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GrowBag graphs for keyword ? (Num. hits/coverage)
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The graphs summarize 31 occurrences of 31 keywords
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Results
Found 111 publication records. Showing 111 according to the selection in the facets
Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
46 | Hao Ren 0003, Xinyu Wu 0001, Wanfeng Shang |
Vision-based soldering process parameters calculation for Robotic soldering. ![Search on Bibsonomy](Pics/bibsonomy.png) |
RCAR ![In: IEEE International Conference on Real-time Computing and Robotics, RCAR 2021, Xining, China, July 15-19, 2021, pp. 1189-1194, 2021, IEEE, 978-1-6654-3678-6. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
46 | Zhancheng Wang, Weimin Li, Hang Tong, Yangsheng Xu |
A Novel On-board Temperature Monitoring Approach in the Reflow Soldering Process. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IROS ![In: 2006 IEEE/RSJ International Conference on Intelligent Robots and Systems, IROS 2006, October 9-15, 2006, Beijing, China, pp. 4245-4251, 2006, IEEE, 1-4244-0258-1. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
33 | Erik Beckert, Thomas Burkhardt, Ramona Eberhardt, Andreas Tünnermann |
Solder Bumping - A Flexible Joining Approach for the Precision Assembly of Optoelectronical Systems. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IPAS ![In: Micro-Assembly Technologies and Applications, IFIP TC5 WG5.5 Fourth International Precision Assembly Seminar (IPAS'2008), Chamonix, France, February 10-13, 2008, pp. 139-147, 2008, Springer, 978-0-387-77402-2. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
laser beam soldering, optics, microassembly, jetting, bumping |
33 | David W. Capson, Sai-Kit Eng |
A Tiered-Color Illumination Approach for Machine Inspection of Solder Joints. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Pattern Anal. Mach. Intell. ![In: IEEE Trans. Pattern Anal. Mach. Intell. 10(3), pp. 387-393, 1988. The full citation details ...](Pics/full.jpeg) |
1988 |
DBLP DOI BibTeX RDF |
PCB inspection, tiered-color illumination, machine inspection, solder joints, color contours, colour vision, printed circuit manufacture, soldering, computer vision, statistical analysis, computerised pattern recognition, computerised pattern recognition, inspection, binary image, printed circuit boards, color vision, flaw detection |
23 | Daoyuan Liu, Yu Guo, Jian Xie, Hanpeng Gao, Shaohua Huang |
Real-Time Quality Inspection Based on Transfer Learning and Feature Clustering for Wave Soldering. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Instrum. Meas. ![In: IEEE Trans. Instrum. Meas. 73, pp. 1-10, 2024. The full citation details ...](Pics/full.jpeg) |
2024 |
DBLP DOI BibTeX RDF |
|
23 | René Thierry Djoumessi, Pietro Lenarda, Alessio Gizzi, Simone Giusti, Pietro Alduini, Marco Paggi |
Digital twin model of colon electromechanics for manometry prediction of laser tissue soldering. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CoRR ![In: CoRR abs/2403.15129, 2024. The full citation details ...](Pics/full.jpeg) |
2024 |
DBLP DOI BibTeX RDF |
|
23 | Yuan Gao, Zhi Chen 0020, Jiahuang Lin, Xiang Li 0009, Yun-Hui Liu |
Development of an automated system for the soldering of USB cables. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Robotics Comput. Integr. Manuf. ![In: Robotics Comput. Integr. Manuf. 79, pp. 102440, 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
23 | Gaurav Dwivedi, Lavlesh Pensia, Viney Lohchab, Raj Kumar |
Nondestructive Inspection and Quantification of Soldering Defects in PCB Using an Autofocusing Digital Holographic Camera. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Instrum. Meas. ![In: IEEE Trans. Instrum. Meas. 72, pp. 1-8, 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
23 | Bubu Xie, Cai Chen, Yihao Lin, Dong Chen, Wei Huang, Kailin Pan, Yubing Gong |
Integrated Approach to Obtain Gas Flow Velocity in Convection Reflow Soldering Oven. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Symmetry ![In: Symmetry 15(9), pp. 1739, September 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
23 | Sik-Ho Tsang, Zhaoqing Suo, Tom Tak-Lam Chan, Huu-Thanh Nguyen 0003, Daniel Pak-Kong Lun |
PCB Soldering Defect Inspection Using Multitask Learning under Low Data Regimes. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Adv. Intell. Syst. ![In: Adv. Intell. Syst. 5(12), December 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
23 | Kyohei Toyoshima, Chihiro Yukawa, Yuki Nagai, Yuma Yamashita, Tetsuya Oda, Leonard Barolli |
A Motion Analysis System for Pointing and Calling Considering Safety Checks for Soldering Work. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3PGCIC ![In: Advances on P2P, Parallel, Grid, Cloud and Internet Computing - Proceedings of the 18th International Conference on P2P, Parallel, Grid, Cloud and Internet Computing (3PGCIC-2023), Daegu, Korea, 6-8 November 2023., pp. 92-102, 2023, Springer, 978-3-031-46969-5. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
