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Venues (Conferences, Journals, ...)
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GrowBag graphs for keyword ? (Num. hits/coverage)
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The graphs summarize 682 occurrences of 533 keywords
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Results
Found 1665 publication records. Showing 1665 according to the selection in the facets
Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
78 | Cathy Barnes, Christian Southee, Brian Henson |
The impact of affective design of product packaging upon consumer purchase decisions. ![Search on Bibsonomy](Pics/bibsonomy.png) |
DPPI ![In: Proceedings of the 2003 International Conference on Designing Pleasurable Products and Interfaces, 2003, Pittsburgh, PA, USA, June 23-26, 2003, pp. 134-135, 2003, ACM, 1-58113-652-8. The full citation details ...](Pics/full.jpeg) |
2003 |
DBLP DOI BibTeX RDF |
packaging design, affective design |
78 | Debashis Basak, Dhabaleswar K. Panda 0001 |
Designing Clustered Multiprocessor Systems under Packaging and Technological Advancements. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Parallel Distributed Syst. ![In: IEEE Trans. Parallel Distributed Syst. 7(9), pp. 962-978, 1996. The full citation details ...](Pics/full.jpeg) |
1996 |
DBLP DOI BibTeX RDF |
k-ary n-cube interconnection, packaging constraints, interconnection networks, parallel architectures, Multiprocessor systems, clustered architectures, hierarchical organization, scalable systems |
78 | Eric Beyne |
Tutorial T7A: Advanced IC Packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
VLSI Design ![In: 20th International Conference on VLSI Design (VLSI Design 2007), Sixth International Conference on Embedded Systems (ICES 2007), 6-10 January 2007, Bangalore, India, pp. 10, 2007, IEEE Computer Society, 0-7695-2762-0. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
69 | William Reilly, Robert Wolfe, MacKenzie Smith |
MIT's CWSpace project: packaging metadata for archiving educational content in DSpace. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Int. J. Digit. Libr. ![In: Int. J. Digit. Libr. 6(2), pp. 139-147, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
Content packaging, IMS-CP, Archiving websites, Learning objects, METS |
65 | Robert DeLine |
Avoiding Packaging Mismatch with Flexible Packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Software Eng. ![In: IEEE Trans. Software Eng. 27(2), pp. 124-143, 2001. The full citation details ...](Pics/full.jpeg) |
2001 |
DBLP DOI BibTeX RDF |
software architecture, software component, system integration, software packaging, Mismatch |
64 | John Zimmerman |
Exploring the role of emotion in the interaction design of digital music players. ![Search on Bibsonomy](Pics/bibsonomy.png) |
DPPI ![In: Proceedings of the 2003 International Conference on Designing Pleasurable Products and Interfaces, 2003, Pittsburgh, PA, USA, June 23-26, 2003, pp. 152-153, 2003, ACM, 1-58113-652-8. The full citation details ...](Pics/full.jpeg) |
2003 |
DBLP DOI BibTeX RDF |
product packaging, kansei engineering, affective design |
60 | María Luisa Pérez-Delgado |
Artificial Ants and Packaging Waste Recycling. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IWANN (2) ![In: Distributed Computing, Artificial Intelligence, Bioinformatics, Soft Computing, and Ambient Assisted Living, 10th International Work-Conference on Artificial Neural Networks, IWANN 2009 Workshops, Salamanca, Spain, June 10-12, 2009. Proceedings, Part II, pp. 596-603, 2009, Springer, 978-3-642-02480-1. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
Packaging Waste, Recycling, Artificial Ants |
60 | Reda Bendraou, Philippe Desfray, Marie-Pierre Gervais, Alexis Muller |
MDA Tool Components: a proposal for packaging know-how in model driven development. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Softw. Syst. Model. ![In: Softw. Syst. Model. 7(3), pp. 329-343, 2008. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
Packaging of know-how, MDA Tool Component, MDD, Reusability |
60 | Sudarshan Bahukudumbi, Sule Ozev, Krishnendu Chakrabarty, Vikram Iyengar |
AWafer-Level Defect Screening Technique to Reduce Test and Packaging Costs for "Big-D/Small-A" Mixed-Signal SoCs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ASP-DAC ![In: Proceedings of the 12th Conference on Asia South Pacific Design Automation, ASP-DAC 2007, Yokohama, Japan, January 23-26, 2007, pp. 823-828, 2007, IEEE Computer Society, 1-4244-0629-3. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
mixed-signal cores, wafer-level defect screening, packaging cost reduction, big-D/small-A mixed-signal system-on-chip designs, mixed-signal SoC, consumer electronics market, wafer-level testing, correlation-based signature analysis, low-cost digital testers, generic cost model, mixed-signal test, digital logic, test cost reduction |
60 | Hiroshi Fujinoki, Murugesan Sanjay, Chintan Shah |
Web File Transmission by Object Packaging - Performance Comparison with HTTP 1.0 and HTTP 1.1 Persistent Connection. ![Search on Bibsonomy](Pics/bibsonomy.png) |
LCN ![In: 28th Annual IEEE Conference on Local Computer Networks (LCN 2003), The Conference on Leading Edge and Practical Computer Networking, 20-24 October 2003, Bonn/Königswinter, Germany, Proceedings, pp. 71-, 2003, IEEE Computer Society, 0-7695-2037-5. The full citation details ...](Pics/full.jpeg) |
2003 |
DBLP DOI BibTeX RDF |
|
55 | |
FSA SiP Market and Patent Analysis Report. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Des. Test Comput. ![In: IEEE Des. Test Comput. 24(2), pp. 184-192, 2007. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
patent analysis, SiP market, SoC, packaging, SiP, system in package |
55 | Reda Bendraou, Philippe Desfray, Marie-Pierre Gervais |
