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Venues (Conferences, Journals, ...)
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GrowBag graphs for keyword ? (Num. hits/coverage)
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The graphs summarize 8 occurrences of 8 keywords
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Results
Found 64 publication records. Showing 64 according to the selection in the facets
Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
60 | Yanming Jia, Yici Cai, Xianlong Hong |
Full-chip routing system for reducing Cu CMP & ECP variation. |
SBCCI |
2008 |
DBLP DOI BibTeX RDF |
electroplating, routing, chemical mechanical polishing |
49 | Samir Ilias, Patrice Topart, Sébastien Leclair, Jean-Sébastien Côté, Loïc Le Noc, Francis Picard, Hubert Jerominek |
Novel Electroplating-Based Technology for the Fabrication of Giant Micromirrors for Space and Terrestrial Applications. |
ICMENS |
2004 |
DBLP DOI BibTeX RDF |
|
47 | Jian-Bin Bao, D. Jed Harrison |
Design and Fabrication of Microchannels for Magnetohydrodynamic Flow. |
ICMENS |
2003 |
DBLP DOI BibTeX RDF |
|
26 | Wenhao Yao, Hu He, Fuliang Wang |
CTAB-Modulated Electroplating of Copper Micropillar Arrays for Non-Enzymatic Glucose Sensing with Improved Sensitivity. |
Sensors |
2024 |
DBLP DOI BibTeX RDF |
|
26 | Anila Puthoor, Megha Agrawal, Varshini K. M., Koushik K. Rao |
Enhancement of Glass micromachining using selective copper electroplating. |
ICST |
2023 |
DBLP DOI BibTeX RDF |
|
26 | Jiahao Gong, Bingxin Liu, Pan Zhang, Huimin Zhang, Lin Gui 0004 |
Copper-Electroplating-Modified Liquid Metal Microfluidic Electrodes. |
Sensors |
2022 |
DBLP DOI BibTeX RDF |
|
26 | Min Pu |
Design and Realization of Electroplating Current Intelligent Regulating Equipment for Printed Circuit Board. |
AIAM |
2022 |
DBLP DOI BibTeX RDF |
|
26 | Pengyu Yan, Hongru Miao, Ada Che, Kaize Yu |
Nash-equilibrium algorithm and incentive protocol for a decentralized decision and scheduling problem in sustainable electroplating plants. |
Comput. Oper. Res. |
2021 |
DBLP DOI BibTeX RDF |
|
26 | Yongli Zhang, Guobao Zhang, Xin Chen |
Computer Numerical Simulation of the Effect of Coagulant Type on Electroplating Wastewater under Mathematical Calculation. |
AIAM (ACM) |
2021 |
DBLP DOI BibTeX RDF |
|
26 | Douglas Alves Goulart, Renato Dutra Pereira |
Autonomous pH control by reinforcement learning for electroplating industry wastewater. |
Comput. Chem. Eng. |
2020 |
DBLP DOI BibTeX RDF |
|
26 | Alexander Leiden, Sebastian Thiede, Christoph Herrmann 0001 |
Agent-Based Simulation Approach for Occupational Safety and Health Planning: A Case of Electroplating Facilities. |
Simul. Notes Eur. |
2020 |
DBLP DOI BibTeX RDF |
|
26 | Gerardo Emanuel Granados, Loïc Lacroix, Kamal Medjaher |
Condition monitoring and prediction of solution quality during a copper electroplating process. |
J. Intell. Manuf. |
2020 |
DBLP DOI BibTeX RDF |
|
26 | Aliakbar Mohammadzadeh, Alison Fox-Robichaud, P. Ravi Selvaganapathy |
Electroplating of Multiple Materials in Parallel Using Patterned Gels with Applications in Electrochemical Sensing. |
Sensors |
2020 |
DBLP DOI BibTeX RDF |
|
26 | Atsushi Sato, Wataru Natsu |
Theoretical Verification of Film Forming in Local Electroplating Process with Electrolyte Suction Tool. |
Int. J. Autom. Technol. |
2020 |
DBLP DOI BibTeX RDF |
|