23 | Ching-Wen Ma, Yanwei Liu |
DeepGD3: Unknown-Aware Deep Generative/Discriminative Hybrid Defect Detector for PCB Soldering Inspection. ![Search on Bibsonomy](Pics/bibsonomy.png) |
UAI ![In: Uncertainty in Artificial Intelligence, UAI 2023, July 31 - 4 August 2023, Pittsburgh, PA, USA., pp. 1326-1335, 2023, PMLR. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP BibTeX RDF |
|
23 | Kyohei Toyoshima, Chihiro Yukawa, Yuki Nagai, Genki Moriya, Kei Tabuchi, Tetsuya Oda, Leonard Barolli |
A Soldering Motion Analysis System for Monitoring Whole Body of People with Developmental Disabilities. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IMIS ![In: Innovative Mobile and Internet Services in Ubiquitous Computing - Proceedings of the 17th International Conference on Innovative Mobile and Internet Services in Ubiquitous Computing (IMIS-2023), Toronto, ON, Canada, 5-7 July 2023., pp. 38-46, 2023, Springer, 978-3-031-35835-7. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
23 | Gian Domenico Licciardo, Paola Vitolo, Stefano Bosco, Santo Pennino, Danilo Pau, Massimiliano Pesaturo, Luigi Di Benedetto, Rosalba Liguori |
Ultra-Tiny Neural Network for Compensation of Post-soldering Thermal Drift in MEMS Pressure Sensors. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISCAS ![In: IEEE International Symposium on Circuits and Systems, ISCAS 2023, Monterey, CA, USA, May 21-25, 2023, pp. 1-5, 2023, IEEE, 978-1-6654-5109-3. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
23 | Kyohei Toyoshima, Chihiro Yukawa, Yuki Nagai, Genki Moriya, Sora Asada, Tetsuya Oda, Leonard Barolli |
A Fuzzy Inference and Posture Detection Based Soldering Motion Monitoring System. ![Search on Bibsonomy](Pics/bibsonomy.png) |
AINA (2) ![In: Advanced Information Networking and Applications - Proceedings of the 37th International Conference on Advanced Information Networking and Applications (AINA-2023), Juiz de Fora, Brazil, 29-31 March 2023, Volume 2, pp. 183-191, 2023, Springer, 978-3-031-28450-2. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
23 | Kyohei Toyoshima, Chihiro Yukawa, Yuki Nagai, Nobuki Saito, Tetsuya Oda, Leonard Barolli |
A Depth Camera Based Soldering Motion Analysis System for Attention Posture Detection Considering Body Orientation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
EIDWT ![In: Advances in Internet, Data & Web Technologies - The 11th International Conference on Emerging Internet, Data & Web Technologies, EIDWT 2023, Semarang, Indonesia, 23-25 February 2023., pp. 341-349, 2023, Springer, 978-3-031-26280-7. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
23 | Kaidi Zhang, Kai Yang, Guangyao Li, Haisong Huang, Jiadui Chen |
Effect of Servo-Pressurized Mode on Soldering Process Characteristics of Micro-Parts. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Access ![In: IEEE Access 10, pp. 115691-115701, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
23 | Renwang Li, Haixia Liu, Jiaqi Li, Jinyu Song, Jie Rong |
Study on carbon footprint model and its parameter optimisation of wave soldering process based on response surface method. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Int. J. Wirel. Mob. Comput. ![In: Int. J. Wirel. Mob. Comput. 22(2), pp. 105-113, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
23 | Cong Zhang, Zige Fan, Yaonan Dai, Hang Chen, Sikai Wang, Xubing Chen |
Path Planning of Laser Soldering System Based on Intelligent Algorithm. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 22(21), pp. 8120, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
23 | Rocío Silvestre, Raúl Llinares Llopis, Laura Contat-Rodrigo, Víctor Serrano Martínez, Josué Ferri, Eduardo García-Breijo |
Low-Temperature Soldering of Surface Mount Devices on Screen-Printed Silver Tracks on Fabrics for Flexible Textile Hybrid Electronics. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 22(15), pp. 5766, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
23 | Kyohei Toyoshima, Tomoya Yasunaga, Chihiro Yukawa, Yuki Nagai, Nobuki Saito, Tetsuya Oda, Leonard Barolli |
Analysis of a Soldering Motion for Dozing State and Attention Posture Detection. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3PGCIC ![In: Advances on P2P, Parallel, Grid, Cloud and Internet Computing - Proceedings of the 17th International Conference on P2P, Parallel, Grid, Cloud and Internet Computing (3PGCIC-2022), Tirana, Albania, 27-29 October 2022., pp. 146-153, 2022, Springer, 978-3-031-19944-8. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
23 | Tomoya Yasunaga, Kyohei Toyoshima, Chihiro Yukawa, Yuki Nagai, Tomoaki Matsui, Tetsuya Oda, Leonard Barolli |
Soldering Danger Detection System Using a Line-of-Sight Estimation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NBiS ![In: Advances in Network-Based Information Systems - The 25th International Conference on Network-Based Information Systems (NBiS-2022), Sanda-Shi, Japan, 7-9 September, 2022, pp. 58-65, 2022, Springer, 978-3-031-14313-7. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
