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GrowBag graphs for keyword ? (Num. hits/coverage)
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The graphs summarize 23 occurrences of 20 keywords
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Results
Found 62 publication records. Showing 62 according to the selection in the facets
Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
131 | David Bargeron, Tomer Moscovich |
Reflowing digital ink annotations. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CHI ![In: Proceedings of the 2003 Conference on Human Factors in Computing Systems, CHI 2003, Ft. Lauderdale, Florida, USA, April 5-10, 2003, pp. 385-393, 2003, ACM, 1-58113-630-7. The full citation details ...](Pics/full.jpeg) |
2003 |
DBLP DOI BibTeX RDF |
reflow, context, annotation, documents, handwriting recognition, digital ink, annotation system design |
33 | Vincent Chik, Beryl Plimmer, John G. Hosking |
Intelligent mind-mapping. ![Search on Bibsonomy](Pics/bibsonomy.png) |
OZCHI ![In: Proceedings of the 2007 Australasian Computer-Human Interaction Conference, OZCHI 2007, Adelaide, Australia, November 28-30, 2007, pp. 195-198, 2007, ACM, 978-1-59593-872-5. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
ink grouping, ink recognition, ink reflow, digital ink, mind-map |
26 | Siang Miang Yeo, Ho Kwang Yow, Keat Hoe Yeoh, Siti Nur Farhana Mohamad Azenal |
Elimination of Die-Pop Defect by Vacuum Reflow for Ultrathin Die With Warpage in Semiconductor Packaging Assembly. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Reliab. ![In: IEEE Trans. Reliab. 73(1), pp. 784-791, March 2024. The full citation details ...](Pics/full.jpeg) |
2024 |
DBLP DOI BibTeX RDF |
|
26 | Syed Mujahid Abbas, Qiang Yu, Michael G. Pecht |
Influence of Substrate on Microvia Structures in Printed Circuit Boards During Reflow. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Access ![In: IEEE Access 11, pp. 142487-142494, 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
26 | Bo-yang Li, Shi-you Lin, Li-sha Chen, Ming-yuan Zhao |
Temperature Curve of Reflow Furnace Based on Newton's Law of Cooling. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Symmetry ![In: Symmetry 15(3), pp. 661, February 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
26 | Bubu Xie, Cai Chen, Yihao Lin, Dong Chen, Wei Huang, Kailin Pan, Yubing Gong |
Integrated Approach to Obtain Gas Flow Velocity in Convection Reflow Soldering Oven. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Symmetry ![In: Symmetry 15(9), pp. 1739, September 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
26 | Wenhao Guan, Qi Su, Haodong Zhou, Shiyu Miao, Xingjia Xie, Lin Li, Qingyang Hong |
ReFlow-TTS: A Rectified Flow Model for High-fidelity Text-to-Speech. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CoRR ![In: CoRR abs/2309.17056, 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
26 | Przemyslaw Ignaciuk, Michal Morawski |
Price-Shaped Optimal Water Reflow in Prosumer Energy Cascade Hydro Plants. ![Search on Bibsonomy](Pics/bibsonomy.png) |
FedCSIS ![In: Proceedings of the 18th Conference on Computer Science and Intelligence Systems, FedCSIS 2023, Warsaw, Poland, September 17-20, 2023., pp. 1001-1005, 2023, 978-83-967447-8-4. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
26 | Vivek Parmar, Sandeep Kaur Kingra, Deepak Verma, Digamber Pandey, Giuseppe Piccolboni, Alessandro Bricalli, Amir Regev, Gabriel Pares, Laurent Grenouillet, Jean-François Nodin, Manan Suri |
Demonstration of SMT-reflow Immune and SCA-resilient PUF on 28nm RRAM device array. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IMW ![In: IEEE International Memory Workshop, IMW 2023, Monterey, CA, USA, May 21-24, 2023, pp. 1-4, 2023, IEEE, 978-1-6654-7459-7. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
26 | Frode Eika Sandnes |
Towards "Image Reflow" on the Web: Avoiding Excessive Panning of Magnified Images by Multiplexing Automatically Cropped Regions of Interest. ![Search on Bibsonomy](Pics/bibsonomy.png) |
INTERACT (4) ![In: Human-Computer Interaction - INTERACT 2023 - 19th IFIP TC13 International Conference, York, UK, August 28 - September 1, 2023, Proceedings, Part IV, pp. 315-319, 2023, Springer, 978-3-031-42292-8. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
26 | Lau Hong Ming, Sujan Debnath, Mahzan Johar, Siti Faizah Mad Asasaari, Mohd Al Fatihhi Szali Januddi, Mohamad Shahrul Effendy Kosnan |