26 | Hao Wang, Zailin Guan, Chaoyong Zhang, Lei Yue, Dan Luo, Saif Ullah |
The Printed-Circuit-Board Electroplating Parallel-Tank Scheduling With Hoist and Group Constraints Using a Hybrid Guided Tabu Search Algorithm. |
IEEE Access |
2019 |
DBLP DOI BibTeX RDF |
|
26 | Aliakbar Mohammadzadeh, Alison Fox-Robichaud, P. Ravi Selvaganapathy |
Parallel Electroplating of Multiple Materials Using Patterned Gels for Electrochemical Sensing. |
IEEE SENSORS |
2019 |
DBLP DOI BibTeX RDF |
|
26 | Navya Venkateshaiah, Ahmad Zakeri, Oliver L. Iliev |
Developing a self-organised Smart Tank Station for Electroplating Process Plant. |
WF-IoT |
2019 |
DBLP DOI BibTeX RDF |
|
26 | Anna Maria Bialostocka, Adam Idzkowski |
The Effect of Ground Changes and the Setting of External Magnetic Field on Electroplating FeNi Layers. |
AUTOMATION |
2019 |
DBLP DOI BibTeX RDF |
|
26 | Xinyue Chang, Zhiyu Jin, Yun-Na Sun, Yan Wang, Zhuoqing Yang, Guifu Ding |
An All-Metal Hollow Microstructure for Pool-Boiling Chip-Integrated Cooling Based on Electroplating. |
NEMS |
2018 |
DBLP DOI BibTeX RDF |
|
26 | Zhen Chen, Yang Peng, Hao Cheng, Zizhou Yang, Mingxiang Chen |
Void-free and high-speed filling of through ceramic holes by copper electroplating. |
Microelectron. Reliab. |
2017 |
DBLP DOI BibTeX RDF |
|
26 | Li-Chun Wu, Teh-Hua Tsai, Man-Hai Liu, Jui-Ling Kuo, Yung-Chu Chang, Ying-Chien Chung |
A Green Microbial Fuel Cell-Based Biosensor for In Situ Chromium (VI) Measurement in Electroplating Wastewater. |
Sensors |
2017 |
DBLP DOI BibTeX RDF |
|
26 | Florian Kurth, Joerg Froemel, Shuji Tanaka, Masayoshi Esashi, Thomas Gessner |
Electroplating of neodymium iron alloys. |
NEMS |
2016 |
DBLP DOI BibTeX RDF |
|
26 | Mark Ashworth, Geoffrey D. Wilcox, Rebecca L. Higginson, Richard J. Heath, Chanqing Liu, Roger J. Mortimer |
The effect of electroplating parameters and substrate material on tin whisker formation. |
Microelectron. Reliab. |
2015 |
DBLP DOI BibTeX RDF |
|
26 | Yihong He, Shuiyong Yu, Fangguo Li |
Research on a New Power Supply for Electroplating. |
UIC/ATC/ScalCom |
2015 |
DBLP DOI BibTeX RDF |
|
26 | Ho-Chiao Chuang, Wei-Hong Lai, Chih-Chung Huang, Ai-Ho Liao, Chih-Kuang Yeh |
Fabrication of through-silicon vias (TSV) by nickel electroplating in supercritical CO2. |
NEMS |
2014 |
DBLP DOI BibTeX RDF |
|
26 | Qinghua Zhao, Anmin Hu, Ming Li, Jiangyan Sun |
Effect of electroplating layer structure on shear property and microstructure of multilayer electroplated Sn-3.5Ag solder bumps. |
Microelectron. Reliab. |
2013 |
DBLP DOI BibTeX RDF |
|
26 | Jeong Hun Kim, Inho Song, Seung Min Lee, Hoseok Choi, Hangjin Byeon, Inyoung Kim, Sang-Hoon Lee |
An Electroplating-Free and Minimal Noise Polyimide Microelectrode for Recording Auditory Evoked Potentials From the Epicranius. |
IEEE Trans. Biomed. Eng. |
2013 |
DBLP DOI BibTeX RDF |
|
26 | Raeyoung Kim, Yoonkey Nam |
Novel platinum black electroplating technique improving mechanical stability. |
EMBC |
2013 |
DBLP DOI BibTeX RDF |
|
26 | Yihong He, Shuiyong Yu |
A New Method of Designing High-Power Electroplating Power Supply. |
GreenCom/iThings/CPScom |
2013 |
DBLP DOI BibTeX RDF |
|
26 | Chaowei Liu, Jie Fu, Qiang Xu 0003 |
Simultaneous mixed-integer dynamic optimization for environmentally benign electroplating. |
Comput. Chem. Eng. |
2011 |
DBLP DOI BibTeX RDF |
|
26 | Isabella Marr, Sebastian Reiß, Gunter Hagen, Ralf Moos |
