Search results for "bonding"

Hits ?▲	Authors	Title	Venue	Year	Link	Author keywords
67	Jun Mizuno, Sharon Farrens, Viorel Dragoi, Thomas Glinsner, Hiroyuki Ishida, Hidetoshi Shinohara, Takafumi Suzuki, Masanori Ishizuka, Shuichi Shoji	Cyclo-Olefin Polymer Direct Bonding Using low Temperature Plasma Activation Bonding.	ICMENS	2005	DBLP DOI BibTeX RDF
67	Chang-Joon Oh, Young Joong Lee, Young-Joon Han, Chung Sam Ahn	A new system for reducing the bonding process cycle time and increasing the accuracy of bonding diagram.	SMC (5)	2004	DBLP DOI BibTeX RDF
64	Adam Liwo, Jaroslaw Pillardy, Cezary Czaplewski, Jooyoung Lee 0002, Daniel R. Ripoll, Malgorzata Groth, Sylwia Rodziewicz-Motowidlo, Rajmund Kazmierkiewicz, Ryszard J. Wawak, Stanislaw Oldziej, Harold A. Scheraga	UNRES: a united-residue force field for energy-based prediction of protein structure - orgin and significance of multibody terms.	RECOMB	2000	DBLP DOI BibTeX RDF
53	Ronald Rousseau 0001, Sandra Rousseau	Remarks concerning the Liberman-Wolf bonding number.	Scientometrics	2006	DBLP DOI BibTeX RDF
53	Soo-Cheol Oh, Sang-Hwa Chung	An M-VIA-Based Channel Bonding Mechanism on Gigabit Ethernet.	PDCAT	2004	DBLP DOI BibTeX RDF
52	Alessio Ceroni, Paolo Frasconi, Andrea Passerini, Alessandro Vullo	Predicting the Disulfide Bonding State of Cysteines with Combinations of Kernel Machines.	J. VLSI Signal Process.	2003	DBLP DOI BibTeX RDF	bonding state of cysteines, structural genomics, machine learning, kernel machines
52	Florian Mueller 0001, Stefan Agamanolis, Rosalind W. Picard	Exertion interfaces: sports over a distance for social bonding and fun.	CHI	2003	DBLP DOI BibTeX RDF	funology, interpersonal trust, social bonding, sports interface, computer mediated communication, video-conferencing, sport, sports, physical interface, exertion interface
51	Yanjie Liu, Lemin Zhang, Dongcui Wang, Yuetao Liu	Research on a New Composite Ultrasonic Energy Transmission Mechanism with Parallel Structure.	RAM	2008	DBLP DOI BibTeX RDF
51	Johannes Friis, Ebbe Nielsen, Jesper Bonding, Fabiano Daher Adegas, Jakob Stoustrup, Peter Fogh Odgaard	Repetitive model predictive approach to individual pitch control of wind turbines.	CDC/ECC	2011	DBLP DOI BibTeX RDF
50	Florian Mueller 0001, Stefan Agamanolis	Sports over a distance.	Comput. Entertain.	2005	DBLP DOI BibTeX RDF	funology, social bonding, computer-mediated communication, video-conferencing, sport, physical interface, exertion interface
40	Sung-Ho Kim, Young-Bae Ko	Wireless Bonding for Maximizing Throughput in Multi-Radio Mesh Networks.	PerCom Workshops	2007	DBLP DOI BibTeX RDF
40	Jun Mizuno, T. Harada, Thomas Glinsner, Masanori Ishizuka, Tomohiko Edura, Ken Tsutsui, Hiroyuki Ishida, Shuichi Shoji, Yasuo Wada	Fabrications of Micro-Channel Device by Hot Emboss and Direct Bonding of PMMA.	ICMENS	2004	DBLP DOI BibTeX RDF
39	Fanzhi Kong, Yizhong Wang	Study on the Fast Matching Location Algorithm Based on Feature Points for Wire Bonding.	ISIP	2008	DBLP DOI BibTeX RDF	wire bonding, feature points matching, SIFT, PRS
