Search results for "electroplating"

Hits ?▲	Authors	Title	Venue	Year	Link	Author keywords
60	Yanming Jia, Yici Cai, Xianlong Hong	Full-chip routing system for reducing Cu CMP & ECP variation.	SBCCI	2008	DBLP DOI BibTeX RDF	electroplating, routing, chemical mechanical polishing
49	Samir Ilias, Patrice Topart, Sébastien Leclair, Jean-Sébastien Côté, Loïc Le Noc, Francis Picard, Hubert Jerominek	Novel Electroplating-Based Technology for the Fabrication of Giant Micromirrors for Space and Terrestrial Applications.	ICMENS	2004	DBLP DOI BibTeX RDF
47	Jian-Bin Bao, D. Jed Harrison	Design and Fabrication of Microchannels for Magnetohydrodynamic Flow.	ICMENS	2003	DBLP DOI BibTeX RDF
26	Wenhao Yao, Hu He, Fuliang Wang	CTAB-Modulated Electroplating of Copper Micropillar Arrays for Non-Enzymatic Glucose Sensing with Improved Sensitivity.	Sensors	2024	DBLP DOI BibTeX RDF
26	Anila Puthoor, Megha Agrawal, Varshini K. M., Koushik K. Rao	Enhancement of Glass micromachining using selective copper electroplating.	ICST	2023	DBLP DOI BibTeX RDF
26	Jiahao Gong, Bingxin Liu, Pan Zhang, Huimin Zhang, Lin Gui 0004	Copper-Electroplating-Modified Liquid Metal Microfluidic Electrodes.	Sensors	2022	DBLP DOI BibTeX RDF
26	Min Pu	Design and Realization of Electroplating Current Intelligent Regulating Equipment for Printed Circuit Board.	AIAM	2022	DBLP DOI BibTeX RDF
26	Pengyu Yan, Hongru Miao, Ada Che, Kaize Yu	Nash-equilibrium algorithm and incentive protocol for a decentralized decision and scheduling problem in sustainable electroplating plants.	Comput. Oper. Res.	2021	DBLP DOI BibTeX RDF
26	Yongli Zhang, Guobao Zhang, Xin Chen	Computer Numerical Simulation of the Effect of Coagulant Type on Electroplating Wastewater under Mathematical Calculation.	AIAM (ACM)	2021	DBLP DOI BibTeX RDF
26	Douglas Alves Goulart, Renato Dutra Pereira	Autonomous pH control by reinforcement learning for electroplating industry wastewater.	Comput. Chem. Eng.	2020	DBLP DOI BibTeX RDF
26	Alexander Leiden, Sebastian Thiede, Christoph Herrmann 0001	Agent-Based Simulation Approach for Occupational Safety and Health Planning: A Case of Electroplating Facilities.	Simul. Notes Eur.	2020	DBLP DOI BibTeX RDF
26	Gerardo Emanuel Granados, Loïc Lacroix, Kamal Medjaher	Condition monitoring and prediction of solution quality during a copper electroplating process.	J. Intell. Manuf.	2020	DBLP DOI BibTeX RDF
26	Aliakbar Mohammadzadeh, Alison Fox-Robichaud, P. Ravi Selvaganapathy	Electroplating of Multiple Materials in Parallel Using Patterned Gels with Applications in Electrochemical Sensing.	Sensors	2020	DBLP DOI BibTeX RDF
26	Atsushi Sato, Wataru Natsu	Theoretical Verification of Film Forming in Local Electroplating Process with Electrolyte Suction Tool.	Int. J. Autom. Technol.	2020	DBLP DOI BibTeX RDF
26	Hao Wang, Zailin Guan, Chaoyong Zhang, Lei Yue, Dan Luo, Saif Ullah	The Printed-Circuit-Board Electroplating Parallel-Tank Scheduling With Hoist and Group Constraints Using a Hybrid Guided Tabu Search Algorithm.	IEEE Access	2019	DBLP DOI BibTeX RDF