23 | Fan Ye, Dayuan Jin, Yun Wan, Xin Xie |
The intelligent design of reflow soldering based on an improved high-dimensional surrogate assisted optimization method. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ITQM ![In: Proceedings of the 9th International Conference on Information Technology and Quantitative Management, ITQM 2022, Global Green Digital Economy: Challenges and Development, December 9-11, 2022, Beijing, China, pp. 295-303, 2022, Elsevier. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
23 | Jae-Chang Shim, YeongSeo Ha, Jihee Park, Yeunghak Lee |
PCB Micro-Soldering Status Inspection System Research based on Deep Learning. ![Search on Bibsonomy](Pics/bibsonomy.png) |
AICCC ![In: Proceedings of the 5th Artificial Intelligence and Cloud Computing Conference, AICCC 2022, Osaka, Japan, December 17-19, 2022., pp. 29-33, 2022, ACM, 978-1-4503-9874-9. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
23 | Kyohei Toyoshima, Tetsuya Oda, Tomoya Yasunaga, Chihiro Yukawa, Yuki Nagai, Nobuki Saito, Leonard Barolli |
Design and Implementation of a Haptics Based Soldering Education System. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IMIS ![In: Innovative Mobile and Internet Services in Ubiquitous Computing - Proceedings of the 16th International Conference on Innovative Mobile and Internet Services in Ubiquitous Computing (IMIS 2022), June 29 - July 1, 2022, Virtual Event / Kitakyushu, Japan., pp. 54-64, 2022, Springer, 978-3-031-08818-6. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
23 | Tomoya Yasunaga, Tetsuya Oda, Kyohei Toyoshima, Yuki Nagai, Chihiro Yukawa, Kengo Katayama, Leonard Barolli |
An Indicate System for Danger Detection and Its Soldering Motion Analysis. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IMIS ![In: Innovative Mobile and Internet Services in Ubiquitous Computing - Proceedings of the 16th International Conference on Innovative Mobile and Internet Services in Ubiquitous Computing (IMIS 2022), June 29 - July 1, 2022, Virtual Event / Kitakyushu, Japan., pp. 31-40, 2022, Springer, 978-3-031-08818-6. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
23 | Tomohito Suzuki, Yuhei Imai, Hiroyuki Manabe |
A bonding technique for electric circuit prototyping using conductive transfer foil and soldering iron. ![Search on Bibsonomy](Pics/bibsonomy.png) |
UIST (Adjunct Volume) ![In: The Adjunct Publication of the 35th Annual ACM Symposium on User Interface Software and Technology, UIST 2022, Bend, OR, USA, 29 October 2022- 2 November 2022, pp. 85:1-85:3, 2022, ACM, 978-1-4503-9321-8. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
23 | Tomoya Yasunaga, Tetsuya Oda, Nobuki Saito, Aoto Hirata, Chihiro Yukawa, Yuki Nagai, Masaharu Hirota |
A Soldering Motion Analysis System for Danger Detection Considering Object Detection and Attitude Estimation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
EIDWT ![In: Advances in Internet, Data & Web Technologies - The 10th International Conference on Emerging Internet, Data and Web Technologies, EIDWT 2022, Okayama, Japan, 24-26 February 2022., pp. 301-307, 2022, Springer, 978-3-030-95902-9. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
23 | Kyohei Toyoshima, Tetsuya Oda, Chihiro Yukawa, Tomoya Yasunaga, Aoto Hirata, Nobuki Saito, Leonard Barolli |
Performance Evaluation of a Soldering Training System Based on Haptics. ![Search on Bibsonomy](Pics/bibsonomy.png) |
EIDWT ![In: Advances in Internet, Data & Web Technologies - The 10th International Conference on Emerging Internet, Data and Web Technologies, EIDWT 2022, Okayama, Japan, 24-26 February 2022., pp. 308-315, 2022, Springer, 978-3-030-95902-9. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
23 | Mau-Luen Tham, Boon Yoong Chong, Yu Han Tan, Yen Khai Wong, Swee Ling Chean, Wei Kun Tan |
Optimizing Deep Learning Inference to Detect PCB Soldering Defects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IICAIET ![In: IEEE International Conference on Artificial Intelligence in Engineering and Technology, IICAIET 2022, Kota Kinabalu, Malaysia, September 13-15, 2022, pp. 1-5, 2022, IEEE, 978-1-6654-6837-4. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
23 | Bryan Christopher T. Wong, Mario G. Laureta, Olwyn S. Barcoma, Angelino A. Pimentel, Renann G. Baldovino |
A Microcontroller-based and Cost-efficient Computer Numerical Control (CNC) Soldering Station. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IICAIET ![In: IEEE International Conference on Artificial Intelligence in Engineering and Technology, IICAIET 2022, Kota Kinabalu, Malaysia, September 13-15, 2022, pp. 1-5, 2022, IEEE, 978-1-6654-6837-4. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
23 | Kyohei Toyoshima, Tomoya Yasunaga, Yuki Nagai, Chihiro Yukawa, Tomoaki Matsui, Tetsuya Oda, Leonard Barolli |
