Search results for "3DIC"

Hits ?▲	Authors	Title	Venue	Year	Link	Author keywords
81	Thorlindur Thorolfsson, Kiran Gonsalves, Paul D. Franzon	Design automation for a 3DIC FFT processor for synthetic aperture radar: a case study.	DAC	2009	DBLP DOI BibTeX RDF	FFT, SAR, TSV, 3DIC
68	Nermeen Hossam, John Ferguson	Fast, Accurate Assembly-Level Physical Verification of 3DIC Packages.	3DIC	2023	DBLP DOI BibTeX RDF
68	Gopi Neela, Jeffrey Draper	Congestion-aware optimal techniques for assigning inter-tier signals to 3D-vias in a 3DIC.	3DIC	2015	DBLP DOI BibTeX RDF
68	T. Robert Harris, Eric J. Wyers, Lee Wang, Samuel Graham, Georges Pavlidis, Paul D. Franzon, W. Rhett Davis	Thermal simulation of heterogeneous GaN/ InP/silicon 3DIC stacks.	3DIC	2015	DBLP DOI BibTeX RDF
68	Vempati Srinivasa Rao	IME's capabilities and programs in 2.5D/3DIC.	3DIC	2015	DBLP DOI BibTeX RDF
68	Isao Sugaya, Hajime Mitsuishi, Hidehiro Maeda, Kazuya Okamoto	New precision wafer bonding technologies for 3DIC.	3DIC	2015	DBLP DOI BibTeX RDF
68	Neela Gopi, Jeffrey Draper	Techniques for assigning inter-tier signals to bondpoints in a face-to-face bonded 3DIC.	3DIC	2013	DBLP DOI BibTeX RDF
68	Tao Zhang 0032, Guangyu Sun 0003	Using NEM relay to improve 3DIC cost efficiency.	3DIC	2011	DBLP DOI BibTeX RDF
68	Myat Thu Linn Aung, Eric Teck Heng Lim, Takefumi Yoshikawa, Tony Tae-Hyoung Kim	Design of capacitive-coupling-based simultaneously bi-directional transceivers for 3DIC.	3DIC	2011	DBLP DOI BibTeX RDF
68	Naoki Saito 0004, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura	Mechanical and electrical reliability of copper interconnections for 3DIC.	3DIC	2011	DBLP DOI BibTeX RDF
68	Xin Liu 0015, Lei Wang 0070, Mini Jayakrishnan, Jingjing Lan, Hongyu Li, Chong Ser Choong, M. Kumarasamy Raja, Yongxin Guo, Wang Ling Goh, Jin He, Shan Gao, Minkyu Je	A miniaturized heterogeneous wireless sensor node in 3DIC.	3DIC	2011	DBLP DOI BibTeX RDF
68	Vance Tyree	3DIC multi-project-wafer program: A collaboration to provide fabrication access.	3DIC	2010	DBLP DOI BibTeX RDF
68	Grzegorz Deptuch	3DIC multi-project fabrication run being organized by CMC/CMP/MOSIS and Tezzaron.	3DIC	2010	DBLP DOI BibTeX RDF
55	Paul D. Franzon, W. Rhett Davis, Michael B. Steer, Steve Lipa, Eun Chu Oh, Thorlindur Thorolfsson, Samson Melamed, Sonali Luniya, Tad Doxsee, Stephen Berkeley, Ben Shani, Kurt Obermiller	Design and CAD for 3D integrated circuits.	DAC	2008	DBLP DOI BibTeX RDF	thermal modeling, TSV, through silicon via, 3DIC
55	Hao Hua, Christopher Mineo, Kory Schoenfliess, Ambarish M. Sule, Samson Melamed, Ravi Jenkal, W. Rhett Davis	Exploring compromises among timing, power and temperature in three-dimensional integrated circuits.	DAC	2006	DBLP DOI BibTeX RDF	trade off, design flow, temperature dependency, 3DIC
42		IEEE International 3D Systems Integration Conference, 3DIC 2023, Cork, Ireland, May 10-12, 2023	3DIC	2023	DBLP DOI BibTeX RDF
42	Jiayi Shen, Chang Liu, Tadaaki Hoshi, Atsushi Sinoda, Hisashi Kino, Tetsu Tanaka, Mariappan Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima	Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last.	3DIC	2023	DBLP DOI BibTeX RDF
