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GrowBag graphs for keyword ? (Num. hits/coverage)
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Results
Found 64 publication records. Showing 64 according to the selection in the facets
Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
60 | Yanming Jia, Yici Cai, Xianlong Hong |
Full-chip routing system for reducing Cu CMP & ECP variation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SBCCI ![In: Proceedings of the 21st Annual Symposium on Integrated Circuits and Systems Design, SBCCI 2008, Gramado, Brazil, September 1-4, 2008, pp. 10-15, 2008, ACM, 978-1-60558-231-3. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
electroplating, routing, chemical mechanical polishing |
49 | Samir Ilias, Patrice Topart, Sébastien Leclair, Jean-Sébastien Côté, Loïc Le Noc, Francis Picard, Hubert Jerominek |
Novel Electroplating-Based Technology for the Fabrication of Giant Micromirrors for Space and Terrestrial Applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICMENS ![In: 2004 International Conference on MEMS, NANO, and Smart Systems (ICMENS 2004), 25-27 August 2004, Banff, Alberta, Canada, pp. 257-261, 2004, IEEE Computer Society, 0-7695-2189-4. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
|
47 | Jian-Bin Bao, D. Jed Harrison |
Design and Fabrication of Microchannels for Magnetohydrodynamic Flow. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICMENS ![In: 2003 International Conference on MEMS, NANO, and Smart Systems (ICMENS 2003), 20-23 July 2003, Banff, Alberta, Canada, pp. 396-399, 2003, IEEE Computer Society, 0-7695-1947-4. The full citation details ...](Pics/full.jpeg) |
2003 |
DBLP DOI BibTeX RDF |
|
26 | Wenhao Yao, Hu He, Fuliang Wang |
CTAB-Modulated Electroplating of Copper Micropillar Arrays for Non-Enzymatic Glucose Sensing with Improved Sensitivity. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 24(5), pp. 1603, March 2024. The full citation details ...](Pics/full.jpeg) |
2024 |
DBLP DOI BibTeX RDF |
|
26 | Anila Puthoor, Megha Agrawal, Varshini K. M., Koushik K. Rao |
Enhancement of Glass micromachining using selective copper electroplating. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICST ![In: 16th International Conference on Sensing Technology, ICST 2023, Hyderabad, India, December 17-20, 2023, pp. 1-5, 2023, IEEE, 979-8-3503-9534-1. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
26 | Jiahao Gong, Bingxin Liu, Pan Zhang, Huimin Zhang, Lin Gui 0004 |
Copper-Electroplating-Modified Liquid Metal Microfluidic Electrodes. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 22(5), pp. 1820, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
26 | Min Pu |
Design and Realization of Electroplating Current Intelligent Regulating Equipment for Printed Circuit Board. ![Search on Bibsonomy](Pics/bibsonomy.png) |
AIAM ![In: 4th International Conference on Artificial Intelligence and Advanced Manufacturing, AIAM 2022, Hamburg, Germany, October 7-9, 2022, pp. 599-602, 2022, IEEE, 978-1-6654-6399-7. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
26 | Pengyu Yan, Hongru Miao, Ada Che, Kaize Yu |
Nash-equilibrium algorithm and incentive protocol for a decentralized decision and scheduling problem in sustainable electroplating plants. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Comput. Oper. Res. ![In: Comput. Oper. Res. 128, pp. 105130, 2021. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
26 | Yongli Zhang, Guobao Zhang, Xin Chen |
Computer Numerical Simulation of the Effect of Coagulant Type on Electroplating Wastewater under Mathematical Calculation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
AIAM (ACM) ![In: AIAM 2021: 3rd International Conference on Artificial Intelligence and Advanced Manufacture, Manchester, United Kingdom, October 23 - 25, 2021, pp. 2127-2132, 2021, ACM, 978-1-4503-8504-6. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
26 | Douglas Alves Goulart, Renato Dutra Pereira |
