Search results for "wafers"

Hits ?▲	Authors	Title	Venue	Year	Link	Author keywords
92	Andrew B. Kahng, Ion I. Mandoiu, Xu Xu 0001, Alexander Zelikovsky	Enhanced Design Flow and Optimizations for Multiproject Wafers.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2007	DBLP DOI BibTeX RDF
77	Sampath Rangarajan, Donald S. Fussell, Miroslaw Malek	Built-In Testing of Integrated Circuit Wafers.	IEEE Trans. Computers	1990	DBLP DOI BibTeX RDF	integrated circuit wafers, silicon wafers, VLSI, integrated circuit testing, automatic testing, built-in testing, production testing
64	Toshiro Kubota, Parag Talekar, Xianyun Ma, Tangali S. Sudarshan	A nondestructive automated defect detection system for silicon carbide wafers.	Mach. Vis. Appl.	2005	DBLP DOI BibTeX RDF
50	Chien-Chang Chen, Wai-Kei Mak	A multi-technology-process reticle floorplanner and wafer dicing planner for multi-project wafers.	ASP-DAC	2006	DBLP DOI BibTeX RDF
50	Meng-Chiou Wu, Rung-Bin Lin	A Comparative Study on Dicing of Multiple Project Wafers.	ISVLSI	2005	DBLP DOI BibTeX RDF
50	Meng-Chiou Wu, Rung-Bin Lin	Reticle floorplanning of flexible chips for multi-project wafers.	ACM Great Lakes Symposium on VLSI	2005	DBLP DOI BibTeX RDF	mask cost, multi-project wafer, reticle floorplanning, dicing
42	Brian Moore 0001, Martin Margala, Christopher J. Backhouse	Design of wireless on-wafer submicron characterization system.	IEEE Trans. Very Large Scale Integr. Syst.	2005	DBLP DOI BibTeX RDF
42	Sameer T. Shikalgar, David Fronckowiak, Edward A. MacNair	Wafer fabrication: 300mm wafer fabrication line simulation model.	WSC	2002	DBLP DOI BibTeX RDF
41	Meng-Chiou Wu, Rung-Bin Lin, Shih-Cheng Tsai	Chip placement in a reticle for multiple-project wafer fabrication.	ACM Trans. Design Autom. Electr. Syst.	2008	DBLP DOI BibTeX RDF	Multiple-project wafers (MPW), compatibility graph, reticle floorplanning, shuttle mask, wafer dicing, simulated annealing (SA), set cover, mixed-integer linear programming (MILP), conflict graph, set partition
41	Royce L. S. Ching, Evangeline F. Y. Young	Shuttle mask floorplanning with modified alpha-restricted grid.	ACM Great Lakes Symposium on VLSI	2006	DBLP DOI BibTeX RDF	multi-project wafers, reticle design
41	Andrew B. Kahng, Ion I. Mandoiu, Qinke Wang, Xu Xu 0001, Alexander Zelikovsky	Multi-project reticle floorplanning and wafer dicing.	ISPD	2004	DBLP DOI BibTeX RDF	multi-project wafers, reticle design, wafer dicing
36	Martin D. F. Wong	Reticle Floorplanning with Guaranteed Yield for Multi-Project Wafers.	ICCD	2004	DBLP DOI BibTeX RDF
36	D. Bhatia	Restructuring wafers for maximum yield and some applications of WSI.	SPDP	1990	DBLP DOI BibTeX RDF
28	Jagadish Jampani, Scott J. Mason	Column generation heuristics for multiple machine, multiple orders per job scheduling problems.	Ann. Oper. Res.	2008	DBLP DOI BibTeX RDF	Column generation, Semiconductor manufacturing, Machine scheduling
28	Fehmi Tanrisever, Erhan Kutanoglu	Forming and scheduling jobs with capacitated containers in semiconductor manufacturing: Single machine problem.	Ann. Oper. Res.	2008	DBLP DOI BibTeX RDF	Job formation, Multi-order jobs, Scheduling, Dynamic programming, Batching