26	Aliakbar Mohammadzadeh, Alison Fox-Robichaud, P. Ravi Selvaganapathy	Parallel Electroplating of Multiple Materials Using Patterned Gels for Electrochemical Sensing.	IEEE SENSORS	2019	DBLP DOI BibTeX RDF
26	Navya Venkateshaiah, Ahmad Zakeri, Oliver L. Iliev	Developing a self-organised Smart Tank Station for Electroplating Process Plant.	WF-IoT	2019	DBLP DOI BibTeX RDF
26	Anna Maria Bialostocka, Adam Idzkowski	The Effect of Ground Changes and the Setting of External Magnetic Field on Electroplating FeNi Layers.	AUTOMATION	2019	DBLP DOI BibTeX RDF
26	Xinyue Chang, Zhiyu Jin, Yun-Na Sun, Yan Wang, Zhuoqing Yang, Guifu Ding	An All-Metal Hollow Microstructure for Pool-Boiling Chip-Integrated Cooling Based on Electroplating.	NEMS	2018	DBLP DOI BibTeX RDF
26	Zhen Chen, Yang Peng, Hao Cheng, Zizhou Yang, Mingxiang Chen	Void-free and high-speed filling of through ceramic holes by copper electroplating.	Microelectron. Reliab.	2017	DBLP DOI BibTeX RDF
26	Li-Chun Wu, Teh-Hua Tsai, Man-Hai Liu, Jui-Ling Kuo, Yung-Chu Chang, Ying-Chien Chung	A Green Microbial Fuel Cell-Based Biosensor for In Situ Chromium (VI) Measurement in Electroplating Wastewater.	Sensors	2017	DBLP DOI BibTeX RDF
26	Florian Kurth, Joerg Froemel, Shuji Tanaka, Masayoshi Esashi, Thomas Gessner	Electroplating of neodymium iron alloys.	NEMS	2016	DBLP DOI BibTeX RDF
26	Mark Ashworth, Geoffrey D. Wilcox, Rebecca L. Higginson, Richard J. Heath, Chanqing Liu, Roger J. Mortimer	The effect of electroplating parameters and substrate material on tin whisker formation.	Microelectron. Reliab.	2015	DBLP DOI BibTeX RDF
26	Yihong He, Shuiyong Yu, Fangguo Li	Research on a New Power Supply for Electroplating.	UIC/ATC/ScalCom	2015	DBLP DOI BibTeX RDF
26	Ho-Chiao Chuang, Wei-Hong Lai, Chih-Chung Huang, Ai-Ho Liao, Chih-Kuang Yeh	Fabrication of through-silicon vias (TSV) by nickel electroplating in supercritical CO2.	NEMS	2014	DBLP DOI BibTeX RDF
26	Qinghua Zhao, Anmin Hu, Ming Li, Jiangyan Sun	Effect of electroplating layer structure on shear property and microstructure of multilayer electroplated Sn-3.5Ag solder bumps.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
26	Jeong Hun Kim, Inho Song, Seung Min Lee, Hoseok Choi, Hangjin Byeon, Inyoung Kim, Sang-Hoon Lee	An Electroplating-Free and Minimal Noise Polyimide Microelectrode for Recording Auditory Evoked Potentials From the Epicranius.	IEEE Trans. Biomed. Eng.	2013	DBLP DOI BibTeX RDF
26	Raeyoung Kim, Yoonkey Nam	Novel platinum black electroplating technique improving mechanical stability.	EMBC	2013	DBLP DOI BibTeX RDF
26	Yihong He, Shuiyong Yu	A New Method of Designing High-Power Electroplating Power Supply.	GreenCom/iThings/CPScom	2013	DBLP DOI BibTeX RDF
26	Chaowei Liu, Jie Fu, Qiang Xu 0003	Simultaneous mixed-integer dynamic optimization for environmentally benign electroplating.	Comput. Chem. Eng.	2011	DBLP DOI BibTeX RDF
26	Isabella Marr, Sebastian Reiß, Gunter Hagen, Ralf Moos	Planar Zeolite Film-Based Potentiometric Gas Sensors Manufactured by a Combined Thick-Film and Electroplating Technique.	Sensors	2011	DBLP DOI BibTeX RDF