Effect of Solder Ball Geometry on Solder Joint Reliability under Solder Reflow Cooling Process. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Int. J. Online Biomed. Eng. ![In: Int. J. Online Biomed. Eng. 18(8), pp. 142-153, June 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
26 | Yuan Sui, Fanyang Bu, Zi-long Shao, Wei Yan |
Optimization simulation of reflow welding based on prediction of regional center temperature field. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CoRR ![In: CoRR abs/2206.10119, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
26 | Jason Wu 0001, Titus Barik, Xiaoyi Zhang 0006, Colin Lea, Jeffrey Nichols 0001, Jeffrey P. Bigham |
Reflow: Automatically Improving Touch Interactions in Mobile Applications through Pixel-based Refinements. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CoRR ![In: CoRR abs/2207.07712, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
26 | Lianxiang Deng, Xianming Zhao, Xiaolin Su, Mei Zhou, Daizheng Huang, Xiaocong Zeng |
Machine learning to predict no reflow and in-hospital mortality in patients with ST-segment elevation myocardial infarction that underwent primary percutaneous coronary intervention. ![Search on Bibsonomy](Pics/bibsonomy.png) |
BMC Medical Informatics Decis. Mak. ![In: BMC Medical Informatics Decis. Mak. 22(1), pp. 109, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
26 | Rafael Luis Yanase de Rezende, João Paulo Coelho |
Modelling and Control of a Retrofitted Oven for SMD Reflow. ![Search on Bibsonomy](Pics/bibsonomy.png) |
OL2A ![In: Optimization, Learning Algorithms and Applications - Second International Conference, OL2A 2022, Póvoa de Varzim, Portugal, October 24-25, 2022, Proceedings, pp. 546-561, 2022, Springer, 978-3-031-23235-0. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
26 | Fan Ye, Dayuan Jin, Yun Wan, Xin Xie |
The intelligent design of reflow soldering based on an improved high-dimensional surrogate assisted optimization method. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ITQM ![In: Proceedings of the 9th International Conference on Information Technology and Quantitative Management, ITQM 2022, Global Green Digital Economy: Challenges and Development, December 9-11, 2022, Beijing, China, pp. 295-303, 2022, Elsevier. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
26 | Frode Eika Sandnes |
Lost in OCR-Translation: Pixel-based Text Reflow to the Rescue: Magnification of Archival Raster Image Documents in the Browser without Horizontal Scrolling. ![Search on Bibsonomy](Pics/bibsonomy.png) |
PETRA ![In: PETRA '22: The 15th International Conference on PErvasive Technologies Related to Assistive Environments, Corfu, Greece, 29 June 2022 - 1 July 2022, pp. 500-506, 2022, ACM, 978-1-4503-9631-8. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
26 | Geng Ma, Xiaoqing Huang, Shihao Liu |
Heat Transfer Modeling and Oven Temperature Curve Optimization of Integrated Circuit Board Reflow Soldering. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Access ![In: IEEE Access 9, pp. 141876-141889, 2021. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
26 | Tin Lun Lam |
Low-Cost Non-Contact PCBs Temperature Monitoring and Control in a Hot Air Reflow Process Based on Multiple Thermocouples Data Fusion. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Access ![In: IEEE Access 9, pp. 123566-123574, 2021. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP DOI BibTeX RDF |
|
26 | Denis Roio, Alberto Ibrisevic, Andrea D'Intino |
Reflow: Zero Knowledge Multi Party Signatures with Application to Distributed Authentication. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CoRR ![In: CoRR abs/2105.14527, 2021. The full citation details ...](Pics/full.jpeg) |
2021 |
DBLP BibTeX RDF |
|
26 | Irandokht Parviziomran, Shun Cao, Krishnaswami Srihari, Daehan Won |
Data-Driven Prediction Model of Components Shift during Reflow Process in Surface Mount Technology. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CoRR ![In: CoRR abs/2001.09619, 2020. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP BibTeX RDF |
|
26 | Tsutaru Kumagai, Hajime Arao, Hong C. Nguyen, Tetsuya Nakanishi |
2-Dimentional Fiber Array with Reflow Compatibility for High-Density Optical Interconnection. ![Search on Bibsonomy](Pics/bibsonomy.png) |
