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Venues (Conferences, Journals, ...)
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GrowBag graphs for keyword ? (Num. hits/coverage)
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The graphs summarize 23 occurrences of 20 keywords
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Results
Found 62 publication records. Showing 62 according to the selection in the facets
| Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
| 131 | David Bargeron, Tomer Moscovich |
Reflowing digital ink annotations.  |
CHI  |
2003 |
DBLP DOI BibTeX RDF |
reflow, context, annotation, documents, handwriting recognition, digital ink, annotation system design |
| 33 | Vincent Chik, Beryl Plimmer, John G. Hosking |
Intelligent mind-mapping. |
OZCHI |
2007 |
DBLP DOI BibTeX RDF |
ink grouping, ink recognition, ink reflow, digital ink, mind-map |
| 26 | Siang Miang Yeo, Ho Kwang Yow, Keat Hoe Yeoh, Siti Nur Farhana Mohamad Azenal |
Elimination of Die-Pop Defect by Vacuum Reflow for Ultrathin Die With Warpage in Semiconductor Packaging Assembly. |
IEEE Trans. Reliab. |
2024 |
DBLP DOI BibTeX RDF |
|
| 26 | Syed Mujahid Abbas, Qiang Yu, Michael G. Pecht |
Influence of Substrate on Microvia Structures in Printed Circuit Boards During Reflow. |
IEEE Access |
2023 |
DBLP DOI BibTeX RDF |
|
| 26 | Bo-yang Li, Shi-you Lin, Li-sha Chen, Ming-yuan Zhao |
Temperature Curve of Reflow Furnace Based on Newton's Law of Cooling. |
Symmetry |
2023 |
DBLP DOI BibTeX RDF |
|
| 26 | Bubu Xie, Cai Chen, Yihao Lin, Dong Chen, Wei Huang, Kailin Pan, Yubing Gong |
Integrated Approach to Obtain Gas Flow Velocity in Convection Reflow Soldering Oven. |
Symmetry |
2023 |
DBLP DOI BibTeX RDF |
|
| 26 | Wenhao Guan, Qi Su, Haodong Zhou, Shiyu Miao, Xingjia Xie, Lin Li, Qingyang Hong |
ReFlow-TTS: A Rectified Flow Model for High-fidelity Text-to-Speech. |
CoRR |
2023 |
DBLP DOI BibTeX RDF |
|
| 26 | Przemyslaw Ignaciuk, Michal Morawski |
Price-Shaped Optimal Water Reflow in Prosumer Energy Cascade Hydro Plants. |
FedCSIS |
2023 |
DBLP DOI BibTeX RDF |
|
| 26 | Vivek Parmar, Sandeep Kaur Kingra, Deepak Verma, Digamber Pandey, Giuseppe Piccolboni, Alessandro Bricalli, Amir Regev, Gabriel Pares, Laurent Grenouillet, Jean-François Nodin, Manan Suri |
Demonstration of SMT-reflow Immune and SCA-resilient PUF on 28nm RRAM device array. |
IMW |
2023 |
DBLP DOI BibTeX RDF |
|
| 26 | Frode Eika Sandnes |
Towards "Image Reflow" on the Web: Avoiding Excessive Panning of Magnified Images by Multiplexing Automatically Cropped Regions of Interest. |
INTERACT (4) |
2023 |
DBLP DOI BibTeX RDF |
|
| 26 | Lau Hong Ming, Sujan Debnath, Mahzan Johar, Siti Faizah Mad Asasaari, Mohd Al Fatihhi Szali Januddi, Mohamad Shahrul Effendy Kosnan |
Effect of Solder Ball Geometry on Solder Joint Reliability under Solder Reflow Cooling Process. |
Int. J. Online Biomed. Eng. |
2022 |
DBLP DOI BibTeX RDF |
|
| 26 | Yuan Sui, Fanyang Bu, Zi-long Shao, Wei Yan |
Optimization simulation of reflow welding based on prediction of regional center temperature field. |
CoRR |
2022 |
DBLP DOI BibTeX RDF |
|
| 26 | Jason Wu 0001, Titus Barik, Xiaoyi Zhang 0006, Colin Lea, Jeffrey Nichols 0001, Jeffrey P. Bigham |
Reflow: Automatically Improving Touch Interactions in Mobile Applications through Pixel-based Refinements. |
