Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
88 | Kuk Won Ko, Young Jun Roh, Hyung Suck Cho, Hyung Cheol Kim |
A Neural Network Approach to the Inspection of Ball Grid Array Solder Joints on Printed Circuit Boards. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IJCNN (5) ![In: Proceedings of the IEEE-INNS-ENNS International Joint Conference on Neural Networks, IJCNN 2000, Neural Computing: New Challenges and Perspectives for the New Millennium, Como, Italy, July 24-27, 2000, Volume 5, pp. 233-238, 2000, IEEE Computer Society. The full citation details ...](Pics/full.jpeg) |
2000 |
DBLP DOI BibTeX RDF |
|
83 | Oscar Montiel, Oscar Castillo 0001, Patricia Melin, Roberto Sepúlveda |
Application of a breeder genetic algorithm for filter optimization. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Nat. Comput. ![In: Nat. Comput. 4(1), pp. 11-37, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
breeder, BGA, evolutionary algorithm, system identification, GA |
53 | Atsushi Teramoto, Takayuki Murakoshi, Masatoshi Tsuzaka, Hiroshi Fujita 0001 |
Automated Solder Inspection Method by Means of X-ray Oblique Computed Tomography. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICIP (5) ![In: Proceedings of the International Conference on Image Processing, ICIP 2007, September 16-19, 2007, San Antonio, Texas, USA, pp. 433-436, 2007, IEEE, 978-1-4244-1436-9. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
48 | Man-Fai Yu, Joel Darnauer, Wayne Wei-Ming Dai |
Interchangeable pin routing with application to package layout. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICCAD ![In: Proceedings of the 1996 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 1996, San Jose, CA, USA, November 10-14, 1996, pp. 668-673, 1996, IEEE Computer Society / ACM, 0-8186-7597-7. The full citation details ...](Pics/full.jpeg) |
1996 |
DBLP DOI BibTeX RDF |
BGA, all-angle wiring, interchangeable pin routing, min-cost max-flow heuristic, multiple layers, octilinear wiring, package layout, pin redistribution, prerouted nets, rectilinear wiring, test fixture routing, triangulated routing network, CAD, NP-complete, ASIC, circuit layout CAD, speed, PGA, input output, routing problems |
47 | Joel A. Jorgenson, Russell J. Wagner |
Design-For-Test in a Multiple Substrate Multichip Module. ![Search on Bibsonomy](Pics/bibsonomy.png) |
J. Electron. Test. ![In: J. Electron. Test. 10(1-2), pp. 97-107, 1997. The full citation details ...](Pics/full.jpeg) |
1997 |
DBLP DOI BibTeX RDF |
Multichip Module (MCM) Test, Known-Good Die (KGD), Ball Grid Array (BGA), Built-In-Self-Test (BIST), boundary-scan |
35 | Wen-Hui Yang, Dao-Qing Dai, Hong Yan 0001 |
Feature Extraction and Uncorrelated Discriminant Analysis for High-Dimensional Data. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Knowl. Data Eng. ![In: IEEE Trans. Knowl. Data Eng. 20(5), pp. 601-614, 2008. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
Pattern Recognition, Feature extraction or construction |
35 | Yukiko Kubo, Atsushi Takahashi 0001 |
Global Routing by Iterative Improvements for Two-Layer Ball Grid Array Packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. ![In: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 25(4), pp. 725-733, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
35 | Yukiko Kubo, Atsushi Takahashi 0001 |
A global routing method for 2-layer ball grid array packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISPD ![In: Proceedings of the 2005 International Symposium on Physical Design, ISPD 2005, San Francisco, California, USA, April 3-6, 2005, pp. 36-43, 2005, ACM, 1-59593-021-3. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
2-layer routing, ball grid array, cost graph, heuristic, global routing, monotonic, greedy |
35 | Oscar Montiel, Oscar Castillo 0001, Patricia Melin, Roberto Sepúlveda |
Evolutionary Modeling Using A Wiener Model. ![Search on Bibsonomy](Pics/bibsonomy.png) |
WSC ![In: Applied Soft Computing Technologies: The Challenge of Complexity, Proceedings of the 9th Online World Conference on Soft Computing in Industrial Applications (WSC9), September 20th - October 8th, 2004, held on the World Wide Web, pp. 619-632, 2004, Springer, 978-3-540-31649-7. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
|
35 | Hans-Michael Voigt, Heinz Mühlenbein |
Erroneous Truncation Selection - A Breeder's Decision Making Perspective. ![Search on Bibsonomy](Pics/bibsonomy.png) |