Autonomous pH control by reinforcement learning for electroplating industry wastewater. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Comput. Chem. Eng. ![In: Comput. Chem. Eng. 140, pp. 106909, 2020. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
26 | Alexander Leiden, Sebastian Thiede, Christoph Herrmann 0001 |
Agent-Based Simulation Approach for Occupational Safety and Health Planning: A Case of Electroplating Facilities. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Simul. Notes Eur. ![In: Simul. Notes Eur. 30(4), pp. 175-182, 2020. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
26 | Gerardo Emanuel Granados, Loïc Lacroix, Kamal Medjaher |
Condition monitoring and prediction of solution quality during a copper electroplating process. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Intell. Manuf. ![In: J. Intell. Manuf. 31(2), pp. 285-300, 2020. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
26 | Aliakbar Mohammadzadeh, Alison Fox-Robichaud, P. Ravi Selvaganapathy |
Electroplating of Multiple Materials in Parallel Using Patterned Gels with Applications in Electrochemical Sensing. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 20(3), pp. 886, 2020. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
26 | Atsushi Sato, Wataru Natsu |
Theoretical Verification of Film Forming in Local Electroplating Process with Electrolyte Suction Tool. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Int. J. Autom. Technol. ![In: Int. J. Autom. Technol. 14(6), pp. 1051-1061, 2020. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
26 | Hao Wang, Zailin Guan, Chaoyong Zhang, Lei Yue, Dan Luo, Saif Ullah |
The Printed-Circuit-Board Electroplating Parallel-Tank Scheduling With Hoist and Group Constraints Using a Hybrid Guided Tabu Search Algorithm. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Access ![In: IEEE Access 7, pp. 61363-61377, 2019. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP DOI BibTeX RDF |
|
26 | Aliakbar Mohammadzadeh, Alison Fox-Robichaud, P. Ravi Selvaganapathy |
Parallel Electroplating of Multiple Materials Using Patterned Gels for Electrochemical Sensing. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE SENSORS ![In: 2019 IEEE SENSORS, Montreal, QC, Canada, October 27-30, 2019, pp. 1-4, 2019, IEEE, 978-1-7281-1634-1. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP DOI BibTeX RDF |
|
26 | Navya Venkateshaiah, Ahmad Zakeri, Oliver L. Iliev |
Developing a self-organised Smart Tank Station for Electroplating Process Plant. ![Search on Bibsonomy](Pics/bibsonomy.png) |
WF-IoT ![In: 5th IEEE World Forum on Internet of Things, WF-IoT 2019, Limerick, Ireland, April 15-18, 2019, pp. 680-685, 2019, IEEE, 978-1-5386-4980-0. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP DOI BibTeX RDF |
|
26 | Anna Maria Bialostocka, Adam Idzkowski |
The Effect of Ground Changes and the Setting of External Magnetic Field on Electroplating FeNi Layers. ![Search on Bibsonomy](Pics/bibsonomy.png) |
AUTOMATION ![In: Automation 2019 - Progress in Automation, Robotics and Measurement Techniques, outcomes of the international conference AUTOMATION 2019, 27-29 March, 2019, Warsaw, Poland, pp. 684-696, 2019, Springer, 978-3-030-13272-9. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP DOI BibTeX RDF |
|
26 | Xinyue Chang, Zhiyu Jin, Yun-Na Sun, Yan Wang, Zhuoqing Yang, Guifu Ding |
An All-Metal Hollow Microstructure for Pool-Boiling Chip-Integrated Cooling Based on Electroplating. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NEMS ![In: 13th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2018, Singapore, Singapore, April 22-26, 2018, pp. 32-35, 2018, IEEE, 978-1-5386-5273-2. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
26 | Zhen Chen, Yang Peng, Hao Cheng, Zizhou Yang, Mingxiang Chen |
Void-free and high-speed filling of through ceramic holes by copper electroplating. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 75, pp. 171-177, 2017. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
26 | Li-Chun Wu, Teh-Hua Tsai, Man-Hai Liu, Jui-Ling Kuo, Yung-Chu Chang, Ying-Chien Chung |