MDA Components: A Flexible Way for Implementing the MDA Approach. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ECMDA-FA ![In: Model Driven Architecture - Foundations and Applications, 1st European Conference, ECMDA-FA 2005, Nuremberg, Germany, November 7-10, 2005, Proceedings, pp. 59-73, 2005, Springer, 3-540-30026-0. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
PLE, Packaging of know-how, MDA Component, MDA, MDD, reusability |
51 | Nagendra Bhargava Bharatula, Paul Lukowicz, Gerhard Tröster |
Functionality-power-packaging considerations in context aware wearable systems. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Pers. Ubiquitous Comput. ![In: Pers. Ubiquitous Comput. 12(2), pp. 123-141, 2008. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
Electronic packaging, Wearable computing, Gesture, Functionality, Context recognition, Miniaturization |
51 | Mark Markus, Markus Lassnig |
Some Critical Remarks on Dynamic Packaging from the Perspective of SMEs and Small Tourism Destinations. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ENTER ![In: Information and Communication Technologies in Tourism, ENTER 2008, Proceedings of the International Conference in Innsbruck, Austria, 2008, pp. 175-185, 2008, Springer, 978-3-211-77279-9. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
Dynamic Packaging Implementation, Potentials and Challenges |
51 | Ruey-Shun Chen, Kun-Chieh Yeh, Chan-Chine Chang, H. H. Chien |
Using Data Mining Technology to improve Manufacturing Quality - A Case Study of LCD Driver IC Packaging Industry. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SNPD ![In: Seventh International Conference on Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing (SNPD 2006), 19-20 June 2006, Las Vegas, Nevada, USA, pp. 115-119, 2006, IEEE Computer Society, 0-7695-2611-X. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
LCD driver IC packaging, Data mining, Decision tree, Data warehouse |
51 | Hiroshi Fujinoki, Kiran K. Gollamudi |
Object Packaging - Web Response Time Reduction for Slow and Busy Web Server. ![Search on Bibsonomy](Pics/bibsonomy.png) |
LCN ![In: 27th Annual IEEE Conference on Local Computer Networks (LCN 2002), 6-8 November 2002, Tampa, FL, USA, Proceedings, pp. 345-347, 2002, IEEE Computer Society, 0-7695-1591-6. The full citation details ...](Pics/full.jpeg) |
2002 |
DBLP DOI BibTeX RDF |
|
46 | S. Y. Kulkarni, K. D. Patil, K. V. V. Murthy |
Transmission line model parameters for very high speed VLSI interconnects in MCMs using FEM with special elements. ![Search on Bibsonomy](Pics/bibsonomy.png) |
VLSI Design ![In: 8th International Conference on VLSI Design (VLSI Design 1995), 4-7 January 1995, New Delhi, India, pp. 260-263, 1995, IEEE Computer Society, 0-8186-6905-5. The full citation details ...](Pics/full.jpeg) |
1995 |
DBLP DOI BibTeX RDF |
very high speed integrated circuits, transmission line theory, integrated circuit packaging, transmission line model parameters, very high speed VLSI interconnects, higher order isoparametric elements, 2D interconnect/dielectric packaging structures, quadrilateral infinite elements, signal conductor boundaries, sharp corners, finite element method, finite element analysis, computation time, multichip modules, multichip modules, FEM, MCM, integrated circuit interconnections, VLSI interconnects |
46 | Joseph L. Hellerstein |
Optimizing software packages for application management. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NOMS ![In: IEEE/IFIP Network Operations and Management Symposium: Pervasive Management for Ubioquitous Networks and Services, NOMS 2008, 7-11 April 2008, Salvador, Bahia, Brazil, pp. 1-8, 2008, IEEE, 978-1-4244-2066-7. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
|
46 | Nils H. Hagge, Bernardo Wagner |
Implementation alternatives for the OMAC state machines using IEC 61499. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ETFA ![In: Proceedings of 13th IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2008, September 15-18, 2008, Hamburg, Germany, pp. 215-220, 2008, IEEE, 1-4244-1505-5. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
|
42 | Lavanya Meherishi, Sushmita A. Narayana, K. S. Ranjani |
Integrated product and packaging decisions with secondary packaging returns and protective packaging management. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Eur. J. Oper. Res. ![In: Eur. J. Oper. Res. 292(3), pp. 930-952, 2021. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
42 | Dug Hee Moon, Kyeong Wook Shin, Chul Soon Park, Dong Soo Kim |
A manufacturing system simulation of semiconductor packaging substrate. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SpringSim ![In: Proceedings of the 2009 Spring Simulation Multiconference, SpringSim 2009, San Diego, California, USA, March 22-27, 2009, 2009, SCS/ACM. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP BibTeX RDF |
lead frame, manufacturing system design, packaging substrate, discrete event simulation, semiconductor |
42 | Fabrizio Marinelli 0001, Maria Elena Nenni, Antonio Sforza |
Capacitated lot sizing and scheduling with parallel machines and shared buffers: A case study in a packaging company. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Ann. Oper. Res. ![In: Ann. Oper. Res. 150(1), pp. 177-192, 2007. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
Scheduling, Packaging, Lot sizing |
42 | Cemal Basaran, Juan Gomez, Minghui Lin, Shidong Li |
Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SCSC ![In: Proceedings of the 2007 Summer Computer Simulation Conference, SCSC 2007, San Diego, California, USA, July 16-19, 2007, pp. 269-275, 2007, Simulation Councils, Inc., 1-56555-316-0. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP BibTeX RDF |
concurrent loading, electronics packaging reliability, solder joint life prediction, dynamic analysis |
42 | Hsin Rau, Chien-Ping Liao, Wei-Jung Shiang, Chiu-Hsiang Lin |