28	Chuan-Yu Chang, Hung-Jen Wang, Si-Yan Lin	Simulation Studies of Two-Layer Hopfield Neural Networks for Automatic Wafer Defect Inspection.	IEA/AIE	2006	DBLP DOI BibTeX RDF
28	Emilio Miguelañez Martín, Ali M. S. Zalzala, Paul Buxton	Swarm intelligence in automated electrical wafer sort classification.	Congress on Evolutionary Computation	2005	DBLP DOI BibTeX RDF
28	Adit D. Singh	T2: Statistical Methods for VLSI Test and Burn-in Optimization.	Asian Test Symposium	2005	DBLP DOI BibTeX RDF
28	Erik Hertzler, David Van Sickle	300mm time constrained queue loop management.	WSC	2005	DBLP BibTeX RDF
28	Chuan-Yu Chang, Jia-Wei Chang, MuDer Jeng	Using a self-organizing neural network for wafer defect inspection.	SMC (5)	2004	DBLP DOI BibTeX RDF
28	Jun-ho Jeong, Young-suk Sim, Hyonkee Sohn, Eung-sug Lee	UV Nanoimprint Lithography Using an Elementwise Embossed Stamp.	ICMENS	2004	DBLP DOI BibTeX RDF
28	Syed M. Alam, Donald E. Troxel, Carl V. Thompson	A Comprehensive Layout Methodology and Layout-Specific Circuit Analyses for Three-Dimensional Integrated Circuits.	ISQED	2002	DBLP DOI BibTeX RDF	3D integrated circuit, 3D IC layout, inter-wafer via, reliability CAD tool, FPGA, performance analysis, reliability analysis
28	Frederic Duvivier	Automatic Detection of Spatial Signature on Wafermaps in a High Volume Production.	DFT	1999	DBLP DOI BibTeX RDF	wafermap, spatial signature, automated data collection, yield
28	Frederick L. Taber	An introduction to area array probing.	ITC	1998	DBLP DOI BibTeX RDF
28	M. J. Little, R. David Etchells, Jan Grinberg, S. P. Laub, J. G. Nash, M. W. Yung	The 3-D Computer.	J. VLSI Signal Process.	1990	DBLP DOI BibTeX RDF
28	José Pineda de Gyvez, Jochen A. G. Jess	On the design and implementation of a wafer yield editor.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	1989	DBLP DOI BibTeX RDF
27	Fred J. Meyer, Dhiraj K. Pradhan	Modeling Defect Spatial Distribution.	IEEE Trans. Computers	1989	DBLP DOI BibTeX RDF	defect spatial distribution modelling, center-satellite model, wafers, redundancy techniques, cluster, VLSI, fault tolerant computing, circuit CAD, fault-tolerant designs, yield models, WSI
22	Qingshan Tang, Xinwei Huang, Yongqi Miao, Jiang Huang	A robust algorithm for rapid pre-alignment of multiple types and sizes of wafers.	Signal Image Video Process.	2024	DBLP DOI BibTeX RDF
22	Fei Yu, Min Xu, Junhua Wang, Xiangchao Zhang, Xinlan Tang	Balancing the Efficiency and Sensitivity of Defect Inspection of Non-Patterned Wafers with TDI-Based Dark-Field Scattering Microscopy.	Sensors	2024	DBLP DOI BibTeX RDF
22	Jun Dong, Chunming Ye	Joint optimisation of uncertain distributed manufacturing and preventive maintenance for semiconductor wafers considering multi-energy complementary.	Int. J. Prod. Res.	2023	DBLP DOI BibTeX RDF
22	Qinghua Zhu 0001, GengHong Wang, NaiQi Wu, Yan Qiao, Yan Hou, MengChu Zhou, SiDe Zhao	Scheduling Single-Arm Multicluster Tools for Two-Type Wafers With Lower-Bound Cycle Time.	IEEE Trans. Syst. Man Cybern. Syst.	2023	DBLP DOI BibTeX RDF
