Search results for "bump"

Hits ?▲	Authors	Title	Venue	Year	Link	Author keywords
19	Jun-Yeob Song, Jae Hak Lee, Hyoung Joon Kim, Chang Woo Lee, Tae Ho Ha	High reliability insert-bump bonding process for 3D integration.	3DIC	2013	DBLP DOI BibTeX RDF
19	Daria La Rocca, Patrizio Campisi, Jordi Solé-Casals	EEG Based User Recognition Using BUMP Modelling.	BIOSIG	2013	DBLP BibTeX RDF
19	Marius Hoffmann, Michael Mock, Michael May 0001	Road-quality Classification and Bump Detection with Bicycle-Mounted Smartphones.	UDM@IJCAI	2013	DBLP BibTeX RDF
19	Bill Huang, Hui Deng, Teemu Savolainen	Dual-Stack Hosts Using "Bump-in-the-Host" (BIH).	RFC	2012	DBLP DOI BibTeX RDF
19	J. W. Jang, L. Li, P. Bowles, R. Bonda, D. R. Frear	High-lead flip chip bump cracking on the thin organic substrate in a module package.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
19	Biljana Dimcic, Riet Labie, Joke De Messemaeker, Kris Vanstreels, Kris Croes, Bert Verlinden, Ingrid De Wolf	Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
19	Ta-Yu Kuan, Yi-Chun Chang, Tai-Chen Chen	Micro-bump assignment for 3D ICs using order relation.	ASP-DAC	2012	DBLP DOI BibTeX RDF
19	Young-Bae Kim, Jaeyong Sung, Myeong Ho Lee	Micro-PIV measurements of capillary underfill flows and effect of bump pitch on filling process.	J. Vis.	2011	DBLP DOI BibTeX RDF
19	Sewon Han, Byung-Seo Kim	Evaluations on Effectiveness of Bump-Slot over DAP-NAD-Based Tactical Wideband Wireless Networks.	NPC	2011	DBLP DOI BibTeX RDF
19	Makoto Motoyoshi, Junichi Takanohashi, Takafumi Fukushima, Yasuo Arai, Mitsumasa Koyanagi	Stacked SOI pixel detector using versatile fine pitch μ-bump technology.	3DIC	2011	DBLP DOI BibTeX RDF
19	Cheng-Ta Ko, Zhi-Cheng Hsiao, Y. J. Chang, Peng-Shu Chen, J. H. Huang, Hsin-Chia Fu, Y. J. Huang, C. W. Chiang, W. L. Tsat, Y. H. Chen, Wei-Chung Lo, Kuan-Neng Chen	Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies.	3DIC	2011	DBLP DOI BibTeX RDF
19	Akihiro Ikeda, Naoya Watanabe, Tanemasa Asano	High frequency signal transmission characteristics of cone bump interconnections.	3DIC	2011	DBLP DOI BibTeX RDF
19	Takanori Shuto, Naoya Watanabe, Akihiro Ikeda, Tanemasa Asano	Low-temperature bonding of LSI chips to PEN film using Au cone bump for heterogeneous integration.	3DIC	2011	DBLP DOI BibTeX RDF
19	Won-Myoung Ki, Myong-Suk Kang, Sehoon Yoo, Chang-Woo Lee	Fabrication and bonding process of fine pitch Cu pillar bump on thin Si chip for 3D stacking IC.	3DIC	2011	DBLP DOI BibTeX RDF
19	Myeong-Hyeok Jeong, Jae-Won Kim, Byung-Hyun Kwak, Young-Bae Park, Byoung-Joon Kim, Young-Chang Joo	Electrical Reliability of Cu/Sn Micro-bump in Wafer Level Packaging for BioMEMS Devices.	BIODEVICES	2011	DBLP BibTeX RDF
19	Radomír Cernoch, Filip Zelezný	Subgroup Discovery Using Bump Hunting on Multi-relational Histograms.	ILP	2011	DBLP DOI BibTeX RDF
19	Ken Smith, Peter Hanaway, Mike Jolley, Reed Gleason, Eric Strid, Tom Daenen, Luc Dupas, Bruno Knuts, Erik Jan Marinissen, Marc Van Dievel	Evaluation of TSV and micro-bump probing for wide I/O testing.	ITC	2011	DBLP DOI BibTeX RDF
19	Ahren Studer, Timothy Passaro, Lujo Bauer	Don't Bump, Shake on It: the exploitation of a popular accelerometer-based smart phone exchange and its secure replacement.	ACSAC	2011	DBLP DOI BibTeX RDF
