF
23	Kyohei Toyoshima, Chihiro Yukawa, Yuki Nagai, Nobuki Saito, Tetsuya Oda, Leonard Barolli	A Depth Camera Based Soldering Motion Analysis System for Attention Posture Detection Considering Body Orientation.	EIDWT	2023	DBLP DOI BibTeX RDF
23	Kaidi Zhang, Kai Yang, Guangyao Li, Haisong Huang, Jiadui Chen	Effect of Servo-Pressurized Mode on Soldering Process Characteristics of Micro-Parts.	IEEE Access	2022	DBLP DOI BibTeX RDF
23	Renwang Li, Haixia Liu, Jiaqi Li, Jinyu Song, Jie Rong	Study on carbon footprint model and its parameter optimisation of wave soldering process based on response surface method.	Int. J. Wirel. Mob. Comput.	2022	DBLP DOI BibTeX RDF
23	Cong Zhang, Zige Fan, Yaonan Dai, Hang Chen, Sikai Wang, Xubing Chen	Path Planning of Laser Soldering System Based on Intelligent Algorithm.	Sensors	2022	DBLP DOI BibTeX RDF
23	Rocío Silvestre, Raúl Llinares Llopis, Laura Contat-Rodrigo, Víctor Serrano Martínez, Josué Ferri, Eduardo García-Breijo	Low-Temperature Soldering of Surface Mount Devices on Screen-Printed Silver Tracks on Fabrics for Flexible Textile Hybrid Electronics.	Sensors	2022	DBLP DOI BibTeX RDF
23	Kyohei Toyoshima, Tomoya Yasunaga, Chihiro Yukawa, Yuki Nagai, Nobuki Saito, Tetsuya Oda, Leonard Barolli	Analysis of a Soldering Motion for Dozing State and Attention Posture Detection.	3PGCIC	2022	DBLP DOI BibTeX RDF
23	Tomoya Yasunaga, Kyohei Toyoshima, Chihiro Yukawa, Yuki Nagai, Tomoaki Matsui, Tetsuya Oda, Leonard Barolli	Soldering Danger Detection System Using a Line-of-Sight Estimation.	NBiS	2022	DBLP DOI BibTeX RDF
23	Fan Ye, Dayuan Jin, Yun Wan, Xin Xie	The intelligent design of reflow soldering based on an improved high-dimensional surrogate assisted optimization method.	ITQM	2022	DBLP DOI BibTeX RDF
23	Jae-Chang Shim, YeongSeo Ha, Jihee Park, Yeunghak Lee	PCB Micro-Soldering Status Inspection System Research based on Deep Learning.	AICCC	2022	DBLP DOI BibTeX RDF
23	Kyohei Toyoshima, Tetsuya Oda, Tomoya Yasunaga, Chihiro Yukawa, Yuki Nagai, Nobuki Saito, Leonard Barolli	Design and Implementation of a Haptics Based Soldering Education System.	IMIS	2022	DBLP DOI BibTeX RDF
23	Tomoya Yasunaga, Tetsuya Oda, Kyohei Toyoshima, Yuki Nagai, Chihiro Yukawa, Kengo Katayama, Leonard Barolli	An Indicate System for Danger Detection and Its Soldering Motion Analysis.	IMIS	2022	DBLP DOI BibTeX RDF
23	Tomohito Suzuki, Yuhei Imai, Hiroyuki Manabe	A bonding technique for electric circuit prototyping using conductive transfer foil and soldering iron.	UIST (Adjunct Volume)	2022	DBLP DOI BibTeX RDF
23	Tomoya Yasunaga, Tetsuya Oda, Nobuki Saito, Aoto Hirata, Chihiro Yukawa, Yuki Nagai, Masaharu Hirota	A Soldering Motion Analysis System for Danger Detection Considering Object Detection and Attitude Estimation.	EIDWT	2022	DBLP DOI BibTeX RDF
23	Kyohei Toyoshima, Tetsuya Oda, Chihiro Yukawa, Tomoya Yasunaga, Aoto Hirata, Nobuki Saito, Leonard Barolli	Performance Evaluation of a Soldering Training System Based on Haptics.	EIDWT	2022	DBLP DOI BibTeX RDF
23	Mau-Luen Tham, Boon Yoong Chong, Yu Han Tan, Yen Khai Wong, Swee Ling Chean, Wei Kun Tan	Optimizing Deep Learning Inference to Detect PCB Soldering Defects.	IICAIET	2022	DBLP DOI BibTeX RDF
23	Bryan Christopher T. Wong, Mario G. Laureta, Olwyn S. Barcoma, Angelino A. Pimentel, Renann G. Baldovino	A Microcontroller-based and Cost-efficient Computer Numerical Control (CNC) Soldering Station.	IICAIET	2022	DBLP DOI BibTeX RDF