39	Yumiko Mori	Atoms of Bonding: Communication Components Bridging Children Worldwide (Invited Talk).	IWIC	2007	DBLP DOI BibTeX RDF	atoms of bonding, simultaneous activity, CMC, Pictogram, intercultural communication
38	Chia-Yi Chang, Hung-Ming Chen	Design Migration From Peripheral ASIC Design to Area-I/O Flip-Chip Design by Chip I/O Planning and Legalization.	IEEE Trans. Very Large Scale Integr. Syst.	2008	DBLP DOI BibTeX RDF
38	Jian-Bin Bao, D. Jed Harrison	Design and Fabrication of Microchannels for Magnetohydrodynamic Flow.	ICMENS	2003	DBLP DOI BibTeX RDF
37	De-Yu Liu, Wai-Kei Mak, Ting-Chi Wang	Temperature-constrained fixed-outline floorplanning for die-stacking system-in-package design.	ACM Great Lakes Symposium on VLSI	2010	DBLP DOI BibTeX RDF	wire bonding, floorplanning, system-in-package
37	Jui-Tsung Wong, Kuei-Hsien Chen, Chwen-Tzeng Su	Designing a System for a Process Parameter Determined through Modified PSO and Fuzzy Neural Network.	PAKDD	2008	DBLP DOI BibTeX RDF	wire bonding process, determination of process parameters, modified particle swarm optimizer, adaptive network-based fuzzy inference system
37	Vivek Shrivastava, Shravan K. Rayanchu, Jongwoon Yoonj, Suman Banerjee 0001	802.11n under the microscope.	Internet Measurement Conference	2008	DBLP DOI BibTeX RDF	channel bonding, mac diversity, phy diversity, performance, wireless, 802.11n, mimo, frame aggregation
37	Hsin-hung Lin, Chih-wen Hsueh, Guo-Chiuan Huang	BondingPlus: Real-Time Message Channel in Linux Ethernet Environment Using Regular Switching Hub.	RTCSA	2003	DBLP DOI BibTeX RDF	IEEE Link Aggregation Standard, channel bonding, network scheduling, packet scheduling
29	Liangxing Hu, Simon Chun Kiat Goh, Yu Dian Lim, Peng Zhao, Michael Joo Zhong Lim, Chuan Seng Tan	Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions.	3DIC	2021	DBLP DOI BibTeX RDF
29	Fatema Akhter, Sun Yuanshuai, Nobuo Funabiki, Hendy Briantoro, Kwenga Ismael Munene, Md. Mahbubur Rahman	Feasibility Investigations of Access-Point Transmission Power Optimization Method under Co-use of Channel Bonding and Non Channel Bonding in Wireless Local-Area Network.	CANDAR (Workshops)	2021	DBLP DOI BibTeX RDF
29	Kwenga Ismael Munene, Nobuo Funabiki, Hendy Briantoro, Md. Mahbubur Rahman, Sujan Chandra Roy, Minoru Kuribayashi	A Study of Throughput Drop Estimation Model for Concurrently Communicating Links Under Coexistence of Channel Bonding and Non-bonding in IEEE 802.11n WLAN.	CISIS	2021	DBLP DOI BibTeX RDF
29	Tamara Papp, László E. Kollár, Tamás Kégl	Theoretical insights into the nature of Pt‒Sn bond: Reevaluating the bonding/back-bonding properties of trichlorostannate with comparison to the cyano ligand.	J. Comput. Chem.	2017	DBLP DOI BibTeX RDF
29	Eiji Higurashi, Ken Okumura, Yutaka Kunimune, Tadatomo Suga, Kei Hagiwara	Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient Air Using a Surface-Activated Bonding Method.	IEICE Trans. Electron.	2017	DBLP DOI BibTeX RDF