19	C. C. Alan Fung, K. Y. Michael Wong, Si Wu 0001	A Moving Bump in a Continuous Manifold: A Comprehensive Study of the Tracking Dynamics of Continuous Attractor Neural Networks.	Neural Comput.	2010	DBLP DOI BibTeX RDF
19	Seok Hwan Lee, Jaeyong Sung, Sarah Eunkyung Kim	Dynamic flow measurements of capillary underfill through a bump array in flip chip package.	Microelectron. Reliab.	2010	DBLP DOI BibTeX RDF
19	Morten S. Mikkelsen	Bump Mapping Unparametrized Surfaces on the GPU.	J. Graphics, GPU, & Game Tools	2010	DBLP DOI BibTeX RDF
19	Mike Christian	Things That Go Bump in the Night (and How to Sleep Through Them).	Web Operations	2010	DBLP BibTeX RDF
19	Lan Peng, Hongyu Li, Dau Fatt Lim, Riko I. Made, Guo-Qiang Lo, Dim-Lee Kwong, Chuan Seng Tan	Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its quality enhancement.	3DIC	2010	DBLP DOI BibTeX RDF
19	DongSeop Lee, Jacques Périaux, Jordi Pons-Prats, Gabriel Bugeda, Eugenio Oñate	Double Shock Control Bump design optimization using hybridised evolutionary algorithms.	IEEE Congress on Evolutionary Computation	2010	DBLP DOI BibTeX RDF
19	François-Benoît Vialatte, Charles-François Vincent Latchoumane, Nigel R. Hudson, Sunil Wimalaratna, Jordi Solé-Casals, Jaeseung Jeong, Andrzej Cichocki	Sparse Bump Modeling of mildAD Patients - Modeling Transient Oscillations in the EEG of Patients with Mild Alzheimer's Disease.	BIOSIGNALS	2010	DBLP BibTeX RDF
19	Jeroen J. M. Zaal, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. Zhang	Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull.	Microelectron. Reliab.	2009	DBLP DOI BibTeX RDF
19	Wei-Chih Kuan, S. W. Liang, Chih Chen	Effect of bump size on current density and temperature distributions in flip-chip solder joints.	Microelectron. Reliab.	2009	DBLP DOI BibTeX RDF
19	Noam Tractinsky, David Shinar	Chi'08 alt.chi / do we bump into things more while speaking on a cell phone?	CHI Extended Abstracts	2008	DBLP DOI BibTeX RDF	speaking, safety, cell phones, automaticity, walking, visual field, dual task, bumping
19	Jun Cheng, Ronald Chung, Edmund Y. Lam, Kenneth S. M. Fung	Handling of multi-reflections in wafer bump 3D reconstruction.	SMC	2008	DBLP DOI BibTeX RDF
19	Nobuaki Miyakawa, Eiri Hashimoto, Takanori Maebashi, Natsuo Nakamura, Yutaka Sacho, Shigeto Nakayama, Shinjiro Toyoda	Stacking technology based on 8-inch wafers using direct connection between TSV and micro-bump.	CICC	2008	DBLP DOI BibTeX RDF
19	Seung-Gi Lee, Woo-Chan Park, Won-Jong Lee, Sung-Bong Yang, Tack-Don Han	An Effective Bump Mapping Hardware Architecture Using Polar Coordinate System.	J. Inf. Sci. Eng.	2007	DBLP BibTeX RDF
19	Jeffrey S. Ovall	Function, Gradient, and Hessian Recovery Using Quadratic Edge-Bump Functions.	SIAM J. Numer. Anal.	2007	DBLP DOI BibTeX RDF
19	Hilmi Demiray	The effect of a bump in an elastic tube on wave propagation in a viscous fluid of variable viscosity.	Appl. Math. Comput.	2007	DBLP DOI BibTeX RDF
19	Akira Ishii, Jun Mitsudo	Constant-Magnification Varifocal Mirror and Its Application to Measuring Three-Dimensional (3-D) Shape of Solder Bump.	IEICE Trans. Electron.	2007	DBLP DOI BibTeX RDF
19	Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo, Seung-Boo Jung	Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications	CoRR	2007	DBLP BibTeX RDF
19	Yi-Shao Lai, Kuo-Ming Chen, Chin-Li Kao, Chiu-Wen Lee, Ying-Ta Chiu	Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy.	Microelectron. Reliab.	2007	DBLP DOI BibTeX RDF
