Search results for "dies"

Hits ?▲	Authors	Title	Venue	Year	Link	Author keywords
75	Xiaoyang Wang, Limin Li	Study on Application of High Speed Milling in Dies Manufacturing for Plate Heat Exchangers.	PROLAMAT	2006	DBLP DOI BibTeX RDF	High Speed Milling, HSM strategy, Dies for Plate Heat Exchangers, Technics
70	Meng-Syue Chan, Chun-Yao Wang, Yung-Chih Chen	An efficient approach to sip design integration.	ISQED	2009	DBLP DOI BibTeX RDF
58	Nam Sung Kim, Jun Seomun, Abhishek A. Sinkar, Jungseob Lee, Tae Hee Han, Ken Choi, Youngsoo Shin	Frequency and yield optimization using power gates in power-constrained designs.	ISLPED	2009	DBLP DOI BibTeX RDF	optimization, yield, power gate, frequency
57	Zorlu Yalniz, Engin Kirda	Supporting Collaboration in the Development of Tools and Dies in Manufacturing Networks.	WETICE	2003	DBLP DOI BibTeX RDF	Collaboration in manufacturing networks, Collaborative Support in Manufacturing Networks, Collaborative Systems
53	Yervant Zorian	Fundamentals of MCM Testing and Design-for-Testability.	J. Electron. Test.	1997	DBLP DOI BibTeX RDF	known good dies, design-for-testability, MCM testing
47	Chenn-Jung Huang, Chua-Chin Wang, Chi-Feng Wu	Image Processing Techniques for Wafer Defect Cluster Identification.	IEEE Des. Test Comput.	2002	DBLP DOI BibTeX RDF
47	Vivek De	Leakage-tolerant design techniques for high performance processors.	ISPD	2002	DBLP DOI BibTeX RDF
45	Hannah Dies, Maria Siampani, Carlos Escobedo, Aristides Docoslis	Direct Detection of Toxic Contaminants in Minimally Processed Food Products Using Dendritic Surface-Enhanced Raman Scattering Substrates.	Sensors	2018	DBLP DOI BibTeX RDF
45	Ismael Abad, Carlos Cerrada, José Antonio Cerrada, Vicente Dies	RRTL: RFID Reader Topology Language. A language to manage RFID reader's networks.	ANT/MobiWIS	2011	DBLP DOI BibTeX RDF
45	Carlos Cerrada, Ismael Abad, José Antonio Cerrada, Vicente Dies	Pipe-DEPCAS: A Middleware Solution for EPC-RFID Data Acquisition Systems.	IWRT	2007	DBLP BibTeX RDF
45	Tao Wu, Bin Li, Long-Wen Wang, Yu Huang	Automatic detectand match of LED dies basing on position relations betweenadjacent dies.	ICMLC	2010	DBLP DOI BibTeX RDF
45	Benjamin N. Lee, Li-C. Wang, Magdy S. Abadir	Issues on Test Optimization with Known Good Dies and Known Defective Dies - A Statistical Perspective.	ITC	2006	DBLP DOI BibTeX RDF
41	Injin Choi, Kunwoo Lee	Evaluation Of Surfaces For Automobile Body Styling.	Computer Graphics International	1996	DBLP DOI BibTeX RDF	automobile body styling, surfaces evaluation, car body design, boundary curves, surface generation, local irregularities, surface quality, shape quality, global irregularities, focal analysis, visualization, data visualisation, rendering (computer graphics), dies, automobiles, automobile industry, reflection mapping
41	Vinay Dabholkar, Sreejit Chakravarty, J. Najm, Janak H. Patel	Cyclic stress tests for full scan circuits.	VTS	1995	DBLP DOI BibTeX RDF	cyclic stress tests, fully testable unpackaged dies, burn-in process, cyclic input sequences, stress related problems, ISCAS89 benchmark circuits, monitored burn-in problems, IC reliability, VLSI, VLSI, logic testing, integrated circuit testing, CMOS, CMOS logic circuits, boundary scan testing, MCMs, integrated circuit reliability, full scan circuits