Planar Zeolite Film-Based Potentiometric Gas Sensors Manufactured by a Combined Thick-Film and Electroplating Technique. |
Sensors |
2011 |
DBLP DOI BibTeX RDF |
|
26 | Abhishek Kumar, Shibu Clement, V. P. Agrawal |
Optimum selection and ranking of electroplating system process parameters: Taguchi-MADM approach. |
Int. J. Appl. Decis. Sci. |
2011 |
DBLP DOI BibTeX RDF |
|
26 | Xiaodan Miao, Xuhan Dai, Peihong Wang, Xiaopeng Zhang 0008, Xiao-Lin Zhao, Guifu Ding |
A new electroplating mask for deep wet etching on glass. |
NEMS |
2010 |
DBLP DOI BibTeX RDF |
|
26 | Jun Tang, Shengping Mao, Hong Wang, Rui Liu, Guifu Ding |
Effect of additives on mechanical properties of electroplating nickel. |
NEMS |
2010 |
DBLP DOI BibTeX RDF |
|
26 | Yu Liu, Xiuhan Li, Dong-Ming Fang, Haixia Zhang 0002 |
RF MEMS filter based on one step of copper electroplating. |
NEMS |
2010 |
DBLP DOI BibTeX RDF |
|
26 | Abhishek Kumar, V. P. Agrawal |
Attribute based specification, comparison and selection of electroplating system using MADM approach. |
Expert Syst. Appl. |
2009 |
DBLP DOI BibTeX RDF |
|
26 | Bong-Hwan Kim, Jong-Bok Kim, Jong-Hyun Kim |
A Highly Manufacturable Large Area Array MEMS Probe Card Using Electroplating and Flipchip Bonding. |
IEEE Trans. Ind. Electron. |
2009 |
DBLP DOI BibTeX RDF |
|
26 | Yue Chen, Xiuhan Li, Dong-Ming Fang, Quan Yuan, Haixia Zhang 0002 |
Spiral capacitor based on copper electroplating. |
NEMS |
2009 |
DBLP DOI BibTeX RDF |
|
26 | Marie-Ange Manier, Sid Lamrous |
An Evolutionary Approach for the Design and Scheduling of Electroplating Facilities. |
J. Math. Model. Algorithms |
2008 |
DBLP DOI BibTeX RDF |
|
26 | Zhen-Zhun Shu, Ming-Li Ke, Guan-Wei Chen, Ray Hua Horng, Chao-Chih Chang, Jean-Yih Tsai, Chung-Ching Lai, Ji-Liang Chen |
Design And Fabrication of Condenser Microphone Using Wafer Transfer And Micro-electroplating Technique |
CoRR |
2008 |
DBLP BibTeX RDF |
|
26 | Jeong-Won Yoon, Hyun-Suk Chun, Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Hoo-Jeong Lee, Seung-Boo Jung |
Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method. |
Microelectron. Reliab. |
2008 |
DBLP DOI BibTeX RDF |
|
26 | Ada Che, Chengbin Chu |
Cyclic hoist scheduling in large real-life electroplating lines. |
OR Spectr. |
2007 |
DBLP DOI BibTeX RDF |
|
26 | Ming-Tzer Lin, Chi-Jia Tong, Chung-Hsun Chiang |
Design and Development of Novel Electroplating Spring Frame Mems Structure Specimens for the Microtensile Testing of Thin Film Materials |
CoRR |
2007 |
DBLP BibTeX RDF |
|
26 | Shyh-Biau Jiang, Dong Liang Lee, Tse-Liang Alan Yeh, Pei Fu Kao |
Micro-Anode Guided Electroplating (MAGE) Control System with Digital Imaging Enhancement. |
SMC |
2006 |
DBLP DOI BibTeX RDF |
|
26 | Felix T. S. Chan |
Application of a hybrid case-based reasoning approach in electroplating industry. |
Expert Syst. Appl. |
2005 |
DBLP DOI BibTeX RDF |
|
26 | Ada Che, Chengbin Chu |
A polynomial algorithm for no-wait cyclic hoist scheduling in an extended electroplating line. |
Oper. Res. Lett. |
2005 |
DBLP DOI BibTeX RDF |
|
26 | Sam Siau, Johan de Baets, André Van Calster, Leon Heremans, Sammy Tanghe |
Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards. |
Microelectron. Reliab. |
2005 |
DBLP DOI BibTeX RDF |
|
26 | Paulo S. Motta, Jack W. Judy |
Multielectrode microprobes for deep-brain stimulation fabricated with a customizable 3-D electroplating process. |
IEEE Trans. Biomed. Eng. |
2005 |