Experimental Results of a Haptics Based Soldering Education System: A Comparison Study of RNN and LSTM for Detection of Dangerous Movements. ![Search on Bibsonomy](Pics/bibsonomy.png) |
INCoS ![In: Advances in Intelligent Networking and Collaborative Systems - The 14th International Conference on Intelligent Networking and Collaborative Systems, INCoS 2022, Sanda-Shi, Japan, 7-9 September 2022., pp. 212-223, 2022, Springer, 978-3-031-14626-8. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
23 | Geng Ma, Xiaoqing Huang, Shihao Liu |
Heat Transfer Modeling and Oven Temperature Curve Optimization of Integrated Circuit Board Reflow Soldering. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Access ![In: IEEE Access 9, pp. 141876-141889, 2021. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
23 | Anton Vladimirovich Milov, Vadim Sergeevich Tynchenko, Sergei Olegovich Kurashkin, Valeriya Valerievna Tynchenko, Vladislav Viktorovich Kukartsev, Vladimir Viktorovich Bukhtoyarov, Roman Sergienko, Viktor Alekseevich Kukartsev, Kirill Aleksandrovich Bashmur |
The Use of Collections of Artificial Neural Networks to Improve the Control Quality of the Induction Soldering Process. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 21(12), pp. 4199, 2021. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
23 | Sebastian Micus, Michael Haupt, Götz T. Gresser |
Automatic Joining of Electrical Components to Smart Textiles by Ultrasonic Soldering. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 21(2), pp. 545, 2021. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
23 | Hao Ren 0003, Xinyu Wu 0001, Wanfeng Shang |
Robotic Micromanipulation for Active Pin Alignment in Electronic Soldering Industry. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICRA ![In: IEEE International Conference on Robotics and Automation, ICRA 2021, Xi'an, China, May 30 - June 5, 2021, pp. 623-628, 2021, IEEE, 978-1-7281-9077-8. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
23 | Anton Vladimirovich Milov, Vadim Tynchenko, Sergei Kurashkin, Valeriya Valerievna Tynchenko |
Ensemble of artificial neural networks to control the induction soldering of spacecraft's waveguide paths. ![Search on Bibsonomy](Pics/bibsonomy.png) |
MetroInd4.0&IoT ![In: IEEE International Workshop on Metrology for Industry 4.0 & IoT, MetroInd4.0&IoT 2021, Rome, Italy, June 7-9, 2021, pp. 65-70, 2021, IEEE, 978-1-6654-1980-2. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
23 | Zhaoqi Jiang, Gui-Sheng Gan, Shi-Qi Chen, Qianzhu Xu, Tian Huang, Cong Liu, Peng Ma, Hao Yang, Siwen Chen, Yiping Wu |
The effect of ultrasonic turn-on sequence for dual ultrasonicassisted soldering. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICTA ![In: 2021 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2021, Zhuhai, China, November 24-26, 2021, pp. 163-166, 2021, IEEE, 978-1-6654-1745-7. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
23 | Yoshinobu Fukumitsu, Keita Nakamichi, Hidetake Uwano, Hiroshi Fukuoka |
Defect Classification using Pressure Change of Sleeve Soldering Machine. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICRCA ![In: ICRCA 2021: The 5th International Conference on Robotics, Control and Automation, Seoul Republic of Korea, March 5 - 7, 2021, pp. 43-47, 2021, ACM, 978-1-4503-8748-4. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
23 | Tomoya Yasunaga, Tetsuya Oda, Nobuki Saito, Aoto Hirata, Kyohei Toyoshima, Kengo Katayama |
Object Detection and Pose Estimation Approaches for Soldering Danger Detection. ![Search on Bibsonomy](Pics/bibsonomy.png) |
GCCE ![In: 10th IEEE Global Conference on Consumer Electronics, GCCE 2021, Kyoto, Japan, October 12-15, 2021, pp. 697-698, 2021, IEEE, 978-1-6654-3676-2. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
23 | Kyohei Toyoshima, Tetsuya Oda, Nobuki Saito, Aoto Hirata, Masaharu Hirota, Kengo Katayama |
Proposal of a Haptics and LSTM Based Soldering Motion Analysis System. ![Search on Bibsonomy](Pics/bibsonomy.png) |
GCCE ![In: 10th IEEE Global Conference on Consumer Electronics, GCCE 2021, Kyoto, Japan, October 12-15, 2021, pp. 1-2, 2021, IEEE, 978-1-6654-3676-2. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
23 | Wenting Dai, Abdul Mujeeb, Marius Erdt, Alexei Sourin |
Soldering defect detection in automatic optical inspection. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Adv. Eng. Informatics ![In: Adv. Eng. Informatics 43, pp. 101004, 2020. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
23 | Sebastian Micus, Ivan Kirsten, Michael Haupt, Götz T. Gresser |
Analysis of Hot Bar Soldering, Insulation Displacement Connections (IDC), and Anisotropic Conductive Adhesives (ACA), for the Automated Production of Smart Textiles. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 20(1), pp. 5, 2020. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
23 | Yuan Gao 0003, Zhi Chen 0020, Mengjun Fang, Yun-Hui Liu, Xiang Li 0009 |