29	Suqing Zheng, Shaofang Xu, Guitao Wang, Qing Tang, Xiaonan Jiang, Zhanting Li, Yong Xu, Renxiao Wang, Fu Lin	Proposed Hydrogen-Bonding Index of Donor or Acceptor Reflecting Its Intrinsic Contribution to Hydrogen-Bonding Strength.	J. Chem. Inf. Model.	2017	DBLP DOI BibTeX RDF
29	Syed Hashim Raza Bukhari, Mubashir Husain Rehmani, Sajid Siraj	A Survey of Channel Bonding for Wireless Networks and Guidelines of Channel Bonding for Futuristic Cognitive Radio Sensor Networks.	IEEE Commun. Surv. Tutorials	2016	DBLP DOI BibTeX RDF
29	William Sanfins, Damien Risaletto, Frédéric Richardeau, G. Blondel, M. Chemin, Philippe Baudesson	Preliminary failure-mode characterization of emerging direct-lead-bonding power module. Comparison with standard wire-bonding interconnection.	Microelectron. Reliab.	2015	DBLP DOI BibTeX RDF
29	Masahiro Kondo, Hidetoshi Miyashita, Sang-Seok Lee, Nobuo Matsuoka	Tentative bonding effect for maintaining alignment accuracy in bonding utilizing thick SU8 as an adhesive material.	NEMS	2015	DBLP DOI BibTeX RDF
29	Adeline B. Y. Lim, Andrew C. K. Chang, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen 0004	Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
29	H. Xu, C. Liu, Vadim V. Silberschmidt, Zhong Chen 0004, J. Wei, M. Sivakumar	Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution.	Microelectron. Reliab.	2011	DBLP DOI BibTeX RDF
29	Yuki Ohara, Kang Wook Lee 0002, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi	Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration.	3DIC	2011	DBLP DOI BibTeX RDF
29	Hsuan-Hung Lin, Lin-Yu Tseng 0001	DBCP: a web server for disulfide bonding connectivity pattern prediction without the prior knowledge of the bonding state of cysteines.	Nucleic Acids Res.	2010	DBLP DOI BibTeX RDF
29	Markus Gabriel, Thomas Knauer, Peter Bisson, Sumant Sood, Wilfried Bair, Jim Hermanowski	Equipment challenges and solutions for diverse temporary bonding and de-bonding processes in 3D integration.	3DIC	2010	DBLP DOI BibTeX RDF
29	Gweltaz Gaudin, Gregory Riou, Didier Landru, Catherine Tempesta, Ionut Radu, Mariam Sadaka, Kevin Winstel, Emily Kinser, Robert Hannon	Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment.	3DIC	2010	DBLP DOI BibTeX RDF
29	Yong Ding, Jang-Kyo Kim	Numerical analysis of ultrasonic wire bonding: Part 2. Effects of bonding parameters on temperature rise.	Microelectron. Reliab.	2008	DBLP DOI BibTeX RDF
29	Halina Szatylowicz, Tadeusz Marek Krygowski, Joanna E. Zachara-Horeglad	Long-Distance Structural Consequences of H-Bonding. How H-Bonding Affects Aromaticity of the Ring in Variously Substituted Aniline/Anilinium/Anilide Complexes with Bases and Acids.	J. Chem. Inf. Model.	2007	DBLP DOI BibTeX RDF
29	Yong Ding, Jang-Kyo Kim, Pin Tong	Effects of bonding force on contact pressure and frictional energy in wire bonding.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
29	Roger A. Klein	Hydrogen bonding in diols and binary diol-water systems investigated using DFT methods. II. Calculated infrared OH-stretch frequencies, force constants, and NMR chemical shifts correlate with hydrogen bond geometry and electron density topology. A reevaluation of geometrical criteria for hydrogen bonding.	J. Comput. Chem.	2003	DBLP DOI BibTeX RDF
