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Venues (Conferences, Journals, ...)
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GrowBag graphs for keyword ? (Num. hits/coverage)
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The graphs summarize 31 occurrences of 27 keywords
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Results
Found 46 publication records. Showing 46 according to the selection in the facets
Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
99 | Erik Beckert, Thomas Burkhardt, Ramona Eberhardt, Andreas Tünnermann |
Solder Bumping - A Flexible Joining Approach for the Precision Assembly of Optoelectronical Systems. |
IPAS |
2008 |
DBLP DOI BibTeX RDF |
laser beam soldering, optics, microassembly, jetting, bumping |
90 | Pragnesh Jay Modi, Manuela M. Veloso |
Bumping strategies for the multiagent agreement problem. |
AAMAS |
2005 |
DBLP DOI BibTeX RDF |
distributed constraint optimization |
71 | Noam Tractinsky, David Shinar |
Chi'08 alt.chi / do we bump into things more while speaking on a cell phone? |
CHI Extended Abstracts |
2008 |
DBLP DOI BibTeX RDF |
speaking, safety, cell phones, automaticity, walking, visual field, dual task, bumping |
69 | Hui Gao, James W. Davis |
Sampling Representative Examples for Dimensionality Reduction and Recognition - Bootstrap Bumping LDA. |
ECCV (3) |
2006 |
DBLP DOI BibTeX RDF |
|
50 | Hasan Arslan, Shantanu Dutt |
An effective hop-based detailed router for FPGAs for optimizing track usage and circuit performance. |
ACM Great Lakes Symposium on VLSI |
2004 |
DBLP DOI BibTeX RDF |
bump and refit paradigm, bumping cost, hop-based routing, switchbox, FPGAs, detailed routing, MST |
41 | Alexander Kolker |
Process Modeling of ICU Patient Flow: Effect of Daily Load Leveling of Elective Surgeries on ICU Diversion. |
J. Medical Syst. |
2009 |
DBLP DOI BibTeX RDF |
Elective surgery, Daily load leveling, Schedule smoothing, ICU diversion, Patient flow simulation, What-if scenarios |
29 | Shantanu Dutt, Vinay Verma, Hasan Arslan |
A search-based bump-and-refit approach to incremental routing for ECO applications in FPGAs. |
ACM Trans. Design Autom. Electr. Syst. |
2002 |
DBLP DOI BibTeX RDF |
Bump-and-refit (B&R) paradigm, ECO (engineering change order), bumping cost, incremental routing, switchbox, field programmable gate arrays, dynamic programming, global routing, detailed routing |
28 | Qiayuan Liao, Zhefeng Cao, Hua Chen 0007, Wei Zhang 0013 |
Real-time Trajectory Optimization and Control for Ball Bumping with Quadruped Robots. |
CoRR |
2022 |
DBLP DOI BibTeX RDF |
|
28 | Alexander Raistrick, Nilesh Kulkarni, David F. Fouhey |
Collision Replay: What Does Bumping Into Things Tell You About Scene Geometry? |
CoRR |
2021 |
DBLP BibTeX RDF |
|
28 | Jinwoo Kim, Lingjun Zhu, Hakki Mert Torun, Madhavan Swaminathan, Sung Kyu Lim |
Micro-bumping, Hybrid Bonding, or Monolithic? A PPA Study for Heterogeneous 3D IC Options. |
DAC |
2021 |
DBLP DOI BibTeX RDF |
|
28 | Alexander Raistrick, Nilesh Kulkarni, David Fouhey |
Collision Replay: What Does Bumping Into Things Tell You About Scene Geometry? |
BMVC |
2021 |
DBLP BibTeX RDF |
|
28 | Arvind Ayyer, Jérémie Bouttier, Sylvie Corteel, Svante Linusson, François Nunzi |
Bumping sequences and multispecies juggling. |
Adv. Appl. Math. |
2018 |
DBLP DOI BibTeX RDF |
|
28 | Sima Jamali, David Mitchell |
Improving SAT Solver Performance with Structure-based Preferential Bumping. |
GCAI |
2017 |