Development of an Autonomous Soldering Robot for USB Wires. ![Search on Bibsonomy](Pics/bibsonomy.png) |
AIM ![In: IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2020, Boston, MA, USA, July 6-9, 2020, pp. 1196-1201, 2020, IEEE, 978-1-7281-6794-7. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
23 | Lauren Race, Joshua A. Miele, Chancey Fleet, Tom Igoe, Amy Hurst |
Putting Tools in Hands: Designing Curriculum for a Nonvisual Soldering Workshop. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ASSETS ![In: ASSETS '20: The 22nd International ACM SIGACCESS Conference on Computers and Accessibility, Virtual Event, Greece, October 26-28, 2020, pp. 78:1-78:4, 2020, ACM, 978-1-4503-7103-2. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
23 | Yuto Hirota, Tetsuya Oda, Nobuki Saito, Aoto Hirata, Masaharu Hirota, Kengo Katatama |
Proposal and Experimental Results of an Ambient Intelligence for Training on Soldering Iron Holding. ![Search on Bibsonomy](Pics/bibsonomy.png) |
BWCCA ![In: Advances on Broad-Band Wireless Computing, Communication and Applications - Proceedings of the 15th International Conference on Broad-Band and Wireless Computing, Communication and Applications (BWCCA-2020), Yonago, Japan, 28-30 October, 2020., pp. 444-453, 2020, Springer, 978-3-030-61107-1. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
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23 | Anton Vladimirovich Milov, Vadim Tynchenko, Vyacheslav Petrenko, Sergei Kurashkin |
Algorithmic and Software Support for Technological Decision-Making in the Process of Induction Soldering. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CSOC (1) ![In: Intelligent Algorithms in Software Engineering - Proceedings of the 9th Computer Science On-line Conference 2020, Volume 1, pp. 521-530, 2020, Springer, 978-3-030-51964-3. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
23 | Thanat Sooknuan, Chanawat Phongklee, Wichupong Wiboonjaroen, Maitree Thumma, Pipatana Amatachaya |
Implementation the SoC of PCB Reflow Soldering. ![Search on Bibsonomy](Pics/bibsonomy.png) |
JCSSE ![In: 16th International Joint Conference on Computer Science and Software Engineering, JCSSE 2019, Chonburi, Thailand, July 10-12, 2019, pp. 385-388, 2019, IEEE, 978-1-7281-0719-6. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP DOI BibTeX RDF |
|
23 | Mariia Kepper, Pol Ribes-Pleguezuelo, Marcel Hornaff, Erik Beckert, Ramona Eberhardt, Pascal Pranyies, Isabelle Toubhans, Francis Descours, Andreas Tünnermann |
Soldering and Packaging Study for an Optical Filter Required for High Resolution Earth Observation Space Missions. ![Search on Bibsonomy](Pics/bibsonomy.png) |
PHOTOPTICS ![In: Proceedings of the 7th International Conference on Photonics, Optics and Laser Technology, PHOTOPTICS 2019, Prague, Czech Republic, February 25-27, 2019., pp. 85-93, 2019, SciTePress, 978-989-758-364-3. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP DOI BibTeX RDF |
|
23 | Dirk Seehase, Christian Kohlen, Arne Neiser, Andrej Novikov, Mathias Nowottnick |
Selective Soldering on Printed Circuit Boards with Endogenous Induction Heat at Appropriate Susceptors. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Period. Polytech. Electr. Eng. Comput. Sci. ![In: Period. Polytech. Electr. Eng. Comput. Sci. 62(4), pp. 172-180, 2018. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
23 | Anil Kunwar, Shengyan Shang, Peter Råback, Yunpeng Wang, Julien Givernaud, Jun Chen, Haitao Ma, Xueguan Song, Ning Zhao |
Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 80, pp. 55-67, 2018. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
23 | Srivalli Chellvarajoo, Mohd Zulkifly Abdullah |
Investigation on nano-reinforced solder paste after reflow soldering part 1: Effects of nano-reinforced solder paste on melting, hardness, spreading rate, and wetting quality. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 84, pp. 230-237, 2018. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
23 | Dominik Rybarczyk, Andrzej Milecki |
The Design and Application of Wireless 3D Tool for Offline Programming of Soldering Robot. ![Search on Bibsonomy](Pics/bibsonomy.png) |
AUTOMATION ![In: Automation 2018 - Advances in Automation, Robotics and Measurement Techniques, outcomes of the international conference AUTOMATION 2018, 21-23 March, 2018, Warsaw, Poland, pp. 453-461, 2018, Springer, 978-3-319-77178-6. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
23 | Wenting Dai, Abdul Mujeeb, Marius Erdt, Alexei Sourin |
Towards Automatic Optical Inspection of Soldering Defects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CW ![In: 2018 International Conference on Cyberworlds, CW 2018, Singapore, October 3-5, 2018, pp. 375-382, 2018, IEEE, 978-1-5386-7315-7. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
23 | Pol Ribes-Pleguezuelo, Katherine Frei, Gudrun Bruckner, Erik Beckert, Ramona Eberhardt, Andreas Tünnermann |
Lithiumniobate Die Assembled by a Low-stress Soldering Technique - Method to Fasten a Surface Acoustic Wave Sensor. ![Search on Bibsonomy](Pics/bibsonomy.png) |