DBLP DOI BibTeX RDF |
|
26 | Jianfeng Luo, Qing Su, Charles C. Chiang, Jamil Kawa |
A layout dependent full-chip copper electroplating topography model. |
ICCAD |
2005 |
DBLP DOI BibTeX RDF |
|
26 | Ricky W. K. Leung, Henry C. W. Lau, C. K. Kwong 0001 |
An Intelligent System to Monitor the Chemical Concentration of Electroplating Process: An Integrated OLAP and Fuzzy Logic Approach. |
Artif. Intell. Rev. |
2004 |
DBLP DOI BibTeX RDF |
knowledge learning, machine learning, fuzzy logic, On-Line Analytical Processing (OLAP) |
26 | Xuechuan Shan, Ryutaro Maeda, Tsuyoshi Ikehara, Z. F. Wang, C. K. Wong |
A Polymer-Based Optical Switch Fabricated Using Silicon Process, Electroplating And Micro Hot Embossing. |
Int. J. Comput. Eng. Sci. |
2003 |
DBLP DOI BibTeX RDF |
|
26 | Mahfoud Mabed, Frédéric Bousseau, Marc Bourcerie |
Z/pZ Petri nets model with application to an electroplating line. |
SMC |
2001 |
DBLP DOI BibTeX RDF |
|
26 | Pavel Spacek, Marie-Ange Manier, Abdellah El Moudni |
Control of an electroplating line in the max and min algebras. |
Int. J. Syst. Sci. |
1999 |
DBLP DOI BibTeX RDF |
|
26 | Kristina Lapin |
Automatic Configuration of Structured Graphical Documents: A Case Study in the Domain of Electroplating Lines. |
Informatica |
1999 |
DBLP DOI BibTeX RDF |
|
26 | Simon Collart Dutilleul, Jean-Paul Denat |
Integration of the chemist expertise in electroplating line automation. |
ECC |
1999 |
DBLP DOI BibTeX RDF |
|
26 | Panayotis C. Andricacos, Cyprian Uzoh, John O. Dukovic, Jean Horkans, Hariklia Deligianni |
Damascene copper electroplating for chip interconnections. |
IBM J. Res. Dev. |
1998 |
DBLP DOI BibTeX RDF |
|
26 | Jean Horkans |
Polarographic methods of monitoring addition agents in the electroplating of Sn-Pb solders. |
IBM J. Res. Dev. |
1998 |
DBLP DOI BibTeX RDF |
|
26 | Ramakrishna Desiraju, Huaming Wang, Jerry L. Sanders |
Performance analysis of a new electroplating line configuration with a linear induction motor based material mover. |
IEEE Trans. Robotics Autom. |
1996 |
DBLP DOI BibTeX RDF |
|
26 | Jean Horkans, I-Chia Hsu Chang, Panayotis C. Andricacos |
A rotating ring-disk stripping technique used to study electroplating of Sn-Pb from methane sulfonic acid solutions. |
IBM J. Res. Dev. |
1993 |
DBLP DOI BibTeX RDF |
|
23 | Shinya Sakuma, Kazuhisa Onda, Yoko Yamanishi, Fumihito Arai |
On-chip detection and separation of micro-particles using magnetized microtools driven by focused magnetic field. |
ICRA |
2009 |
DBLP DOI BibTeX RDF |
|
23 | Daisaku Azuma, Jameson Lee, Keisuke Narumi, Fumihito Arai |
Fabrication and feedback control of an articulated microarm. |
ICRA |
2009 |
DBLP DOI BibTeX RDF |
|
23 | Yin Shen, Yici Cai, Qiang Zhou 0001, Xianlong Hong |
DFM Based Detailed Routing Algorithm for ECP and CMP. |
ISQED |
2008 |
DBLP DOI BibTeX RDF |
ECP, CMP, DFM, detailed routing |
23 | Markus Luetzelschwab, Dominik Weiland, Marc P. Y. Desmulliez |
Adaptive Packaging Solution for a Microlens Array Placed Over a Micro-UV-LED Array. |
IPAS |
2008 |
DBLP DOI BibTeX RDF |
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23 | Negin Manavizadeh, Rashid Safa Isini, Behzad Esfandyarpour, Ebrahim Asl Soleimani, Hassan Ghafoori Fard |
Low Cost Electroplated Ni/Cu Ohmic Contacts for Multicrystalline Si Solar Cells using an Ultrasonic System. |
CCECE |
2006 |
DBLP DOI BibTeX RDF |
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