DBLP DOI BibTeX RDF |
|
28 | Dan Romik, Piotr Sniady |
Limit shapes of bumping routes in the Robinson-Schensted correspondence. |
Random Struct. Algorithms |
2016 |
DBLP DOI BibTeX RDF |
|
28 | Sébastien Gallois-Garreignot, Naceur Benzima, Etienne Benmussa, Caroline Moutin, Pierre-Olivier Bouchard, Vincent Fiori, Clément Tavernier |
Qualification of bumping processes: Experimental and numerical investigations on mechanical stress and failure modes induced by shear test. |
Microelectron. Reliab. |
2015 |
DBLP DOI BibTeX RDF |
|
28 | Guang Tan, Mingming Lu, Fangsheng Jiang, Kongyang Chen, Xiaoxia Huang, Jie Wu 0001 |
Bumping: A Bump-Aided Inertial Navigation Method for Indoor Vehicles Using Smartphones. |
IEEE Trans. Parallel Distributed Syst. |
2014 |
DBLP DOI BibTeX RDF |
|
28 | Vincent Fiori, Komi-Atchou Ewuame, Sébastien Gallois-Garreignot, Hervé Jaouen, Clément Tavernier |
Numerical analysis of thermo-mechanical and mobility effects for 28 nm node and beyond: Comparison and design consequences over bumping technologies. |
Microelectron. Reliab. |
2014 |
DBLP DOI BibTeX RDF |
|
28 | Vincent Fiori, Sébastien Gallois-Garreignot, Hervé Jaouen, Clément Tavernier |
Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32 nm and beyond. |
Microelectron. Reliab. |
2013 |
DBLP DOI BibTeX RDF |
|
28 | Murat Sariyar, Andreas Borg |
Bagging, bumping, multiview, and active learning for record linkage with empirical results on patient identity data. |
Comput. Methods Programs Biomed. |
2012 |
DBLP DOI BibTeX RDF |
|
28 | Gregory Dobson, Hsiao-Hui Lee, Edieal J. Pinker |
A Model of ICU Bumping. |
Oper. Res. |
2010 |
DBLP DOI BibTeX RDF |
|
28 | Taho Yang, Yuan-Ting Cheng |
The use of Mahalanobis-Taguchi System to improve flip-chip bumping height inspection efficiency. |
Microelectron. Reliab. |
2010 |
DBLP DOI BibTeX RDF |
|
28 | Sergei Skorobogatov |
Flash Memory 'Bumping' Attacks. |
CHES |
2010 |
DBLP DOI BibTeX RDF |
|
28 | Eiji Higurashi, Daisuke Chino, Tadatomo Suga |
Residue-Free Solder Bumping Using Small AuSn Particles by Hydrogen Radicals. |
IEICE Trans. Electron. |
2009 |
DBLP DOI BibTeX RDF |
|
28 | Yann Civale, Deniz Sabuncuoglu Tezcan, Harold G. G. Philipsen, P. Jaenen, Rahul Agarwal, F. Duval, Philippe Soussan, Youssef Travaly, Eric Beyne |
Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping. |
3DIC |
2009 |
DBLP DOI BibTeX RDF |
|
28 | Chen-Fu Chien 0001, Chih-Han Hu, Chi-Yung Lin |
Analysing inspection frequency for wafer bumping process and an empirical study of UNISON decision framework. |
Int. J. Manuf. Technol. Manag. |
2008 |
DBLP DOI BibTeX RDF |
|
28 | Chih-Hung Li, Wen-Hsiao Peng, Tihao Chiang |
Design of Memory Sub-System with Constant-Rate Bumping Process for H.264/AVC Decoder. |
IEEE Trans. Consumer Electron. |
2007 |
DBLP DOI BibTeX RDF |
|
28 | Chen-Fu Chien 0001, Huan-Chung Li, Angus Jeang |
Data mining for improving the solder bumping process in the semiconductor packaging industry. |
Intell. Syst. Account. Finance Manag. |
2006 |
DBLP DOI BibTeX RDF |
|
28 | Jinseog Kim, Yongdai Kim |
Maximum a posteriori pruning on decision trees and its application to bootstrap BUMPing. |
Comput. Stat. Data Anal. |
2006 |
DBLP DOI BibTeX RDF |
|
28 | Kuo-Ming Chen, J. D. Wu, Kuo-Ning Chiang |
Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration. |
Microelectron. Reliab. |
2006 |
DBLP DOI BibTeX RDF |
|
28 | Peter A. Gruber, Luc Bélanger, Guy P. Brouillette, David H. Danovitch, Jean-Luc Landreville, David T. Naugle, Valerie A. Oberson, Da-Yuan Shih, Chris L. Tessler, Michel R. Turgeon |