Using Fuzzy Theory for Packaging Attribute Deployment for New Notebook Computer Introduction. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEA/AIE ![In: New Trends in Applied Artificial Intelligence, 20th International Conference on Industrial, Engineering and Other Applications of Applied Intelligent Systems, IEA/AIE 2007, Kyoto, Japan, June 26-29, 2007, Proceedings, pp. 250-259, 2007, Springer, 978-3-540-73322-5. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
new product introduction, TOPIS, packaging, FMEA, QFD |
42 | M. Niedermayer, Stephan Guttowski, Rolf Thomasius, David Dmitry Polityko, K. Schrank, Herbert Reichl |
Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IPSN ![In: Proceedings of the Fifth International Conference on Information Processing in Sensor Networks, IPSN 2006, Nashville, Tennessee, USA, April 19-21, 2006, pp. 391-398, 2006, ACM, 1-59593-334-4. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
3D packaging, hetero system integration, wireless sensor systems, design methodology |
42 | Wenzhao Li, Wei Wang, Min Gao, Junbo Wang |
Research on Performance Test and Evaluation Method of Assembly Packaging Ammunition. ![Search on Bibsonomy](Pics/bibsonomy.png) |
PROLAMAT ![In: Knowledge Enterprise: Intelligent Strategies in Product Design, Manufacturing, and Management, Proceedings of PROLAMAT 2006, IFIP TC5 International Conference, June 15-17, 2006, Shanghai, China, pp. 818-824, 2006, Springer, 0-387-34402-0. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
Ammunition packaging, Rank sum test, Bayes method, T-test, Small samples |
41 | Jung Ho Ahn, Nathan L. Binkert, Al Davis, Moray McLaren, Robert S. Schreiber |
HyperX: topology, routing, and packaging of efficient large-scale networks. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SC ![In: Proceedings of the ACM/IEEE Conference on High Performance Computing, SC 2009, November 14-20, 2009, Portland, Oregon, USA, 2009, ACM, 978-1-60558-744-8. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
|
41 | Jacob R. Minz, Sung Kyu Lim |
Block-level 3-D Global Routing With an Application to 3-D Packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. ![In: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 25(10), pp. 2248-2257, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
41 | Jeroen Bekaert, Emiel De Kooning, Rik Van de Walle |
Packaging models for the storage and distribution of complex digital objectsin archival information systems: a review of MPEG-21 DID principles. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Multim. Syst. ![In: Multim. Syst. 10(4), pp. 286-301, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
Complex digital object, OAIS Reference Model, MPEG-21 DID |
41 | Peter Sandborn, Mike Vertal |
Analyzing Packaging Trade-Offs During System Design. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Des. Test Comput. ![In: IEEE Des. Test Comput. 15(3), pp. 10-19, 1998. The full citation details ...](Pics/full.jpeg) |
1998 |
DBLP DOI BibTeX RDF |
|
37 | Paddy J. French |
Integrated Microsystems in Industrial Applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SAMOS ![In: Embedded Computer Systems: Architectures, Modeling, and Simulation, 6th International Workshop, SAMOS 2006, Samos, Greece, July 17-20, 2006, Proceedings, pp. 467-476, 2006, Springer, 3-540-36410-2. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
integrated sensors, packaging |
37 | Di Wu 0005, Zongkai Yang, Wenqing Cheng |
A Standardized Visual Web-Based Courseware Authoring System. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICALT ![In: Proceedings of the 5th IEEE International Conference on Advanced Learning Technologies, ICALT 2005, Kaohsiung, Taiwan, July 5-8, 2005, pp. 78-79, 2005, IEEE Computer Society, 0-7695-2338-2. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
Content Packaging, Question and Test Interoperability, Courseware Authoring, E-Learning, Learning Object Metadata |
37 | Ruimin Shen, Liping Shen, Xinwei Fan |
e-Learning Content Management Based on Learning Object. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICWL ![In: Advances in Web-Based Learning - ICWL 2004, Third International Conference, Beijing, China, August 8-11, 2004, Proceedings, pp. 249-254, 2004, Springer, 3-540-22542-0. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
Modified dynamic Directed Acycline Graph (MDAG), Content Packaging Specification, Ontology, Learning Object, Meta-data |
37 | W. Stephen Lacy, José Cruz-Rivera, D. Scott Wills |
The Offset Cube: A Three-Dimensional Multicomputer Network Topology Using Through-Wafer Optics. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Parallel Distributed Syst. ![In: IEEE Trans. Parallel Distributed Syst. 9(9), pp. 893-908, 1998. The full citation details ...](Pics/full.jpeg) |
1998 |
DBLP DOI BibTeX RDF |
MPP networks, ultra-compact systems, offset cube, 3D packaging, through-wafer signaling, adaptive routing, optical interconnect, deadlock freedom, 3D mesh |
37 | John Mugler, Thomas J. Naughton, Stephen L. Scott |
OSCAR Meta-Package System. ![Search on Bibsonomy](Pics/bibsonomy.png) |
HPCS ![In: 19th Annual International Symposium on High Performance Computing Systems and Applications (HPCS 2005), 15-18 May 2005, Guelph, Ontario, Canada, pp. 353-360, 2005, IEEE Computer Society, 0-7695-2343-9. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
|
37 | J. S. Hebhardt, C. F. Groves, R. Bardas |
NAA: an approach to analyzing backpanel crosstalk. ![Search on Bibsonomy](Pics/bibsonomy.png) |
AFIPS National Computer Conference ![In: American Federation of Information Processing Societies: 1977 National Computer Conference, June 13-16, 1977, Dallas, Texas, USA, pp. 331-340, 1977, AFIPS Press, 978-1-4503-7914-4. The full citation details ...](Pics/full.jpeg) |
1977 |
DBLP DOI BibTeX RDF |
|