CoRR |
2022 |
DBLP DOI BibTeX RDF |
|
| 26 | Lianxiang Deng, Xianming Zhao, Xiaolin Su, Mei Zhou, Daizheng Huang, Xiaocong Zeng |
Machine learning to predict no reflow and in-hospital mortality in patients with ST-segment elevation myocardial infarction that underwent primary percutaneous coronary intervention. |
BMC Medical Informatics Decis. Mak. |
2022 |
DBLP DOI BibTeX RDF |
|
| 26 | Rafael Luis Yanase de Rezende, João Paulo Coelho |
Modelling and Control of a Retrofitted Oven for SMD Reflow. |
OL2A |
2022 |
DBLP DOI BibTeX RDF |
|
| 26 | Fan Ye, Dayuan Jin, Yun Wan, Xin Xie |
The intelligent design of reflow soldering based on an improved high-dimensional surrogate assisted optimization method. |
ITQM |
2022 |
DBLP DOI BibTeX RDF |
|
| 26 | Frode Eika Sandnes |
Lost in OCR-Translation: Pixel-based Text Reflow to the Rescue: Magnification of Archival Raster Image Documents in the Browser without Horizontal Scrolling. |
PETRA |
2022 |
DBLP DOI BibTeX RDF |
|
| 26 | Geng Ma, Xiaoqing Huang, Shihao Liu |
Heat Transfer Modeling and Oven Temperature Curve Optimization of Integrated Circuit Board Reflow Soldering. |
IEEE Access |
2021 |
DBLP DOI BibTeX RDF |
|
| 26 | Tin Lun Lam |
Low-Cost Non-Contact PCBs Temperature Monitoring and Control in a Hot Air Reflow Process Based on Multiple Thermocouples Data Fusion. |
IEEE Access |
2021 |
DBLP DOI BibTeX RDF |
|
| 26 | Denis Roio, Alberto Ibrisevic, Andrea D'Intino |
Reflow: Zero Knowledge Multi Party Signatures with Application to Distributed Authentication. |
CoRR |
2021 |
DBLP BibTeX RDF |
|
| 26 | Irandokht Parviziomran, Shun Cao, Krishnaswami Srihari, Daehan Won |
Data-Driven Prediction Model of Components Shift during Reflow Process in Surface Mount Technology. |
CoRR |
2020 |
DBLP BibTeX RDF |
|
| 26 | Tsutaru Kumagai, Hajime Arao, Hong C. Nguyen, Tetsuya Nakanishi |
2-Dimentional Fiber Array with Reflow Compatibility for High-Density Optical Interconnection. |
OFC |
2020 |
DBLP BibTeX RDF |
|
| 26 | Thanat Sooknuan, Chanawat Phongklee, Wichupong Wiboonjaroen, Maitree Thumma, Pipatana Amatachaya |
Implementation the SoC of PCB Reflow Soldering. |
JCSSE |
2019 |
DBLP DOI BibTeX RDF |
|
| 26 | Ho Jin Lee, Min-Won Seo, Jungho Yi, Jong-Mo Seo |
Stretchability enhancement of electronics according to the surface patterns fabricated by thermal reflow process. |
EMBC |
2019 |
DBLP DOI BibTeX RDF |
|
| 26 | Srivalli Chellvarajoo, Mohd Zulkifly Abdullah |
Investigation on nano-reinforced solder paste after reflow soldering part 1: Effects of nano-reinforced solder paste on melting, hardness, spreading rate, and wetting quality. |
Microelectron. Reliab. |
2018 |
DBLP DOI BibTeX RDF |
|
| 26 | Gyuhyeong Goh, Jun Ying Tan, Kyuseok K. S. Lee, Yoontae Kim, Jungkwun J. K. Kim |
Modeling and Fabrication of Timed-Development-and-Thermal-Reflow (TDTR) Process for Microlens. |
NEMS |
2018 |
DBLP DOI BibTeX RDF |
|
| 26 | Pawel Pawlowski, Adam Dabrowski, Marcin Grenz, Michal Bladowski |
Reflow Oven for Heating and Soldering SMD and BGA Components. |
MIXDES |
2018 |
DBLP DOI BibTeX RDF |
|
| 26 | A. M. Najib, Mohd Zulkifly Abdullah, Abdullah Aziz Saad, Z. Samsudin, F. Che Ani |
Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering. |
Microelectron. Reliab. |
2017 |
DBLP DOI BibTeX RDF |
|
| 26 | Nguyen Van Toan, Shim Hahng, Yunheub Song, Takahito Ono |