29	Y. C. Chan, D. Y. Luk	Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure.	Microelectron. Reliab.	2002	DBLP DOI BibTeX RDF
29	Y. C. Chan, D. Y. Luk	Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature.	Microelectron. Reliab.	2002	DBLP DOI BibTeX RDF
27	Sébastien Duval, Hiromichi Hashizume	First Design of a Ubiquitous System for Affective Bonding and Support with Family and Friends.	HCI (15)	2007	DBLP DOI BibTeX RDF	HCI, Emotions, Cultures, Wearable, Family, Emotional design, Friends, Ubiquity
27	N. Hassaïne, L. Villeneuve, Y. Shen, F. Concilio	Modeling of Tape Automated Bonding (TAB) for High Performance Integrated Circuits.	CCECE	2006	DBLP DOI BibTeX RDF
27	Gabriella Trucco, Giorgio Boselli, Valentino Liberali	A Study of Crosstalk Through Bonding and Package Parasitics in CMOS Mixed Analog-Digital Circuits.	PATMOS	2004	DBLP DOI BibTeX RDF
27	Gabriella Trucco, Giorgio Boselli, Valentino Liberali	An approach to computer simulation of bonding and package crosstalk in mixed-signal CMOS ICs.	SBCCI	2004	DBLP DOI BibTeX RDF	crosstalk, mixed-signal ICs
27	Haigang Feng, Rouying Zhan, Guang Chen, Qiong Wu 0013, Xiaokang Guan, Haolu Xie, Albert Z. Wang	Bonding-pad-oriented on-chip ESD protection structures for ICs.	ISCAS (1)	2003	DBLP DOI BibTeX RDF
27	James (JianQiang) Lü, Ronald J. Gutmann	Experiences in Developing a Research-Focused Project Course: IP-Core Based IC Design Enabled by 3D Wafer Bonding.	MSE	2001	DBLP DOI BibTeX RDF
27	Takahiro Kawamura, Tetsuo Hasegawa, Akihiko Ohsuga, Shinichi Honiden	Bee-gent: Bonding and Encapsulation Enhancement Agent Framework for Development of Distributed Systems.	APSEC	1999	DBLP DOI BibTeX RDF	Agent, Distributed, Multi-Agent, Interaction Protocol, ACL
26	Moira Burke, Cameron Marlow, Thomas M. Lento	Social network activity and social well-being.	CHI	2010	DBLP DOI BibTeX RDF	loneliness, computer-mediated communication, social network sites, social capital
26	Kazuya Nakao, Masaaki Fujikawa, Ryo Shimizu, Miki Akamatsu	QSAR application for the prediction of compound permeability with in silico descriptors in practical use.	J. Comput. Aided Mol. Des.	2009	DBLP DOI BibTeX RDF	PAMPA, Log P, pK a, PSA, Caco-2, QSAR
26	Michael Domaratzki	Hairpin Structures Defined by DNA Trajectories.	Theory Comput. Syst.	2009	DBLP DOI BibTeX RDF	Hairpins, DNA trajectories, DNA words, Formal languages
26	Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka	Three-dimensional integration technology and integrated systems.	ASP-DAC	2009	DBLP DOI BibTeX RDF
26	Whitman Richards, Nicholas C. Wormald	Representing Small Group Evolution.	CSE (4)	2009	DBLP DOI BibTeX RDF
26	Satyender Goel, Artëm E. Masunov	Pairwise Spin-Contamination Correction Method and DFT Study of MnH and H2 Dissociation Curves.	ICCS (2)	2009	DBLP DOI BibTeX RDF