32 | Muhammad Adeel Talib, Alan W. Colman, Jun Han 0004, Justin King, Malinda Kapuruge |
A Service Packaging Platform for Delivering Services. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE SCC ![In: 2010 IEEE International Conference on Services Computing, SCC 2010, Miami, Florida, USA, July 5-10, 2010, pp. 202-209, 2010, IEEE Computer Society, 978-0-7695-4126-6. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
service packaging platform, service delivery functions, service contracts |
32 | Florian Zach, Ulrike Gretzel, Daniel R. Fesenmaier |
Tourist Activated Networks: Implications for Dynamic Packaging Systems in Tourism. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ENTER ![In: Information and Communication Technologies in Tourism, ENTER 2008, Proceedings of the International Conference in Innsbruck, Austria, 2008, pp. 198-208, 2008, Springer, 978-3-211-77279-9. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
tourist activated networks, dynamic packaging, on-the-move traveller, destination management organizations, network analysis |
32 | M. B. Korchemkin |
A heuristic partitioning algorithm for a packaging problem. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Computing ![In: Computing 31(3), pp. 203-209, 1983. The full citation details ...](Pics/full.jpeg) |
1983 |
DBLP DOI BibTeX RDF |
Packaging problem, single source transportation problem, heuristic partitioning algorithm, large-scale 0-1 programming problem |
32 | Andreas Jagersberger, Klemens Waldhör |
Dynamic Packaging using a Cluster-based Demographic Filtering Approach. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ENTER ![In: Information and Communication Technologies in Tourism, ENTER 2008, Proceedings of the International Conference in Innsbruck, Austria, 2008, pp. 186-197, 2008, Springer, 978-3-211-77279-9. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
travel recommendation, demographic filtering, collaborative filtering, user model, content based filtering |
32 | Sai-Ho Ling, Herbert H. C. Iu, Frank H. F. Leung, Kit Yan Chan |
Modelling the development of fluid dispensing for electronic packaging: Hybrid Particle Swarm Optimization based-wavelet neural network approach. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IJCNN ![In: Proceedings of the International Joint Conference on Neural Networks, IJCNN 2008, part of the IEEE World Congress on Computational Intelligence, WCCI 2008, Hong Kong, China, June 1-6, 2008, pp. 98-103, 2008, IEEE, 978-1-4244-1820-6. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
|
32 | Andrea Grassi, Elisa Gebennini, Gabriele Goldoni, Cesare Fantuzzi, Rita Gamberini, Robert Nevin, Bianca Rimini |
Complex Packaging Line Modelling and Simulation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICRA ![In: 2007 IEEE International Conference on Robotics and Automation, ICRA 2007, 10-14 April 2007, Roma, Italy, pp. 2946-2950, 2007, IEEE. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
32 | Rakesh Murthy, Aditya N. Das, Dan O. Popa, Harry E. Stephanou |
M3: Multiscale, Deterministic and Reconfigurable Macro-Micro Assembly System for Packaging of MEMS. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICRA ![In: 2007 IEEE International Conference on Robotics and Automation, ICRA 2007, 10-14 April 2007, Roma, Italy, pp. 668-673, 2007, IEEE. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
32 | Cesar Augusto Tacla, Fabio Manoel Caliari, Gustavo Alberto Giménez Lugo |
An Application Ontology for Furniture Packaging Design. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CSCWD ![In: Proceedings of the 11th International Conference on Computer Supported Cooperative Work in Design, CSCWD 2007, April 26-28, 2007, Melbourne, Australia, pp. 728-733, 2007, IEEE. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
32 | Dongwon Seo, Yuhua Guo |
Mismatch Compensated Design Techniques under Packaging-Induced Die Stress. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISCAS ![In: International Symposium on Circuits and Systems (ISCAS 2007), 27-20 May 2007, New Orleans, Louisiana, USA, pp. 3788-3791, 2007, IEEE, 1-4244-0920-9. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
32 | Thierry Bodhuin |
PODoJA: Packaging Optimizer for Downloadable Java Applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
WCRE ![In: 13th Working Conference on Reverse Engineering (WCRE 2006), 23-27 October 2006, Benevento, Italy, pp. 295-296, 2006, IEEE Computer Society, 0-7695-2719-1. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
32 | Takoua Abdellatif, Jakub Kornas, Jean-Bernard Stefani |
J2EE Packaging, Deployment and Reconfiguration Using a General Component Model. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Component Deployment ![In: Component Deployment, Third International Working Conference, CD 2005, Grenoble, France, November 28-29, 2005, Proceedings, pp. 134-148, 2005, Springer, 3-540-30517-3. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
|
32 | Steve Chu, Prasad V. Saraph, Lee Schruben |
Packaging capacity analysis of a biopharmaceutical production operation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
WSC ![In: Proceedings of the 37th Winter Simulation Conference, Orlando, FL, USA, December 4-7, 2005, pp. 2449-2453, 2005, IEEE Computer Society, 0-7803-9519-0. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
|
32 | Lalitha Immaneni, Anju Kapur, Brett Neal |
Design Tools for Packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISQED ![In: 5th International Symposium on Quality of Electronic Design (ISQED 2004), 22-24 March 2004, San Jose, CA, USA, pp. 179-183, 2004, IEEE Computer Society, 0-7695-2093-6. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
|
32 | Zongkai Yang, Gang Zhao, Di Wu 0005, Jianhua He |