26	Abhishek Kumar, Shibu Clement, V. P. Agrawal	Optimum selection and ranking of electroplating system process parameters: Taguchi-MADM approach.	Int. J. Appl. Decis. Sci.	2011	DBLP DOI BibTeX RDF
26	Xiaodan Miao, Xuhan Dai, Peihong Wang, Xiaopeng Zhang 0008, Xiao-Lin Zhao, Guifu Ding	A new electroplating mask for deep wet etching on glass.	NEMS	2010	DBLP DOI BibTeX RDF
26	Jun Tang, Shengping Mao, Hong Wang, Rui Liu, Guifu Ding	Effect of additives on mechanical properties of electroplating nickel.	NEMS	2010	DBLP DOI BibTeX RDF
26	Yu Liu, Xiuhan Li, Dong-Ming Fang, Haixia Zhang 0002	RF MEMS filter based on one step of copper electroplating.	NEMS	2010	DBLP DOI BibTeX RDF
26	Abhishek Kumar, V. P. Agrawal	Attribute based specification, comparison and selection of electroplating system using MADM approach.	Expert Syst. Appl.	2009	DBLP DOI BibTeX RDF
26	Bong-Hwan Kim, Jong-Bok Kim, Jong-Hyun Kim	A Highly Manufacturable Large Area Array MEMS Probe Card Using Electroplating and Flipchip Bonding.	IEEE Trans. Ind. Electron.	2009	DBLP DOI BibTeX RDF
26	Yue Chen, Xiuhan Li, Dong-Ming Fang, Quan Yuan, Haixia Zhang 0002	Spiral capacitor based on copper electroplating.	NEMS	2009	DBLP DOI BibTeX RDF
26	Marie-Ange Manier, Sid Lamrous	An Evolutionary Approach for the Design and Scheduling of Electroplating Facilities.	J. Math. Model. Algorithms	2008	DBLP DOI BibTeX RDF
26	Zhen-Zhun Shu, Ming-Li Ke, Guan-Wei Chen, Ray Hua Horng, Chao-Chih Chang, Jean-Yih Tsai, Chung-Ching Lai, Ji-Liang Chen	Design And Fabrication of Condenser Microphone Using Wafer Transfer And Micro-electroplating Technique	CoRR	2008	DBLP BibTeX RDF
26	Jeong-Won Yoon, Hyun-Suk Chun, Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Hoo-Jeong Lee, Seung-Boo Jung	Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method.	Microelectron. Reliab.	2008	DBLP DOI BibTeX RDF
26	Ada Che, Chengbin Chu	Cyclic hoist scheduling in large real-life electroplating lines.	OR Spectr.	2007	DBLP DOI BibTeX RDF
26	Ming-Tzer Lin, Chi-Jia Tong, Chung-Hsun Chiang	Design and Development of Novel Electroplating Spring Frame Mems Structure Specimens for the Microtensile Testing of Thin Film Materials	CoRR	2007	DBLP BibTeX RDF
26	Shyh-Biau Jiang, Dong Liang Lee, Tse-Liang Alan Yeh, Pei Fu Kao	Micro-Anode Guided Electroplating (MAGE) Control System with Digital Imaging Enhancement.	SMC	2006	DBLP DOI BibTeX RDF
26	Felix T. S. Chan	Application of a hybrid case-based reasoning approach in electroplating industry.	Expert Syst. Appl.	2005	DBLP DOI BibTeX RDF
26	Ada Che, Chengbin Chu	A polynomial algorithm for no-wait cyclic hoist scheduling in an extended electroplating line.	Oper. Res. Lett.	2005	DBLP DOI BibTeX RDF
26	Sam Siau, Johan de Baets, André Van Calster, Leon Heremans, Sammy Tanghe	Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards.	Microelectron. Reliab.	2005	DBLP DOI BibTeX RDF
26	Paulo S. Motta, Jack W. Judy	Multielectrode microprobes for deep-brain stimulation fabricated with a customizable 3-D electroplating process.	IEEE Trans. Biomed. Eng.	2005	DBLP DOI BibTeX RDF