22	Francisco López de la Rosa, José L. Gómez-Sirvent, Rafael Morales 0001, Roberto Sánchez-Reolid, Antonio Fernández-Caballero 0001	Defect detection and classification on semiconductor wafers using two-stage geometric transformation-based data augmentation and SqueezeNet lightweight convolutional neural network.	Comput. Ind. Eng.	2023	DBLP DOI BibTeX RDF
22	Souvik Ghosh 0001, Quentin Smets, S. Banerjee, Tom Schram, K. Kennes, R. Verheyen, P. Kumar, M.-E. Boulon, Benjamin Groven, H. M. Silva, S. Kundu, Daire Cott, Dennis Lin, P. Favia, T. Nuytten, A. Phommahaxay, Inge Asselberghs, C. De La Rosa, Gouri Sankar Kar, Steven Brems	Integration of epitaxial monolayer MX₂ channels on 300mm wafers via Collective-Die-To-Wafer (CoD2W) transfer.	VLSI Technology and Circuits	2023	DBLP DOI BibTeX RDF
22	GengHong Wang, Qinghua Zhu 0001, Yan Hou, Yan Qiao, NaiQi Wu, MengChu Zhou	Optimally Scheduling Single-Arm Multicluster Tools for Manufacturing Hybrid-Type Wafers.	SMC	2023	DBLP DOI BibTeX RDF
22	Yun Gao, Noah Pestana, Skylar Deckoff-Jones, Jiajiu Zheng, Jordan Goldstein, Andrew M. Netherton, Ren-Jye Shiue, Michael R. Watts, Christopher V. Poulton	Passive Integrated Athermal (De)Multiplexers on 300 mm Silicon Photonics Wafers.	OFC	2023	DBLP DOI BibTeX RDF
22	Luigi Fassio, Hoang Hong Hanh, Massimo Alioto	A Resistor/Trimming-Less Self-Biased Current Reference Class with Area Down to $3,500\ \mu \mathrm{m}^{2}$, 42.8 pW Power and 10.4% Accuracy across Corner Wafers in 180 nm.	A-SSCC	2023	DBLP DOI BibTeX RDF
22	Hongwei Xu, Wei Qin, Youlong Lv, Jie Zhang 0041	Data-Driven Adaptive Virtual Metrology for Yield Prediction in Multibatch Wafers.	IEEE Trans. Ind. Informatics	2022	DBLP DOI BibTeX RDF
22	Chen Shang, Kaiyin Feng, Eamonn T. Hughes, Andrew Clark, Mukul Debnath, Rosalyn Koscica, Gerald Leake, Joshua Herman, David Harame, Peter Ludewig, Yating Wan, John E. Bowers 0001	Electrically pumped quantum-dot lasers grown on 300 mm patterned Si photonic wafers.	CoRR	2022	DBLP DOI BibTeX RDF
22	Sean Hooten, Mudit Jain, Thomas Van Vaerenbergh, Peng Sun, Quentin Wilmart, M. Ashkan Seyedi, Zhihong Huang, Marco Fiorentino, Raymond G. Beausoleil	Inverse-Designed Dual Layer c-Si/SiN Vertical Grating Couplers Tested on 300mm Wafers.	OECC/PSC	2022	DBLP DOI BibTeX RDF
22	Tingting Leng, Jufeng Wang, Chunfeng Liu 0003	Scheduling of single-arm cluster tools mixedly processing two kinds of wafers.	ICNSC	2022	DBLP DOI BibTeX RDF
22	Ankit Gupta 0010, Adrita Barari, Damini, Keerthi Kiran Jagannathachar, Seungwoo Lee, Janghoon Oh, Jungha Kim, Min-Joo Kim	Identifying Combination of Defects and Unknown Defects on Semiconductor Wafers using Deep Learning and Hierarchical Reclustering.	VLSID	2022	DBLP DOI BibTeX RDF
22	Masahide Goto, Yuki Honda, Masakazu Nanba, Yoshinori Iguchi, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto	3-Layer stacked pixel-parallel CMOS image sensors using hybrid bonding of SOI wafers.	Imaging Sensors and Systems	2022	DBLP DOI BibTeX RDF