A Standard Visual Courseware Authoring Tool Based on Content Packaging Specification. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ITCC (1) ![In: International Conference on Information Technology: Coding and Computing (ITCC'04), Volume 1, April 5-7, 2004, Las Vegas, Nevada, USA, pp. 207-211, 2004, IEEE Computer Society, 0-7695-2108-8. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
|
32 | Osamu Wada, Toshimasa Namekawa, Hiroshi Ito, Atsushi Nakayama, Shuso Fujii |
Post-Packaging Auto Repair Techniques for Fast Row Cycle Embedded DRAM. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ITC ![In: Proceedings 2004 International Test Conference (ITC 2004), October 26-28, 2004, Charlotte, NC, USA, pp. 1016-1023, 2004, IEEE Computer Society, 0-7803-8581-0. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
|
32 | Lucimar C. Martins, Tatiana A. S. Coelho, Simone Diniz Junqueira Barbosa, Marco A. Casanova, Carlos José Pereira de Lucena |
A Framework for Filtering and Packaging Hypermedia Documents. ![Search on Bibsonomy](Pics/bibsonomy.png) |
AH ![In: Adaptive Hypermedia and Adaptive Web-Based Systems, Second International Conference, AH 2002, Malaga, Spain, May 29-31, 2002, Proceedings, pp. 274-283, 2002, Springer, 3-540-43737-1. The full citation details ...](Pics/full.jpeg) |
2002 |
DBLP DOI BibTeX RDF |
|
32 | Jennifer Blain Christen, Cristina E. Davis, Min Li, Andreas G. Andreou |
Design, double sided post-processing, and packaging of CMOS compatible bio-MEMS device arrays. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISCAS (1) ![In: Proceedings of the 2002 International Symposium on Circuits and Systems, ISCAS 2002, Scottsdale, Arizona, USA, May 26-29, 2002, pp. 665-668, 2002, IEEE, 0-7803-7448-7. The full citation details ...](Pics/full.jpeg) |
2002 |
DBLP DOI BibTeX RDF |
|
32 | Brian A. Box, John Nieznanski |
Common processor element packaging for CHAMP. ![Search on Bibsonomy](Pics/bibsonomy.png) |
FCCM ![In: 3rd IEEE Symposium on Field-Programmable Custom Computing Machines (FCCM '95), 19-21 April 1995, Napa Valley, CA, USA, pp. 39-44, 1995, IEEE Computer Society, 0-8186-7086-X. The full citation details ...](Pics/full.jpeg) |
1995 |
DBLP DOI BibTeX RDF |
|
32 | Barry Whalen |
Automating the Design of Electronic Packaging (tutorial). ![Search on Bibsonomy](Pics/bibsonomy.png) |
DAC ![In: Proceedings of the 25th ACM/IEEE Conference on Design Automation, DAC '88, Anaheim, CA, USA, June 12-15, 1988., pp. 81, 1988, ACM. The full citation details ...](Pics/full.jpeg) |
1988 |
DBLP BibTeX RDF |
|
28 | Xin Gao, Wenjing Luo, Yu Liu, Bo Zhong |
Analysis of the Effectiveness of Integrating Traditional Chinese Medicine Culture and Tang Grass Pattern into Medicinal Packaging Design for User Experience Enhancement - Simulation and Modeling based on SNNs Neural Network FittingIntegrating Traditional Chinese Medicine Culture and Tang Grass Pattern into Medicinal Packaging Design for User Experience Enhancement. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISAIMS ![In: Proceedings of the 2023 4th International Symposium on Artificial Intelligence for Medicine Science, ISAIMS 2023, Chengdu, China, October 20-22, 2023, pp. 1256-1260, 2023, ACM. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
28 | Stephan L. K. Freichel, Johannes Wollenburg, Johannes K. Wörtge |
The role of packaging in omni-channel fashion retail supply chains - How can packaging contribute to logistics efficiency? ![Search on Bibsonomy](Pics/bibsonomy.png) |
Logist. Res. ![In: Logist. Res. 13(1), pp. 1, 2020. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
28 | Mónica Forero-Díaz, Brayan D. Sanchez Correa, Mauricio Salas Román, Miguel A. Buitrago Casas |
Challenges for the design of people-centered pharmaceutical packaging: Exploration of the interaction of people with pharmaceutical packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
PervasiveHealth ![In: PervasiveHealth '20: 14th EAI International Conference on Pervasive Computing Technologies for Healthcare, Atlanta, GA, USA, 6-8 October, 2020, pp. 431-435, 2020, ACM, 978-1-4503-7532-0. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
28 | Austin Lancaster, Manish Keswani |
Integrated circuit packaging review with an emphasis on 3D packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Integr. ![In: Integr. 60, pp. 204-212, 2018. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
28 | Jakkreeporn Sannork, Aree Wiboonpongse, Tzong-Ru Lee |
Assessing Consumers' Perceptions of Packaging Attributes and Packaging Label of Community's 'Green' Chili (Pepper) Products in Thailand. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IUKM ![In: Integrated Uncertainty in Knowledge Modelling and Decision Making - 6th International Symposium, IUKM 2018, Hanoi, Vietnam, March 15-17, 2018, Proceedings, pp. 397-407, 2018, Springer, 978-3-319-75428-4. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
28 | Yu-Che Huang, Ming-Yu Hsiao, Hong-Jin Yi, Tien-Chaun Yeh |
A teaching research for packaging design in brand building: a case study of tea packaging in Teama. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICETC ![In: Proceedings of the 10th International Conference on Education Technology and Computers, ICETC 2018, Tokyo, Japan, October 26-28, 2018, pp. 212-216, 2018, ACM, 978-1-4503-6517-8. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
28 | Michihiro Inoue, Fumito Imura, Arami Saruwatari, Shiro Hara |
Packaging in minimal fab: An integrated semiconductor line from wafer process to packaging process. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICICDT ![In: International Conference on IC Design and Technology, ICICDT 2016, Ho Chi Minh, Vietnam, June 27-29, 2016, pp. 1-3, 2016, IEEE, 978-1-5090-0827-8. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
28 | Chong Leong Gan, Uda Hashim |
Wafer-Level Chip-Scale Packaging (Analog and Power Electronics Packaging), XVII. Springer (2015), 322, ISBN: 978-1-4939-1555-2. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 55(11), pp. 2481, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
