Search results for "copper"

Hits ?▲	Authors	Title	Venue	Year	Link	Author keywords
92	Valeriy Sukharev	Physically based simulation of electromigration-induced degradation mechanisms in dual-inlaid copper interconnects.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2005	DBLP DOI BibTeX RDF
66	Lixin Dong, Xinyong Tao, Li Zhang 0010, Xiaobin Zhang, Bradley J. Nelson	Nanorobotic Spot Welding by Attogram Precision Metal Deposition from Copper-filled Carbon Nanotubes.	ICRA	2007	DBLP DOI BibTeX RDF
55	Cemal Basaran, Minghui Lin, Shidong Li	Computational simulation of electromigration induced damage in copper interconnects.	SCSC	2007	DBLP BibTeX RDF	copper interconnects, damage mechanics, electronics packaging reliability, thin film, electromigration
53	N. S. Nagaraj, Tom Bonifield, Abha Singh, Roger Griesmer, Poras T. Balsara	Interconnect Modeling for Copper/Low-k Technologies.	VLSI Design	2004	DBLP DOI BibTeX RDF
53	Gyun-Tack Bae, Randall W. Hall	Density Functional Calculation of the Structure and Electronic Properties of CunOn (n=1-4) Clusters.	ICCS (2)	2009	DBLP DOI BibTeX RDF	copper oxide clusters, Density functional theory
42	Bipin Rajendran, Pawan Kapur, Krishna Saraswat, R. Fabian W. Pease	Self-consistent power/performance/reliability analysis for copper interconnects.	SLIP	2004	DBLP DOI BibTeX RDF	Joule heating, copper interconnects, rent's rule, electromigration, duty cycle, current density
42	Li-Fu Chang, Keh-Jeng Chang, Robert Mathews	Simulating frequency-dependent current distribution for inductance modeling of on-chip copper interconnects.	ISPD	2000	DBLP DOI BibTeX RDF	cladding material, copper interconnect, electromagnetic field solvers, skin-effect current distribution
41	Andrés Bustillo, Javier Sedano, José Ramón Villar 0001, Leticia Curiel, Emilio Corchado	AI for Modelling the Laser Milling of Copper Components.	IDEAL	2008	DBLP DOI BibTeX RDF
41	Yongru Gu, Keshab K. Parhi	Interleaved Trellis Coded Modulation and Decoder Optimizations for 10 Gigabit Ethernet over Copper.	J. VLSI Signal Process.	2006	DBLP DOI BibTeX RDF	trellis coded modulation, 10 Gigabit ethernet, interleaving, high speed, complexity reduction
41	Timothy Read, Elena Bárcena, Beatriz Barros, Raquel Varela, Jesús Pancorbo	COPPER: Modeling User Linguistic Production Competence in an Adaptive Collaborative Environment.	User Modeling	2005	DBLP DOI BibTeX RDF
41	Stephen Bates, Kris Iniewski	10 GBPS over Copper Lines - State of the Art in VLSI, invited.	IWSOC	2005	DBLP DOI BibTeX RDF	10GBASE-T, 10GBASE-X, Data Communications, LDPC
41	Paul Gray, Anthony Betz	Performance Evaluation of Copper-Based Gigabit Ethernet Interfaces.	LCN	2002	DBLP DOI BibTeX RDF
39	Kaustav Banerjee	Graphene based nanomaterials for VLSI interconnect and energy-storage applications.	SLIP	2009	DBLP DOI BibTeX RDF	carbon nanomaterials, graphene nano-ribbons, interconnects, carbon nanotubes, passives
39	Tamer Ragheb, Yehia Massoud	On the modeling of resistance in graphene nanoribbon (GNR) for future interconnect applications.	ICCAD	2008	DBLP DOI BibTeX RDF
39	Soumya Eachempati, Arthur Nieuwoudt, Aman Gayasen, Narayanan Vijaykrishnan, Yehia Massoud	Assessing carbon nanotube bundle interconnect for future FPGA architectures.	DATE	2007	DBLP DOI BibTeX RDF