22	Yu-Kun Lin, Bing-Fei Wu	Machine Learning-Based Wheel Monitoring for Sapphire Wafers.	IEEE Access	2021	DBLP DOI BibTeX RDF
22	Hiroaki Kudo, Tetsuya Matsumoto, Kentaro Kutsukake, Noritaka Usami	Occurrence Prediction of Dislocation Regions in Photoluminescence Image of Multicrystalline Silicon Wafers Using Transfer Learning of Convolutional Neural Network.	IEICE Trans. Fundam. Electron. Commun. Comput. Sci.	2021	DBLP DOI BibTeX RDF
22	Yijian Jiang, Haoqi Tan, Yan Zhao	Improving Optical and Electrical Properties of GaN Epitaxial Wafers and Enhancing Luminescent Properties of GaN-Based Light-Emitting-Diode with Excimer Laser Irradiation.	Symmetry	2021	DBLP DOI BibTeX RDF
22	Thomas Olschewski	Defect Detection on Semiconductor Wafers by Distribution Analysis.	CoRR	2021	DBLP BibTeX RDF
22	Yuanyuan Yan, Qinghua Tao, Huangang Wang, Wenhui Fan	Noncyclic Scheduling of Multi-cluster Tools with Multi-type Wafers Based on Pareto Optimization.	ICCAE	2021	DBLP DOI BibTeX RDF
22	Geert H. van Kollenburg, Mike Holenderski, Patrizia Vasquez, Nirvana Meratnia	Predictive discarding of wafers based on power leakage predictions from single layer misalignment data.	ISM	2021	DBLP DOI BibTeX RDF
22	Kenneth M. Jabon, Christopher V. Poulton, Ren-Jye Shiue, Matthew J. Byrd, Zhan Su 0001, Mohammad H. Teimourpour, Scott Breitenstein, Ronald P. Millman, Dogan A. Atlas, Michael R. Watts, Erman Timurdogan	Edge-Coupled Active and Passive Wafer-Scale Measurements on 300mm Silicon Photonics Wafers.	OFC	2021	DBLP BibTeX RDF
22	Marwa Sayed Salem, Abdullah J. Alzahrani, Rabie A. Ramadan, Adwan Alanazi 0001, Ahmed Shaker, Mohamed Abouelatta, Christian Gontrand, Mohammed Elbanna, Abdelhalim Zekry	Physically Based Analytical Model of Heavily Doped Silicon Wafers Based Proposed Solar Cell Microstructure.	IEEE Access	2020	DBLP DOI BibTeX RDF
22	Rui Wang 0058, Nan Chen 0002	Defect pattern recognition on wafers using convolutional neural networks.	Qual. Reliab. Eng. Int.	2020	DBLP DOI BibTeX RDF
22	Ayumi Onaka-Masada, Takeshi Kadono, Ryosuke Okuyama, Ryo Hirose, Koji Kobayashi, Akihiro Suzuki, Yoshihiro Koga, Kazunari Kurita	Reduction of Dark Current in CMOS Image Sensor Pixels Using Hydrocarbon-Molecular-Ion-Implanted Double Epitaxial Si Wafers.	Sensors	2020	DBLP DOI BibTeX RDF
22	Christopher Hakoda, Eric S. Davis, Cristian Pantea, Vamshi Krishna Chillara	Multi-Level Information Storage Using Engineered Electromechanical Resonances of Piezoelectric Wafers: A Concept Piezoelectric Quick Response (PQR) Code.	Sensors	2020	DBLP DOI BibTeX RDF
22	Liang Zhu, Biao Mei, Weidong Zhu, Wei Li	Laser-based Thickness Control in a Double-Side Polishing System for Silicon Wafers.	Sensors	2020	DBLP DOI BibTeX RDF
22	Zining Wang, Masayoshi Tomizuka	Precise 3D Calibration of Wafer Handling Robot by Visual Detection and Tracking of Elliptic-shape Wafers.	ICRA	2020	DBLP DOI BibTeX RDF
22	Martin Kleindienst, Stefan Koch 0002, Markus Reichhartinger	Model-based Temperature Control of a Continuous Flow Heater for Efficient Processing of Silicon Wafers.	CCTA	2020	DBLP DOI BibTeX RDF