Fabrication of Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducer Arrays Using Glass Reflow Process. |
Micromachines |
2016 |
DBLP DOI BibTeX RDF |
|
| 26 | Nguyen Van Toan, Suguru Sangu, Takahito Ono |
Glass reflow process and its applications. |
NEMS |
2016 |
DBLP DOI BibTeX RDF |
|
| 26 | I. Siti Rabiatull Aisha, A. Ourdjini, M. A. Azmah Hanim, O. Saliza Azlina |
Effect of reflow soldering profile on intermetallic compound formation. |
Int. J. Comput. Appl. Technol. |
2015 |
DBLP DOI BibTeX RDF |
|
| 26 | Olivér Krammer |
Modelling the self-alignment of passive chip components during reflow soldering. |
Microelectron. Reliab. |
2014 |
DBLP DOI BibTeX RDF |
|
| 26 | Shu-Kai S. Fan, Yuan-Jung Chang, Nafy Aidara |
Nonlinear Profile Monitoring of Reflow Process Data Based on the Sum of Sine Functions. |
Qual. Reliab. Eng. Int. |
2013 |
DBLP DOI BibTeX RDF |
|
| 26 | Tong Hong Wang, Ching-I Tsai, Chang-Chi Lee, Yi-Shao Lai |
Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile. |
Microelectron. Reliab. |
2013 |
DBLP DOI BibTeX RDF |
|
| 26 | Sri Chaitra Chavali, Yuvraj Singh, Ganesh Subbarayan, Anurag Bansal, Mudasir Ahmad |
Effect of pad surface finish and reflow cooling rate on the microstructure and the mechanical behavior of SnAgCu solder alloys. |
Microelectron. Reliab. |
2013 |
DBLP DOI BibTeX RDF |
|
| 26 | Yap Boon Kar, Tan Cai Hui, Ramasamy Agileswari, Calvin Lo |
Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests. |
Microelectron. Reliab. |
2013 |
DBLP DOI BibTeX RDF |
|
| 26 | Jun-Ku Kim, Chang-Wook Baek |
Capacitive pressure sensor with wafer-through silicon vias using SOI-Si direct wafer bonding and glass reflow technique. |
IEICE Electron. Express |
2013 |
DBLP DOI BibTeX RDF |
|
| 26 | Rajorshi G. Choudhury, Arohi Kumar, Devesh Varshney, Prachi Jain, Varun Malhotra |
Context Sensitive Reflow of HTML Objects. |
Web Intelligence |
2013 |
DBLP DOI BibTeX RDF |
|
| 26 | Tsung-Nan Tsai |
Thermal parameters optimization of a reflow soldering profile in printed circuit board assembly: A comparative study. |
Appl. Soft Comput. |
2012 |
DBLP DOI BibTeX RDF |
|
| 26 | Xu Zeng, Hong-Qi Sun, Yan-Feng He, Xin-Ping Qu |
Reflow discoloration formation on pure tin (Sn) surface finish. |
Microelectron. Reliab. |
2012 |
DBLP DOI BibTeX RDF |
|
| 26 | Chun-Sean Lau, Mohd Zulkifly Abdullah, F. Che Ani |
Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method. |
Microelectron. Reliab. |
2012 |
DBLP DOI BibTeX RDF |
|
| 26 | Ming-Yi Tsai, C. W. Ting, C. Y. Huang, Yi-Shao Lai |
Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes. |
Microelectron. Reliab. |
2011 |
DBLP DOI BibTeX RDF |
|
| 26 | Saurabh Panjwani, Abhinav Uppal, Edward Cutrell |
Script-agnostic reflow of text in document images. |
Mobile HCI |
2011 |
DBLP DOI BibTeX RDF |
|
| 26 | Johanna Virkki, Tomi Seppälä, Pasi Raumonen |
Testing the effects of reflow on tantalum capacitors. |
Microelectron. Reliab. |
2010 |
DBLP DOI BibTeX RDF |
|
| 26 | Hu Guojun, Roberto Rossi, Jing-en Luan, Xavier Baraton |
Interface delamination analysis of TQFP package during solder reflow. |
Microelectron. Reliab. |
2010 |
DBLP DOI BibTeX RDF |
|
| 26 | Balázs Illés, Gábor Harsányi |
3D thermal model to investigate component displacement phenomenon during reflow soldering. |
Microelectron. Reliab. |