39	Yehia Massoud, Arthur Nieuwoudt	Modeling and design challenges and solutions for carbon nanotube-based interconnect in future high performance integrated circuits.	ACM J. Emerg. Technol. Comput. Syst.	2006	DBLP DOI BibTeX RDF	nanotube bundle, interconnect, inductance, Carbon nanotube, resistance
39	Hiroshi Natsu, Jesús Favela, Alberto L. Morán, Dominique Decouchant, Ana María Martínez Enríquez	Distributed Pair Programming on the Web.	ENC	2003	DBLP DOI BibTeX RDF
39	David R. Engebretsen, Daniel M. Kuchta, Richard C. Booth, John D. Crow, Wayne G. Nation	Parallel Fiber-Optic SCI Links.	IEEE Micro	1996	DBLP DOI BibTeX RDF	fiber optics, SCI-Link (Scalable Coherent Interface-Link), Parallel processing, interconnects
35	Cathryn Copper, Sara Eddin	Breaking Barriers: How Libraries Can Better Support Female Architecture Students for Professional Success.	Coll. Res. Libr.	2023	DBLP DOI BibTeX RDF
35	Yoon Chung Han, Rebecca Allen, Colette Bangert, Darcy Gerbarg, Copper Frances Giloth, Barbara Nessim, Joan Truckenbrod, Jane Veeder	Retrospective of Female Digital Art Pioneers.	SIGGRAPH Art Gallery	2023	DBLP DOI BibTeX RDF
35	Jeremy E. Viny, Lucy Copper, Audrey Desjardins	Examining Opaque Infrastructures with the Desktop Odometer.	Conference on Designing Interactive Systems	2021	DBLP DOI BibTeX RDF
35	Copper Frances Giloth, Jonathan Tanant	VR in the garden: The Labyrinthe of Versailles revisited.	VSMM	2017	DBLP DOI BibTeX RDF
35	Copper Frances Giloth, Jonathan Tanant	User experiences in three approaches to a visit to a 3D Labyrinthe of Versailles.	DigitalHERITAGE (1)	2015	DBLP DOI BibTeX RDF
35	Copper Frances Giloth, Jonathan Tanant	An immersive labyrinth.	VR	2015	DBLP DOI BibTeX RDF
35	Jenna Copper, George Semich	YouTube as a Teacher Training Tool: Information and Communication Technology as a Delivery Instrument for Professional Development.	Int. J. Inf. Commun. Technol. Educ.	2014	DBLP DOI BibTeX RDF
35	Copper Frances Giloth, Jonathan Tanant	Reconstitution of the Labyrinthe of Versailles as a Mobile App.	IV	2014	DBLP DOI BibTeX RDF
35	Copper Frances Giloth, Jonathan Tanant	Labyrinth at Versailles: Imaginary Spaces.	IV	2014	DBLP DOI BibTeX RDF
35	Alain Fuser, Florent Fontaine, Jack Copper	Data Quality, Consistency, and Interpretation Management for Wind Farms by Using Neural Networks.	IPDPS Workshops	2014	DBLP DOI BibTeX RDF
35	Copper Frances Giloth	Sunday morning at the City Hall Doors/Dimanche Matin aux Portes d'Hôtel de Ville.	SIGGRAPH Art Gallery	2007	DBLP DOI BibTeX RDF
35	Copper Frances Giloth	Looking back 25 years: SIGGRAPH 82 art show.	SIGGRAPH Art Gallery	2007	DBLP DOI BibTeX RDF
35	Copper Frances Giloth	Alphabet word gestures: 1243.	SIGGRAPH Teapot	2006	DBLP DOI BibTeX RDF
35	Copper Frances Giloth	Alphabet word gestures: all.	SIGGRAPH Teapot	2006	DBLP DOI BibTeX RDF
35	Copper Frances Giloth	Alphabet word gestures: 1243-231.	SIGGRAPH Teapot	2006	DBLP DOI BibTeX RDF
35	Hai Hu, S. B. Somiari, J. Copper, R. D. Everly, C. Heckman, Rick Jordan, R. Somiari, Jeffrey Hooke, Craig D. Shriver, Michael N. Liebman	Can Circulating Matrix Metalloproteinases Be Predictors of Breast Cancer? A Neural Network Modeling Study.	ICNC (1)	2005	DBLP DOI BibTeX RDF
35	Linda Z. Copper	Cross-cultural preference of visual information in primary school ESL children.	ASIST	2002	DBLP DOI BibTeX RDF