28 | Guotao Wang, Paul S. Ho, Steven Groothuis |
Chip-packaging interaction: a critical concern for Cu/low k packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 45(7-8), pp. 1079-1093, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
|
28 | Robert DeLine |
Corrections to 'Avoiding Packaging Mismatch with Flexible Packaging'. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Software Eng. ![In: IEEE Trans. Software Eng. 27(6), pp. 576, 2001. The full citation details ...](Pics/full.jpeg) |
2001 |
DBLP DOI BibTeX RDF |
|
28 | Robert DeLine |
Avoiding Packaging Mismatch with Flexible Packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICSE ![In: Proceedings of the 1999 International Conference on Software Engineering, ICSE' 99, Los Angeles, CA, USA, May 16-22, 1999., pp. 97-106, 1999, ACM, 1-58113-074-0. The full citation details ...](Pics/full.jpeg) |
1999 |
DBLP DOI BibTeX RDF |
|
28 | Pedro Ortiz, Neil Keegan, Julia Spoors, John Hedley, Alun Harris, Jim Burdess, Richie Burnett, Margit Biehl, Werner Haberer, Thomas Velten, Matthew Solomon, Andrew Campitelli, Calum McNeil |
A Cancer Diagnostics Biosensor System Based on Micro- and Nano-technologies. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NanoNet ![In: Nano-Net - 4th International ICST Conference, Nano-Net 2009, Lucerne, Switzerland, October 18-20, 2009. Proceedings, pp. 169-177, 2009, Springer, 978-3-642-04849-4. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
clinical diagnostics, microfluidics, packaging, biosensors, Lab-on-a-Chip, bioMEMS |
28 | Tariq Mahmood, Francesco Ricci 0001, Adriano Venturini |
Learning Adaptive Recommendation Strategies for Online Travel Planning. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ENTER ![In: Information and Communication Technologies in Tourism, ENTER 2009, Proceedings of the International Conference in Amsterdam, The Netherlands, 2009, pp. 149-160, 2009, Springer, 978-3-211-93970-3. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
Dynamic Packaging, Information Presentation and Delivery, Reinforcement Learning, Markov Decision Process, Travel Planning, Conversational Recommender Systems |
28 | Philip Doganis, Haralambos Sarimveis |
Optimal production scheduling for the dairy industry. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Ann. Oper. Res. ![In: Ann. Oper. Res. 159(1), pp. 315-331, 2008. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
Yogurt, Scheduling, Optimization, Parallel machines, Mixed-integer linear programming, Packaging |
28 | Wilkey Wong, Ximena Uribe-Zarain, Roberta Golinkoff, Kelly Fisher, Kathy Hirsh-Pasek |
Parents' views of the benefits claimed in educational toy advertising. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IDC ![In: Proceedings of the 7th International Conference on Interaction Design and Children, IDC 2008, Chicago, Illinois, USA, June 11-13, 2008, pp. 165-168, 2008, ACM, 978-1-59593-994-4. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
parental perceptions, toy packaging, advertising, influence, purchasing, cognitive development, sensory |
28 | Yuen-Hui Chee, Mike Koplow, Michael Mark, Nathan Pletcher, Mike Seeman, Fred L. Burghardt, Dan Steingart, Jan M. Rabaey, Paul K. Wright, Seth Sanders |
PicoCube: a 1 cm3 sensor node powered by harvested energy. ![Search on Bibsonomy](Pics/bibsonomy.png) |
DAC ![In: Proceedings of the 45th Design Automation Conference, DAC 2008, Anaheim, CA, USA, June 8-13, 2008, pp. 114-119, 2008, ACM, 978-1-60558-115-6. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
active antennas, advanced packaging, low power, energy management, energy harvesting, intelligent sensors |
28 | Bharat Upadrasta, Mohammad T. Khasawneh, Sarah S. Lam |
Advanced Technology Training for Operating the Microlithography Panel Printer. ![Search on Bibsonomy](Pics/bibsonomy.png) |
HCI (12) ![In: Digital Human Modeling, First International Conference on Digital Human Modeling, ICDHM 2007, Held as Part of HCI International 2007, Beijing, China, July 22-27, 2007, Proceedings, pp. 998-1007, 2007, Springer, 978-3-540-73318-8. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
electronics packaging, simulation, modeling, Virtual reality, training |
28 | Andrew Yang, Rajit Chandra, Simon Burke, Javier A. DeLaCruz, Sribalan Santhanam, Uming Ko |
Entering the hot zone - can you handle the heat and be cool? ![Search on Bibsonomy](Pics/bibsonomy.png) |
DAC ![In: Proceedings of the 43rd Design Automation Conference, DAC 2006, San Francisco, CA, USA, July 24-28, 2006, pp. 174-175, 2006, ACM, 1-59593-381-6. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
IC packaging, thermal effects, low power |
28 | Vijay Lakamraju, Israel Koren, C. Mani Krishna 0001 |
Filtering Random Graphs to Synthesize Interconnection Networks with Multiple Objectives. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Parallel Distributed Syst. ![In: IEEE Trans. Parallel Distributed Syst. 13(11), pp. 1139-1149, 2002. The full citation details ...](Pics/full.jpeg) |
2002 |
DBLP DOI BibTeX RDF |
fault tolerance, Interconnection networks, synthesis, filters, embedding, diameter, packaging, random regular graphs |
28 | Ines Grützner, Niniek Angkasaputra, Dietmar Pfahl |
A systematic approach to produce small courseware modules for combined learning and knowledge management environements. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SEKE ![In: Proceedings of the 14th international conference on Software engineering and knowledge engineering, SEKE 2002, Ischia, Italy, July 15-19, 2002, pp. 533-539, 2002, ACM, 1-58113-556-4. The full citation details ...](Pics/full.jpeg) |
2002 |
DBLP DOI BibTeX RDF |
courseware module production, knowledge packaging, CSCL |
28 | Sadik C. Esener, Philippe J. Marchand |