PPSN ![In: Parallel Problem Solving from Nature - PPSN IV, International Conference on Evolutionary Computation. The 4th International Conference on Parallel Problem Solving from Nature, Berlin, Germany, September 22-26, 1996, Proceedings, pp. 276-285, 1996, Springer, 3-540-61723-X. The full citation details ...](Pics/full.jpeg) |
1996 |
DBLP DOI BibTeX RDF |
|
35 | Heinz Mühlenbein, Jürgen Bendisch, Hans-Michael Voigt |
From Recombination of Genes to the Estimation of Distributions II. Continuous Parameters. ![Search on Bibsonomy](Pics/bibsonomy.png) |
PPSN ![In: Parallel Problem Solving from Nature - PPSN IV, International Conference on Evolutionary Computation. The 4th International Conference on Parallel Problem Solving from Nature, Berlin, Germany, September 22-26, 1996, Proceedings, pp. 188-197, 1996, Springer, 3-540-61723-X. The full citation details ...](Pics/full.jpeg) |
1996 |
DBLP DOI BibTeX RDF |
|
35 | Dirk Schlierkamp-Voosen, Heinz Mühlenbein |
Strategy Adaption by Competing Subpopulations. ![Search on Bibsonomy](Pics/bibsonomy.png) |
PPSN ![In: Parallel Problem Solving from Nature - PPSN III, International Conference on Evolutionary Computation. The Third Conference on Parallel Problem Solving from Nature, Jerusalem, Israel, October 9-14, 1994, Proceedings, pp. 199-208, 1994, Springer, 3-540-58484-6. The full citation details ...](Pics/full.jpeg) |
1994 |
DBLP DOI BibTeX RDF |
breeder genetic algorithm, strategy adaptation, multiresolution search, competition |
30 | Rui Shi 0003, Chung-Kuan Cheng |
Efficient escape routing for hexagonal array of high density I/Os. ![Search on Bibsonomy](Pics/bibsonomy.png) |
DAC ![In: Proceedings of the 43rd Design Automation Conference, DAC 2006, San Francisco, CA, USA, July 24-28, 2006, pp. 1003-1008, 2006, ACM, 1-59593-381-6. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
BGA, flip chip, hexagonal array, escape routing |
25 | Lei Tang 0002, Kangrong Li, Xingshe Zhou 0001, Qiao Yang, Penghui Pan, Daowei Wu, Baoxia Li, Yanling Wang, Nailiang Kuang, Liaoliao Zhang |
Analytical equivalent circuit modeling and analysis of complex BGA for 3D silicon-interposer packaging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. J. ![In: Microelectron. J. 143, pp. 106027, January 2024. The full citation details ...](Pics/full.jpeg) |
2024 |
DBLP DOI BibTeX RDF |
|
25 | Chuantao Hou, Long Wang, Liang Cao, Guoqing Chen, Peng Cao, Jianru Wang |
Refined simulation method and failure study of BGA package structure based on image drive. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. J. ![In: Microelectron. J. 138, pp. 105844, 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
25 | Long Wang, Chuantao Hou, Junxing Zheng, Peng Cao, Jianru Wang |
Automated coplanarity inspection of BGA solder balls by structured light. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. J. ![In: Microelectron. J. 137, pp. 105802, 2023. The full citation details ...](Pics/full.jpeg) |
2023 |
DBLP DOI BibTeX RDF |
|
25 | S. Cong, W. W. Zhang, P. Liu, Y. N. Han, Y. H. Tian |
Process optimization for enhancing interconnect performance of large-size BGA component during vibration loading. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. J. ![In: Microelectron. J. 121, pp. 105383, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
25 | Yidong Yuan, Tianmeng Zhang, Ziren Wang, Kaixuan Song, Lingyu Bi, Lu Tian, Jinchun Gao |
Impact of ground solder ball failure in BGA package on near electric field radiation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEICE Electron. Express ![In: IEICE Electron. Express 19(17), pp. 20220313, 2022. The full citation details ...](Pics/full.jpeg) |
2022 |
DBLP DOI BibTeX RDF |
|
25 | Ceren Türer Akdeniz, Zümray Dokur, Tamer Ölmez |
Detection of BGA solder defects from X-ray images using deep neural network. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Turkish J. Electr. Eng. Comput. Sci. ![In: Turkish J. Electr. Eng. Comput. Sci. 28(4), pp. 2020-2029, 2020. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
25 | Jyun-Ru Jiang, Yun-Chih Kuo, Simon Yi-Hung Chen, Hung-Ming Chen |
On Pre-Assignment Route Prototyping for Irregular Bumps on BGA Packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
DATE ![In: 2020 Design, Automation & Test in Europe Conference & Exhibition, DATE 2020, Grenoble, France, March 9-13, 2020, pp. 1311-1314, 2020, IEEE, 978-3-9819263-4-7. The full citation details ...](Pics/full.jpeg) |
2020 |
DBLP DOI BibTeX RDF |
|
25 | Vikas Ahuja, Vijay Kumar Neeluru |
Robust BGA Void Detection Using Multi Directional Scan Algorithms. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CoRR ![In: CoRR abs/1909.00211, 2019. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP BibTeX RDF |