26	Jianfeng Luo, Qing Su, Charles C. Chiang, Jamil Kawa	A layout dependent full-chip copper electroplating topography model.	ICCAD	2005	DBLP DOI BibTeX RDF
26	Ricky W. K. Leung, Henry C. W. Lau, C. K. Kwong 0001	An Intelligent System to Monitor the Chemical Concentration of Electroplating Process: An Integrated OLAP and Fuzzy Logic Approach.	Artif. Intell. Rev.	2004	DBLP DOI BibTeX RDF	knowledge learning, machine learning, fuzzy logic, On-Line Analytical Processing (OLAP)
26	Xuechuan Shan, Ryutaro Maeda, Tsuyoshi Ikehara, Z. F. Wang, C. K. Wong	A Polymer-Based Optical Switch Fabricated Using Silicon Process, Electroplating And Micro Hot Embossing.	Int. J. Comput. Eng. Sci.	2003	DBLP DOI BibTeX RDF
26	Mahfoud Mabed, Frédéric Bousseau, Marc Bourcerie	Z/pZ Petri nets model with application to an electroplating line.	SMC	2001	DBLP DOI BibTeX RDF
26	Pavel Spacek, Marie-Ange Manier, Abdellah El Moudni	Control of an electroplating line in the max and min algebras.	Int. J. Syst. Sci.	1999	DBLP DOI BibTeX RDF
26	Kristina Lapin	Automatic Configuration of Structured Graphical Documents: A Case Study in the Domain of Electroplating Lines.	Informatica	1999	DBLP DOI BibTeX RDF
26	Simon Collart Dutilleul, Jean-Paul Denat	Integration of the chemist expertise in electroplating line automation.	ECC	1999	DBLP DOI BibTeX RDF
26	Panayotis C. Andricacos, Cyprian Uzoh, John O. Dukovic, Jean Horkans, Hariklia Deligianni	Damascene copper electroplating for chip interconnections.	IBM J. Res. Dev.	1998	DBLP DOI BibTeX RDF
26	Jean Horkans	Polarographic methods of monitoring addition agents in the electroplating of Sn-Pb solders.	IBM J. Res. Dev.	1998	DBLP DOI BibTeX RDF
26	Ramakrishna Desiraju, Huaming Wang, Jerry L. Sanders	Performance analysis of a new electroplating line configuration with a linear induction motor based material mover.	IEEE Trans. Robotics Autom.	1996	DBLP DOI BibTeX RDF
26	Jean Horkans, I-Chia Hsu Chang, Panayotis C. Andricacos	A rotating ring-disk stripping technique used to study electroplating of Sn-Pb from methane sulfonic acid solutions.	IBM J. Res. Dev.	1993	DBLP DOI BibTeX RDF
23	Shinya Sakuma, Kazuhisa Onda, Yoko Yamanishi, Fumihito Arai	On-chip detection and separation of micro-particles using magnetized microtools driven by focused magnetic field.	ICRA	2009	DBLP DOI BibTeX RDF
23	Daisaku Azuma, Jameson Lee, Keisuke Narumi, Fumihito Arai	Fabrication and feedback control of an articulated microarm.	ICRA	2009	DBLP DOI BibTeX RDF
23	Yin Shen, Yici Cai, Qiang Zhou 0001, Xianlong Hong	DFM Based Detailed Routing Algorithm for ECP and CMP.	ISQED	2008	DBLP DOI BibTeX RDF	ECP, CMP, DFM, detailed routing
23	Markus Luetzelschwab, Dominik Weiland, Marc P. Y. Desmulliez	Adaptive Packaging Solution for a Microlens Array Placed Over a Micro-UV-LED Array.	IPAS	2008	DBLP DOI BibTeX RDF
23	Negin Manavizadeh, Rashid Safa Isini, Behzad Esfandyarpour, Ebrahim Asl Soleimani, Hassan Ghafoori Fard	Low Cost Electroplated Ni/Cu Ohmic Contacts for Multicrystalline Si Solar Cells using an Ultrasonic System.	CCECE	2006	DBLP DOI BibTeX RDF