42	Po-Yao Chuang, Francesco Lorenzelli, Sreejit Chakravarty, Slimane Boutobza, Cheng-Wen Wu, Georges G. E. Gielen, Erik Jan Marinissen	Effective and Efficient Test and Diagnosis Pattern Generation for Many Inter-Die Interconnects in Chiplet-Based Packages.	3DIC	2023	DBLP DOI BibTeX RDF
42	Koutaro Hachiya	Measurement Point Selection Algorithms for Testing Power TSVs.	3DIC	2023	DBLP DOI BibTeX RDF
42	Joshua A. Stevens, Tse-Han Pan, Prasanth Prabu Ravichandiran, Paul D. Franzon	Chiplet Set For Artificial Intelligence.	3DIC	2023	DBLP DOI BibTeX RDF
42	Mariappan Murugesan, M. Sawa, E. Sone, Makoto Motoyoshi, Mitsumasa Koyanagi, Takafumi Fukushima	Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding.	3DIC	2023	DBLP DOI BibTeX RDF
42	Mohamed Naeim, Hanqi Yang, Pinhong Chen, Rong Bao, Antoine Dekeyser, Giuliano Sisto, Moritz Brunion, Rongmei Chen, Geert Van der Plas, Eric Beyne, Dragomir Milojevic	Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs.	3DIC	2023	DBLP DOI BibTeX RDF
42	Somnath Pal, Liang Ye, James O'Callaghan, Fatih Bilge Atar, Cian O'Mathuna, Brian Corbett, Ranajit Sai, Sambuddha Khan	A Study on a Tether-Less Approach Towards Micro-Transfer-Printing of Large-Footprint Power Micro-Inductor Chiplets.	3DIC	2023	DBLP DOI BibTeX RDF
42	Emre Can Durmaz, Carl Heine, Zhibo Cao, Jens Lehmann 0002, Dietmar Kissinger, Matthias Wietstruck	SiGe BiCMOS Technology with Embedded Microchannels based on Cu Pillar PCB Integration Enabling sub-THz Microfluidic Sensor Applications.	3DIC	2023	DBLP DOI BibTeX RDF
42	Erik W. Masselink, Andrew Stark, Benjamin B. Yang, T. Robert Harris	Review of Hybrid Integration Techniques for Integrating III-V Onta Silicon.	3DIC	2023	DBLP DOI BibTeX RDF
42	Pouria Zaghari, Sourish S. Sinha, Jong Eun Ryu, Paul D. Franzon, Douglas C. Hopkins	Thermal Cycling and Fatigue Life Analysis of a Laterally Conducting GaN-based Power Package.	3DIC	2023	DBLP DOI BibTeX RDF
42	Priyank Kashyap, Prasanth Prabu Ravichandiran, Lee Wang, Dror Baron, Chau-Wai Wong, Tianfu Wu 0001, Paul D. Franzon	Thermal Estimation for 3D-ICs Through Generative Networks.	3DIC	2023	DBLP DOI BibTeX RDF
42		IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021	3DIC	2021	DBLP DOI BibTeX RDF
42	Christophe Dubarry, Lucile Arnaud, Maria-Luisa Calvo-Muñoz, Gaëlle Mauguen, Stéphane Moreau, R. Crochemore, Nicolas Bresson, Bernard Aventurier	3D interconnection using copper direct hybrid bonding for GaN on silicon wafer.	3DIC	2021	DBLP DOI BibTeX RDF
42	Ziyue Zhang, Yingtao Ding, Baoyan Yang, Anrun Ren, Zhiming Chen 0001	A Low-Cost and Low-Temperature Method to Realize Carbon Nanotube Conductor in Through-Silicon-Via.	3DIC	2021	DBLP DOI BibTeX RDF
42	Koji Kiyoyama, Yoshihiko Horio, Takafumi Fukushima, Hiroyuki Hashimoto, Takemori Orima, Mitsumasa Koyanagi	Design for 3-D Stacked Neural Network Circuit with Cyclic Analog Computing.	3DIC	2021	DBLP DOI BibTeX RDF
42	Yoshihiko Horio, Takemori Orima, Koji Kiyoyama, Mitsumasa Koyanagi	Implementation of a Chaotic Neural Network Reservoir on a TSV/$\mu\text{Bump}$ Stacked 3D Cyclic Neural Network Integrated Circuit.	3DIC	2021	DBLP DOI BibTeX RDF
42	Prasanth Prabu Ravichandiran, Paul D. Franzon	A Review of 3D-Dynamic Random-Access Memory based Near-Memory Computation.	3DIC	2021	DBLP DOI BibTeX RDF