|
25 | Sandeep Mallampati, Zaeem Baig, Scott Pozder, Eng Chye Chua |
A Comparison of Environmental Stressing Data and Simulation at the Corner of a Test Chip in a FC-BGA Package. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IRPS ![In: IEEE International Reliability Physics Symposium, IRPS 2019, Monterey, CA, USA, March 31 - April 4, 2019, pp. 1-4, 2019, IEEE, 978-1-5386-9504-3. The full citation details ...](Pics/full.jpeg) |
2019 |
DBLP DOI BibTeX RDF |
|
25 | S. Pin, Alexandrine Guédon-Gracia, Jean-Yves Delétage, Hélène Frémont |
Creep measurement and choice of creep laws for BGA assemblies' reliability simulation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 88-90, pp. 1172-1176, 2018. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
25 | Jack Du |
Reliability Analysis for High-Density PCA After Multiple BGA Reworks. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICSRS ![In: 3rd International Conference on System Reliability and Safety, ICSRS 2018, Barcelona, Spain, November 23-25, 2018, pp. 192-198, 2018, IEEE, 978-1-7281-0238-2. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
25 | Pawel Pawlowski, Adam Dabrowski, Marcin Grenz, Michal Bladowski |
Reflow Oven for Heating and Soldering SMD and BGA Components. ![Search on Bibsonomy](Pics/bibsonomy.png) |
MIXDES ![In: 25th International Conference `Mixed Design of Integrated Circuits and System`, MIXDES 2018, Gdynia, Poland, June 21-23, 2018, pp. 324-329, 2018, IEEE, 978-83-63578-14-5. The full citation details ...](Pics/full.jpeg) |
2018 |
DBLP DOI BibTeX RDF |
|
25 | Hosung Lee, Sanghyeon Baeg, Nelson Hua, Shi-Jie Wen |
Temporal and frequency characteristic analysis of margin-related failures caused by an intermittent nano-scale fracture of the solder ball in a BGA package device. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 69, pp. 88-99, 2017. The full citation details ...](Pics/full.jpeg) |
2017 |
DBLP DOI BibTeX RDF |
|
25 | Tsung-Nan Tsai, Mika Liukkonen |
Robust parameter design for the micro-BGA stencil printing process using a fuzzy logic-based Taguchi method. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Appl. Soft Comput. ![In: Appl. Soft Comput. 48, pp. 124-136, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
25 | Aizat Abas, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, F. Che Ani, Soon Fuat Khor |
Lattice Boltzmann method study of bga bump arrangements on void formation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 56, pp. 170-181, 2016. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
25 | Christian Wittke, Zoya Dyka, Oliver Skibitzki, Peter Langendörfer |
Preparation of SCA Attacks: Successfully Decapsulating BGA Packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SECITC ![In: Innovative Security Solutions for Information Technology and Communications - 9th International Conference, SECITC 2016, Bucharest, Romania, June 9-10, 2016, Revised Selected Papers, pp. 240-247, 2016, 978-3-319-47237-9. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
25 | Ankur Gupta, Mayank Shrivastava, Maryam Shojaei Baghini, Harald Gossner, V. Ramgopal Rao |
A Fully-Integrated Radio-Frequency Power Amplifier in 28nm CMOS Technology Mounted in BGA Package. ![Search on Bibsonomy](Pics/bibsonomy.png) |
VLSID ![In: 29th International Conference on VLSI Design and 15th International Conference on Embedded Systems, VLSID 2016, Kolkata, India, January 4-8, 2016, pp. 156-161, 2016, IEEE Computer Society, 978-1-4673-8700-2. The full citation details ...](Pics/full.jpeg) |
2016 |
DBLP DOI BibTeX RDF |
|
25 | R. Alberti, Riccardo Enrici Vaion, A. Mervic, S. Testa |
Metal fatigue in copper pillar Flip Chip BGA: A refined acceleration model for the aluminium pad cracking failure mechanism. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 55(9-10), pp. 1838-1842, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
25 | Fang Liu, Ye Lu 0002, Zhen Wang, Zhiming Zhang |
Numerical simulation and fatigue life estimation of BGA packages under random vibration loading. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 55(12), pp. 2777-2785, 2015. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
25 | Somchai Nuanprasert, Sueki Baba, Takashi Suzuki |
An efficient method of occluded solder ball segmentation for automated BGA void defect inspection using X-ray images. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IECON ![In: IECON 2015 - 41st Annual Conference of the IEEE Industrial Electronics Society, Yokohama, Japan, November 9-12, 2015, pp. 3308-3313, 2015, IEEE, 978-1-4799-1762-4. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