OFC ![In: Optical Fiber Communications Conference and Exhibition, OFC 2020, San Diego, CA, USA, March 8-12, 2020, pp. 1-3, 2020, IEEE, 978-1-9435-8071-2. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP BibTeX RDF |
|
26 | Thanat Sooknuan, Chanawat Phongklee, Wichupong Wiboonjaroen, Maitree Thumma, Pipatana Amatachaya |
Implementation the SoC of PCB Reflow Soldering. ![Search on Bibsonomy](Pics/bibsonomy.png) |
JCSSE ![In: 16th International Joint Conference on Computer Science and Software Engineering, JCSSE 2019, Chonburi, Thailand, July 10-12, 2019, pp. 385-388, 2019, IEEE, 978-1-7281-0719-6. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP DOI BibTeX RDF |
|
26 | Ho Jin Lee, Min-Won Seo, Jungho Yi, Jong-Mo Seo |
Stretchability enhancement of electronics according to the surface patterns fabricated by thermal reflow process. ![Search on Bibsonomy](Pics/bibsonomy.png) |
EMBC ![In: 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2019, Berlin, Germany, July 23-27, 2019, pp. 1282-1285, 2019, IEEE, 978-1-5386-1311-5. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP DOI BibTeX RDF |
|
26 | Srivalli Chellvarajoo, Mohd Zulkifly Abdullah |
Investigation on nano-reinforced solder paste after reflow soldering part 1: Effects of nano-reinforced solder paste on melting, hardness, spreading rate, and wetting quality. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 84, pp. 230-237, 2018. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
26 | Gyuhyeong Goh, Jun Ying Tan, Kyuseok K. S. Lee, Yoontae Kim, Jungkwun J. K. Kim |
Modeling and Fabrication of Timed-Development-and-Thermal-Reflow (TDTR) Process for Microlens. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NEMS ![In: 13th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2018, Singapore, Singapore, April 22-26, 2018, pp. 578-581, 2018, IEEE, 978-1-5386-5273-2. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
26 | Pawel Pawlowski, Adam Dabrowski, Marcin Grenz, Michal Bladowski |
Reflow Oven for Heating and Soldering SMD and BGA Components. ![Search on Bibsonomy](Pics/bibsonomy.png) |
MIXDES ![In: 25th International Conference `Mixed Design of Integrated Circuits and System`, MIXDES 2018, Gdynia, Poland, June 21-23, 2018, pp. 324-329, 2018, IEEE, 978-83-63578-14-5. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
26 | A. M. Najib, Mohd Zulkifly Abdullah, Abdullah Aziz Saad, Z. Samsudin, F. Che Ani |
Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 79, pp. 69-78, 2017. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
26 | Nguyen Van Toan, Shim Hahng, Yunheub Song, Takahito Ono |
Fabrication of Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducer Arrays Using Glass Reflow Process. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Micromachines ![In: Micromachines 7(5), pp. 76, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
26 | Nguyen Van Toan, Suguru Sangu, Takahito Ono |
Glass reflow process and its applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
NEMS ![In: 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016, Sendai, Japan, April 17-20, 2016, pp. 260-264, 2016, IEEE, 978-1-5090-1947-2. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
26 | I. Siti Rabiatull Aisha, A. Ourdjini, M. A. Azmah Hanim, O. Saliza Azlina |
Effect of reflow soldering profile on intermetallic compound formation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Int. J. Comput. Appl. Technol. ![In: Int. J. Comput. Appl. Technol. 52(4), pp. 244-250, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
26 | Olivér Krammer |
Modelling the self-alignment of passive chip components during reflow soldering. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 54(2), pp. 457-463, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
26 | Shu-Kai S. Fan, Yuan-Jung Chang, Nafy Aidara |
Nonlinear Profile Monitoring of Reflow Process Data Based on the Sum of Sine Functions. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Qual. Reliab. Eng. Int. ![In: Qual. Reliab. Eng. Int. 29(5), pp. 743-758, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
26 | Tong Hong Wang, Ching-I Tsai, Chang-Chi Lee, Yi-Shao Lai |
Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 53(2), pp. 297-302, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
26 | Sri Chaitra Chavali, Yuvraj Singh, Ganesh Subbarayan, Anurag Bansal, Mudasir Ahmad |