22	Kazunari Kurita, Takeshi Kadono, Satoshi Shigematsu, Ryo Hirose, Ryosuke Okuyama, Ayumi Onaka-Masada, Hidehiko Okuda, Yoshihiro Koga	Proximity Gettering Design of Hydrocarbon-Molecular-Ion-Implanted Silicon Wafers Using Dark Current Spectroscopy for CMOS Image Sensors.	Sensors	2019	DBLP DOI BibTeX RDF
22	Dervis Türkmen, Carina Dettenrieder, Pontus Forsberg, Andreas Mattsson, Fredrik Nikolajeff, Lars Österlund, Mikael Karlsson, Boris Mizaikoff	Corrosion Detection by Infrared Attenuated Total Reflection Spectroscopy via Diamond-Like Carbon-Coated Silicon Wafers and Iron-Sensitive Dyes.	Sensors	2019	DBLP DOI BibTeX RDF
22	Dong Liu 0011, Chek Sing Teo, Wenyu Liang, Kok Kiong Tan	Soft-Acting, Noncontact Gripping Method for Ultrathin Wafers Using Distributed Bernoulli Principle.	IEEE Trans Autom. Sci. Eng.	2019	DBLP DOI BibTeX RDF
22	Akihisa Kubota	Surface Finishing of Single-Crystal SiC and GaN Wafers Using a Magnetic Tool in H2O2 Solution.	Int. J. Autom. Technol.	2019	DBLP DOI BibTeX RDF
22	Kei Sumita, Jun Takeyasu, Kimihiko Kato, Kasidit Toprasertpong, Mitsuru Takenaka, Shinichi Takagi	Fabrication of High Quality InAs-on-Lnsulator Structures by Smart Cut Process with Reuse of InAs Wafers.	3DIC	2019	DBLP DOI BibTeX RDF
22	Masahide Goto, Joeri De Vos, Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi, Eiji Higurashi, Yuki Honda, Takuya Saraya, Masaharu Kobayashi, Hiroshi Toshiyoshi, Toshiro Hiramoto	Triple-Layering Technology for Pixel-Parallel CMOS Image Sensors Developed by Hybrid Bonding of SOI Wafers.	3DIC	2019	DBLP DOI BibTeX RDF
22	Erman Timurdogan, Zhan Su 0001, Ren-Jye Shiue, Christopher V. Poulton, Matthew J. Byrd, Simon Xin, Michael R. Watts	APSUNY Process Design Kit (PDKv3.0): O, C and L Band Silicon Photonics Component Libraries on 300mm Wafers.	OFC	2019	DBLP BibTeX RDF
22	Qiang Huan, Mingtong Chen, Faxin Li	A Comparative Study of Three Types Shear Mode Piezoelectric Wafers in Shear Horizontal Wave Generation and Reception.	Sensors	2018	DBLP DOI BibTeX RDF
22	Corinna Kofler, Robert Muhr, Gunter Spöck	Detecting Star Cracks in Topography Images of Specular Back Surfaces of Structured Wafers.	ICMLA	2018	DBLP DOI BibTeX RDF
22	Junji Senzaki, Shohei Hayashi, Yoshiyuki Yonezawa, Hajime Okumura	Challenges to realize highly reliable SiC power devices: From the current status and issues of SiC wafers.	IRPS	2018	DBLP DOI BibTeX RDF
22	Seungchul Lee, Daeyoung Kim	Distributed-based Hierarchical Clustering System for Large-scale Semiconductor Wafers.	IEEM	2018	DBLP DOI BibTeX RDF
22	Yanjun Lu, ChunRong Pan, Yan Qiao, Naiqi Wu, Yufeng Chen 0001	Petri net-based deadlock avoidance for single-arm cluster tools with concurrently processing two-type wafers.	ICNSC	2018	DBLP DOI BibTeX RDF
22	Eiji Higurashi, Ken Okumura, Yutaka Kunimune, Tadatomo Suga, Kei Hagiwara	Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient Air Using a Surface-Activated Bonding Method.	IEICE Trans. Electron.	2017	DBLP DOI BibTeX RDF
22	Min-Seok Jang, Sung Woo Ma, Jongsoo Song, Myungmo Sung, Young-Ho Kim	Adhesion of NCF to oxidized Si wafers after oxygen plasma treatment.	Microelectron. Reliab.	2017	DBLP DOI BibTeX RDF