23	Kyohei Toyoshima, Tomoya Yasunaga, Yuki Nagai, Chihiro Yukawa, Tomoaki Matsui, Tetsuya Oda, Leonard Barolli	Experimental Results of a Haptics Based Soldering Education System: A Comparison Study of RNN and LSTM for Detection of Dangerous Movements.	INCoS	2022	DBLP DOI BibTeX RDF
23	Geng Ma, Xiaoqing Huang, Shihao Liu	Heat Transfer Modeling and Oven Temperature Curve Optimization of Integrated Circuit Board Reflow Soldering.	IEEE Access	2021	DBLP DOI BibTeX RDF
23	Anton Vladimirovich Milov, Vadim Sergeevich Tynchenko, Sergei Olegovich Kurashkin, Valeriya Valerievna Tynchenko, Vladislav Viktorovich Kukartsev, Vladimir Viktorovich Bukhtoyarov, Roman Sergienko, Viktor Alekseevich Kukartsev, Kirill Aleksandrovich Bashmur	The Use of Collections of Artificial Neural Networks to Improve the Control Quality of the Induction Soldering Process.	Sensors	2021	DBLP DOI BibTeX RDF
23	Sebastian Micus, Michael Haupt, Götz T. Gresser	Automatic Joining of Electrical Components to Smart Textiles by Ultrasonic Soldering.	Sensors	2021	DBLP DOI BibTeX RDF
23	Hao Ren 0003, Xinyu Wu 0001, Wanfeng Shang	Robotic Micromanipulation for Active Pin Alignment in Electronic Soldering Industry.	ICRA	2021	DBLP DOI BibTeX RDF
23	Anton Vladimirovich Milov, Vadim Tynchenko, Sergei Kurashkin, Valeriya Valerievna Tynchenko	Ensemble of artificial neural networks to control the induction soldering of spacecraft's waveguide paths.	MetroInd4.0&IoT	2021	DBLP DOI BibTeX RDF
23	Zhaoqi Jiang, Gui-Sheng Gan, Shi-Qi Chen, Qianzhu Xu, Tian Huang, Cong Liu, Peng Ma, Hao Yang, Siwen Chen, Yiping Wu	The effect of ultrasonic turn-on sequence for dual ultrasonicassisted soldering.	ICTA	2021	DBLP DOI BibTeX RDF
23	Yoshinobu Fukumitsu, Keita Nakamichi, Hidetake Uwano, Hiroshi Fukuoka	Defect Classification using Pressure Change of Sleeve Soldering Machine.	ICRCA	2021	DBLP DOI BibTeX RDF
23	Tomoya Yasunaga, Tetsuya Oda, Nobuki Saito, Aoto Hirata, Kyohei Toyoshima, Kengo Katayama	Object Detection and Pose Estimation Approaches for Soldering Danger Detection.	GCCE	2021	DBLP DOI BibTeX RDF
23	Kyohei Toyoshima, Tetsuya Oda, Nobuki Saito, Aoto Hirata, Masaharu Hirota, Kengo Katayama	Proposal of a Haptics and LSTM Based Soldering Motion Analysis System.	GCCE	2021	DBLP DOI BibTeX RDF
23	Wenting Dai, Abdul Mujeeb, Marius Erdt, Alexei Sourin	Soldering defect detection in automatic optical inspection.	Adv. Eng. Informatics	2020	DBLP DOI BibTeX RDF
23	Sebastian Micus, Ivan Kirsten, Michael Haupt, Götz T. Gresser	Analysis of Hot Bar Soldering, Insulation Displacement Connections (IDC), and Anisotropic Conductive Adhesives (ACA), for the Automated Production of Smart Textiles.	Sensors	2020	DBLP DOI BibTeX RDF
23	Yuan Gao 0003, Zhi Chen 0020, Mengjun Fang, Yun-Hui Liu, Xiang Li 0009	Development of an Autonomous Soldering Robot for USB Wires.	AIM	2020	DBLP DOI BibTeX RDF
23	Lauren Race, Joshua A. Miele, Chancey Fleet, Tom Igoe, Amy Hurst	Putting Tools in Hands: Designing Curriculum for a Nonvisual Soldering Workshop.	ASSETS	2020	DBLP DOI BibTeX RDF
23	Yuto Hirota, Tetsuya Oda, Nobuki Saito, Aoto Hirata, Masaharu Hirota, Kengo Katatama	Proposal and Experimental Results of an Ambient Intelligence for Training on Soldering Iron Holding.	BWCCA	2020	DBLP DOI BibTeX RDF