A Green Microbial Fuel Cell-Based Biosensor for In Situ Chromium (VI) Measurement in Electroplating Wastewater. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 17(11), pp. 2461, 2017. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
26 | Florian Kurth, Joerg Froemel, Shuji Tanaka, Masayoshi Esashi, Thomas Gessner |
Electroplating of neodymium iron alloys. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NEMS ![In: 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016, Sendai, Japan, April 17-20, 2016, pp. 405-408, 2016, IEEE, 978-1-5090-1947-2. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
26 | Mark Ashworth, Geoffrey D. Wilcox, Rebecca L. Higginson, Richard J. Heath, Chanqing Liu, Roger J. Mortimer |
The effect of electroplating parameters and substrate material on tin whisker formation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 55(1), pp. 180-191, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
26 | Yihong He, Shuiyong Yu, Fangguo Li |
Research on a New Power Supply for Electroplating. ![Search on Bibsonomy](Pics/bibsonomy.png) |
UIC/ATC/ScalCom ![In: 2015 IEEE 12th Intl Conf on Ubiquitous Intelligence and Computing and 2015 IEEE 12th Intl Conf on Autonomic and Trusted Computing and 2015 IEEE 15th Intl Conf on Scalable Computing and Communications and Its Associated Workshops (UIC-ATC-ScalCom), Beijing, China, August 10-14, 2015, pp. 1548-1550, 2015, IEEE Computer Society, 978-1-4673-7211-4. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
26 | Ho-Chiao Chuang, Wei-Hong Lai, Chih-Chung Huang, Ai-Ho Liao, Chih-Kuang Yeh |
Fabrication of through-silicon vias (TSV) by nickel electroplating in supercritical CO2. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NEMS ![In: 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2014, Waikiki Beach, HI, USA, April 13-16, 2014, pp. 108-112, 2014, IEEE, 978-1-4799-4726-3. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
26 | Qinghua Zhao, Anmin Hu, Ming Li, Jiangyan Sun |
Effect of electroplating layer structure on shear property and microstructure of multilayer electroplated Sn-3.5Ag solder bumps. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 53(2), pp. 321-326, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
26 | Jeong Hun Kim, Inho Song, Seung Min Lee, Hoseok Choi, Hangjin Byeon, Inyoung Kim, Sang-Hoon Lee |
An Electroplating-Free and Minimal Noise Polyimide Microelectrode for Recording Auditory Evoked Potentials From the Epicranius. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Biomed. Eng. ![In: IEEE Trans. Biomed. Eng. 60(12), pp. 3425-3431, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
26 | Raeyoung Kim, Yoonkey Nam |
Novel platinum black electroplating technique improving mechanical stability. ![Search on Bibsonomy](Pics/bibsonomy.png) |
EMBC ![In: 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2013, Osaka, Japan, July 3-7, 2013, pp. 184-187, 2013, IEEE. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
26 | Yihong He, Shuiyong Yu |
A New Method of Designing High-Power Electroplating Power Supply. ![Search on Bibsonomy](Pics/bibsonomy.png) |
GreenCom/iThings/CPScom ![In: 2013 IEEE International Conference on Green Computing and Communications (GreenCom) and IEEE Internet of Things (iThings) and IEEE Cyber, Physical and Social Computing (CPSCom), Beijing, China, August 20-23, 2013, pp. 1429-1433, 2013, IEEE, 978-0-7695-5046-6. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
26 | Chaowei Liu, Jie Fu, Qiang Xu 0003 |
Simultaneous mixed-integer dynamic optimization for environmentally benign electroplating. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Comput. Chem. Eng. ![In: Comput. Chem. Eng. 35(11), pp. 2411-2425, 2011. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
26 | Isabella Marr, Sebastian Reiß, Gunter Hagen, Ralf Moos |
Planar Zeolite Film-Based Potentiometric Gas Sensors Manufactured by a Combined Thick-Film and Electroplating Technique. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Sensors ![In: Sensors 11(8), pp. 7736-7748, 2011. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
26 | Abhishek Kumar, Shibu Clement, V. P. Agrawal |