35	Saibal Mukhopadhyay, Hamid Mahmoodi, Kaushik Roy 0001	Reduction of Parametric Failures in Sub-100-nm SRAM Array Using Body Bias.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2008	DBLP DOI BibTeX RDF
35	Xiuyi Zhou, Yi Xu, Yu Du, Youtao Zhang, Jun Yang 0002	Thermal Management for 3D Processors via Task Scheduling.	ICPP	2008	DBLP DOI BibTeX RDF
23	Tak-Yung Kim, Taewhan Kim	Clock tree synthesis with pre-bond testability for 3D stacked IC designs.	DAC	2010	DBLP DOI BibTeX RDF	optimization, routing, buffer insertion, 3D ICs, clock tree
23	Yangyang Pan, Tong Zhang 0002	Improving VLIW Processor Performance Using Three-Dimensional (3D) DRAM Stacking.	ASAP	2009	DBLP DOI BibTeX RDF
23	Qi Wu 0006, Jian-Qiang Lu, Kenneth Rose, Tong Zhang 0002	Efficient implementation of decoupling capacitors in 3D processor-dram integrated computing systems.	ACM Great Lakes Symposium on VLSI	2009	DBLP DOI BibTeX RDF	three-dimentional integration, dram, decoupling capacitor
23	Taeho Kgil, Ali G. Saidi, Nathan L. Binkert, Steven K. Reinhardt, Krisztián Flautner, Trevor N. Mudge	PicoServer: Using 3D stacking technology to build energy efficient servers.	ACM J. Emerg. Technol. Comput. Syst.	2008	DBLP DOI BibTeX RDF	3D stacking technology, Tier-1/2/3 server, Low power, chip multiprocessor, full-system simulation
23	Jinseob Jeong, Seungwhun Paik, Youngsoo Shin	Statistical mixed Vt allocation of body-biased circuits for reduced leakage variation.	ASP-DAC	2008	DBLP DOI BibTeX RDF
23	Sudarshan Bahukudumbi, Krishnendu Chakrabarty	Wafer-Level Modular Testing of Core-Based SoCs.	IEEE Trans. Very Large Scale Integr. Syst.	2007	DBLP DOI BibTeX RDF
23	Xiaoya Li, Daoping Huang, Zonghai Sun	A Routing Protocol for Balancing Energy Consumption in Heterogeneous Wireless Sensor Networks.	MSN	2007	DBLP DOI BibTeX RDF	balance energy consumption, Wireless sensor networks, routing protocol
23	C. W. Kim, C. H. Park, S. S. Lee	An Automated Design System of Press Die Components Using 3-D CAD Library.	ICCSA (2)	2007	DBLP DOI BibTeX RDF	3D CAD Library, Press Die Components, CATIA, BOM, Design, Database, API, Visual Basic, Microsoft Access
23	Syed M. Alam, Robert E. Jones, Shahid Rauf, Ritwik Chatterjee	Inter-Strata Connection Characteristics and Signal Transmission in Three-Dimensional (3D) Integration Technology.	ISQED	2007	DBLP DOI BibTeX RDF
23	Chien-Chang Chen, Wai-Kei Mak	A multi-technology-process reticle floorplanner and wafer dicing planner for multi-project wafers.	ASP-DAC	2006	DBLP DOI BibTeX RDF
23	John C. Koob, Daniel A. Leder, Raymond J. Sung, Tyler L. Brandon, Duncan G. Elliott, Bruce F. Cockburn, Lisa G. McIlrath	Design of a 3-D fully depleted SOI computational RAM.	IEEE Trans. Very Large Scale Integr. Syst.	2005	DBLP DOI BibTeX RDF
23	Eugenio Culurciello, Andreas G. Andreou	Capacitive coupling of data and power for 3D silicon-on-insulator VLSI.	ISCAS (4)	2005	DBLP DOI BibTeX RDF
23	Matthias Handy, Marc Haase, Dirk Timmermann	Low energy adaptive clustering hierarchy with deterministic cluster-head selection.	MWCN	2002	DBLP DOI BibTeX RDF
23	Bram Kruseman, Stefan van den Oetelaar, Josep Rius 0001	Comparison of IDDQ Testing and Very-Low Voltage Testing.	ITC	2002	DBLP DOI BibTeX RDF
23	Shengli Li, Kai Zhang, Jien-Chung Lo	The 2nd Order Analysis of IDDQ Test Data.	DFT	2000	DBLP DOI BibTeX RDF