35	Copper Giloth	Skippy peanut butter jars, 1980.	SIGGRAPH Electronic Art and Animation Catalog	1998	DBLP DOI BibTeX RDF
35	Copper Giloth	Thirdperson, 1994.	SIGGRAPH Electronic Art and Animation Catalog	1998	DBLP DOI BibTeX RDF
35	Copper Giloth, Jane Veeder	The Paint Problem.	IEEE Computer Graphics and Applications	1985	DBLP DOI BibTeX RDF
35	Albert N. Copper III, John P. Kearns	Real-Time Distributed Control with Asynchronous Message Reception.	RTSS	1985	DBLP BibTeX RDF
30	Raofeng Guo, Chin-Chao Hung, Zong-Han Lin, Wei-Ting Chen	Relationship Assessment of COVID-19, Air Pollution, and Copper Demand from the Perspective of Copper Price.	Axioms	2022	DBLP DOI BibTeX RDF
30	Fredrik Orädd, Jonas Hyld Steffen, Pontus Gourdon, Magnus Andersson	Copper binding leads to increased dynamics in the regulatory N-terminal domain of full-length human copper transporter ATP7B.	PLoS Comput. Biol.	2022	DBLP DOI BibTeX RDF
30	Mohammad Al Ktash, Mona Stefanakis, Tim Englert, Maryam S. L. Drechsel, Jan Stiedl, Simon Green, Timo Jacob, Barbara Boldrini, Edwin Ostertag, Karsten Rebner, Marc Brecht	UV Hyperspectral Imaging as Process Analytical Tool for the Characterization of Oxide Layers and Copper States on Direct Bonded Copper.	Sensors	2021	DBLP DOI BibTeX RDF
30	Yanhua Fu, Hongfei Xie, Yachun Mao, Tao Ren 0002, Dong Xiao	Copper Content Inversion of Copper Ore Based on Reflectance Spectra and the VTELM Algorithm.	Sensors	2020	DBLP DOI BibTeX RDF
30	Shashi Kumar, Yuji Iwahori, Manas Kamal Bhuyan	PCB Defect Classification Using Logical Combination of Segmented Copper and Non-copper Part.	CVIP (1)	2016	DBLP DOI BibTeX RDF
30	Raj Sekar Sethu, Hong Seng Ng, Alvin Chan, Cheng Nee Ong, Sieng Fong Chan	Characterization of copper precipitates on aluminum copper bond pads formed after plasma clean and de-ionized water exposure.	Microelectron. Reliab.	2015	DBLP DOI BibTeX RDF
30	Antonio Alonso-Ayuso, Felipe Carvallo, Laureano F. Escudero, Monique Guignard 0001, Jiaxing Pi, Raghav Puranmalka, Andrés Weintraub	Medium range optimization of copper extraction planning under uncertainty in future copper prices.	Eur. J. Oper. Res.	2014	DBLP DOI BibTeX RDF
30	Benjamin Backes, Colin McDonough, Larry Smith 0004, Wei Wang 0003, Robert E. Geer	Effects of Copper Plasticity on the Induction of Stress in Silicon from Copper Through-Silicon Vias (TSVs) for 3D Integrated Circuits.	J. Electron. Test.	2012	DBLP DOI BibTeX RDF
30	Masakatsu Maeda, Takaaki Sato, Naoto Inoue, Daisuke Yagi, Yasuo Takahashi	Anomalous microstructure formed at the interface between copper ribbon and tin-deposited copper plate by ultrasonic bonding.	Microelectron. Reliab.	2011	DBLP DOI BibTeX RDF
30	Catherine H. Chen, Shawn X. Zhang, S. W. Ricky Lee, Lebbai Mohamed	Investigation on copper diffusion depth in copper wire bonding.	Microelectron. Reliab.	2011	DBLP DOI BibTeX RDF
30	Tomohiro Uno	Bond reliability under humid environment for coated copper wire and bare copper wire.	Microelectron. Reliab.	2011	DBLP DOI BibTeX RDF
30	Zsolt Tökei, Yunlong Li, G. P. Beyer	Reliability challenges for copper low-k dielectrics and copper diffusion barriers.	Microelectron. Reliab.	2005	DBLP DOI BibTeX RDF
30	Y. S. Zheng, Y. J. Su, B. Yu, P. D. Foo	Investigation of defect on copper bond pad surface in copper/low k process integration.	Microelectron. Reliab.	2003	DBLP DOI BibTeX RDF