22	Jiwon Yang, Seung-kyung Lee, Seokho Kang 0001, Sungzoon Cho, Young-Hak Lee, Hae-Sang Park	Ranking process parameter association with low yield wafers using spec-out event network analysis.	Comput. Ind. Eng.	2017	DBLP DOI BibTeX RDF
22	Tom Schram, Quentin Smets, Benjamin Groven, M. H. Heyne, E. Kunnen, A. Thiam, Katia Devriendt, Annelies Delabie, Dennis Lin, M. Lux, Daniele Chiappe, I. Asselberghs, S. Brus, Cedric Huyghebaert, S. Sayan, A. Juncker, Matty Caymax, Iuliana P. Radu	WS2 transistors on 300 mm wafers with BEOL compatibility.	ESSDERC	2017	DBLP DOI BibTeX RDF
22	Romain Ritzenthaler, Hans Mertens, An De Keersgieter, Jérôme Mitard, Dan Mocuta, N. Horiguchi	Isolation of nanowires made on bulk wafers by ground plane doping.	ESSDERC	2017	DBLP DOI BibTeX RDF
22	Arsham Abedini, Mahdi Ehsanian	Defect detection on IC wafers based on neural network.	ICM	2017	DBLP DOI BibTeX RDF
22	Corinna Kofler, Gunter Spöck, Robert Muhr	Classifying defects in topography images of silicon wafers.	WSC	2017	DBLP DOI BibTeX RDF
22	Jipeng Wang, Chunrong Pan, Hesuan Hu, Yuan Zhou 0005	Scheduling of single-arm cluster tools with multi-type wafers and shared PMs.	CASE	2017	DBLP DOI BibTeX RDF
22	Pascual Muñoz	Photonic integration in the palm of your hand: Generic technology and multi-project wafers, technical roadblocks, challenges and evolution.	OFC	2017	DBLP BibTeX RDF
22	Chunrong Pan, Kun Zhao, Yi-Sheng Huang	Schedulability analysis for dual-armed cluster tools with mixed-processing of multi-variety wafers.	ICNSC	2017	DBLP DOI BibTeX RDF
22	Bahadir Tunaboylu	Power Delivery Performance of Probe Test Systems for Semiconductor Wafers.	IEEE Des. Test	2016	DBLP DOI BibTeX RDF
22	Amarendra Kumar, Kunal Kashyap, Max T. Hou, J. Andrew Yeh	Mechanical Strength and Broadband Transparency Improvement of Glass Wafers via Surface Nanostructures.	Sensors	2016	DBLP DOI BibTeX RDF
22	Luca Pirro, Irina Ionica, Sorin Cristoloveanu, Gérard Ghibaudo	Low-frequency noise in bare SOI wafers: Experiments and model.	ESSDERC	2015	DBLP DOI BibTeX RDF
22	Sukeshwar Kannan, Rahul Agarwal, Arnaud Bousquet, Geetha Aluri, Hui-Shan Chang	Device performance analysis on 20nm technology thin wafers in a 3D package.	IRPS	2015	DBLP DOI BibTeX RDF
22	Qian Zhang, Boquan Li 0004, Zhi-quan Sun, Yu-Jun Li, Chang-yun Pan	Solar Wafers Counting Based on Image Texture Feature.	IGTA	2015	DBLP DOI BibTeX RDF
22	Kuldeep Shah, Eli Saber, Kevin Verrier	Improved metrology of implant lines on static images of textured silicon wafers using line integral method.	Image Processing: Machine Vision Applications	2015	DBLP DOI BibTeX RDF
22	M. R. Dodge, F. Shadman	Computer modeling of surface interactions and contaminant transport in microstructures during the rinsing of patterned semiconductor wafers.	Comput. Chem. Eng.	2014	DBLP DOI BibTeX RDF
22	Aref Bakhtazad, Rayyan Manwar, Sazzadur Chowdhury	Cavity formation in bonded silicon wafers using partially cured dry etch bisbenzocyclobutene (BCB).	LASCAS	2014	DBLP DOI BibTeX RDF