Optimum selection and ranking of electroplating system process parameters: Taguchi-MADM approach. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Int. J. Appl. Decis. Sci. ![In: Int. J. Appl. Decis. Sci. 4(4), pp. 341-361, 2011. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
26 | Xiaodan Miao, Xuhan Dai, Peihong Wang, Xiaopeng Zhang 0008, Xiao-Lin Zhao, Guifu Ding |
A new electroplating mask for deep wet etching on glass. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NEMS ![In: 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010, Xiamen, China, January 20-23, 2010, pp. 454-457, 2010, IEEE, 978-1-4244-6543-9. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
26 | Jun Tang, Shengping Mao, Hong Wang, Rui Liu, Guifu Ding |
Effect of additives on mechanical properties of electroplating nickel. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NEMS ![In: 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010, Xiamen, China, January 20-23, 2010, pp. 450-453, 2010, IEEE, 978-1-4244-6543-9. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
26 | Yu Liu, Xiuhan Li, Dong-Ming Fang, Haixia Zhang 0002 |
RF MEMS filter based on one step of copper electroplating. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NEMS ![In: 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010, Xiamen, China, January 20-23, 2010, pp. 945-949, 2010, IEEE, 978-1-4244-6543-9. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
26 | Abhishek Kumar, V. P. Agrawal |
Attribute based specification, comparison and selection of electroplating system using MADM approach. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Expert Syst. Appl. ![In: Expert Syst. Appl. 36(8), pp. 10815-10827, 2009. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
|
26 | Bong-Hwan Kim, Jong-Bok Kim, Jong-Hyun Kim |
A Highly Manufacturable Large Area Array MEMS Probe Card Using Electroplating and Flipchip Bonding. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Ind. Electron. ![In: IEEE Trans. Ind. Electron. 56(4), pp. 1079-1085, 2009. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
|
26 | Yue Chen, Xiuhan Li, Dong-Ming Fang, Quan Yuan, Haixia Zhang 0002 |
Spiral capacitor based on copper electroplating. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NEMS ![In: 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2009, Shenzhen, China, January 5-8, 2009, pp. 432-435, 2009, IEEE Computer Society, 978-1-4244-4629-2. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
|
26 | Marie-Ange Manier, Sid Lamrous |
An Evolutionary Approach for the Design and Scheduling of Electroplating Facilities. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Math. Model. Algorithms ![In: J. Math. Model. Algorithms 7(2), pp. 197-215, 2008. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
|
26 | Zhen-Zhun Shu, Ming-Li Ke, Guan-Wei Chen, Ray Hua Horng, Chao-Chih Chang, Jean-Yih Tsai, Chung-Ching Lai, Ji-Liang Chen |
Design And Fabrication of Condenser Microphone Using Wafer Transfer And Micro-electroplating Technique ![Search on Bibsonomy](Pics/bibsonomy.png) |
CoRR ![In: CoRR abs/0805.0856, 2008. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP BibTeX RDF |
|
26 | Jeong-Won Yoon, Hyun-Suk Chun, Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Hoo-Jeong Lee, Seung-Boo Jung |
Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 48(11-12), pp. 1857-1863, 2008. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
|
26 | Ada Che, Chengbin Chu |
Cyclic hoist scheduling in large real-life electroplating lines. ![Search on Bibsonomy](Pics/bibsonomy.png) |
OR Spectr. ![In: OR Spectr. 29(3), pp. 445-470, 2007. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
26 | Ming-Tzer Lin, Chi-Jia Tong, Chung-Hsun Chiang |
Design and Development of Novel Electroplating Spring Frame Mems Structure Specimens for the Microtensile Testing of Thin Film Materials ![Search on Bibsonomy](Pics/bibsonomy.png) |
CoRR ![In: CoRR abs/0711.3300, 2007. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP BibTeX RDF |
|
26 | Shyh-Biau Jiang, Dong Liang Lee, Tse-Liang Alan Yeh, Pei Fu Kao |