23	Zao Yang, Kwang-Ting Cheng, King L. Tai	A New Bare Die Test Methodology.	VTS	1999	DBLP DOI BibTeX RDF
23	Kaiyuan Huang, Vinod K. Agarwal, Krishnaiyan Thulasiraman	Diagnosis of clustered faults and wafer testing.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	1998	DBLP DOI BibTeX RDF
23	Jonathan T.-Y. Chang, Chao-Wen Tseng, Chien-Mo James Li, Mike Purtell, Edward J. McCluskey	Analysis of pattern-dependent and timing-dependent failures in an experimental test chip.	ITC	1998	DBLP DOI BibTeX RDF
23	Yervant Zorian, Hakim Bederr	An Effective Multi-Chip BIST Scheme.	J. Electron. Test.	1997	DBLP DOI BibTeX RDF	built-in self-test, DFT, MCM testing
22	Juan Llorca-Schenk, Juan Ramón Rico-Juan, Miguel Sánchez Lozano	Designing porthole aluminium extrusion dies on the basis of eXplainable Artificial Intelligence.	Expert Syst. Appl.	2023	DBLP DOI BibTeX RDF
22	Susanne Strahringer	Industrie 5.0 - Die ganzheitliche Idee einer menschlicheren, nachhaltigeren und widerstandsfähigeren Industrie oder ein Sammelbecken für dies und das?	HMD Prax. Wirtsch.	2023	DBLP DOI BibTeX RDF
22	Yang Ge, Tejinder Singh Sandhu, Dmitri V. Truhachev, Kamal El-Sankary	A Single-TSV and Single-DCDL Approach for Skew Compensation of Multi-Dies Clock Synchronization in 3-D-ICs.	IEEE Trans. Very Large Scale Integr. Syst.	2023	DBLP DOI BibTeX RDF
22	Lantao Li, Chen Sun	NLOS Dies Twice: Challenges and Solutions of V2X for Cooperative Perception.	CoRR	2023	DBLP DOI BibTeX RDF
22	D. P. Jena	Mathematical modelling and numerical simulation of direct extrusion process for different cross-section of dies.	Int. J. Manuf. Technol. Manag.	2023	DBLP DOI BibTeX RDF
22	Liang Ma, Fanwu Meng	Anomaly Detection in the Production Process of Stamping Progressive Dies Using the Shape- and Size-Adaptive Descriptors.	Sensors	2023	DBLP DOI BibTeX RDF
22	Isamu Nishida, Eiki Yamada, Hidenori Nakatsuji	Automated Process Planning System for Machining Injection Molding Dies Using CAD Models of Product Shapes in STL Format.	Int. J. Autom. Technol.	2023	DBLP DOI BibTeX RDF
22	Mohamed Naeim, Hanqi Yang, Pinhong Chen, Rong Bao, Antoine Dekeyser, Giuliano Sisto, Moritz Brunion, Rongmei Chen, Geert Van der Plas, Eric Beyne, Dragomir Milojevic	Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs.	3DIC	2023	DBLP DOI BibTeX RDF
22	Mayank Raj, Chuan Xie, Ade Bekele, Adam Chou, Wenfeng Zhang, Ying Cao 0010, Jae Wook Kim, Nakul Narang, Hongyuan Zhao, Yipeng Wang 0003, Kee Hian Tan, Winson Lin, Jay Im, David Mahashin, Santiago Asuncion, Parag Upadhyaya, Yohan Frans	A O.96pJ/b 7 × 50Gb/s-per-Fiber WDM Receiver with Stacked 7nm CMOS and 45nm Silicon Photonic Dies.	ISSCC	2023	DBLP DOI BibTeX RDF
22	Dorothee Müller, Ludger Humbert	Hätte ich gewusst, dass dies Informatik ist, dann hätte ich ...	INFOS	2023	DBLP DOI BibTeX RDF
22	M. N. Sudha, M. Rajendiran, Mariusz Specht, Kasarla Satish Reddy, S. Sugumaran	A low-area design of two-factor authentication using DIES and SBI for IoT security.	J. Supercomput.	2022	DBLP DOI BibTeX RDF
22	Clemens Fricke, Daniel Wolff, Marco Kemmerling, Stefanie Elgeti	Investigation of reinforcement learning for shape optimization of profile extrusion dies.	CoRR	2022	DBLP DOI BibTeX RDF
22	Alon Shakevsky, Eyal Ronen, Avishai Wool	Trust Dies in Darkness: Shedding Light on Samsung's TrustZone Keymaster Design.	IACR Cryptol. ePrint Arch.	2022	DBLP BibTeX RDF