Effect of pad surface finish and reflow cooling rate on the microstructure and the mechanical behavior of SnAgCu solder alloys. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 53(6), pp. 892-898, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
26 | Yap Boon Kar, Tan Cai Hui, Ramasamy Agileswari, Calvin Lo |
Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 53(1), pp. 164-173, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
26 | Jun-Ku Kim, Chang-Wook Baek |
Capacitive pressure sensor with wafer-through silicon vias using SOI-Si direct wafer bonding and glass reflow technique. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEICE Electron. Express ![In: IEICE Electron. Express 10(15), pp. 20130453, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
26 | Rajorshi G. Choudhury, Arohi Kumar, Devesh Varshney, Prachi Jain, Varun Malhotra |
Context Sensitive Reflow of HTML Objects. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Web Intelligence ![In: 2013 IEEE/WIC/ACM International Conferences on Web Intelligence, WI 2013, Atlanta, GA, USA, November 17-20, 2013, pp. 147-153, 2013, IEEE Computer Society, 978-1-4799-2902-3. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
26 | Tsung-Nan Tsai |
Thermal parameters optimization of a reflow soldering profile in printed circuit board assembly: A comparative study. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Appl. Soft Comput. ![In: Appl. Soft Comput. 12(8), pp. 2601-2613, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
26 | Xu Zeng, Hong-Qi Sun, Yan-Feng He, Xin-Ping Qu |
Reflow discoloration formation on pure tin (Sn) surface finish. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(6), pp. 1153-1156, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
26 | Chun-Sean Lau, Mohd Zulkifly Abdullah, F. Che Ani |
Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(6), pp. 1143-1152, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
26 | Ming-Yi Tsai, C. W. Ting, C. Y. Huang, Yi-Shao Lai |
Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 51(3), pp. 642-648, 2011. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
26 | Saurabh Panjwani, Abhinav Uppal, Edward Cutrell |
Script-agnostic reflow of text in document images. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Mobile HCI ![In: Proceedings of the 13th Conference on Human-Computer Interaction with Mobile Devices and Services, Mobile HCI 2011, Stockholm, Sweden, August 30 - September 2, 2011, pp. 299-302, 2011, ACM, 978-1-4503-0541-9. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
26 | Johanna Virkki, Tomi Seppälä, Pasi Raumonen |
Testing the effects of reflow on tantalum capacitors. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 50(9-11), pp. 1650-1653, 2010. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
26 | Hu Guojun, Roberto Rossi, Jing-en Luan, Xavier Baraton |
Interface delamination analysis of TQFP package during solder reflow. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 50(7), pp. 1014-1020, 2010. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
26 | Balázs Illés, Gábor Harsányi |
3D thermal model to investigate component displacement phenomenon during reflow soldering. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 48(7), pp. 1062-1068, 2008. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
|
26 | C. K. Wong, John H. L. Pang, J. W. Tew, B. K. Lok, H. J. Lu, F. L. Ng, Y. F. Sun |
The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 48(4), pp. 611-621, 2008. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
|
26 | Se Young Yang, Young-Doo Jeon, Soon-Bok Lee, Kyung-Wook Paik |
Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(2-4), pp. 512-522, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
26 | Zhancheng Wang, Weimin Li, Hang Tong, Yangsheng Xu |
A Novel On-board Temperature Monitoring Approach in the Reflow Soldering Process. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IROS ![In: 2006 IEEE/RSJ International Conference on Intelligent Robots and Systems, IROS 2006, October 9-15, 2006, Beijing, China, pp. 4245-4251, 2006, IEEE, 1-4244-0258-1. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
26 | Tsung-Nan Tsai |
Development of an integrated reflow soldering control system using incremental hybrid process knowledge. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Expert Syst. Appl. ![In: Expert Syst. Appl. 28(4), pp. 681-692, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
|
26 | Tsung-Nan Tsai, Taho Yang, Pao-An Hou |