19	Kimihiro Yamanaka, Yutaka Tsukada, Katsuaki Suganuma	Studies on solder bump electromigration in Cu/Sn-3Ag-0.5Cu/Cu system.	Microelectron. Reliab.	2007	DBLP DOI BibTeX RDF
19	Mei Dong, Ronald Chung, Edmund Y. Lam, Kenneth S. M. Fung	Use of Paraplanar Constraint for Parallel Inspection of Wafer Bump Heights.	IPCV	2007	DBLP BibTeX RDF
19	Takahiro Yukizane, Shin-ya Ohi, Eiji Miyano, Hideo Hirose	The Bump Hunting Method Using the Genetic Algorithm with the Extreme-Value Statistics.	IEICE Trans. Inf. Syst.	2006	DBLP DOI BibTeX RDF
19	Rui Jiang 0001, Hua Yang, Fengzhu Sun, Ting Chen 0006	Searching for interpretable rules for disease mutations: a simulated annealing bump hunting strategy.	BMC Bioinform.	2006	DBLP DOI BibTeX RDF
19	Richard J. Cant, Caroline S. Langensiepen	Efficient anti-aliased bump mapping.	Comput. Graph.	2006	DBLP DOI BibTeX RDF
19	D. Noonan, Patrick J. McNally, Weimin Chen, Aapo Lankinen, L. Knuuttila, Turkka O. Tuomi, Andreas N. Danilewsky, Rolf Simon	The evaluation of mechanical stresses developed in underlying silicon substrates due to electroless nickel under bump metallization using synchrotron X-ray topography.	Microelectron. J.	2006	DBLP DOI BibTeX RDF
19	J. D. Wu, P. J. Zheng, C. W. Lee, S. C. Hung, J. J. Lee	A study in flip-chip UBM/bump reliability with effects of SnPb solder composition.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
19	W.-M. Chen, Paul McCloskey, S. Cian O'Mathuna	Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
19	Mohd Khairuddin Md Arshad, Ibrahim Ahmad, Azman Jalar, Ghazali Omar	The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
19	Miguel Ullán, Manuel Lozano 0003, Mokhtar Chmeissani, G. Blanchot, Enric Cabruja, J. García, M. Maiorino, Ricardo Martínez, Giulio Pellegrini, Carles Puigdengoles	Test structure assembly for bump bond yield measurement on high density flip chip technologies.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
19	Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung	Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
19	Dae Whan Kim, Byung-Seon Kong	The effect of hygro-mechanical and thermo-mechanical stress on delamination of gold bump.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
19	Chih-Tang Peng, Chia-Tai Kuo, Kuo-Ning Chiang, Terry Ku, Kenny Chang	Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
19	Deepak Agarwal, Jeff M. Phillips, Suresh Venkatasubramanian	The hunting of the bump: on maximizing statistical discrepancy.	SODA	2006	DBLP DOI BibTeX RDF
19	Sunwoo Yuk, Shin-Woong Park, Yun Yi	Design and Evaluation of a 2D Array PIN Photodiode Bump Bonded to Readout IC for the Low Energy X-ray Detector.	EMBC	2006	DBLP DOI BibTeX RDF
19	Jonathan M. McCune, Adrian Perrig, Michael K. Reiter	Bump in the Ether: A Framework for Securing Sensitive User Input.	USENIX Annual Technical Conference, General Track	2006	DBLP BibTeX RDF
19	Fujun He, Zhijiang Du, Lining Sun, Rui Lin	Intelligent Response to Bump in an Autonomous Wheeled Robot.	ISDA (2)	2006	DBLP DOI BibTeX RDF
19	Leo Chau-Kuang Liau, Burce Shin-Ching Chen	Process optimization of gold stud bump manufacturing using artificial neural networks.	Expert Syst. Appl.	2005	DBLP DOI BibTeX RDF
19	J. W. Wan, Wen-Jun Zhang 0001, D. J. Bergstrom	Influence of transient flow and solder bump resistance on underfill process.	Microelectron. J.	2005	DBLP DOI BibTeX RDF