2008 |
DBLP DOI BibTeX RDF |
|
| 26 | C. K. Wong, John H. L. Pang, J. W. Tew, B. K. Lok, H. J. Lu, F. L. Ng, Y. F. Sun |
The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging. |
Microelectron. Reliab. |
2008 |
DBLP DOI BibTeX RDF |
|
| 26 | Se Young Yang, Young-Doo Jeon, Soon-Bok Lee, Kyung-Wook Paik |
Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages. |
Microelectron. Reliab. |
2006 |
DBLP DOI BibTeX RDF |
|
| 26 | Zhancheng Wang, Weimin Li, Hang Tong, Yangsheng Xu |
A Novel On-board Temperature Monitoring Approach in the Reflow Soldering Process. |
IROS |
2006 |
DBLP DOI BibTeX RDF |
|
| 26 | Tsung-Nan Tsai |
Development of an integrated reflow soldering control system using incremental hybrid process knowledge. |
Expert Syst. Appl. |
2005 |
DBLP DOI BibTeX RDF |
|
| 26 | Tsung-Nan Tsai, Taho Yang, Pao-An Hou |
Neurofuzzy modelling of the reflow thermal profile for surface mount assembly. |
Int. J. Syst. Sci. |
2005 |
DBLP DOI BibTeX RDF |
|
| 26 | Tong Yan Tee, Zhaowei Zhong |
Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis. |
Microelectron. Reliab. |
2004 |
DBLP DOI BibTeX RDF |
|
| 26 | Chi-Hui Chien, Yung-Chang Chen, Yii-Tay Chiou, Thaiping Chen, Chi-Chang Hsieh, Jia-Jin Yan, Wei-Zhi Chen, Yii-Der Wu |
Influences of the moisture absorption on PBGA package's warpage during IR reflow process. |
Microelectron. Reliab. |
2003 |
DBLP DOI BibTeX RDF |
|
| 26 | Chunyan Yin, M. O. Alam, Yan Cheong Chan, Chris Bailey 0001, Hua Lu 0003 |
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. |
Microelectron. Reliab. |
2003 |
DBLP DOI BibTeX RDF |
|
| 26 | Wei Huang, James M. Loman, Bülent Sener |
Study of the effect of reflow time and temperature on Cu-Sn intermetallic compound layer reliability. |
Microelectron. Reliab. |
2002 |
DBLP DOI BibTeX RDF |
|
| 26 | L. F. Miller |
Controlled collapse reflow chip joining. |
IBM J. Res. Dev. |
2000 |
DBLP DOI BibTeX RDF |
|
| 26 | H. Victor Mahaney |
Thermal modeling of the infrared reflow process for Solder Ball Connect (SBC). |
IBM J. Res. Dev. |
1993 |
DBLP DOI BibTeX RDF |
|
| 25 | Leo A. Meyerovich, Rastislav Bodík |
Fast and parallel webpage layout. |
WWW |
2010 |
DBLP DOI BibTeX RDF |
box model, mobile, html, multicore, layout, attribute grammar, css, font, selector |
| 25 | Michael Shilman, Zile Wei |
Recognizing Freeform Digital Ink Annotations. |
Document Analysis Systems |
2004 |
DBLP DOI BibTeX RDF |
|
| 25 | Matthew R. B. Hardy, David F. Brailsford, Peter L. Thomas |
Creating structured PDF files using XML templates. |
ACM Symposium on Document Engineering |
2004 |
DBLP DOI BibTeX RDF |
logical structure insertion, XML, PDF |
| 25 | Matthew R. B. Hardy, David F. Brailsford |
Mapping and displaying structural transformations between XML and PDF. |
ACM Symposium on Document Engineering |
2002 |
DBLP DOI BibTeX RDF |
document structure transformation, XML, PDF |
| 25 | Robert C. Crida, Andrew J. Stoddart, John Illingworth |
Using PCA to Model Shape for Process Control. |
3DIM |
1997 |
DBLP DOI BibTeX RDF |
surface mount components, solder paste, electrical connection, screen printing process, laser range scanner principal component analysis, solder paste shape, process control loop, shape analysis, process control, process control, shape modelling |
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