25 | Li Wang 0058, Rui Ma 0003, Fei Lu 0004, Albert Z. Wang, Zongyu Dong, Xin Wang 0031, Chen Zhang 0017, Bin Zhao 0002, Siqiang Fan, He Tang |
Function-based ESD protection circuit design verification for BGA pad-ring array. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ASICON ![In: 2015 IEEE 11th International Conference on ASIC, ASICON 2015, Chengdu, China, November 3-6, 2015, pp. 1-4, 2015, IEEE, 978-1-4799-8483-1. The full citation details ...](Pics/full.jpeg) |
2015 |
DBLP DOI BibTeX RDF |
|
25 | Fang Liu, Guang Meng |
Random vibration reliability of BGA lead-free solder joint. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 54(1), pp. 226-232, 2014. The full citation details ...](Pics/full.jpeg) |
2014 |
DBLP DOI BibTeX RDF |
|
25 | Yao Yao 0003, Leon M. Keer |
Cohesive fracture mechanics based numerical analysis to BGA packaging and lead free solders under drop impact. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 53(4), pp. 629-637, 2013. The full citation details ...](Pics/full.jpeg) |
2013 |
DBLP DOI BibTeX RDF |
|
25 | Bo Wang, Jiajun Li, Anthony Gallagher, James Wrezel, Pongpinit Towashirporn, Naiqin Zhao |
Drop impact reliability of Sn-1.0Ag-0.5Cu BGA interconnects with different mounting methods. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(7), pp. 1475-1482, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
25 | Ming-Hung Shu, Bi-Min Hsu, Min-Chuan Hu |
Optimal combination of soldering conditions of BGA for halogen-free and lead-free SMT-green processes. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 52(11), pp. 2690-2700, 2012. The full citation details ...](Pics/full.jpeg) |
2012 |
DBLP DOI BibTeX RDF |
|
25 | Da Yu, Abdullah Al-Yafawi, Tung T. Nguyen, Seungbae Park, Soonwan Chung |
High-cycle fatigue life prediction for Pb-free BGA under random vibration loading. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 51(3), pp. 649-656, 2011. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
25 | Hsiu-Jen Lin, Tung-Han Chuang |
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 51(2), pp. 445-452, 2011. The full citation details ...](Pics/full.jpeg) |
2011 |
DBLP DOI BibTeX RDF |
|
25 | Tung T. Nguyen, Donggun Lee, Jae B. Kwak, Seungbae Park |
Effect of glue on reliability of flip chip BGA packages under thermal cycling. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 50(7), pp. 1000-1006, 2010. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
25 | Mei-Ling Wu, Donald Barker |
Rapid assessment of BGA life under vibration and bending, and influence of input parameter uncertainties. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 50(1), pp. 140-148, 2010. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
25 | John G. Taylor |
A roadmap for autonomous adaptive systems: The brain-guided attention (BGA) system. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IJCNN ![In: International Joint Conference on Neural Networks, IJCNN 2010, Barcelona, Spain, 18-23 July, 2010, pp. 1-8, 2010, IEEE, 978-1-4244-6916-1. The full citation details ...](Pics/full.jpeg) |
2010 |
DBLP DOI BibTeX RDF |
|
25 | Keiko Oda, Takahiro Matsubara, Kei-ichiro Watanabe, Kaori Tanaka, Maraki Maetani |
Optical Connection between Optical Via Hole in BGA Package and Optical Waveguide on Board. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEICE Trans. Electron. ![In: IEICE Trans. Electron. 92-C(2), pp. 239-246, 2009. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
|
25 | Bálint Sinkovics, Olivér Krammer |
Board level investigation of BGA solder joint deformation strength. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 49(6), pp. 573-578, 2009. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
|
25 | Liyu Yang, Joseph B. Bernstein, T. Koschmieder |
Assessment of acceleration models used for BGA solder joint reliability studies. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 49(12), pp. 1546-1554, 2009. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
|
25 | Fang Liu, Guang Meng, Mei Zhao, Jun feng Zhao |
Experimental and numerical analysis of BGA lead-free solder joint reliability under board-level drop impact. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 49(1), pp. 79-85, 2009. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
|
25 | Luigi Pietro Maria Colombo, Davide Paleari, Alexey Petrushin |