26	Timothy Lee, Rahul Singh	Comparative Analysis of Disulfide Bond Determination Using Computational-Predictive Methods and Mass Spectrometry-Based Algorithmic Approach.	BIRD	2008	DBLP DOI BibTeX RDF
26	Florian Mueller 0001, Gunnar Stevens, Alex Thorogood, Shannon O'Brien, Volker Wulf	Sports over a Distance.	Pers. Ubiquitous Comput.	2007	DBLP DOI BibTeX RDF
26	Jia-Wei Fang, I-Jye Lin, Yao-Wen Chang, Jyh-Herng Wang	A Network-Flow-Based RDL Routing Algorithmz for Flip-Chip Design.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2007	DBLP DOI BibTeX RDF
26	Michael Domaratzki	Bond-free DNA language classes.	Nat. Comput.	2007	DBLP DOI BibTeX RDF	bond free properties, shuffle on trajectories, theory of codes
26	Eric Wong 0002, Sung Kyu Lim	Whitespace redistribution for thermal via insertion in 3D stacked ICs.	ICCD	2007	DBLP DOI BibTeX RDF
26	Daniel Quadt	Simulation-based scheduling of parallel wire-bonders with limited clamp&paddles.	WSC	2006	DBLP DOI BibTeX RDF
26	Michael Domaratzki	Hairpin Structures Defined by DNA Trajectories.	DNA	2006	DBLP DOI BibTeX RDF
26	Peter E. Strazdins, Richard Alexander, David Barr	Performance Enhancement of SMP Clusters with Multiple Network Interfaces Using Virtualization.	ISPA Workshops	2006	DBLP DOI BibTeX RDF
26	Mariana Lima, Sofía Liberman, Jane M. Russell	Scientific group cohesiveness at the National University of México.	Scientometrics	2005	DBLP DOI BibTeX RDF
26	Yian Zhu	The Study and Implementation of Wireless Network Router NPU-1.	ICESS	2005	DBLP DOI BibTeX RDF
26	Bryan Black, Donald Nelson, Clair Webb, Nick Samra	3D Processing Technology and Its Impact on iA32 Microprocessors.	ICCD	2004	DBLP DOI BibTeX RDF
26	Li Ding 0002, Pinaki Mazumder	Simultaneous switching noise analysis using application specific device modeling.	IEEE Trans. Very Large Scale Integr. Syst.	2003	DBLP DOI BibTeX RDF
24	Florian Mueller 0001, Martin R. Gibbs	A physical three-way interactive game based on table tennis.	IE	2007	DBLP BibTeX RDF	bonding, network, social interaction, tangible, physical, videoconferencing, active, sports, exertion interface, connectedness, exhausting, team spirit, sweat, rapport, table-tennis, ping pong
24	Arthur L. Corcoran, Roger L. Wainwright	Reducing disruption of superior building blocks in genetic algorithms.	SAC	1996	DBLP DOI BibTeX RDF	relative bonding strength, genetic algorithms, reduction, building blocks, masking
24	Peter Sandborn, Rajarshi Ghosh, Ken Drake, Magdy S. Abadir, Linda Bal, Ashish Parikh	Multichip systems trade-off analysis tool.	J. Electron. Test.	1994	DBLP DOI BibTeX RDF	flip chip bonding, multichip module (MCM), packaging and interconnect, Conceptual design, trade-off analysis
14	Zuoen Deng, Haisong Huang, Jingwei Yang, Jiadui Chen, Xin Gao, Kai Yang	Digital twin modeling method of the temperature field of thermo-compression bonding blade based on generative adversarial networks.	Adv. Eng. Softw.	2024	DBLP DOI BibTeX RDF
14	José-Francisco Gómez-Hernández, José-María Gutiérrez-Hernández, Antonio Jimeno-Morenilla, José-Luis Sánchez-Romero, María-Dolores Fabregat-Periago	Development of an Integrated Robotic Workcell for Automated Bonding in Footwear Manufacturing.	IEEE Access	2024	DBLP DOI BibTeX RDF