23	Anton Vladimirovich Milov, Vadim Tynchenko, Vyacheslav Petrenko, Sergei Kurashkin	Algorithmic and Software Support for Technological Decision-Making in the Process of Induction Soldering.	CSOC (1)	2020	DBLP DOI BibTeX RDF
23	Thanat Sooknuan, Chanawat Phongklee, Wichupong Wiboonjaroen, Maitree Thumma, Pipatana Amatachaya	Implementation the SoC of PCB Reflow Soldering.	JCSSE	2019	DBLP DOI BibTeX RDF
23	Mariia Kepper, Pol Ribes-Pleguezuelo, Marcel Hornaff, Erik Beckert, Ramona Eberhardt, Pascal Pranyies, Isabelle Toubhans, Francis Descours, Andreas Tünnermann	Soldering and Packaging Study for an Optical Filter Required for High Resolution Earth Observation Space Missions.	PHOTOPTICS	2019	DBLP DOI BibTeX RDF
23	Dirk Seehase, Christian Kohlen, Arne Neiser, Andrej Novikov, Mathias Nowottnick	Selective Soldering on Printed Circuit Boards with Endogenous Induction Heat at Appropriate Susceptors.	Period. Polytech. Electr. Eng. Comput. Sci.	2018	DBLP DOI BibTeX RDF
23	Anil Kunwar, Shengyan Shang, Peter Råback, Yunpeng Wang, Julien Givernaud, Jun Chen, Haitao Ma, Xueguan Song, Ning Zhao	Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints.	Microelectron. Reliab.	2018	DBLP DOI BibTeX RDF
23	Srivalli Chellvarajoo, Mohd Zulkifly Abdullah	Investigation on nano-reinforced solder paste after reflow soldering part 1: Effects of nano-reinforced solder paste on melting, hardness, spreading rate, and wetting quality.	Microelectron. Reliab.	2018	DBLP DOI BibTeX RDF
23	Dominik Rybarczyk, Andrzej Milecki	The Design and Application of Wireless 3D Tool for Offline Programming of Soldering Robot.	AUTOMATION	2018	DBLP DOI BibTeX RDF
23	Wenting Dai, Abdul Mujeeb, Marius Erdt, Alexei Sourin	Towards Automatic Optical Inspection of Soldering Defects.	CW	2018	DBLP DOI BibTeX RDF
23	Pol Ribes-Pleguezuelo, Katherine Frei, Gudrun Bruckner, Erik Beckert, Ramona Eberhardt, Andreas Tünnermann	Lithiumniobate Die Assembled by a Low-stress Soldering Technique - Method to Fasten a Surface Acoustic Wave Sensor.	PHOTOPTICS	2018	DBLP DOI BibTeX RDF
23	Pawel Pawlowski, Adam Dabrowski, Marcin Grenz, Michal Bladowski	Reflow Oven for Heating and Soldering SMD and BGA Components.	MIXDES	2018	DBLP DOI BibTeX RDF
23	D. Feil, T. Herberholz, M. Guyenot, Mathias Nowottnick	Highly variable Sn-Cu diffusion soldering process for high performance power electronics.	Microelectron. Reliab.	2017	DBLP DOI BibTeX RDF
23	A. M. Najib, Mohd Zulkifly Abdullah, Abdullah Aziz Saad, Z. Samsudin, F. Che Ani	Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering.	Microelectron. Reliab.	2017	DBLP DOI BibTeX RDF
23	Xiang Li 0009, Xing Su, Yunhui Liu	Adaptive region control for robotic soldering of flexible PCBs.	ICAR	2017	DBLP DOI BibTeX RDF
23	Xiang Li 0009, Xing Su, Yunhui Liu	Cooperative robotic soldering of flexible PCBs.	IROS	2017	DBLP DOI BibTeX RDF
23	Thibaut Heckmann, Thomas R. Souvignet, S. Lepeer, David Naccache	Low-temperature low-cost 58 Bismuth - 42 Tin alloy forensic chip re-balling and re-soldering.	Digit. Investig.	2016	DBLP DOI BibTeX RDF
23	Jonas Neubert, Hod Lipson	Soldercubes: a self-soldering self-reconfiguring modular robot system.	Auton. Robots	2016	DBLP DOI BibTeX RDF
23	Rossella Berni, Marcantonio Catelani, Caterina Fiesoli, Valeria L. Scarano	A Comparison of Alloy-Surface Finish Combinations Considering Different Component Package Types and Their Impact on Soldering Reliability.	IEEE Trans. Reliab.	2016	DBLP DOI BibTeX RDF