A Model of BGA Thermal Vias as an Example of Lumped Parameter Analysis in Thermal Modeling of SiPs and Stacked Die Packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Proc. IEEE ![In: Proc. IEEE 97(1), pp. 70-77, 2009. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
|
25 | Yih-Chih Chiou, Chern-Sheng Lin, Bor-Cheng Chiou |
The feature extraction and analysis of flaw detection and classification in BGA gold-plating areas. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Expert Syst. Appl. ![In: Expert Syst. Appl. 35(4), pp. 1771-1779, 2008. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
|
25 | Y. T. Chin, P. K. Lam, H. K. Yow, Teck Yong Tou |
Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 48(7), pp. 1079-1086, 2008. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
|
25 | N. Roth, Wolfgang Wondrak, A. Willikens, James Hofmeister |
Ball grid array (BGA) solder joint intermittency real-time detection. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 48(8-9), pp. 1155-1160, 2008. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
|
25 | Jong-Woong Kim, Jin-Kyu Jang, Sang-Ok Ha, Sang-Su Ha, Dae-Gon Kim, Seung-Boo Jung |
Effect of high-speed loading conditions on the fracture mode of the BGA solder joint. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 48(11-12), pp. 1882-1889, 2008. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
|
25 | W. D. van Driel, A. Mavinkurve, Marcel A. J. van Gils, G. Q. Zhang |
Advanced structural similarity rules for the BGA package family. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 47(2-3), pp. 205-214, 2007. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
25 | Ja-Myeong Koo, Seung-Boo Jung |
Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 47(12), pp. 2169-2178, 2007. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
25 | Xin Qu, Zhaoyi Chen, Bo Qi, Taekoo Lee, Jiaji Wang |
Board level drop test and simulation of leaded and lead-free BGA-PCB assembly. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 47(12), pp. 2197-2204, 2007. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
25 | Hongxia Gao, Yueming Hu 0002, Haiming Liu 0003, Xiaosheng Fang |
A Fast Method for Detecting and Locating BGA Based on Twice Grading and Linking Technique. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISIC ![In: 22nd IEEE International Symposium on Intelligent Control, ISIC 2007, Singapore, October 1-3, 2007, pp. 375-378, 2007, IEEE, 978-1-4244-0441-4. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
25 | Jun Gao |
Machine-Vision-Based Measurement of BGA Connector Solder Balls. ![Search on Bibsonomy](Pics/bibsonomy.png) |
SNPD (2) ![In: Proceedings of the 8th ACIS International Conference on Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing, SNPD 2007, July 30 - August 1, 2007, Qingdao, China, pp. 177-180, 2007, IEEE Computer Society, 0-7695-2909-7. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
25 | Ming-Kun Chen, Cheng-Chi Tai, Yu-Jung Huang |
Nondestructive analysis of interconnection in two-die BGA using TDR. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Instrum. Meas. ![In: IEEE Trans. Instrum. Meas. 55(2), pp. 400-405, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
25 | Xia Liu, Valmiki K. Sooklal, Melody A. Verges, Michael C. Larson |
Experimental study and life prediction on high cycle vibration fatigue in BGA packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(7), pp. 1128-1138, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
25 | Ming-Yi Tsai, W. C. Chiang, T. M. Liu, G. H. Hsu |
Thermal deformation measurements and predictions of MAP-BGA electronic packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(2-4), pp. 476-486, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
25 | Tong Yan Tee, Hun Shen Ng, Zhaowei Zhong |
Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(12), pp. 2131-2138, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
25 | YoungBae Kim, Hiroshi Noguchi, Masazumi Amagai |
Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb-Sn solder. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(2-4), pp. 459-466, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
25 | T. Kangasvieri, Olli Nousiainen, Jussi Putaala, Risto Rautioaho, J. Vähäkangas |
Reliability and RF performance of BGA solder joints with plastic-core solder balls in LTCC/PWB assemblies. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(8), pp. 1335-1347, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
25 | Dong-Jun Lee, Hyo S. Lee |
Major factors to the solder joint strength of ENIG layer in FC BGA package. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(7), pp. 1119-1127, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