42	Ankit Kaul, Yandong Luo, Xiaochen Peng, Shimeng Yu, Muhannad S. Bakir	Thermal Reliability Considerations of Resistive Synaptic Devices for 3D CIM System Performance.	3DIC	2021	DBLP DOI BibTeX RDF
42	Liangxing Hu, Simon Chun Kiat Goh, Yu Dian Lim, Peng Zhao, Michael Joo Zhong Lim, Chuan Seng Tan	Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions.	3DIC	2021	DBLP DOI BibTeX RDF
42	Qianli Zhao, W. Rhett Davis	A Virtual Platform for Object Detection Systems.	3DIC	2021	DBLP DOI BibTeX RDF
42	Patrick Krüger, Thomas Voß, Matthias Wietstruck	Bond Strength Optimization of Plasma Activated Low Temperature Oxide-Oxide Fusion Bonding Through Thermocycling.	3DIC	2021	DBLP DOI BibTeX RDF
42	Takafumi Fukushima, Shinichi Sakuyama, Masatomo Takahashi, Hiroyuki Hashimoto, Jichoel Bea, Theodorus Marcello, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi, Mariappan Murugesan	Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing.	3DIC	2021	DBLP DOI BibTeX RDF
42	Ayano Furue, Satoshi Matsumoto	Numerical investigations for 3D power supply on chip by coupling of thermal-fluid, circuit, and electromagnetic field simulations.	3DIC	2021	DBLP DOI BibTeX RDF
42	Mariappan Murugesan, E. Sone, A. Simomura, Makoto Motoyoshi, M. Sawa, K. Fukuda, Mitsumasa Koyanagi, Takafumi Fukushima	Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications.	3DIC	2021	DBLP DOI BibTeX RDF
42	Shinei Miyasaka, Satoshi Matsumoto	Numerical predictions of 3D power-supply on chip taking into considerations of proximity effect.	3DIC	2021	DBLP DOI BibTeX RDF
42	Lee Baker, Robert Patti, Paul D. Franzon	Multi-ANN embedded system based on a custom 3D-DRAM.	3DIC	2021	DBLP DOI BibTeX RDF
42	Sreejith Kochupurackal Rajan, Ankit Kaul, Gary S. May, Muhannad S. Bakir	Electrical and Performance Benefits of Advanced Monolithic Cooling for 2.5D Heterogeneous ICs.	3DIC	2021	DBLP DOI BibTeX RDF
42	Anthony Mastroianni, Benjamin Kerr, Jawad Nasrullah, Kevin Cameron, Hockshan James Wong, David Ratchkov, Joseph A. Reynick	Proposed Standardization of Heterogenous Integrated Chiplet Models.	3DIC	2021	DBLP DOI BibTeX RDF
42	Yuske Ogushi, Satoshi Matsumoto	Fully integrated transformer less floating gate driver for 3D power supply on chip.	3DIC	2021	DBLP DOI BibTeX RDF
42		2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019	3DIC	2019	DBLP BibTeX RDF
42	Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka	Investigation of the Underfill with Negative-Thermal-Expansion Material to Suppress Mechanical Stress in 3D Integration System.	3DIC	2019	DBLP DOI BibTeX RDF
42	Valeriy Sukharev, Armen Kteyan, Jun-Ho Choy	An Accurate Assessment of Chip-Package Interaction is a Key Factor for Designing Resilient 3D IC Systems.	3DIC	2019	DBLP DOI BibTeX RDF
42	Chia-Hsuan Lee 0003, Hsin-Chi Chang, Jui-Han Liu, Hiroyuki Ito, Young-Suk Kim, Kuan-Neng Chen, Takayuki Ohba	Temperature Cycling Reliability of WOW Bumpless Through Silicon Vias.	3DIC	2019	DBLP DOI BibTeX RDF
42	Jing Tao, Hongyu Li, Peng Zhao, Yu Dian Lim, Anak Agung Alit Apriyana, Chuan Seng Tan	Design Considerations and Fabrication Challenges of Surface Electrode Ion Trap with TSV Integration.	3DIC	2019	DBLP DOI BibTeX RDF