23	Tsung-Nan Tsai, Jun-Hsien Yeh	Identification and risk assessment of soldering failure sources using a hybrid failure mode and effect analysis model and a fuzzy inference system.	J. Intell. Fuzzy Syst.	2015	DBLP DOI BibTeX RDF
23	Wei Chih Liu, Yan Hao Chen, Te-yuan Chung, Cheng Yi Liu	Study of Al-Cu compounds as soldering bond pad for high-power device packaging.	Microelectron. Reliab.	2015	DBLP DOI BibTeX RDF
23	M. S. Abdul Aziz, Mohd Zulkifly Abdullah, C. Y. Khor, I. A. Azid	Optimization of pin through hole connector in thermal fluid-structure interaction analysis of wave soldering process using response surface methodology.	Simul. Model. Pract. Theory	2015	DBLP DOI BibTeX RDF
23	I. Siti Rabiatull Aisha, A. Ourdjini, M. A. Azmah Hanim, O. Saliza Azlina	Effect of reflow soldering profile on intermetallic compound formation.	Int. J. Comput. Appl. Technol.	2015	DBLP DOI BibTeX RDF
23	Manabu Ishihara	Haptic Device Using a Soldering Test System.	HCI (27)	2015	DBLP DOI BibTeX RDF
23	Chien-Yi Huang, Hui-Hua Huang	Process optimization of SnCuNi soldering material using artificial parametric design.	J. Intell. Manuf.	2014	DBLP DOI BibTeX RDF
23	Jonas Neubert, Arne Rost, Hod Lipson	Self-Soldering Connectors for Modular Robots.	IEEE Trans. Robotics	2014	DBLP DOI BibTeX RDF
23	Olivér Krammer	Modelling the self-alignment of passive chip components during reflow soldering.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
23	Yang Liu 0103, Stanley Y. Y. Leung, Jia Zhao, Cell K. Y. Wong, Cadmus A. Yuan, Guoqi Zhang, Fenglian Sun, Liangliang Luo	Thermal and mechanical effects of voids within flip chip soldering in LED packages.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
23	Francesco Adamo, Gregorio Andria, Attilio Di Nisio, Nicola Giaquinto, Valeria L. Scarano, Maurizio Spadavecchia	Wideband measurement method for prognosis of soldering failure on electronic boards.	I2MTC	2014	DBLP DOI BibTeX RDF
23	Marco Felix, Andres Medel, Alvaro Gonzalez, Heriberto Marquez, David Salazar, Citlalli Anguiano	QTH lamp optical output power analysis for SMT components' infrared light soldering systems.	IECON	2014	DBLP DOI BibTeX RDF
23	Laurenz Notter, Jacques Jacot	Assembly of Silicon Micro-parts with Steel Spindles Using Low-Temperature Soldering.	IPAS	2014	DBLP DOI BibTeX RDF
23	Miao Cai, D. J. Xie, W. B. Chen, B. Y. Wu, Dao-Guo Yang, G. Q. Zhang	A novel soldering method to evaluate PCB pad cratering for pin-pull testing.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
23	Tong Hong Wang, Ching-I Tsai, Chang-Chi Lee, Yi-Shao Lai	Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
23	Marco Felix, Andres Medel, Miguel Bravo, Citlalli Anguiano, Heriberto Marquez, David Salazar	Heated area measurement and analysis of optical setups for focused IR light soldering system.	IECON	2013	DBLP DOI BibTeX RDF
23	Mika Liukkonen, Elina Havia, Yrjö Hiltunen	Computational intelligence in mass soldering of electronics - A survey.	Expert Syst. Appl.	2012	DBLP DOI BibTeX RDF
23	Tsung-Nan Tsai	Development of a soldering quality classifier system using a hybrid data mining approach.	Expert Syst. Appl.	2012	DBLP DOI BibTeX RDF
23	Tsung-Nan Tsai	Thermal parameters optimization of a reflow soldering profile in printed circuit board assembly: A comparative study.	Appl. Soft Comput.	2012	DBLP DOI BibTeX RDF