25 | Bruno Foucher, J. Tomas, F. Mounsi, M. Jeremias |
Life margin assessment with Physics of Failure Tools application to BGA packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 46(5-6), pp. 1013-1018, 2006. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
25 | Alexandrine Guédon-Gracia, Eric Woirgard, Christian Zardini |
Correlation between Experimental Results and FE Simulations to Evaluate Lead-Free BGA Assembly Reliability. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 45(9-11), pp. 1652-1657, 2005. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
|
25 | Tong Yan Tee, Zhaowei Zhong |
Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 44(12), pp. 1957-1965, 2004. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
|
25 | Wen-Yu Lo, Ming-Dou Ker |
Analysis and Prevention on NC-ball induced ESD Damages in a 683-Pin BGA Packaged Chipset IC. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 43(9-11), pp. 1583-1588, 2003. The full citation details ...](Pics/full.jpeg) |
2003 |
DBLP DOI BibTeX RDF |
|
25 | Yuko Sawada, Kozo Harada, Hirofumi Fujioka |
Study of package warp behavior for high-performance flip-chip BGA. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 43(3), pp. 465-471, 2003. The full citation details ...](Pics/full.jpeg) |
2003 |
DBLP DOI BibTeX RDF |
|
25 | Reza Ghaffarian |
Qualification approaches and thermal cycle test results for CSP/BGA/FCBGA. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 43(5), pp. 695-706, 2003. The full citation details ...](Pics/full.jpeg) |
2003 |
DBLP DOI BibTeX RDF |
|
25 | Mohammad Yunus, K. Srihari, James M. Pitarresi, Anthony Primavera |
Effect of voids on the reliability of BGA/CSP solder joints. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 43(12), pp. 2077-2086, 2003. The full citation details ...](Pics/full.jpeg) |
2003 |
DBLP DOI BibTeX RDF |
|
25 | Jean-Yves Delétage, F. J.-M. Verdier, Bernard Plano, Yannick Deshayes, Laurent Béchou, Yves Danto |
Reliability estimation of BGA and CSP assemblies using degradation law model and technological parameters deviations. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 43(7), pp. 1137-1144, 2003. The full citation details ...](Pics/full.jpeg) |
2003 |
DBLP DOI BibTeX RDF |
|
25 | Chi-Wei Ruo, Ching-Long Shih |
Locating and checking of a BGA pin's position using gray level. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICRA ![In: Proceedings of the 2003 IEEE International Conference on Robotics and Automation, ICRA 2003, September 14-19, 2003, Taipei, Taiwan, pp. 3523-3528, 2003, IEEE. The full citation details ...](Pics/full.jpeg) |
2003 |
DBLP DOI BibTeX RDF |
|
25 | Rich Evans |
A Package Design Perspective, "It will be BGA and Flip-Chip". ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISQED ![In: 4th International Symposium on Quality of Electronic Design (ISQED 2003), 24-26 March 2003, San Jose, CA, USA, pp. 11, 2003, IEEE Computer Society, 0-7695-1881-8. The full citation details ...](Pics/full.jpeg) |
2003 |
DBLP DOI BibTeX RDF |
|
25 | Kinuko Mishiro, Shigeo Ishikawa, Mitsunori Abe, Toshio Kumai, Yutaka Higashiguchi, Ken-ichiro Tsubone |
Effect of the drop impact on BGA/CSP package reliability. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 42(1), pp. 77-82, 2002. The full citation details ...](Pics/full.jpeg) |
2002 |
DBLP DOI BibTeX RDF |
|
25 | Huimin Xie, Anand K. Asundi, Chai Gin Boay, Lu Yunguang, Jin Yu, Zhaowei Zhong, Bryan K. A. Ngoi |
High resolution AFM scanning Moiré method and its application to the micro-deformation in the BGA electronic package. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 42(8), pp. 1219-1227, 2002. The full citation details ...](Pics/full.jpeg) |
2002 |
DBLP DOI BibTeX RDF |
|
25 | Y. C. Chan, P. L. Tu, K. C. Hung |
Study of the self-alignment of no-flow underfill for micro-BGA assembly. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 41(11), pp. 1867-1875, 2001. The full citation details ...](Pics/full.jpeg) |
2001 |
DBLP DOI BibTeX RDF |
|
25 | Valentin Videkov, Slavka Tzanova, Radosvet Arnaudov, Nikolai Iordanov |
New assembling technique for BGA packages without thermal processes. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 41(4), pp. 611-615, 2001. The full citation details ...](Pics/full.jpeg) |
2001 |
DBLP DOI BibTeX RDF |
|
25 | P. L. Tu, Y. C. Chan, K. C. Hung, J. K. L. Lai |
Study of micro-BGA solder joint reliability. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 41(2), pp. 287-293, 2001. The full citation details ...](Pics/full.jpeg) |