22	Indah Kurnia Mahasih Lianny, Sanurya Putri Purbaningrum, Edwin Sahrial Solih	Implementation of Single Minute Exchange of Dies at PT Ganding Toolsindo.	ICONETSI	2022	DBLP DOI BibTeX RDF
22	Alon Shakevsky, Eyal Ronen, Avishai Wool	Trust Dies in Darkness: Shedding Light on Samsung's TrustZone Keymaster Design.	USENIX Security Symposium	2022	DBLP BibTeX RDF
22	Van Ha Nguyen, Nueraimaiti Aimaier, Gabriel Nobert, Tan Pham, Nicolas G. Constantin, Yves Blaquière, Glenn E. R. Cowan	A Reconfigurable Power System-in-Package Module using GaN HEMTs and IC Bare Dies on LTCC Substrate: Design - Implementation - Experiment and Future Directions.	NEWCAS	2022	DBLP DOI BibTeX RDF
22	Ernst W. Mayr, Werner M. Seiler, Evgenii V. Vorozhtsov	Vladimir Gerdt dies at 73.	ACM Commun. Comput. Algebra	2021	DBLP DOI BibTeX RDF
22	Daniel Kopp, Christoph Dietzel, Oliver Hohlfeld	DDoS Never Dies? An IXP Perspective on DDoS Amplification Attacks.	CoRR	2021	DBLP BibTeX RDF
22	Milan Janosov	Network Science Predicts Who Dies Next in Game of Thrones.	CoRR	2021	DBLP BibTeX RDF
22	Qitai Wang, Yuntao Chen, Ziqi Pang, Naiyan Wang, Zhaoxiang Zhang 0001	Immortal Tracker: Tracklet Never Dies.	CoRR	2021	DBLP BibTeX RDF
22	Yang Yang 0100, Srichand Hinduja, Oladele Owodunni, Robert Heinemann	Recognition of features in sheet metal parts manufactured using progressive dies.	Comput. Aided Des.	2021	DBLP DOI BibTeX RDF
22	Daniel Kopp, Christoph Dietzel, Oliver Hohlfeld	DDoS Never Dies? An IXP Perspective on DDoS Amplification Attacks.	PAM	2021	DBLP DOI BibTeX RDF
22	Saikat Dey, Ayan Mallik, Neil Goldsman	A Comprehensive Design Procedure and Performance Evaluation of 200°C Non-Inverting Buck-Boost Converter using SiC MOSFET Bare Dies.	IECON	2021	DBLP DOI BibTeX RDF
22	Tiago Mück	Network-on-Chips for Future 3D Stacked Dies (Invited).	SLIP	2021	DBLP DOI BibTeX RDF
22	Werner M. Seiler	Jacques Calmet dies at 77.	ACM Commun. Comput. Algebra	2020	DBLP DOI BibTeX RDF
22	Katie Hafner	Lawrence Roberts, Who Helped Design Internet's Precursor, Dies at 81.	IEEE Commun. Mag.	2019	DBLP DOI BibTeX RDF
22	Frederic Ouattara, Arash Nejat, Lionel Torres, Ken Mackay	Practical Experiments on Fabricated TAS-MRAM Dies to Evaluate the Stochastic Behavior of Voltage-Controlled TRNGs.	IEEE Access	2019	DBLP DOI BibTeX RDF
22	Gui Li, Xiaoyu Long, Min Zhou	A new design method based on feature reusing of the non-standard cam structure for automotive panels stamping dies.	J. Intell. Manuf.	2019	DBLP DOI BibTeX RDF
22	Amir Atapour Abarghouei, Toby P. Breckon	Veritatem Dies Aperit- Temporally Consistent Depth Prediction Enabled by a Multi-Task Geometric and Semantic Scene Understanding Approach.	CoRR	2019	DBLP BibTeX RDF
22	Hanna Soneda, Masaki Hashizume, Hiroyuki Yotsuyanagi, Shyue-Kung Lu	Electrical Field Test Method of Resistive Open Defects between Dies by Quiescent Currents through Embedded Diodes.	3DIC	2019	DBLP DOI BibTeX RDF
22	Emilie Bourjot, Paul Stewart, Christophe Dubarry, E. Lagoutte, E. Rolland, Nicolas Bresson, G. Romano, D. Scevola, Viorel Balan, Jérôme Dechamp, Marc Zussy, Gaëlle Mauguen, Clément Castan, Loïc Sanchez, Amadine Jouve, Frank Fournel, Séverine Cheramy	Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development.	3DIC	2019	DBLP DOI BibTeX RDF