Micro-Anode Guided Electroplating (MAGE) Control System with Digital Imaging Enhancement. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SMC ![In: Proceedings of the IEEE International Conference on Systems, Man and Cybernetics, Taipei, Taiwan, October 8-11, 2006, pp. 3233-3236, 2006, IEEE, 1-4244-0099-6. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
26 | Felix T. S. Chan |
Application of a hybrid case-based reasoning approach in electroplating industry. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Expert Syst. Appl. ![In: Expert Syst. Appl. 29(1), pp. 121-130, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
|
26 | Ada Che, Chengbin Chu |
A polynomial algorithm for no-wait cyclic hoist scheduling in an extended electroplating line. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Oper. Res. Lett. ![In: Oper. Res. Lett. 33(3), pp. 274-284, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
|
26 | Sam Siau, Johan de Baets, André Van Calster, Leon Heremans, Sammy Tanghe |
Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 45(3-4), pp. 675-687, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
|
26 | Paulo S. Motta, Jack W. Judy |
Multielectrode microprobes for deep-brain stimulation fabricated with a customizable 3-D electroplating process. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Biomed. Eng. ![In: IEEE Trans. Biomed. Eng. 52(5), pp. 923-933, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
|
26 | Jianfeng Luo, Qing Su, Charles C. Chiang, Jamil Kawa |
A layout dependent full-chip copper electroplating topography model. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCAD ![In: 2005 International Conference on Computer-Aided Design, ICCAD 2005, San Jose, CA, USA, November 6-10, 2005, pp. 133-140, 2005, IEEE Computer Society, 0-7803-9254-X. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
|
26 | Ricky W. K. Leung, Henry C. W. Lau, C. K. Kwong 0001 |
An Intelligent System to Monitor the Chemical Concentration of Electroplating Process: An Integrated OLAP and Fuzzy Logic Approach. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Artif. Intell. Rev. ![In: Artif. Intell. Rev. 21(2), pp. 139-159, 2004. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
knowledge learning, machine learning, fuzzy logic, On-Line Analytical Processing (OLAP) |
26 | Xuechuan Shan, Ryutaro Maeda, Tsuyoshi Ikehara, Z. F. Wang, C. K. Wong |
A Polymer-Based Optical Switch Fabricated Using Silicon Process, Electroplating And Micro Hot Embossing. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Int. J. Comput. Eng. Sci. ![In: Int. J. Comput. Eng. Sci. 4(3), pp. 724-728, 2003. The full citation details ...](Pics/full.jpeg) |
2003 |
DBLP DOI BibTeX RDF |
|
26 | Mahfoud Mabed, Frédéric Bousseau, Marc Bourcerie |
Z/pZ Petri nets model with application to an electroplating line. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SMC ![In: Proceedings of the IEEE International Conference on Systems, Man & Cybernetics: `e-Systems and e-Man for Cybernetics in Cyberspace`, Tucson, Arizona, USA, 7-10 October 2001, pp. 1583-1588, 2001, IEEE, 0-7803-7087-2. The full citation details ...](Pics/full.jpeg) |
2001 |
DBLP DOI BibTeX RDF |
|
26 | Pavel Spacek, Marie-Ange Manier, Abdellah El Moudni |
Control of an electroplating line in the max and min algebras. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Int. J. Syst. Sci. ![In: Int. J. Syst. Sci. 30(7), pp. 759-778, 1999. The full citation details ...](Pics/full.jpeg) |
1999 |
DBLP DOI BibTeX RDF |
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26 | Kristina Lapin |
Automatic Configuration of Structured Graphical Documents: A Case Study in the Domain of Electroplating Lines. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Informatica ![In: Informatica 10(1), pp. 89-108, 1999. The full citation details ...](Pics/full.jpeg) |
1999 |
DBLP DOI BibTeX RDF |
|
26 | Simon Collart Dutilleul, Jean-Paul Denat |
Integration of the chemist expertise in electroplating line automation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ECC ![In: 5th European Control Conference, ECC 1999, Karlsruhe, Germany, August 31 - September 3, 1999, pp. 1836-1841, 1999, IEEE, 978-3-9524173-5-5. The full citation details ...](Pics/full.jpeg) |