22	Daivid Fowler, Charles Baudot, Jean-Marc Fedeli, B. Caire, Léopold Virot, A. Leliepvre, G. Grand, A. Myko, Delphine Marris-Morini, Sonia Messaoudene, Aurelie Souhaite, Ségolène Olivier, Philippe Grosse, Guang-Hua Duan, B. Ben Bakir, Frédéric Boeuf, Laurent Vivien, Sylvie Menezo	Complete Si-photonics device-library on 300mm wafers.	OFC	2014	DBLP DOI BibTeX RDF
22	Harpreet Singh Grover, Francis P. Dawson, Dave M. Camm, Yann Cressault, Markus Lieberer	Application of a plasma Arc lamp for thermal processing of semiconductor wafers.	IAS	2014	DBLP DOI BibTeX RDF
22	Melanie Po-Leen Ooi, Hong Kuan Sok, Ye Chow Kuang, Serge N. Demidenko, Chris Chan	Defect cluster recognition system for fabricated semiconductor wafers.	Eng. Appl. Artif. Intell.	2013	DBLP DOI BibTeX RDF
22	Melanie Po-Leen Ooi, Hong Kuan Sok, Ye Chow Kuang, Huiyuan Cheng, Eric Kwang Joo Sim, Serge N. Demidenko, Chris W. K. Chan	Identifying Systematic Failures on Semiconductor Wafers Using ADCAS.	IEEE Des. Test	2013	DBLP DOI BibTeX RDF
22	Hirokazu Fukidome, Yusuke Kawai, Hiroyuki Handa, Hiroki Hibino, Hidetoshi Miyashita, Masato Kotsugi, Takuo Ohkochi, Myung-Ho Jung, Tetsuya Suemitsu, Toyohiko Kinoshita, Taiichi Otsuji, Maki Suemitsu	Site-Selective Epitaxy of Graphene on Si Wafers.	Proc. IEEE	2013	DBLP DOI BibTeX RDF
22	Stefan Mitterhofer, Jakob D. Pühringer, Viktor Schlosser	An acoustic set up for the vibration analysis of silicon wafers.	IECON	2013	DBLP DOI BibTeX RDF
22	He-Yau Kang, Amy H. I. Lee, Chun-Mei Lai	An integrated replenishment model with quantity discounts, reentry and downward substitution for control wafers.	J. Intell. Manuf.	2012	DBLP DOI BibTeX RDF
22	W. Heo, Nae-Eung Lee	Effect of additive N2 and Ar gases on surface smoothening and fracture strength of Si wafers during high-speed chemical dry thinning.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
22	Philippe Gaubert, Akinobu Teramoto, Shigetoshi Sugawa, Tadahiro Ohmi	The role of the temperature on the scattering mechanisms limiting the electron mobility in metal-oxide-semiconductor field-effect-transistors fabricated on (110) silicon-oriented wafers.	ESSDERC	2012	DBLP DOI BibTeX RDF
22	Bong-Jin Yum, Jae Hoon Koo, Seong-Jun Kim	Analysis of defective patterns on wafers in semiconductor manufacturing: A bibliographical review.	CASE	2012	DBLP DOI BibTeX RDF
22	Gloria Rodríguez-Verján, Eric Tartiere, Jacques Pinaton, Stéphane Dauzère-Pérès, Alexis Thieullen	Dispatching of lots to dynamically reduce the wafers at risk in semiconductor manufacturing.	CASE	2012	DBLP DOI BibTeX RDF
22	Prem Pal, Kazuo Sato, Hirotaka Hida	MEMS components with perfectly protected edges and corners in Si{110} wafers.	MHS	2011	DBLP DOI BibTeX RDF
22	Ozren Gamulin, Maja Balarin, Mile Ivanda, Marin Kosovic, Vedran Derek, Lara Mikac, Kristina Serec, Kresimir Furic, Dubravka Krilov	Micro and nano structure of electrochemically etched silicon epitaxial wafers.	MIPRO	2011	DBLP BibTeX RDF
22	Jian-Yang Lin, Pai-Yu Chang	KOH anisotropic etching of Si wafers for LED electrode arrays.	NEMS	2011	DBLP DOI BibTeX RDF