22	Kathleen C. Fraser, Frauke Zeller, David Harris Smith, Saif M. Mohammad, Frank Rudzicz	How do we feel when a robot dies? Emotions expressed on Twitter before and after hitchBOT's destruction.	WASSA@NAACL-HLT	2019	DBLP DOI BibTeX RDF
22	Amir Atapour Abarghouei, Toby P. Breckon	Veritatem Dies Aperit - Temporally Consistent Depth Prediction Enabled by a Multi-Task Geometric and Semantic Scene Understanding Approach.	CVPR	2019	DBLP BibTeX RDF
22	Ilias Giechaskiel, Kasper Rasmussen, Jakub Szefer	Reading Between the Dies: Cross-SLR Covert Channels on Multi-Tenant Cloud FPGAs.	ICCD	2019	DBLP DOI BibTeX RDF
22	Shen Liu, Yuancai Yang, Tao Xie, Xiaobiao Shan	Experimental Study on Fine Titanium Wire Drawing with Two Ultrasonically Oscillating Dies.	IEEE Access	2018	DBLP DOI BibTeX RDF
22	Yoann Pascal, Denis Labrousse, Mickael Petit, Stéphane Lefebvre, François Costa	Experimental investigation of the reliability of Printed Circuit Board (PCB)-embedded power dies with pressed contact made of metal foam.	Microelectron. Reliab.	2018	DBLP DOI BibTeX RDF
22	Sudipta Mondal, Krishnendu Chakrabarty	Pre-assembly testing of interconnects in embedded multi-die interconnect bridge (EMIB) dies.	DATE	2018	DBLP DOI BibTeX RDF
22	Matthias Ehlenz, Thiemo Leonhardt, Christian Cherek, Wiktoria Wilkowska, Ulrik Schroeder	The lone wolf dies, the pack survives?: Analyzing a Computer Science Learning Application on a Multitouch-Tabletop.	Koli Calling	2018	DBLP DOI BibTeX RDF
22	Rajiv Khanna, Anastasios Kyrillidis	IHT dies hard: Provable accelerated Iterative Hard Thresholding.	AISTATS	2018	DBLP BibTeX RDF
22	Feifei Zhang, Ji Zhang, Kai He, Zhiqiang Hang	Application of Electro-hydraulic Forming (EHF) Process with Simple Dies in Sheet Metal Forming.	ICIA	2018	DBLP DOI BibTeX RDF
22	Mandeep Chahal, Vikram Singh 0003, Rohit Garg	Machinability evaluation of dies steel H-11 with CNC Milling using digraph and matrix method.	Int. J. Syst. Assur. Eng. Manag.	2017	DBLP DOI BibTeX RDF
22	Mandeep Chahal, Vikram Singh 0003, Rohit Garg	Optimum surface roughness evaluation of dies steel H-11 with CNC milling using RSM with desirability function.	Int. J. Syst. Assur. Eng. Manag.	2017	DBLP DOI BibTeX RDF
22	Rajiv Khanna, Anastasios Kyrillidis	IHT dies hard: Provable accelerated Iterative Hard Thresholding.	CoRR	2017	DBLP BibTeX RDF
22	John Mulholland, Michele Mosca, Johannes Braun 0001	The Day the Cryptography Dies.	IEEE Secur. Priv.	2017	DBLP DOI BibTeX RDF
22	Delong Qiu, Liqiang Cao, Qidong Wang, Fengze Hou, Xugang Wang	Experimental and numerical study of 3D stacked dies under forced air cooling and water immersion cooling.	Microelectron. Reliab.	2017	DBLP DOI BibTeX RDF
22	Wojciech Skarka, Tomasz Neumann	New Methods of Designing Stamping Dies Assemblies by Using Generative Models.	TE	2017	DBLP DOI BibTeX RDF
22	Bernd-Arno Behrens, Jan Puppa, Adis Huskic, Kai Brunotte, Anas Bouguecha, Tobias Prüß	Influence of heat pipe cooling on the wear of hot forging dies.	Prod. Eng.	2016	DBLP DOI BibTeX RDF
22	Samson Melamed, Naoya Watanabe, Shunsuke Nemoto, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi	Impact of thinning stacked dies on the thermal resistance of bump-bonded three-dimensional integrated circuits.	Microelectron. Reliab.	2016	DBLP DOI BibTeX RDF