42	Demin Liu, Po-Chih Chen, Yi-Chieh Tsai, Kuan-Neng Chen	Low Temperature Cu to Cu Direct Bonding below 150 °C with Au Passivation Layer.	3DIC	2019	DBLP DOI BibTeX RDF
42	Kei Sumita, Jun Takeyasu, Kimihiko Kato, Kasidit Toprasertpong, Mitsuru Takenaka, Shinichi Takagi	Fabrication of High Quality InAs-on-Lnsulator Structures by Smart Cut Process with Reuse of InAs Wafers.	3DIC	2019	DBLP DOI BibTeX RDF
42	Yuuki Araga, Kikuchi Katsuya, Masahiro Aoyagi	Electrostatic Shield TSVs to Suppress Coupling Among Stacked ICs.	3DIC	2019	DBLP DOI BibTeX RDF
42	Taro Matsudaira, Shunsuke Shindo, Tomohiro Shimizu, Takeshi Ito, Shoso Shinguhara, Satoru Shimizu	Cu Diffusion Barrier Properties of Various CoWB Electroless Plated Films on SiO2/Si Substrate for Via-last TSV Application.	3DIC	2019	DBLP DOI BibTeX RDF
42	Han Kyeol Seo, Hae-Sung Park, Sarah Eunkyung Kim	Effects of Argon and Nitrogen ion Bombardments on Sputtered and Electroplated Cu Surfaces for Cu Bonding Application.	3DIC	2019	DBLP DOI BibTeX RDF
42	Sethavut Duangchan, Keisuke Yamamoto, Dong Wang, Hiroshi Nakashima, Akiyoshi Baba	SiN used as a Stressor in Germanium-On-Insulator Substrate.	3DIC	2019	DBLP DOI BibTeX RDF
42	Sungho Lee, Yuki Susumago, Zhengyang Qian, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima	Development of 3D-IC Embedded Flexible Hybrid System.	3DIC	2019	DBLP DOI BibTeX RDF
42	Hanna Soneda, Masaki Hashizume, Hiroyuki Yotsuyanagi, Shyue-Kung Lu	Electrical Field Test Method of Resistive Open Defects between Dies by Quiescent Currents through Embedded Diodes.	3DIC	2019	DBLP DOI BibTeX RDF
42	Cheong-Ha Jung, Won Seo, Gu-sung Kim	Thermal Stress Tracking in Multi-Die 3D Stacking Structure by Finite Element Analysis.	3DIC	2019	DBLP DOI BibTeX RDF
42	Akira Matsuzawa	A Universal ADC for Sensor Applications.	3DIC	2019	DBLP DOI BibTeX RDF
42	Wei Feng, Naoya Watanabe, Haruo Shimamoto, Masahiro Aoyagi, Katsuya Kikuchi	Thermal Stress Comparison of Annular-Trench-Isolated (ATI) TSV with Cu and Solder Core.	3DIC	2019	DBLP DOI BibTeX RDF
42	Y. Kagawa, H. Iwamoto	3D Integration Technologies for the Stacked CMOS Image Sensors.	3DIC	2019	DBLP DOI BibTeX RDF
42	Makoto Motoyoshi, Kohki Yanagimura, Taikoh Fushimi, Shunta Endo	Stacked Pixel Sensor/Detector Technology using Au Micro-Bump Junction.	3DIC	2019	DBLP DOI BibTeX RDF
42	Imed Jani, Didier Lattard, Pascal Vivet, Lucile Arnaud, Edith Beigné	Misalignment Analysis and Electrical Performance of High Density 3D-IC interconnects.	3DIC	2019	DBLP DOI BibTeX RDF
42	Giuliano Sisto, Peter Debacker, Rongmei Chen, Geert Van der Plas, Richard Chou, Eric Beyne, Dragomir Milojevic	Design Enablement of Fine Pitch Face-to-Face 3D System Integration using Die-by-Die Place & Route.	3DIC	2019	DBLP DOI BibTeX RDF
42	Minami Nakayama, Seiya Abe, Satoshi Matsumoto	Transformer-Less Floating Gate Driver for 3D Power SoC.	3DIC	2019	DBLP DOI BibTeX RDF
42	Yuki Miwa, Sungho Lee, Rui Liang, Kousei Kumahara, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka	Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs.	3DIC	2019	DBLP DOI BibTeX RDF