Neurofuzzy modelling of the reflow thermal profile for surface mount assembly. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Int. J. Syst. Sci. ![In: Int. J. Syst. Sci. 36(2), pp. 89-101, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
|
26 | Tong Yan Tee, Zhaowei Zhong |
Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 44(1), pp. 105-114, 2004. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
|
26 | Chi-Hui Chien, Yung-Chang Chen, Yii-Tay Chiou, Thaiping Chen, Chi-Chang Hsieh, Jia-Jin Yan, Wei-Zhi Chen, Yii-Der Wu |
Influences of the moisture absorption on PBGA package's warpage during IR reflow process. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 43(1), pp. 131-139, 2003. The full citation details ...](Pics/full.jpeg) |
2003 |
DBLP DOI BibTeX RDF |
|
26 | Chunyan Yin, M. O. Alam, Yan Cheong Chan, Chris Bailey 0001, Hua Lu 0003 |
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 43(4), pp. 625-633, 2003. The full citation details ...](Pics/full.jpeg) |
2003 |
DBLP DOI BibTeX RDF |
|
26 | Wei Huang, James M. Loman, Bülent Sener |
Study of the effect of reflow time and temperature on Cu-Sn intermetallic compound layer reliability. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 42(8), pp. 1229-1234, 2002. The full citation details ...](Pics/full.jpeg) |
2002 |
DBLP DOI BibTeX RDF |
|
26 | L. F. Miller |
Controlled collapse reflow chip joining. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IBM J. Res. Dev. ![In: IBM J. Res. Dev. 44(1), pp. 93-105, 2000. The full citation details ...](Pics/full.jpeg) |
2000 |
DBLP DOI BibTeX RDF |
|
26 | H. Victor Mahaney |
Thermal modeling of the infrared reflow process for Solder Ball Connect (SBC). ![Search on Bibsonomy](Pics/bibsonomy.png) |
IBM J. Res. Dev. ![In: IBM J. Res. Dev. 37(5), pp. 609-620, 1993. The full citation details ...](Pics/full.jpeg) |
1993 |
DBLP DOI BibTeX RDF |
|
25 | Leo A. Meyerovich, Rastislav Bodík |
Fast and parallel webpage layout. ![Search on Bibsonomy](Pics/bibsonomy.png) |
WWW ![In: Proceedings of the 19th International Conference on World Wide Web, WWW 2010, Raleigh, North Carolina, USA, April 26-30, 2010, pp. 711-720, 2010, ACM, 978-1-60558-799-8. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
box model, mobile, html, multicore, layout, attribute grammar, css, font, selector |
25 | Michael Shilman, Zile Wei |
Recognizing Freeform Digital Ink Annotations. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Document Analysis Systems ![In: Document Analysis Systems VI, 6th International Workshop, DAS 2004, Florence, Italy, September 8-10, 2004, Proceedings, pp. 322-331, 2004, Springer, 3-540-23060-2. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
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25 | Matthew R. B. Hardy, David F. Brailsford, Peter L. Thomas |
Creating structured PDF files using XML templates. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ACM Symposium on Document Engineering ![In: Proceedings of the 2004 ACM Symposium on Document Engineering, Milwaukee, Wisconsin, USA, October 28-30, 2004, pp. 99-108, 2004, ACM, 1-58113-938-1. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
logical structure insertion, XML, PDF |
25 | Matthew R. B. Hardy, David F. Brailsford |
Mapping and displaying structural transformations between XML and PDF. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ACM Symposium on Document Engineering ![In: Proceedings of the 2002 ACM Symposium on Document Engineering, McLean, Virginia, USA, November 8-9, 2002, pp. 95-102, 2002, ACM. The full citation details ...](Pics/full.jpeg) |
2002 |
DBLP DOI BibTeX RDF |
document structure transformation, XML, PDF |
25 | Robert C. Crida, Andrew J. Stoddart, John Illingworth |
Using PCA to Model Shape for Process Control. ![Search on Bibsonomy](Pics/bibsonomy.png) |
3DIM ![In: International Conference on Recent Advances in 3-D Digital Imaging and Modeling (3DIM '97), May 12-15, 1997, Ottawa, Ontario, Canada, pp. 318-325, 1997, IEEE Computer Society, 0-8186-7943-3. The full citation details ...](Pics/full.jpeg) |
1997 |
DBLP DOI BibTeX RDF |
surface mount components, solder paste, electrical connection, screen printing process, laser range scanner principal component analysis, solder paste shape, process control loop, shape analysis, process control, process control, shape modelling |
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