23	Hitoshi Sakurai, Keun-Soo Kim, Kiju Lee, Chang-Jae Kim, Youichi Kukimoto, Katsuaki Suganuma	Effects of Cu contents in flux on microstructure and joint strength of Sn-3.5Ag soldering with electroless Ni-P/Au surface finish.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
23	Ming-Hung Shu, Bi-Min Hsu, Min-Chuan Hu	Optimal combination of soldering conditions of BGA for halogen-free and lead-free SMT-green processes.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
23	Chun-Sean Lau, Mohd Zulkifly Abdullah, F. Che Ani	Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
23	Csaba Benedek	Detection of soldering defects in Printed Circuit Boards with Hierarchical Marked Point Processes.	Pattern Recognit. Lett.	2011	DBLP DOI BibTeX RDF
23	Mika Liukkonen, Elina Havia, Hannu Leinonen, Yrjö Hiltunen	Quality-oriented optimization of wave soldering process by using self-organizing maps.	Appl. Soft Comput.	2011	DBLP DOI BibTeX RDF
23	Changhua Du, Chuntian Li, Tao Wang, Wenchao Huang	The Study and Development of Modern Wave Soldering Materials for 3C Products.	ICFCE	2011	DBLP DOI BibTeX RDF
23	Marcantonio Catelani, Valeria L. Scarano, Francesco Bertocci	Implementation and Characterization of a Medical Ultrasound Phased Array Probe With New Pb-Free Soldering Materials.	IEEE Trans. Instrum. Meas.	2010	DBLP DOI BibTeX RDF
23	Chung-Chi Wu, Yung-Nan Hu	Image Recognition for PCB Soldering Platform Controlled by Embedded Microchip Based on Hopfield Neural Network.	J. Comput.	2010	DBLP BibTeX RDF
23	Mika Liukkonen, Elina Havia, Hannu Leinonen, Yrjö Hiltunen	Application of self-organizing maps in analysis of wave soldering process.	Expert Syst. Appl.	2009	DBLP DOI BibTeX RDF
23	Jun-Tae Lee, Wei Li, Dave (Dae-Wook) Kim	Process modelling and experimentation of a cordless resistance soldering system.	Int. J. Manuf. Res.	2009	DBLP DOI BibTeX RDF
23	Girolamo Fornarelli, Antonio Giaquinto, Gioacchino Brunetti, Giuseppe Acciani	A Neurofuzzy Method for the Evaluation of Soldering Global Quality Index.	IEEE Trans. Ind. Informatics	2009	DBLP DOI BibTeX RDF
23	Zhenhua Xiong, Xinjue Zhou, Yulin Wang, Han Ding 0001	Automatic Soldering System Based on Computer Vision.	ICIRA	2009	DBLP DOI BibTeX RDF
23	Balázs Illés, Gábor Harsányi	3D thermal model to investigate component displacement phenomenon during reflow soldering.	Microelectron. Reliab.	2008	DBLP DOI BibTeX RDF
23	C. K. Wong, John H. L. Pang, J. W. Tew, B. K. Lok, H. J. Lu, F. L. Ng, Y. F. Sun	The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging.	Microelectron. Reliab.	2008	DBLP DOI BibTeX RDF
23	Nele Van Steenberge, Paresh Limaye, Geert Willems, Bart Vandevelde, Inge Schildermans	Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly.	Microelectron. Reliab.	2007	DBLP DOI BibTeX RDF
23	Tsung-Nan Tsai	Development of an integrated reflow soldering control system using incremental hybrid process knowledge.	Expert Syst. Appl.	2005	DBLP DOI BibTeX RDF
23	Zbigniew Moser, Wladyslaw Gasior, Adam Debski	Database of Pb - free soldering materials, surface tension and density, experiment vs. Modeling.	Data Sci. J.	2005	DBLP DOI BibTeX RDF
23	Peter Alpern, Kheng Chooi Lee, Rainer Tilgner	Effect of long and short Pb-free soldering profiles of IPC/JEDEC J-STD-020 on plastic SMD packages.	Microelectron. Reliab.	2004	DBLP DOI BibTeX RDF
23	Alexandrine Guédon, Eric Woirgard, Christian Zardini	Evaluation of lead-free soldering for automotive applications.	Microelectron. Reliab.	2002	DBLP DOI BibTeX RDF