30	Hong Meng Ho, Wai Lam, Serguei Stoukatch, Petar Ratchev, Charles J. Vath, Eric Beyne	Direct gold and copper wires bonding on copper.	Microelectron. Reliab.	2003	DBLP DOI BibTeX RDF
30	Constance E. Schuster, Mark G. Vangel, Harry A. Schafft	Improved estimation of the resistivity of pure copper and electrical determination of thin copper film dimensions.	Microelectron. Reliab.	2001	DBLP DOI BibTeX RDF
30	Petter Persson, Johnny Bustad, Michael C. Zerner	INDO calculations of small copper clusters and CO adsorbed on copper(100) surfaces.	J. Comput. Chem.	2000	DBLP DOI BibTeX RDF
28	Ali Enteshari, Mohsen Kavehrad, Jarir M. Fadlullah	Signal construction for high-speed access over copper wiring.	CCECE	2009	DBLP DOI BibTeX RDF
28	Yongru Gu, Keshab K. Parhi	Pipelined Parallel Decision-Feedback Decoders for High-Speed Ethernet Over Copper.	IEEE Trans. Signal Process.	2007	DBLP DOI BibTeX RDF
28	Subarna Sinha, Jianfeng Luo, Charles C. Chiang	Model Based Layout Pattern Dependent Metal Filling Algorithm for Improved Chip Surface Uniformity in the Copper Process.	ASP-DAC	2007	DBLP DOI BibTeX RDF
28	Lihua Xue, Hongzhong Huang, Yaohua Hu, Zhangming Shi	Neural Networks Based Multiplex Forecasting System of the End-Point of Copper Blow Period.	ISNN (3)	2005	DBLP DOI BibTeX RDF
28	Michael R. Blaha	A Copper Bullet for Software Quality Improvement.	Computer	2004	DBLP DOI BibTeX RDF
28	Valeriy Sukharev	Physically-Based Simulation of Electromigration Induced Failures in Copper Dual-Damascene Interconnect.	ISQED	2004	DBLP DOI BibTeX RDF
28	Thierry Devoivre, M. Lunenborg, C. Julien, J.-P. Carrere, P. Ferreira, W. J. Toren, A. VandeGoor, P. Gayet, T. Berger, O. Hinsinger, P. Vannier, Y. Trouiller, Y. Rody, P.-J. Goirand, R. Palla, I. Thomas, F. Guyader, David Roy 0001, B. Borot, Nicolas Planes, Sylvie Naudet, F. Pico, D. Duca, F. Lalanne, D. Heslinga, M. Haond	Validated 90nm CMOS Technology Platform with Low-k Copper Interconnects for Advanced System-on-Chip (SoC).	MTDT	2002	DBLP DOI BibTeX RDF
28	Eric Borghs, Jeroen Jacobs, Michaël Beck, Adrian Mihanta, Piet Vandaele, Thierry Pollet	Prototyping Ethernet in the First Mile over Point-to-Point Copper.	IEEE International Workshop on Rapid System Prototyping	2002	DBLP DOI BibTeX RDF
28	Sébastien Mallier, Fabienne Nouvel, Jean-Yves Baudais, Daniel Gardan, Ahmed Zeddam	Multi-Carrier CDMA over Copper Lines-Comparison of Performances with the ADSL System.	DELTA	2002	DBLP DOI BibTeX RDF	DMT, equalization, MC-CDMA, ADSL
27	Krishna Saraswat	Performance comparison of cu/low-k, carbon nanotube, and optics for on-chip and off-chip interconnects.	SLIP	2009	DBLP DOI BibTeX RDF	copper, energy per bit, power, latency, bandwidth, optical interconnect, carbon nanotube
27	Tadahiro Shibutani, Qiang Yu, Masaki Shiratori	Effect of Creep Properties on Pressure Induced Tin Whisker Formation.	SSIRI	2008	DBLP DOI BibTeX RDF	lead-free, tin whisker, creep, tin-copper, tin-lead, pressure
26	Victoria Pachón, Jacinto Mata, Manuel J. Maña López	Practical Application of a KDD Process to a Sulphuric Acid Plant.	IWANN (2)	2009	DBLP DOI BibTeX RDF	Data Mining, Association Rule, KDD, Data Preprocessing
26	Saroj K. Nayak	Carbon nanotube, graphene and atomic wires as next generation interconnects: current status and future promise.	SLIP	2009	DBLP DOI BibTeX RDF	quantum simulation, performance, design, reliability