PHOTOPTICS ![In: Proceedings of the 6th International Conference on Photonics, Optics and Laser Technology, PHOTOPTICS 2018, Funchal, Madeira, Portugal, January 25-27, 2018., pp. 91-97, 2018, SCITEPRESS, 978-989-758-286-8. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
23 | Pawel Pawlowski, Adam Dabrowski, Marcin Grenz, Michal Bladowski |
Reflow Oven for Heating and Soldering SMD and BGA Components. ![Search on Bibsonomy](Pics/bibsonomy.png) |
MIXDES ![In: 25th International Conference `Mixed Design of Integrated Circuits and System`, MIXDES 2018, Gdynia, Poland, June 21-23, 2018, pp. 324-329, 2018, IEEE, 978-83-63578-14-5. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
23 | D. Feil, T. Herberholz, M. Guyenot, Mathias Nowottnick |
Highly variable Sn-Cu diffusion soldering process for high performance power electronics. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 76-77, pp. 455-459, 2017. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
23 | A. M. Najib, Mohd Zulkifly Abdullah, Abdullah Aziz Saad, Z. Samsudin, F. Che Ani |
Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 79, pp. 69-78, 2017. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
23 | Xiang Li 0009, Xing Su, Yunhui Liu |
Adaptive region control for robotic soldering of flexible PCBs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICAR ![In: 18th International Conference on Advanced Robotics, ICAR 2017, Hong Kong, China, July 10-12, 2017, pp. 216-221, 2017, IEEE, 978-1-5386-3157-7. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
23 | Xiang Li 0009, Xing Su, Yunhui Liu |
Cooperative robotic soldering of flexible PCBs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IROS ![In: 2017 IEEE/RSJ International Conference on Intelligent Robots and Systems, IROS 2017, Vancouver, BC, Canada, September 24-28, 2017, pp. 1651-1656, 2017, IEEE, 978-1-5386-2682-5. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
23 | Thibaut Heckmann, Thomas R. Souvignet, S. Lepeer, David Naccache |
Low-temperature low-cost 58 Bismuth - 42 Tin alloy forensic chip re-balling and re-soldering. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Digit. Investig. ![In: Digit. Investig. 19, pp. 60-68, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
23 | Jonas Neubert, Hod Lipson |
Soldercubes: a self-soldering self-reconfiguring modular robot system. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Auton. Robots ![In: Auton. Robots 40(1), pp. 139-158, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
23 | Rossella Berni, Marcantonio Catelani, Caterina Fiesoli, Valeria L. Scarano |
A Comparison of Alloy-Surface Finish Combinations Considering Different Component Package Types and Their Impact on Soldering Reliability. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Reliab. ![In: IEEE Trans. Reliab. 65(1), pp. 272-281, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
23 | Tsung-Nan Tsai, Jun-Hsien Yeh |
Identification and risk assessment of soldering failure sources using a hybrid failure mode and effect analysis model and a fuzzy inference system. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Intell. Fuzzy Syst. ![In: J. Intell. Fuzzy Syst. 28(6), pp. 2771-2784, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
23 | Wei Chih Liu, Yan Hao Chen, Te-yuan Chung, Cheng Yi Liu |
Study of Al-Cu compounds as soldering bond pad for high-power device packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 55(12), pp. 2549-2553, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
23 | M. S. Abdul Aziz, Mohd Zulkifly Abdullah, C. Y. Khor, I. A. Azid |
Optimization of pin through hole connector in thermal fluid-structure interaction analysis of wave soldering process using response surface methodology. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Simul. Model. Pract. Theory ![In: Simul. Model. Pract. Theory 57, pp. 45-57, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
23 | I. Siti Rabiatull Aisha, A. Ourdjini, M. A. Azmah Hanim, O. Saliza Azlina |
Effect of reflow soldering profile on intermetallic compound formation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Int. J. Comput. Appl. Technol. ![In: Int. J. Comput. Appl. Technol. 52(4), pp. 244-250, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
23 | Manabu Ishihara |
Haptic Device Using a Soldering Test System. ![Search on Bibsonomy](Pics/bibsonomy.png) |
HCI (27) ![In: HCI International 2015 - Posters' Extended Abstracts - International Conference, HCI International 2015, Los Angeles, CA, USA, August 2-7, 2015. Proceedings, Part I, pp. 190-195, 2015, Springer, 978-3-319-21379-8. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
23 | Chien-Yi Huang, Hui-Hua Huang |
Process optimization of SnCuNi soldering material using artificial parametric design. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Intell. Manuf. ![In: J. Intell. Manuf. 25(4), pp. 813-823, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