42	Robert Fischbach, Tilman Horst, Jens Lienig	A Graph-Based Model of Micro-Transfer Printing for Cost-Optimized Heterogeneous 2.5D Systems.	3DIC	2019	DBLP DOI BibTeX RDF
42	Toshiaki Satoh, Hiroyuki Yotsuyanagi, Masaki Hashizume	On Delay Elements in Boundary Scan Cells for Delay Testing of 3D IC Interconnection.	3DIC	2019	DBLP DOI BibTeX RDF
42	Masahide Goto, Joeri De Vos, Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi, Eiji Higurashi, Yuki Honda, Takuya Saraya, Masaharu Kobayashi, Hiroshi Toshiyoshi, Toshiro Hiramoto	Triple-Layering Technology for Pixel-Parallel CMOS Image Sensors Developed by Hybrid Bonding of SOI Wafers.	3DIC	2019	DBLP DOI BibTeX RDF
42	Fumihiro Inoue, Julien Bertheau, Samuel Suhard, Alain Phommahaxay, Takuya Ohashi, Tetsuro Kinoshita, Yohei Kinoshita, Eric Beyne	Protective Layer for Collective Die to Wafer Hybrid Bonding.	3DIC	2019	DBLP DOI BibTeX RDF
42	Srinivasan Gopal, Deukhyoun Heo, Tanay Karnik	Hierarchical Design Methodology and Optimization for Proximity Communication based Contactless 3D ThruChip Interface.	3DIC	2019	DBLP DOI BibTeX RDF
42	Hae-Sung Park, Han Kyeol Seo, Sarah Eunkyung Kim	Characterization of Nitride Passivated Cu Surface for Low-Temperature Cu-Cu Bonding.	3DIC	2019	DBLP DOI BibTeX RDF
42	Kwang-Seong Choi, Yong-Sung Eom, Seok Hwan Moon, Jiho Joo, Kwangjoo Lee, Jung Hak Kim, Ju Hyeon Kim	Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration.	3DIC	2019	DBLP DOI BibTeX RDF
42	Quy Dinh, Kazuo Kondo, Tetsuji Hirato	Reduction of TSV Pumping.	3DIC	2019	DBLP DOI BibTeX RDF
42	Wei-Hsuan Yang, Jin-Fu Li 0001, Chun-Lung Hsu, Chi-Tien Sun, Shih-Hsu Huang	A Built-in Self-Test Scheme for TSVs of Logic-DRAM Stacked 3D ICs.	3DIC	2019	DBLP DOI BibTeX RDF
42	Mariappan Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima	Growth Optimization of Multi-Layer Graphene for Thermal-TSV Application in 3D-LSI.	3DIC	2019	DBLP DOI BibTeX RDF
42	Tsukasa Miura, Masaki Sakakibara, Hirotsugu Takahashi, Tadayuki Taura, Keiji Tatani, Yusuke Oike, Takayuki Ezaki	A 6.9 μm Pixel-Pitch 3D Stacked Global Shutter CMOS Image Sensor with 3M Cu-Cu connections.	3DIC	2019	DBLP DOI BibTeX RDF
42	Yi-Chieh Tsai, Chia-Hsuan Lee 0003, Kuan-Neng Chen	Investigation of Low Temperature Cu Pillar Eutectic Bonding for 3D Chip Stacking Technology.	3DIC	2019	DBLP DOI BibTeX RDF
42	Peter Ramm, Armin Klumpp, Christof Landesberger, Josef Weber, Andy Heinig, Peter Schneider, Günter Elst, Manfred Engelhardt	Fraunhofer's Initial and Ongoing Contributions in 3D IC Integration.	3DIC	2019	DBLP DOI BibTeX RDF
42	T. Robert Harris, W. Rhett Davis, Steven Lipa, W. Shepherd Pitts, Paul D. Franzon	Vertical Stack Thermal Characterization of Heterogeneous Integration and Packages.	3DIC	2019	DBLP DOI BibTeX RDF
42	Miho Yamada, Shun Ono, Yasuo Arai, Ikuo Kurachi, Toru Tsuboyama, Masayuki Ikebe, Makoto Motoyoshi	3D Integrated Pixel Sensor with Silicon-on-Insulator Technology for the International Linear Collider Experiment.	3DIC	2019	DBLP DOI BibTeX RDF
42	Ken Suzuki, Ryota Mizuno, Yutaro Nakoshi, Hideo Miura	Crystallinity Dependence of Long-Term Reliability of Electroplated Gold Thin-Film Interconnections.	3DIC	2019	DBLP DOI BibTeX RDF