14	Murad A. Abusubaih	An Intelligence-Based Framework for Managing WLANs: The Potential of Non-Contiguous Channel Bonding.	IEEE Access	2024	DBLP DOI BibTeX RDF
14	Yaofeng Yi, Toshimasa Umezawa, Kouichi Akahane, Tetsuya Kawanishi	Thermal Study for High-Photocurrent Photodetector in Non-Saturation Region Using Thin Substrate, Thin Absorber, and Flip- Chip Bonding Process.	IEEE Access	2024	DBLP DOI BibTeX RDF
14	Hong-Nhat Hoang, Dong-Hyun Kim 0011, Jong-Deok Kim	LiTE4DCB: A Lightweight Throughput Estimation for Heterogeneous Dynamic Channel Bonding WLANs Based on Continuous-Time Markov Chain.	IEEE Access	2024	DBLP DOI BibTeX RDF
14	Srinivas Gandla, Sunju Kang, Junho Kim, Yunjeong Yu, Jaeseong Kim, Hyeongtae Lim, Hyuk-Jun Kwon, Sung-Min Park, Sunkook Kim	Flex-to-Stretch Hybrid Electronics - Bonding-Free Robust Interface for Wearable Wireless Physiological Monitoring.	IEEE Internet Things J.	2024	DBLP DOI BibTeX RDF
14	Jinwoo Kim, Lingjun Zhu, Hakki Mert Torun, Madhavan Swaminathan, Sung Kyu Lim	A PPA Study for Heterogeneous 3-D IC Options: Monolithic, Hybrid Bonding, and Microbumping.	IEEE Trans. Very Large Scale Integr. Syst.	2024	DBLP DOI BibTeX RDF
14	Thom H. Dunning, Lu T. Xu	Electronic structure of Li1,2,3+,0,- and nature of the bonding in Li2,3+,0,-.	J. Comput. Chem.	2024	DBLP DOI BibTeX RDF
14	Toni Oestereich, Ralf Tonner-Zech, Julia Westermayr	Decoding energy decomposition analysis: Machine-learned Insights on the impact of the density functional on the bonding analysis.	J. Comput. Chem.	2024	DBLP DOI BibTeX RDF
14	Marek Freindorf, Juliana J. Antonio, Elfi Kraka	Iron-histidine bonding in bishistidyl hemoproteins-A local vibrational mode study.	J. Comput. Chem.	2024	DBLP DOI BibTeX RDF
14	Vilakkathala U. Krishnapriya, Cherumuttathu H. Suresh	Unraveling pnicogen bonding cooperativity: Insights from molecular electrostatic potential analysis.	J. Comput. Chem.	2024	DBLP DOI BibTeX RDF
14	Farnaz Yashmin, Rohan Sharma, Lakhya Jyoti Mazumder, Pankaz Kumar Sharma	Noble gas dative bonding with coinage metal carbene complexes: A theoretical study.	J. Comput. Chem.	2024	DBLP DOI BibTeX RDF
14	Vasilii Korotenko, Hendrik Zipse	The stability of oxygen-centered radicals and its response to hydrogen bonding interactions.	J. Comput. Chem.	2024	DBLP DOI BibTeX RDF
14	Naigong Yu, Hongzheng Li, Qiao Xu, Sié Ouattara, Firdaous Essaf	3D reconstruction and defect pattern recognition of bonding wire based on stereo vision.	CAAI Trans. Intell. Technol.	2024	DBLP DOI BibTeX RDF
14	Tikhon Pshenitsyn	Bonding Grammars.	CoRR	2024	DBLP DOI BibTeX RDF
14	Jialing Liu, Jiang Wei, Tengjian Zou	Bridging and Bonding: Exploring the Influence of Community-Level Networks on Product Innovation in Video Game Communities.	IEEE Trans. Engineering Management	2024	DBLP DOI BibTeX RDF
14	Siting Liu 0002, Jiaxi Jiang, Zhuolun He, Ziyi Wang, Yibo Lin, Bei Yu 0001, Martin D. F. Wong	Routing-aware Legal Hybrid Bonding Terminal Assignment for 3D Face-to-Face Stacked ICs.	ISPD	2024	DBLP DOI BibTeX RDF