23 | Jonas Neubert, Arne Rost, Hod Lipson |
Self-Soldering Connectors for Modular Robots. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Robotics ![In: IEEE Trans. Robotics 30(6), pp. 1344-1357, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
23 | Olivér Krammer |
Modelling the self-alignment of passive chip components during reflow soldering. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 54(2), pp. 457-463, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
23 | Yang Liu 0103, Stanley Y. Y. Leung, Jia Zhao, Cell K. Y. Wong, Cadmus A. Yuan, Guoqi Zhang, Fenglian Sun, Liangliang Luo |
Thermal and mechanical effects of voids within flip chip soldering in LED packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 54(9-10), pp. 2028-2033, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
23 | Francesco Adamo, Gregorio Andria, Attilio Di Nisio, Nicola Giaquinto, Valeria L. Scarano, Maurizio Spadavecchia |
Wideband measurement method for prognosis of soldering failure on electronic boards. ![Search on Bibsonomy](Pics/bibsonomy.png) |
I2MTC ![In: IEEE International Instrumentation and Measurement Technology Conference, I2MTC 2014, Proceedings, Montevideo, Uruguay, May 12-15, 2014, pp. 693-696, 2014, IEEE. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
23 | Marco Felix, Andres Medel, Alvaro Gonzalez, Heriberto Marquez, David Salazar, Citlalli Anguiano |
QTH lamp optical output power analysis for SMT components' infrared light soldering systems. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IECON ![In: IECON 2014 - 40th Annual Conference of the IEEE Industrial Electronics Society, Dallas, TX, USA, October 29 - November 1, 2014, pp. 2376-2379, 2014, IEEE, 978-1-4799-4032-5. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
23 | Laurenz Notter, Jacques Jacot |
Assembly of Silicon Micro-parts with Steel Spindles Using Low-Temperature Soldering. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IPAS ![In: Precision Assembly Technologies and Systems - 7th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2014, Chamonix, France, February 16-18, 2014, Revised Selected Papers, pp. 8-14, 2014, Springer, 978-3-662-45585-2. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
23 | Miao Cai, D. J. Xie, W. B. Chen, B. Y. Wu, Dao-Guo Yang, G. Q. Zhang |
A novel soldering method to evaluate PCB pad cratering for pin-pull testing. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 53(9-11), pp. 1568-1574, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
23 | Tong Hong Wang, Ching-I Tsai, Chang-Chi Lee, Yi-Shao Lai |
Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 53(2), pp. 297-302, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
23 | Marco Felix, Andres Medel, Miguel Bravo, Citlalli Anguiano, Heriberto Marquez, David Salazar |
Heated area measurement and analysis of optical setups for focused IR light soldering system. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IECON ![In: IECON 2013 - 39th Annual Conference of the IEEE Industrial Electronics Society, Vienna, Austria, November 10-13, 2013, pp. 3935-3939, 2013, IEEE, 978-1-4799-0224-8. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
23 | Mika Liukkonen, Elina Havia, Yrjö Hiltunen |
Computational intelligence in mass soldering of electronics - A survey. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Expert Syst. Appl. ![In: Expert Syst. Appl. 39(10), pp. 9928-9937, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
23 | Tsung-Nan Tsai |
Development of a soldering quality classifier system using a hybrid data mining approach. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Expert Syst. Appl. ![In: Expert Syst. Appl. 39(5), pp. 5727-5738, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
23 | Tsung-Nan Tsai |
Thermal parameters optimization of a reflow soldering profile in printed circuit board assembly: A comparative study. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Appl. Soft Comput. ![In: Appl. Soft Comput. 12(8), pp. 2601-2613, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
23 | Hitoshi Sakurai, Keun-Soo Kim, Kiju Lee, Chang-Jae Kim, Youichi Kukimoto, Katsuaki Suganuma |
Effects of Cu contents in flux on microstructure and joint strength of Sn-3.5Ag soldering with electroless Ni-P/Au surface finish. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(11), pp. 2716-2722, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
23 | Ming-Hung Shu, Bi-Min Hsu, Min-Chuan Hu |
Optimal combination of soldering conditions of BGA for halogen-free and lead-free SMT-green processes. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(11), pp. 2690-2700, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
23 | Chun-Sean Lau, Mohd Zulkifly Abdullah, F. Che Ani |
Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(6), pp. 1143-1152, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
23 | Csaba Benedek |