2001 |
DBLP DOI BibTeX RDF |
|
25 | Quan Qi |
Reliability studies of two flip-chip BGA packages using power cycling test. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Microelectron. Reliab. ![In: Microelectron. Reliab. 41(4), pp. 553-562, 2001. The full citation details ...](Pics/full.jpeg) |
2001 |
DBLP DOI BibTeX RDF |
|
25 | Ulrich Bartling, Heinz Mühlenbein |
Optimization of Large Scale Parcel Distribution Systems by the Breeder Genetic Algorithm (BGA). ![Search on Bibsonomy](Pics/bibsonomy.png) |
ICGA ![In: Proceedings of the 7th International Conference on Genetic Algorithms, East Lansing, MI, USA, July 19-23, 1997, pp. 473-480, 1997, Morgan Kaufmann. The full citation details ...](Pics/full.jpeg) |
1997 |
DBLP BibTeX RDF |
|
25 | Heinz Mühlenbein, Dirk Schlierkamp-Voosen |
The Science of Breeding and Its Application to the Breeder Genetic Algorithm (BGA). ![Search on Bibsonomy](Pics/bibsonomy.png) |
Evol. Comput. ![In: Evol. Comput. 1(4), pp. 335-360, 1993. The full citation details ...](Pics/full.jpeg) |
1993 |
DBLP DOI BibTeX RDF |
|
18 | Jin-Tai Yan, Zhi-Wei Chen |
IO connection assignment and RDL routing for flip-chip designs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ASP-DAC ![In: Proceedings of the 14th Asia South Pacific Design Automation Conference, ASP-DAC 2009, Yokohama, Japan, January 19-22, 2009, pp. 588-593, 2009, IEEE, 978-1-4244-2748-2. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
|
18 | Jin-Tai Yan, Zhi-Wei Chen |
RDL pre-assignment routing for flip-chip designs. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ACM Great Lakes Symposium on VLSI ![In: Proceedings of the 19th ACM Great Lakes Symposium on VLSI 2009, Boston Area, MA, USA, May 10-12 2009, pp. 401-404, 2009, ACM, 978-1-60558-522-2. The full citation details ...](Pics/full.jpeg) |
2009 |
DBLP DOI BibTeX RDF |
RDL routing, flip-chip design, routability, wirelength |
18 | Sertac Cinel, Cüneyt F. Bazlamaçci |
A Distributed Heuristic Algorithm for the Rectilinear Steiner Minimal Tree Problem. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. ![In: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 27(11), pp. 2083-2087, 2008. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
|
18 | Hong Liu 0002, Ke Wu, Peter Meusel, Nikolaus Seitz, Gerd Hirzinger, M. H. Jin, Yiwei Liu, Shaowei Fan, T. Lan, Zhaopeng Chen |
Multisensory five-finger dexterous hand: The DLR/HIT Hand II. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IROS ![In: 2008 IEEE/RSJ International Conference on Intelligent Robots and Systems, September 22-26, 2008, Acropolis Convention Center, Nice, France, pp. 3692-3697, 2008, IEEE, 978-1-4244-2057-5. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
|
18 | Farah Mohammadi 0001, Mohsen Marami |
Dynamic compact thermal model of a package. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISCAS ![In: International Symposium on Circuits and Systems (ISCAS 2008), 18-21 May 2008, Sheraton Seattle Hotel, Seattle, Washington, USA, pp. 2869-2872, 2008, IEEE, 978-1-4244-1683-7. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
|
18 | Dongchul Kim, Taehoon Kim, Jung-A Lee, Yungseon Eo |
Experimental Characterisations of Coupled Transmission Lines. ![Search on Bibsonomy](Pics/bibsonomy.png) |
DELTA ![In: 4th IEEE International Symposium on Electronic Design, Test and Applications, DELTA 2008, Hong Kong, January 23-25, 2008, pp. 262-265, 2008, IEEE Computer Society, 978-0-7695-3110-6. The full citation details ...](Pics/full.jpeg) |
2008 |
DBLP DOI BibTeX RDF |
interconnect lines, signal transient, crosstalk, transmission line, s-parameters |
18 | Zhiwei Lin 0001, A. Benjamin Premkumar, A. S. Madhukumar |
Receive antenna selection for MIMO-SM systems with linear MMSE receivers in the presence of unknown interference. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Trans. Wirel. Commun. ![In: IEEE Trans. Wirel. Commun. 6(2), pp. 417-422, 2007. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
18 | Hui Liu, Zixing Cai, Yong Wang 0002 |
A new constrained optimization evolutionary algorithm by using good point set. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IEEE Congress on Evolutionary Computation ![In: Proceedings of the IEEE Congress on Evolutionary Computation, CEC 2007, 25-28 September 2007, Singapore, pp. 1247-1254, 2007, IEEE, 978-1-4244-1339-3. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
18 | Ren-Jie Lee, Ming-Fang Lai, Hung-Ming Chen |