14	Yoshitaka Shibata, Yasushi Banshy, Shoichi Noguchi	Performance Evaluation of V2X Communication Based on Channel Bonding Wireless Link Method for Autonomous Driving.	AINA (1)	2024	DBLP DOI BibTeX RDF
14	Debdatta Kandar, Phidahunlang Chyne, Samarendra Nath Sur, Sukumar Nandi	A study on the channel bonding in IoT networks: Requirements, applications, and challenges.	Int. J. Commun. Syst.	2023	DBLP DOI BibTeX RDF
14	Lanyu Zhang, Jian Gao 0002, Yun Chen 0002, Xin Chen 0005, Yunbo He	A High-Efficiency Searching Time Reduction Method for VCM Soft-Landing Operation During Chip Bonding.	IEEE Trans. Ind. Electron.	2023	DBLP DOI BibTeX RDF
14	Wuyu Zhang, Kun Tan, Bing Ji, Lei Qi 0005, Xiang Cui, Xiangyu Zhang 0004, Luchun Du	In Situ Diagnosis of Multichip IGBT Module Wire Bonding Faults Based on Collector Voltage Undershoot.	IEEE Trans. Ind. Electron.	2023	DBLP DOI BibTeX RDF
14	Ziyad Khalaf Farej, Mohammed Ahmed Hassan	Analysis and Performance Evaluation of the Static and Dynamic Channel Bonding for the IEEE 802.11ac WLAN.	Int. J. Interact. Mob. Technol.	2023	DBLP DOI BibTeX RDF
14	Roberta Avanzato, Francesco Beritelli, Corrado Rametta	Enhancing Perceptual Experience of Video Quality in Drone Communications by Using VPN Bonding.	IEEE Embed. Syst. Lett.	2023	DBLP DOI BibTeX RDF
14	Hao Xie, Sichao Du, Bo Pu, Jun Hu, Yu Zhang, Wei Qi, Hong Liu, Shuo Zhang, Duo Xiao	Electrothermal Responses of Bonding Wire Arrays in GaN Power Amplifier.	IEEE Access	2023	DBLP DOI BibTeX RDF
14	Lakhya Jyoti Mazumder, Rohan Sharma, Farnaz Yashmin, Pankaz Kumar Sharma	Beryllium bonding with noble gas atoms.	J. Comput. Chem.	2023	DBLP DOI BibTeX RDF
14	Lewis R. Thomas-Hargreaves, Yu-Qian Liu, Zhongma Cui, Sudip Pan, Magnus R. Buchner	Bonding situations in tricoordinated beryllium phenyl complexes.	J. Comput. Chem.	2023	DBLP DOI BibTeX RDF
14	Puthan Veetil Muhasina, Pattiyil Parameswaran	σ versus π-radical: Tuning the electronic nature of neutral carbon (I) compounds with three non-bonding electrons.	J. Comput. Chem.	2023	DBLP DOI BibTeX RDF
14	Jan-Niclas Luy, Pascal Henkel, Daniel Grigjanis, Jannis Jung, Doreen Mollenhauer, Ralf Tonner-Zech	Bonding character of intermediates in on-surface Ullmann reactions revealed with energy decomposition analysis.	J. Comput. Chem.	2023	DBLP DOI BibTeX RDF
14	Sonam Suthar, Kartik Chandra Mondal	Open shell versus closed shell bonding interaction in cyclopropane derivatives: EDA-NOCV analyses.	J. Comput. Chem.	2023	DBLP DOI BibTeX RDF
14	Sujit Das, Kavita Devi, Sonam Suthar, Kartik Chandra Mondal	Bonding and stability of elusive silaboryne (SiB) and germaboryne (GeB) with donor base ligands.	J. Comput. Chem.	2023	DBLP DOI BibTeX RDF
14	Derek R. Langstieh, Richard H. Duncan Lyngdoh, Robert Bruce King, Henry F. Schaefer III	Lantern-type dinickel complexes: An exploration of possibilities for nickel-nickel bonding with bridging bidentate ligands.	J. Comput. Chem.	2023	DBLP DOI BibTeX RDF