26	Hidehiro Toyoda, Michitaka Okuno, Shinji Nishimura, Matsuaki Terada	A 100 Gb/s and High-Reliable Physical-Layer Architecture for VSR and Backplane Ethernet.	ICC	2008	DBLP DOI BibTeX RDF
26	Lei Li, Zheng Cao, Mingyu Chen 0001, Jianping Fan 0002	Design and Evaluation of Optical Bus in High Performance Computer.	ICYCS	2008	DBLP DOI BibTeX RDF
26	Arthur Nieuwoudt, Mosin Mondal, Yehia Massoud	Predicting the Performance and Reliability of Carbon Nanotube Bundles for On-Chip Interconnect.	ASP-DAC	2007	DBLP DOI BibTeX RDF
26	Ray T. Chen	Optical interconnects: a viable solution for interconnection beyond 10 gbit/sec.	ISPD	2007	DBLP DOI BibTeX RDF	PCB interconnects, optical bus architecture, optical interconnects
26	Arthur Nieuwoudt, Yehia Massoud	Assessing the Implications of Process Variations on Future Carbon Nanotube Bundle Interconnect Solutions.	ISQED	2007	DBLP DOI BibTeX RDF
26	Azad Naeemi, Reza Sarvari, James D. Meindl	Performance Modeling and Optimization for Single- and Multi-Wall Carbon Nanotube Interconnects.	DAC	2007	DBLP DOI BibTeX RDF
26	Timothy Read, Beatriz Barros, Elena Bárcena, Jesús Pancorbo	Coalescing individual and collaborative learning to model user linguistic competences.	User Model. User Adapt. Interact.	2006	DBLP DOI BibTeX RDF	ICALL, Adaptive group formation, Collaborative activity templates, European framework for languages, Bayesian networks
26	Kaustav Banerjee, Navin Srivastava	Are carbon nanotubes the future of VLSI interconnections?	DAC	2006	DBLP DOI BibTeX RDF	VLSI, interconnects, carbon nanotubes
26	Andres Sierra, Stamatios V. Kartalopoulos	Evaluation of Two Prevalent EPON Networks Using Simulation Methods.	AICT/ICIW	2006	DBLP DOI BibTeX RDF
26	Jesús Favela, Hiroshi Natsu, Cynthia B. Pérez, Omar Robles, Alberto L. Morán, Raul Romero, Ana María Martínez Enríquez, Dominique Decouchant	Empirical Evaluation of Collaborative Support for Distributed Pair Programming.	CRIWG	2004	DBLP DOI BibTeX RDF
26	Kyung-Ah Han, Jae-Jin Lee, Jae-Cheol Ryou 0001	The VDSL Deployments and Their Associated Crosstalk with xDSL Systems.	ICT	2004	DBLP DOI BibTeX RDF
26	Dirk K. de Vries, Paul L. C. Simon	Calibration of Open Interconnect Yield Models.	DFT	2003	DBLP DOI BibTeX RDF
26	N. S. Nagaraj, Tom Bonifield, Abha Singh, Frank Cano, Usha Narasimha, Mak Kulkarni, Poras T. Balsara, Cyrus D. Cantrell	Benchmarks for Interconnect Parasitic Resistance and Capacitance.	ISQED	2003	DBLP DOI BibTeX RDF
26	Eleftheria S. Sergaki, George S. Stavrakakis, Anastasios D. Pouliezos	Optimal Robot Speed Trajectory by Minimization of the Actuator Motor Electromechanical Losses.	J. Intell. Robotic Syst.	2002	DBLP DOI BibTeX RDF	electric actuators, dc motor actuators, direct drive rotary actuators, electromechanical losses, loss minimization, optimal speed trajectory, robotic manipulators, industrial robots
26	Ruowen Rong, Dave Brooks, Gang Fu, Elliot Eichen	Web-based expert system for automated DSL loop qualification.	NOMS	2000	DBLP DOI BibTeX RDF
26	Yehea I. Ismail, Eby G. Friedman, José Luis Neves	Repeater insertion in tree structured inductive interconnect.	ICCAD	1999	DBLP DOI BibTeX RDF
15	Huanran Wang, Chunyang Gu, Weiduo Zhao, Shuo Wang, Han Zhao, Giampaolo Buticchi, Chris Gerada, He Zhang 0013	Open-Circuit Fault-Tolerant Control for Nonsinusoidal Back EMF Five-Phase PMSM With Copper Loss Reduction.	IEEE Trans. Ind. Electron.	2024	DBLP DOI BibTeX RDF