Fast Flip-Chip Pin-Out Designation Respin by Pin-Block Design and Floorplanning for Package-Board Codesign. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ASP-DAC ![In: Proceedings of the 12th Conference on Asia South Pacific Design Automation, ASP-DAC 2007, Yokohama, Japan, January 23-26, 2007, pp. 804-809, 2007, IEEE Computer Society, 1-4244-0629-3. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
18 | Hyunsik Kim, Yungseon Eo |
High-Frequency-Measurement-Based Frequency-Variant Transmission Line Characterization and Circuit Modeling for Accurate Signal Integrity Verification. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISQED ![In: 8th International Symposium on Quality of Electronic Design (ISQED 2007), 26-28 March 2007, San Jose, CA, USA, pp. 507-512, 2007, IEEE Computer Society, 978-0-7695-2795-6. The full citation details ...](Pics/full.jpeg) |
2007 |
DBLP DOI BibTeX RDF |
|
18 | Mohammed Bougataya, Ahmed Lakhsasi, Daniel Massicotte |
Steady State Thermo-mechanical Stress Prediction for Large VLSI circuits using GDS Method. ![Search on Bibsonomy](Pics/bibsonomy.png) |
CCECE ![In: Proceedings of the Canadian Conference on Electrical and Computer Engineering, CCECE 2006, May 7-10, 2006, Ottawa Congress Centre, Ottawa, Canada, pp. 1205-1209, 2006, IEEE, 1-4244-0038-4. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
18 | Snehashis Roy, Sukumar Jairam, H. Udayakumar |
A Methodology for Switching Activity Based IO Powerpad Optimisation. ![Search on Bibsonomy](Pics/bibsonomy.png) |
VLSI Design ![In: 19th International Conference on VLSI Design (VLSI Design 2006), 3-7 January 2006, Hyderabad, India, pp. 794-797, 2006, IEEE Computer Society, 0-7695-2502-4. The full citation details ...](Pics/full.jpeg) |
2006 |
DBLP DOI BibTeX RDF |
|
18 | David Minor, Shmuel Rippa |
GRAPE - An Industrial Distributed System for Computer Vision. ![Search on Bibsonomy](Pics/bibsonomy.png) |
IPDPS ![In: 19th International Parallel and Distributed Processing Symposium (IPDPS 2005), CD-ROM / Abstracts Proceedings, 4-8 April 2005, Denver, CO, USA, 2005, IEEE Computer Society, 0-7695-2312-9. The full citation details ...](Pics/full.jpeg) |
2005 |
DBLP DOI BibTeX RDF |
|
18 | Roderick P. Cruz |
Flip Chip Advanced Package Solder Joint Embrittlement Fault Isolation Using TDR. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISQED ![In: 5th International Symposium on Quality of Electronic Design (ISQED 2004), 22-24 March 2004, San Jose, CA, USA, pp. 190-195, 2004, IEEE Computer Society, 0-7695-2093-6. The full citation details ...](Pics/full.jpeg) |
2004 |
DBLP DOI BibTeX RDF |
|
18 | George Lykakis, N. Mouratidis, Kyriakos Vlachos, Nikos A. Nikolaou, Stylianos Perissakis, G. Sourdis, George E. Konstantoulakis, Dionisios N. Pnevmatikatos, Dionisios I. Reisis |
Efficient Field Processing Cores in an Innovative Protocol Processor System-on-Chip. ![Search on Bibsonomy](Pics/bibsonomy.png) |
DATE ![In: 2003 Design, Automation and Test in Europe Conference and Exposition (DATE 2003), 3-7 March 2003, Munich, Germany, pp. 20014-20019, 2003, IEEE Computer Society, 0-7695-1870-2. The full citation details ...](Pics/full.jpeg) |
2003 |
DBLP DOI BibTeX RDF |
|
18 | Myung Hee Kim, Hyunseung Choo, Byung Ho Yae, Jonghyun Lee |
A Practical RWA Algorithm Based on Lookup Table for Edge Disjoint Paths. ![Search on Bibsonomy](Pics/bibsonomy.png) |
Human.Society@Internet 2003 ![In: Web Communication Technologies and Internet-Related Social Issues - HSI 2003, Second International Conference on Human Society@Internet, Seoul, Korea, June 18-20, 2003, Proceedings, pp. 138-147, 2003, Springer, 3-540-40456-2. The full citation details ...](Pics/full.jpeg) |
2003 |
DBLP DOI BibTeX RDF |
|
18 | Sangman Moh, Kyoung Park, Sungnam Kim |
KinCA: An InfiniBand Host Channel Adapter Based on Dual Processor Cores. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ISCIS ![In: Computer and Information Sciences - ISCIS 2003, 18th International Symposium, Antalya, Turkey, November 3-5, 2003, Proceedings, pp. 83-90, 2003, Springer, 3-540-20409-1. The full citation details ...](Pics/full.jpeg) |
2003 |
DBLP DOI BibTeX RDF |
|
18 | Leon van de Logt, Frank van der Heyden, Tom Waayers |
An extension to JTAG for at-speed debug on a system. ![Search on Bibsonomy](Pics/bibsonomy.png) |
ITC ![In: Proceedings 2003 International Test Conference (ITC 2003), Breaking Test Interface Bottlenecks, 28 September - 3 October 2003, Charlotte, NC, USA, pp. 785-792, 2003, IEEE Computer Society, 0-7803-8106-8. The full citation details ...](Pics/full.jpeg) |
2003 |
DBLP DOI BibTeX RDF |
|