Detection of soldering defects in Printed Circuit Boards with Hierarchical Marked Point Processes. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Pattern Recognit. Lett. ![In: Pattern Recognit. Lett. 32(13), pp. 1535-1543, 2011. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
23 | Mika Liukkonen, Elina Havia, Hannu Leinonen, Yrjö Hiltunen |
Quality-oriented optimization of wave soldering process by using self-organizing maps. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Appl. Soft Comput. ![In: Appl. Soft Comput. 11(1), pp. 214-220, 2011. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
23 | Changhua Du, Chuntian Li, Tao Wang, Wenchao Huang |
The Study and Development of Modern Wave Soldering Materials for 3C Products. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICFCE ![In: Frontiers in Computer Education [International Conference on Frontiers in Computer Education, ICFCE 2011, Macao, China, December 1-2, 2011], pp. 971-978, 2011, Springer, 978-3-642-27551-7. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
23 | Marcantonio Catelani, Valeria L. Scarano, Francesco Bertocci |
Implementation and Characterization of a Medical Ultrasound Phased Array Probe With New Pb-Free Soldering Materials. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Instrum. Meas. ![In: IEEE Trans. Instrum. Meas. 59(10), pp. 2522-2529, 2010. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
23 | Chung-Chi Wu, Yung-Nan Hu |
Image Recognition for PCB Soldering Platform Controlled by Embedded Microchip Based on Hopfield Neural Network. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Comput. ![In: J. Comput. 5(9), pp. 1436-1443, 2010. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP BibTeX RDF |
|
23 | Mika Liukkonen, Elina Havia, Hannu Leinonen, Yrjö Hiltunen |
Application of self-organizing maps in analysis of wave soldering process. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Expert Syst. Appl. ![In: Expert Syst. Appl. 36(3), pp. 4604-4609, 2009. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
|
23 | Jun-Tae Lee, Wei Li, Dave (Dae-Wook) Kim |
Process modelling and experimentation of a cordless resistance soldering system. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Int. J. Manuf. Res. ![In: Int. J. Manuf. Res. 4(4), pp. 428-438, 2009. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
|
23 | Girolamo Fornarelli, Antonio Giaquinto, Gioacchino Brunetti, Giuseppe Acciani |
A Neurofuzzy Method for the Evaluation of Soldering Global Quality Index. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Ind. Informatics ![In: IEEE Trans. Ind. Informatics 5(1), pp. 56-66, 2009. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
|
23 | Zhenhua Xiong, Xinjue Zhou, Yulin Wang, Han Ding 0001 |
Automatic Soldering System Based on Computer Vision. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICIRA ![In: Intelligent Robotics and Applications, Second International Conference, ICIRA 2009, Singapore, December 16-18, 2009. Proceedings, pp. 885-896, 2009, Springer, 978-3-642-10816-7. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
|
23 | Balázs Illés, Gábor Harsányi |
3D thermal model to investigate component displacement phenomenon during reflow soldering. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 48(7), pp. 1062-1068, 2008. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
|
23 | C. K. Wong, John H. L. Pang, J. W. Tew, B. K. Lok, H. J. Lu, F. L. Ng, Y. F. Sun |
The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 48(4), pp. 611-621, 2008. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
|
23 | Nele Van Steenberge, Paresh Limaye, Geert Willems, Bart Vandevelde, Inge Schildermans |
Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 47(2-3), pp. 215-222, 2007. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
23 | Tsung-Nan Tsai |
Development of an integrated reflow soldering control system using incremental hybrid process knowledge. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Expert Syst. Appl. ![In: Expert Syst. Appl. 28(4), pp. 681-692, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
|
23 | Zbigniew Moser, Wladyslaw Gasior, Adam Debski |
Database of Pb - free soldering materials, surface tension and density, experiment vs. Modeling. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Data Sci. J. ![In: Data Sci. J. 4, pp. 195-208, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
|
23 | Peter Alpern, Kheng Chooi Lee, Rainer Tilgner |
Effect of long and short Pb-free soldering profiles of IPC/JEDEC J-STD-020 on plastic SMD packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 44(9-11), pp. 1293-1297, 2004. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
|
23 | Alexandrine Guédon, Eric Woirgard, Christian Zardini |
Evaluation of lead-free soldering for automotive applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 42(9-11), pp. 1555-1558, 2002. The full citation details ...](Pics/full.jpeg) |
2002 |
DBLP DOI BibTeX RDF |
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