1999 |
DBLP DOI BibTeX RDF |
|
26 | Panayotis C. Andricacos, Cyprian Uzoh, John O. Dukovic, Jean Horkans, Hariklia Deligianni |
Damascene copper electroplating for chip interconnections. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IBM J. Res. Dev. ![In: IBM J. Res. Dev. 42(5), pp. 567-574, 1998. The full citation details ...](Pics/full.jpeg) |
1998 |
DBLP DOI BibTeX RDF |
|
26 | Jean Horkans |
Polarographic methods of monitoring addition agents in the electroplating of Sn-Pb solders. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IBM J. Res. Dev. ![In: IBM J. Res. Dev. 42(5), pp. 621-628, 1998. The full citation details ...](Pics/full.jpeg) |
1998 |
DBLP DOI BibTeX RDF |
|
26 | Ramakrishna Desiraju, Huaming Wang, Jerry L. Sanders |
Performance analysis of a new electroplating line configuration with a linear induction motor based material mover. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Robotics Autom. ![In: IEEE Trans. Robotics Autom. 12(4), pp. 590-595, 1996. The full citation details ...](Pics/full.jpeg) |
1996 |
DBLP DOI BibTeX RDF |
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26 | Jean Horkans, I-Chia Hsu Chang, Panayotis C. Andricacos |
A rotating ring-disk stripping technique used to study electroplating of Sn-Pb from methane sulfonic acid solutions. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IBM J. Res. Dev. ![In: IBM J. Res. Dev. 37(2), pp. 97-106, 1993. The full citation details ...](Pics/full.jpeg) |
1993 |
DBLP DOI BibTeX RDF |
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23 | Shinya Sakuma, Kazuhisa Onda, Yoko Yamanishi, Fumihito Arai |
On-chip detection and separation of micro-particles using magnetized microtools driven by focused magnetic field. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICRA ![In: 2009 IEEE International Conference on Robotics and Automation, ICRA 2009, Kobe, Japan, May 12-17, 2009, pp. 1820-1825, 2009, IEEE. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
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23 | Daisaku Azuma, Jameson Lee, Keisuke Narumi, Fumihito Arai |
Fabrication and feedback control of an articulated microarm. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICRA ![In: 2009 IEEE International Conference on Robotics and Automation, ICRA 2009, Kobe, Japan, May 12-17, 2009, pp. 3073-3078, 2009, IEEE. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
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23 | Yin Shen, Yici Cai, Qiang Zhou 0001, Xianlong Hong |
DFM Based Detailed Routing Algorithm for ECP and CMP. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISQED ![In: 9th International Symposium on Quality of Electronic Design (ISQED 2008), 17-19 March 2008, San Jose, CA, USA, pp. 357-360, 2008, IEEE Computer Society, 978-0-7695-3117-5. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
ECP, CMP, DFM, detailed routing |
23 | Markus Luetzelschwab, Dominik Weiland, Marc P. Y. Desmulliez |
Adaptive Packaging Solution for a Microlens Array Placed Over a Micro-UV-LED Array. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IPAS ![In: Micro-Assembly Technologies and Applications, IFIP TC5 WG5.5 Fourth International Precision Assembly Seminar (IPAS'2008), Chamonix, France, February 10-13, 2008, pp. 129-138, 2008, Springer, 978-0-387-77402-2. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
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23 | Negin Manavizadeh, Rashid Safa Isini, Behzad Esfandyarpour, Ebrahim Asl Soleimani, Hassan Ghafoori Fard |
Low Cost Electroplated Ni/Cu Ohmic Contacts for Multicrystalline Si Solar Cells using an Ultrasonic System. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CCECE ![In: Proceedings of the Canadian Conference on Electrical and Computer Engineering, CCECE 2006, May 7-10, 2006, Ottawa Congress Centre, Ottawa, Canada, pp. 1621-1624, 2006, IEEE, 1-4244-0038-4. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
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