19	Deepak Agarwal, Jeff M. Phillips, Suresh Venkatasubramanian	The Hunting of the Bump: On Maximizing Statistical Discrepancy	CoRR	2005	DBLP BibTeX RDF
19	Ivan N. Ndip, Grit Sommer, Werner John, Herbert Reichl	Characterization of bump arrays at RF/microwave frequencies.	Microelectron. Reliab.	2005	DBLP DOI BibTeX RDF
19	Phillip N. Azariadis, Nikos A. Aspragathos	Obstacle representation by Bump-surfaces for optimal motion-planning.	Robotics Auton. Syst.	2005	DBLP DOI BibTeX RDF
19	Naoki Kawai	Bump mapping onto real objects.	SIGGRAPH Sketches	2005	DBLP DOI BibTeX RDF
19	Joshua Beveridge	Things that go bump in the night.	SIGGRAPH Electronic Art and Animation Catalog	2005	DBLP DOI BibTeX RDF
19	Patrick Conran	SpecVar maps: baking bump maps into specular response.	SIGGRAPH Sketches	2005	DBLP DOI BibTeX RDF
19	Neil J. Gunther	Benchmarking Blunders and Things That Go Bump in the Night	CoRR	2004	DBLP BibTeX RDF
19	Esther Wai Ching Yau, Jing Feng Gong, Philip Chan	Al surface morphology effect on flip-chip solder bump shear strength.	Microelectron. Reliab.	2004	DBLP DOI BibTeX RDF
19	Pawel Wrotek, Alexander Rice, Morgan McGuire	Real-time bump map deformations.	SIGGRAPH Posters	2004	DBLP DOI BibTeX RDF
19	James A. Paterson, Andrew W. Fitzgibbon	Extracting face bump maps from video.	SIGGRAPH Sketches	2004	DBLP DOI BibTeX RDF
19	John J. H. Reche, Deok-Hoon Kim	Wafer level packaging having bump-on-polymer structure.	Microelectron. Reliab.	2003	DBLP DOI BibTeX RDF
19	Qian Wang, Naoe Hosoda, Toshihiro Itoh, Tadatomo Suga	Reliability of Au bump-Cu direct interconnections fabricated by means of surface activated bonding method.	Microelectron. Reliab.	2003	DBLP DOI BibTeX RDF
19	M. Robb, A. D. Spence, Mike J. Chantler, M. Timmins	Real-Time Per-pixel Rendering of Bump-mapped Textures Captured using Photometric Stereo.	VVG	2003	DBLP DOI BibTeX RDF
19	Menachem Elimelech	Particle Deposition onto Solid Surfaces with Microscopic Charge Heterogeneity: The "Bump Effect".	ICMENS	2003	DBLP DOI BibTeX RDF
19	Seungyun Lee, Myung-Ki Shin, Yong-Jin Kim, Erik Nordmark, Alain Durand	Dual Stack Hosts Using "Bump-in-the-API" (BIA).	RFC	2002	DBLP DOI BibTeX RDF
19	De-Shin Liu, Chin-Yu Ni	The optimization design of bump interconnections in flip chip packages from the electrical standpoint.	Microelectron. Reliab.	2002	DBLP DOI BibTeX RDF
19	Joachim Kloeser, Paradiso Coskina, Rolf Aschenbrenner, Herbert Reichl	Bump formation for flip chip and CSP by solder paste printing.	Microelectron. Reliab.	2002	DBLP DOI BibTeX RDF
19	Tom Forsyth	Self-Shadowing Bump Map Using 3D Texture Hardware.	J. Graphics, GPU, & Game Tools	2002	DBLP DOI BibTeX RDF
19	Sabine M. McConnell, David B. Skillicorn	Semidiscrete Decomposition: A Bump Hunting Technique.	AusDM	2002	DBLP BibTeX RDF
19	Jean-Michel Dischler, Karl Maritaud, Djamchid Ghazanfarpour	Coherent Bump Map Recovery from a Single Texture Image.	Graphics Interface	2002	DBLP BibTeX RDF
19	James Alexander Paterson, Andrew W. Fitzgibbon	Flexible bump map capture from video.	Eurographics (Short Presentations)	2002	DBLP DOI BibTeX RDF
19	Anders Hast, Tony Barrera, Ewert Bengtsson	Improved Bump Mapping by using Quadratic Vector Interpolation.	Eurographics (Short Presentations)	2002	DBLP DOI BibTeX RDF
19	Anders Hast, Tony Barrera, Ewert Bengtsson	Reconstruction Filters for Bump Mapping.	WSCG (Posters)	2002	DBLP BibTeX RDF