Present and Future Needs of Free-Space Optical Interconnects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IPDPS Workshops ![In: Parallel and Distributed Processing, 15 IPDPS 2000 Workshops, Cancun, Mexico, May 1-5, 2000, Proceedings, pp. 1104-1109, 2000, Springer, 3-540-67442-X. The full citation details ...](Pics/full.jpeg) |
2000 |
DBLP DOI BibTeX RDF |
Optical Packaging, Micro-optics, Free-Space Optical Interconnects, Optical Interconnects, OptoElectronics |
28 | Jun Han |
A Comprehensive Interface Definition Framework for Software Components. ![Search on Bibsonomy](Pics/bibsonomy.png) |
APSEC ![In: 5th Asia-Pacific Software Engineering Conference (APSEC '98), 2-4 December 1998, Taipei, Taiwan, ROC, pp. 110-, 1998, IEEE Computer Society, 0-8186-9183-2. The full citation details ...](Pics/full.jpeg) |
1998 |
DBLP DOI BibTeX RDF |
component interface, interface signature, interface constraint, role-based interface packaging and configuration, software component, Component based software engineering |
28 | T. Boggess, F. Shirley |
High-performance scalable computing for real-time applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCCN ![In: Proceedings of the International Conference On Computer Communications and Networks (ICCCN 1997), September 22-25, 1997 Las Vegas, NV, USA, pp. 332-335, 1997, IEEE Computer Society, 0-8186-8186-1. The full citation details ...](Pics/full.jpeg) |
1997 |
DBLP DOI BibTeX RDF |
high-performance scalable computing, interconnect technologies, high-performance computing technologies, embedded military applications, heterogeneous computer nodes, high-throughput system area network, standardized intelligent node-to-network interface, LANai, Sanders, Ptolemy environment, high density interconnect packaging, avionics applications, PacketWay, Internet Engineering Task Force proposed standard, high speed inter-SAN encryption, simulation, modeling, real-time systems, reconfigurable computing, real-time applications, RISC, switched network, digital signal processor, Myrinet |
28 | Kai-Yuan Chao, D. F. Wong 0001 |
Signal integrity optimization on the pad assignment for high-speed VLSI design. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCAD ![In: Proceedings of the 1995 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 1995, San Jose, California, USA, November 5-9, 1995, pp. 720-725, 1995, IEEE Computer Society / ACM, 0-8186-7213-7. The full citation details ...](Pics/full.jpeg) |
1995 |
DBLP DOI BibTeX RDF |
pad assignment, simultaneous swiching Noise, floorplanning, crosstalk, signal integrity, packaging |
27 | Santhosh Coimbatore Vaidyanathan, Amit Mangesh Brahme, Sukumar Jairam |
Techniques for Early Package Closure in System-in-Packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISQED ![In: 9th International Symposium on Quality of Electronic Design (ISQED 2008), 17-19 March 2008, San Jose, CA, USA, pp. 608-613, 2008, IEEE Computer Society, 978-0-7695-3117-5. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
spacer, landing, SoC, SIP, CSP, MCM, POP |
27 | Ray T. Chen |
Optical interconnects: a viable solution for interconnection beyond 10 gbit/sec. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISPD ![In: Proceedings of the 2007 International Symposium on Physical Design, ISPD 2007, Austin, Texas, USA, March 18-21, 2007, pp. 85-86, 2007, ACM, 978-1-59593-613-4. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
PCB interconnects, optical bus architecture, optical interconnects |
27 | Ryan Gerard, Robert R. Downs, James J. Marshall, Robert E. Wolfe |
The Software Reuse Working Group: A Case Study in Fostering Reuse. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRI ![In: Proceedings of the IEEE International Conference on Information Reuse and Integration, IRI 2007, 13-15 August 2007, Las Vegas, Nevada, USA, pp. 24-29, 2007, IEEE Systems, Man, and Cybernetics Society. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
27 | Amit K. Gupta, William J. Dally |
Topology optimization of interconnection networks. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Comput. Archit. Lett. ![In: IEEE Comput. Archit. Lett. 5(1), pp. 10-13, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
27 | Larry Gilg |
Known Good Die. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Electron. Test. ![In: J. Electron. Test. 10(1-2), pp. 15-25, 1997. The full citation details ...](Pics/full.jpeg) |
1997 |
DBLP DOI BibTeX RDF |
known good die, KGD, chip scale (size) package, multi-chip module (MCM), wafer probe, membrane probe card, buckling beam probe card, KGD carrier, CSP, burn-in |
27 | Shekar Rao, Bert Haskell, Ian Yee |
Trade-off analysis on cost and manufacturing technology of an electronic product: Case study. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Electron. Test. ![In: J. Electron. Test. 5(2-3), pp. 219-228, 1994. The full citation details ...](Pics/full.jpeg) |
1994 |
DBLP DOI BibTeX RDF |
analysis of PCB (printed circuit boards), Benchmarking, trade-off, redesign |
27 | Changsheng Ying, Jun Gu |
Automated pin grid array package routing on multilayer ceramic substrates. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Very Large Scale Integr. Syst. ![In: IEEE Trans. Very Large Scale Integr. Syst. 1(4), pp. 571-575, 1993. The full citation details ...](Pics/full.jpeg) |
1993 |
DBLP DOI BibTeX RDF |
|
23 | Joseph Fjelstad |
Retrospective on electronics technology and prospective methods for co-design of IC packaging and manufacturing improvements. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISQED ![In: 10th International Symposium on Quality of Electronic Design (ISQED 2009), 16-18 March 2009, San Jose, CA, USA, pp. 559-564, 2009, IEEE Computer Society, 978-1-4244-2952-3. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
|
23 | Zhengjia Wang, Yuhui Wang, Zhouping Yin |