22	Falk Naumann, Volkmar Gottschalk, Bernd Burchard, Frank Altmann	Reliability evaluation of Si-dies due to assembly issues.	Microelectron. Reliab.	2016	DBLP DOI BibTeX RDF
22	Pengjie Sun, Fenlou Zhai, Ru Wang, Zhe Li	Template Development for Web-based Simulation Analysis of Wire Drawing Dies.	ICIME	2016	DBLP DOI BibTeX RDF
22	Mohammad Julaei Moghaddam, Mohamad Reza Soleymani, Mohammad Ali Farsi	Sequence planning for stamping operations in progressive dies.	J. Intell. Manuf.	2015	DBLP DOI BibTeX RDF
22	Davit Mirzoyan, Benny Akesson, Sander Stuijk, Kees Goossens	Maximizing the Number of Good Dies for Streaming Applications in NoC-Based MPSoCs Under Process Variation.	ACM Trans. Embed. Comput. Syst.	2015	DBLP DOI BibTeX RDF
22	Erich Novak, Klaus Ritter 0001, Ian H. Sloan, Henryk Wozniakowski	Joseph F. Traub, the Founding Editor of the Journal of Complexity, dies at 83.	J. Complex.	2015	DBLP DOI BibTeX RDF
22	Kosuke Nanbara, Akihiro Odoriba, Masaki Hashizume, Hiroyuki Yotsuyanagi, Shyue-Kung Lu	Electrical interconnect test of 3D ICs made of dies without ESD protection circuits with a built-in test circuit.	3DIC	2015	DBLP DOI BibTeX RDF
22	Xianshu Luo, Yulian Cao, Junfeng Song, Xiaonan Hu, Tsung-Yang Liow, Mingbin Yu, Qijie Wang, Guo-Qiang Lo	High-throughput multiple dies-to-wafer (D2W) bonding for III/V-on-Si hybrid lasers.	OFC	2015	DBLP BibTeX RDF
22	Rajit Karmakar, Aditya Agarwal, Santanu Chattopadhyay	Testing of 3D-stacked ICs with hard- and soft-dies - a Particle Swarm Optimization based approach.	VTS	2015	DBLP DOI BibTeX RDF
22	Burcu Özcan, Alpaslan Figlali	Artificial neural networks for the cost estimation of stamping dies.	Neural Comput. Appl.	2014	DBLP DOI BibTeX RDF
22	Shaoqiu Xu, Zhihang Cheng, Yang Gao, Qing Pan	Visual wafer dies counting using geometrical characteristics.	IET Image Process.	2014	DBLP DOI BibTeX RDF
22	Bernd-Arno Behrens, Timur Yilkiran, Sörn Ocylok, Andreas Weisheit, Ingomar Kelbassa	Deposition welding of hot forging dies using nanoparticle reinforced weld metal.	Prod. Eng.	2014	DBLP DOI BibTeX RDF
22	M.-Dolores Cubells-Beltrán, Càndid Reig Escriva, Andrea De Marcellis, E. Figueras, Alberto Yufera, Boris Zadov, Eugene Paperno, Susana Cardoso, Paulo P. Freitas	Monolithic integration of Giant Magnetoresistance (GMR) devices onto standard processed CMOS dies.	Microelectron. J.	2014	DBLP DOI BibTeX RDF
22	Oded Raz, Pinxiang Duan, Harm J. S. Dorren	Simple and low cost technique for stacking known good dies to create compact 3D stacked parallel optics assemblies.	3DIC	2014	DBLP DOI BibTeX RDF
22	Simon Bouget, Hoel Kervadec, Anne-Marie Kermarrec, François Taïani	Polystyrene: the Decentralized Data Shape That Never Dies.	ICDCS	2014	DBLP DOI BibTeX RDF
22	Sandeep Kumar Goel, Min-Jer Wang, Saman Adham, Ashok Mehta, Frank Lee	Design-for-diagnosis: Your safety net in catching design errors in known good dies in CoWoSTM/3D ICs.	VLSI-DAT	2014	DBLP DOI BibTeX RDF
22	Cebeli Özek, Yahya Hisman Çelik, Müzeyyen Bulut Özek	A fuzzy logic model to determine the effects of die/blank holder angle and punch radius on drawing ratio in angular deep drawing dies.	J. Intell. Fuzzy Syst.	2013	DBLP DOI BibTeX RDF
22	Ji Wu, Gaofeng Wang	Cost evaluation on reuse of generic network service dies in three-dimensional integrated circuits.	Microelectron. J.	2013	DBLP DOI BibTeX RDF