19	Jun Sung Kim, Jong Hyun Lee, Kyu Ho Park	A fast and efficient bump mapping algorithm by angular perturbation.	Comput. Graph.	2001	DBLP DOI BibTeX RDF
19	Ursula Becker, Ludwig Fahrmeir	Bump Hunting for Risk: a New Data Mining Tool and its Applications.	Comput. Stat.	2001	DBLP DOI BibTeX RDF
19	Frank Stepniak	Conversion of the under bump metallurgy into intermetallics: the impact on flip chip reliability.	Microelectron. Reliab.	2001	DBLP DOI BibTeX RDF
19	Jan Kautz, Wolfgang Heidrich, Hans-Peter Seidel	Real-Time Bump Map Synthesis.	Workshop on Graphics Hardware	2001	DBLP DOI BibTeX RDF
19	Vinay Verma, Shantanu Dutt	A Search-Based Bump-and-Refit Approach to Incremental Routing for ECO Applications in FPGAs.	ICCAD	2001	DBLP DOI BibTeX RDF
19	Kazuaki Tsuchiya, Hidemitsu Higuchi, Yoshifumi Atarashi	Dual Stack Hosts using the "Bump-In-the-Stack" Technique (BIS).	RFC	2000	DBLP DOI BibTeX RDF
19	Marco Tarini, Paolo Cignoni, Claudio Rocchini, Roberto Scopigno	Real Time, Accurate, Multi-Featured Rendering of Bump Mapped Surfaces.	Comput. Graph. Forum	2000	DBLP DOI BibTeX RDF
19	Hiroyuki Tsukahara, Yoji Nishiyama, Fumiyuki Takahashi, Takashi Fuse, Toru Nishino, Moritoshi Ando	High-speed solder bump inspection system using a laser scanner and CCD camera.	Syst. Comput. Jpn.	2000	DBLP DOI BibTeX RDF
19	Jan Kautz, Hans-Peter Seidel	Towards Interactive Bump Mapping with Anisotropic Shift-Variant BRDFs.	Workshop on Graphics Hardware	2000	DBLP DOI BibTeX RDF
19	Jerome H. Friedman, Nicholas I. Fisher	Bump hunting in high-dimensional data.	Stat. Comput.	1999	DBLP DOI BibTeX RDF
19	Melvyn L. Smith, G. Smith, T. Hill	Gradient space analysis of surface defects using a photometric stereo derived bump map.	Image Vis. Comput.	1999	DBLP DOI BibTeX RDF
19	Stephen Hinde	The bell tolls for the bell-shaped curve: or how hot magnets, species distribution and things that go bump in the air will change our view of risk.	Comput. Secur.	1999	DBLP DOI BibTeX RDF
19	Jian J. Zhang 0001	Least distorted bump mapping onto surface patches.	Comput. Graph.	1998	DBLP DOI BibTeX RDF
19	I. Ernst, H. Rüsseler, H. Schulz, O. Wittig	Gouraud Bump Mapping.	Workshop on Graphics Hardware	1998	DBLP DOI BibTeX RDF
19	Anders Kugler	IMEM: An Intelligent Memory for Bump- and Reflection-Mapping.	Workshop on Graphics Hardware	1998	DBLP DOI BibTeX RDF
19	K. Bennebroek, I. Ernst, H. Rüsseler, O. Wittig	Design principles of hardware-based phong shading and bump-mapping.	Comput. Graph.	1997	DBLP DOI BibTeX RDF
19	Holly E. Rushmeier, Gabriel Taubin, André Guéziec	Appying Shape from Lighting Variation to Bump Map Capture.	Rendering Techniques	1997	DBLP DOI BibTeX RDF
19	I. Ernst, D. Jackél, H. Rüsseler, O. Wittig	Hardware-supported bump mapping.	Comput. Graph.	1996	DBLP DOI BibTeX RDF
19	David A. Wagner 0001, Steven M. Bellovin	A "bump in the stack" encryptor for MS-DOS systems.	NDSS	1996	DBLP DOI BibTeX RDF
19	K. Bennebroek, I. Ernst, H. Rüsseler, O. Wittig	Design Principles of Hardware-based Phong Shading and Bump Mapping.	Workshop on Graphics Hardware	1996	DBLP DOI BibTeX RDF
19	I. Ernst, D. Jackél, H. Rüsseler, O. Wittig	Hardware Supported Bump Mapping: A Step towards Ingber Quality Real-Time Rendering.	Workshop on Graphics Hardware	1995	DBLP DOI BibTeX RDF
19	Gary William Flake	The Capacity of a Bump.	NIPS	1995	DBLP BibTeX RDF