15	Kai Sun, Lei Zhao, Pengxin Tian, Jianjun Zhao, Dianhui Wang	Prediction of X-ray fluorescence copper grade using regularized stochastic configuration networks.	Inf. Sci.	2024	DBLP DOI BibTeX RDF
15	Moein Farhadian, Mehdi Moallem, Babak Fahimi, Behzad Mirzaeian Dehkordi, Mehdi Sahebzamani	Alternate Rotor Design for Line-Start Synchronous Reluctance Motor With Minimum Use of Copper.	IEEE Access	2024	DBLP DOI BibTeX RDF
15	Jingyang Wang, Bolin Dai, Tianhu Zhang, Lin Qi	A Novel Hybrid Model of CEEMDAN-CNN-SAGU for Shanghai Copper Price Prediction.	IEEE Access	2024	DBLP DOI BibTeX RDF
15	Amarprit Singh, Manabendra Bhuyan, Anil Hazarika, Lachit Dutta	Model-Based Derivation of Electrical Parameters and Impedance Study of Two-Electrode Copper Nanoparticle-Based Pencil-Drawn Glucose Sensor.	IEEE Trans. Ind. Informatics	2024	DBLP DOI BibTeX RDF
15	Andreas Stathopoulos	Special Section: 2022 Copper Mountain Conference on Iterative Methods.	SIAM J. Sci. Comput.	2024	DBLP DOI BibTeX RDF
15	Yanan Tao, Chao Liang, Ziqi Mei, Zhiqiang Song, Yu Wu, Yunna Sun, Wenqiang Zhang, Yong Ruan, Xiaoguang Zhao	Numerical simulation of copper electrodeposition for Through Silicon Via (TSV) with SPS-PEG-Cl additive system.	Microelectron. J.	2024	DBLP DOI BibTeX RDF
15	Zhaohui Jiang 0001, Chuan Xu, Jinshi Liu, Weichao Luo, Zhiwen Chen 0001, Weihua Gui 0001	A Dual Closed-Loop Digital Twin Construction Method for Optimizing the Copper Disc Casting Process.	IEEE CAA J. Autom. Sinica	2024	DBLP DOI BibTeX RDF
15	Wenhao Yao, Hu He, Fuliang Wang	CTAB-Modulated Electroplating of Copper Micropillar Arrays for Non-Enzymatic Glucose Sensing with Improved Sensitivity.	Sensors	2024	DBLP DOI BibTeX RDF
15	Yu Li, Rencheng Zhang, Kai Yang 0003, Yufan Qi	Research on an Equivalent Heat Source Model of the AC Arc in the Short Gap of a Copper-Core Cable and a Fire Risk Assessment Method.	Sensors	2024	DBLP DOI BibTeX RDF
15	Hussain Ahmed, Matti Vilkko	Price-based coordination strategy for copper smelting process.	Comput. Chem. Eng.	2023	DBLP DOI BibTeX RDF
15	Hussain Ahmed, Matti Vilkko	Coordination strategy based on hard-heuristics and price-updating scheme for copper smelting process.	Comput. Chem. Eng.	2023	DBLP DOI BibTeX RDF
15	Sonja H. M. Germscheid, Fritz T. C. Röben, Han Sun, André Bardow, Alexander Mitsos, Manuel Dahmen	Demand response scheduling of copper production under short-term electricity price uncertainty.	Comput. Chem. Eng.	2023	DBLP DOI BibTeX RDF
15	Mingliang Li, Kegang Li, Qingci Qin, Rui Yue	Slope stability prediction based on IPOARF algorithm: A case study of Lala Copper Mine, Sichuan, China.	Expert Syst. Appl.	2023	DBLP DOI BibTeX RDF
15	Huanran Wang, Chunyang Gu, Shuo Wang, Weiduo Zhao, Shun Bai, Giampaolo Buticchi, Chris Gerada, He Zhang 0013	Single-Phase Short-Circuit Fault Tolerant Control for Five-Phase Permanent Magnet Machines With Copper Loss Reduction.	IEEE Trans. Ind. Electron.	2023	DBLP DOI BibTeX RDF
15	Soo-Hwan Park, Jun-Woo Chin, Kyoung-Soo Cha, Jun-Yeol Ryu, Myung-Seop Lim	Investigation of AC Copper Loss Considering Effect of Field and Armature Excitation on IPMSM With Hairpin Winding.	IEEE Trans. Ind. Electron.	2023	DBLP DOI BibTeX RDF