42	Fan-Hsuan Tang, Hsu-Yu Kao, Shih-Hsu Huang, Jin-Fu Li 0001	3D Test Wrapper Chain Optimization with I/O Cells Binding Considered.	3DIC	2019	DBLP DOI BibTeX RDF
42	Jubee Tada, Kazuto Takahashi, Ryusuke Egawa	A Design Scheme for 3-D Stacked CNN Accelerators.	3DIC	2019	DBLP DOI BibTeX RDF
42	Koji Sakui, Takayuki Ohba	High Bandwidth Memory (HBM) and High Bandwidth NAND (HBN) with the Bumpless TSV Technology.	3DIC	2019	DBLP DOI BibTeX RDF
42	Koji Kiyoyama, Qian Zhengy, Hiroyuki Hashimoto, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka	Development of a CDS Circuit for 3-D Stacked Neural Network Chip using CMOS Analog Signal Processing.	3DIC	2019	DBLP DOI BibTeX RDF
42	Koichi Takemura, Akio Ukita, Yasuhiro Ibusuki, Mitsuru Kurihara, Akihiro Noriki, Takeru Amano, Daisuke Okamoto, Yasuyuki Suzuki, Kazuhiko Kurata	Vertical Optical and Electrical Interconnection for Chip-Scale-Packaged Si Photonic Transceivers.	3DIC	2019	DBLP DOI BibTeX RDF
42	Toru Aoki, Katsuyuki Takagi, Toshiyuki Takagi, Hiroki Kase, Akifumi Koike	X-ray Photon-Counting Imager with CdTe/Si-LSI Stacking.	3DIC	2019	DBLP DOI BibTeX RDF
42	Hiroto Tanaka, Yoshiyuki Arai, Toshiyuki Jinda, Noboru Asahi, Katsumi Terada	Collective and Gang Bonding for Three-Dimensional Integrated Circuits in Chip-on-Wafer Process.	3DIC	2019	DBLP DOI BibTeX RDF
42	Amadine Jouve, Loïc Sanchez, Clément Castan, Nicolas Bresson, Frank Fournel, Nicolas Raynaud, Pascal Metzger	Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields.	3DIC	2019	DBLP DOI BibTeX RDF
42	Mariappan Murugesan, Mitsumasa Koyanagi, Hiroyuki Hashimoto, Ji Chel Bea, Takafumi Fukushima	Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration.	3DIC	2019	DBLP DOI BibTeX RDF
42	Sreejith Kochupurackal Rajan, Ming Jui Li, Muhannad S. Bakir, Gary S. May	High Density and Low-Temperature Interconnection Enabled by Mechanical Self-Alignment and Electroless Plating.	3DIC	2019	DBLP DOI BibTeX RDF
42	Olivier Billoint, Karim Azizi-Mourier, Gerald Cibrario, Didier Lattard, Mehdi Mouhdach, Sébastien Thuries, Pascal Vivet	Merging PDKs to Build a Design Environment for 3D Circuits: Methodology, Challenges and Limitations.	3DIC	2019	DBLP DOI BibTeX RDF
42	Akihiro Noriki, Isao Tamai, Yasuhiro Ibusuki, Akio Ukita, Satoshi Suda, Daisuke Shimura, Yosuke Onawa, Hiroki Yaegashi, Takeru Amano	Optical TSV Using Si-Photonics Integrated Curved Micro-Mirror.	3DIC	2019	DBLP DOI BibTeX RDF
42	Akitsu Shigetou, Tilo H. Yang, C. Robert Kao	Hydrolysis-Tolerant Hybrid Bonding in Ambient Atmosphere for 3D Integration.	3DIC	2019	DBLP DOI BibTeX RDF
42	Koji Hamaguchi, Mitsuki Nakata, Kouta Segawa, Naoya Suzuki, Toshihisa Nonaka	Investigation of the Influence of Material Properties on Warpage and Solder Joint Reliability of 2.5D & FO Package.	3DIC	2019	DBLP DOI BibTeX RDF
42	Chuei-Tang Wang, Douglas Yu	Power-Performance Advantages of InFO Technology for Advanced System Integration.	3DIC	2019	DBLP DOI BibTeX RDF
42	Alit Apriyana Anak Agung, Peng Zhao, Chuan Seng Tan	TiN Guard Ring Around TSV for Cross-Talk Suppression of Parallel Networking of Data Center.	3DIC	2019	DBLP DOI BibTeX RDF
42	Masahiro Nomura	Heat Transfer in Nanostructured Si and Heat Flux Control Technique.	3DIC	2019	DBLP DOI BibTeX RDF