Low-cost wafer bumping. |
IBM J. Res. Dev. |
2005 |
DBLP DOI BibTeX RDF |
|
28 | Pragnesh Jay Modi, Manuela M. Veloso |
Bumping Strategies for the Private Incremental Multiagent Agreement Problem. |
AAAI Spring Symposium: Persistent Assistants: Living and Working with AI |
2005 |
DBLP BibTeX RDF |
|
28 | Dionysios Manessis, Rainer Patzelt, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl |
Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping. |
Microelectron. Reliab. |
2004 |
DBLP DOI BibTeX RDF |
|
28 | Andrew J. G. Strandjord, Scott Popelar, Christine Jauernig |
Interconnecting to aluminum- and copper-based semiconductors (electroless-nickel/gold for solder bumping and wire bonding). |
Microelectron. Reliab. |
2002 |
DBLP DOI BibTeX RDF |
|
28 | Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard |
Stacked solder bumping technology for improved solder joint reliability. |
Microelectron. Reliab. |
2001 |
DBLP DOI BibTeX RDF |
|
28 | Tom Heskes |
Balancing Between Bagging and Bumping. |
NIPS |
1996 |
DBLP BibTeX RDF |
|
28 | Kazuyuki Nagata, Tsukasa Ogasawara, Toru Omata |
Optimum Velocity Vector of Articulated Robot for Soft Bumping. |
J. Robotics Mechatronics |
1992 |
DBLP DOI BibTeX RDF |
|
21 | Xianghong Sun, Weina Qu, Thomas Plocher, Li Wang |
A Study of Fire Information Detection on PDA Device. |
HCI (3) |
2009 |
DBLP DOI BibTeX RDF |
Information detection, PDA, fire |
21 | Shuanghui Hao, Weifeng Zheng, Minghui Hao, Jie Liu, Hong Li |
Simulation and Development Environment for Digital Controlled PMSM Servo System. |
ICIRA (2) |
2008 |
DBLP DOI BibTeX RDF |
PMSM servo system, closed-loop simulation, Reverse Polish Notation, Runge-Kutta |
21 | Frank Hoeller, Dirk Schulz 0001, Mark Moors, Frank E. Schneider |
Accompanying persons with a mobile robot using motion prediction and probabilistic roadmaps. |
IROS |
2007 |
DBLP DOI BibTeX RDF |
|
21 | Haogang Chen 0002, Qicheng Li, Guoping Wang, Feng Zhou 0004, Xiaohui Tang, Kun Yang |
An Efficient Method for Real-Time Ocean Simulation. |
Edutainment |
2007 |
DBLP DOI BibTeX RDF |
|
21 | Hsien-Hsi Hsieh, Wen-Kai Tai |
A Straightforward and Intuitive Approach on Generation and Display of Crack-Like Patterns on 3D Objects. |
Computer Graphics International |
2006 |
DBLP DOI BibTeX RDF |
Crack-like pattern, Cracking propagation, Rendering |
21 | Chul Hong Min, Tae-Seon Kim |
Modeling of Micro Spring Tension Force for Vertical Type Probe Card Fabrication. |
ISNN (2) |
2006 |
DBLP DOI BibTeX RDF |
|
21 | Ken Hinckley |
Distributed and local sensing techniques for face-to-face collaboration. |
ICMI |
2003 |
DBLP DOI BibTeX RDF |
co-present collaboration, sensing techniques, context awareness |
21 | Ken Hinckley |
Synchronous gestures for multiple persons and computers. |
UIST |
2003 |
DBLP DOI BibTeX RDF |
distributed sensor systems, ubiquitous computing, context awareness, sensors, input devices, multi-user interfaces |
21 | Steve Mann 0001 |
Eudaemonic Computing ("underwearables"). |
ISWC |
1997 |
DBLP DOI BibTeX RDF |
eudaemonic computing, eudaemonic space, humanistic intelligence, existential technology, wearable computing, vibrotactile |
21 | Sy-Yen Kuo |
YOR: a yield-optimizing routing algorithm by minimizing critical areas and vias. |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. |
1993 |
DBLP DOI BibTeX RDF |
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