A Multi-physics Simulation Based Parameters Optimization for Anisotropic Conductive Adhesive Interconnection in Electronic Packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICIRA (2) ![In: Intelligent Robotics and Applications, First International Conference, ICIRA 2008, Wuhan, China, October 15-17, 2008 Proceedings, Part II, pp. 896-905, 2008, Springer, 978-3-540-88516-0. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
Anisotropic conductive adhesive (ACA), coupled field, multi-physics simulation, optimization, reliability |
23 | Yanjie Liu, Teng Li, Lining Sun |
Modeling and Control of Macro-micro Dual-Drive High Acceleration and High Precision Positioning Stage Using for IC Packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICIRA (2) ![In: Intelligent Robotics and Applications, First International Conference, ICIRA 2008, Wuhan, China, October 15-17, 2008 Proceedings, Part II, pp. 269-278, 2008, Springer, 978-3-540-88516-0. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
macro-micro dual-drive, positioning stage, motion couple, LQG, modeling |
23 | Markus Luetzelschwab, Dominik Weiland, Marc P. Y. Desmulliez |
Adaptive Packaging Solution for a Microlens Array Placed Over a Micro-UV-LED Array. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IPAS ![In: Micro-Assembly Technologies and Applications, IFIP TC5 WG5.5 Fourth International Precision Assembly Seminar (IPAS'2008), Chamonix, France, February 10-13, 2008, pp. 129-138, 2008, Springer, 978-0-387-77402-2. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
|
23 | Steve Davis 0001, M. G. King, John W. Casson, John O. Gray, Darwin G. Caldwell |
Automated Handling, Assembly and Packaging of Highly Variable Compliant Food Products - Making a Sandwich. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICRA ![In: 2007 IEEE International Conference on Robotics and Automation, ICRA 2007, 10-14 April 2007, Roma, Italy, pp. 1213-1218, 2007, IEEE. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
23 | Kyung Ho Chung, Myung Sil Choi, Kwang Seon Ahn |
A Study on the Packaging for Fast Boot-up Time in the Embedded Linux. ![Search on Bibsonomy](Pics/bibsonomy.png) |
RTCSA ![In: 13th IEEE International Conference on Embedded and Real-Time Computing Systems and Applications (RTCSA 2007), 21-24 August 2007, Daegu, Korea, pp. 89-94, 2007, IEEE Computer Society, 0-7695-2975-5. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
23 | Dong Gun Kam, Joungho Kim, Jiheon Yu, Ho Choi, Kicheol Bae, Choonheung Lee |
Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Des. Test Comput. ![In: IEEE Des. Test Comput. 23(3), pp. 212-219, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
wire bonded plastic ball grid array, WB-PBGA, 40 Gb/s Serial Link, chip-to-chip serial link, SiP, System-in-Package |
23 | Dan O. Popa, Rakesh Murthy, Manoj Mitta, Jeongsik Sin, Harry E. Stephanou |
M3-Modular Multi-Scale Assembly System for MEMS Packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IROS ![In: 2006 IEEE/RSJ International Conference on Intelligent Robots and Systems, IROS 2006, October 9-15, 2006, Beijing, China, pp. 3712-3717, 2006, IEEE, 1-4244-0258-1. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
23 | Shweta Rani, Jay Goodkin, Judy Cobb, Thomas G. Habing, Richard Urban, Janet Eke, Richard Pearce-Moses |
Technical architecture overview: tools for acquisition, packaging and ingest of web objects into multiple repositories. ![Search on Bibsonomy](Pics/bibsonomy.png) |
JCDL ![In: ACM/IEEE Joint Conference on Digital Libraries, JCDL 2006, Chapel Hill, NC, USA, June 11-15, 2006, Proceedings, pp. 360, 2006, ACM, 1-59593-354-9. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
interoperability architecture, digital preservation, web archiving |
23 | Renshen Wang, Rui Shi 0003, Chung-Kuan Cheng |
Layer minimization of escape routing in area array packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCAD ![In: 2006 International Conference on Computer-Aided Design, ICCAD 2006, San Jose, CA, USA, November 5-9, 2006, pp. 815-819, 2006, ACM, 1-59593-389-1. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
bottleneck analysis, central triangular pattern, escape routing |
23 | Radoslav Andreev, Ivan Ganchev, Mairtin O'Droma |
Content Metadata Application and Packaging Service (CMAPS) - Innovative Framework for Producing SCORM-Compliant e-Learning Content. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICALT ![In: Proceedings of the 5th IEEE International Conference on Advanced Learning Technologies, ICALT 2005, Kaohsiung, Taiwan, July 5-8, 2005, pp. 274-278, 2005, IEEE Computer Society, 0-7695-2338-2. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
|
23 | Noriaki Sakamoto, Norihiko Sugita, Takafumi Kikuchi, Hideki Tanaka, Takashi Akazawa |
Designing and packaging technology of Renesas SIP. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISCAS (6) ![In: International Symposium on Circuits and Systems (ISCAS 2005), 23-26 May 2005, Kobe, Japan, pp. 5926-5929, 2005, IEEE, 0-7803-8834-8. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
|
23 | Manling Tan, Xin Zeng |
The Use of VRML in Assessing Colour in Soft Drink Packaging Design. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IV ![In: 8th International Conference on Information Visualisation, IV 2004, 14-16 July 2004, London, UK, pp. 235-238, 2004, IEEE Computer Society, 0-7695-2177-0. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
|
23 | Nicolás de Abajo, Alberto B. Diez, Vanesa Lobato, Sergio R. Cuesta |
ANN quality diagnostic models for packaging manufacturing: an industrial data mining case study. ![Search on Bibsonomy](Pics/bibsonomy.png) |
KDD ![In: Proceedings of the Tenth ACM SIGKDD International Conference on Knowledge Discovery and Data Mining, Seattle, Washington, USA, August 22-25, 2004, pp. 799-804, 2004, ACM, 1-58113-888-1. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
tinplate quality, ANNs, FMEA, CRISP-DM |
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