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Found 625 publication records. Showing 625 according to the selection in the facets
| Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
| 1 | Jiayi Shen, Chang Liu, Tadaaki Hoshi, Atsushi Sinoda, Hisashi Kino, Tetsu Tanaka, Mariappan Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima |
Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last.  |
3DIC  |
2023 |
DBLP DOI BibTeX RDF |
|
| 1 | Nermeen Hossam, John Ferguson |
Fast, Accurate Assembly-Level Physical Verification of 3DIC Packages. |
3DIC |
2023 |
DBLP DOI BibTeX RDF |
|
| 1 | Po-Yao Chuang, Francesco Lorenzelli, Sreejit Chakravarty, Slimane Boutobza, Cheng-Wen Wu, Georges G. E. Gielen, Erik Jan Marinissen |
Effective and Efficient Test and Diagnosis Pattern Generation for Many Inter-Die Interconnects in Chiplet-Based Packages. |
3DIC |
2023 |
DBLP DOI BibTeX RDF |
|
| 1 | Koutaro Hachiya |
Measurement Point Selection Algorithms for Testing Power TSVs. |
3DIC |
2023 |
DBLP DOI BibTeX RDF |
|
| 1 | Joshua A. Stevens, Tse-Han Pan, Prasanth Prabu Ravichandiran, Paul D. Franzon |
Chiplet Set For Artificial Intelligence. |
3DIC |
2023 |
DBLP DOI BibTeX RDF |
|
| 1 | Mariappan Murugesan, M. Sawa, E. Sone, Makoto Motoyoshi, Mitsumasa Koyanagi, Takafumi Fukushima |
Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding. |
3DIC |
2023 |
DBLP DOI BibTeX RDF |
|
| 1 | Mohamed Naeim, Hanqi Yang, Pinhong Chen, Rong Bao, Antoine Dekeyser, Giuliano Sisto, Moritz Brunion, Rongmei Chen, Geert Van der Plas, Eric Beyne, Dragomir Milojevic |
Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs. |
3DIC |
2023 |
DBLP DOI BibTeX RDF |
|
| 1 | Somnath Pal, Liang Ye, James O'Callaghan, Fatih Bilge Atar, Cian O'Mathuna, Brian Corbett, Ranajit Sai, Sambuddha Khan |
A Study on a Tether-Less Approach Towards Micro-Transfer-Printing of Large-Footprint Power Micro-Inductor Chiplets. |
3DIC |
2023 |
DBLP DOI BibTeX RDF |
|
| 1 | |
IEEE International 3D Systems Integration Conference, 3DIC 2023, Cork, Ireland, May 10-12, 2023 |
3DIC |
2023 |
DBLP DOI BibTeX RDF |
|
| 1 | Emre Can Durmaz, Carl Heine, Zhibo Cao, Jens Lehmann 0002, Dietmar Kissinger, Matthias Wietstruck |
SiGe BiCMOS Technology with Embedded Microchannels based on Cu Pillar PCB Integration Enabling sub-THz Microfluidic Sensor Applications. |
3DIC |
2023 |
DBLP DOI BibTeX RDF |
|
| 1 | Erik W. Masselink, Andrew Stark, Benjamin B. Yang, T. Robert Harris |
Review of Hybrid Integration Techniques for Integrating III-V Onta Silicon. |
3DIC |
2023 |
DBLP DOI BibTeX RDF |
|
| 1 | Pouria Zaghari, Sourish S. Sinha, Jong Eun Ryu, Paul D. Franzon, Douglas C. Hopkins |
Thermal Cycling and Fatigue Life Analysis of a Laterally Conducting GaN-based Power Package. |
3DIC |
2023 |
DBLP DOI BibTeX RDF |
|
| 1 | Priyank Kashyap, Prasanth Prabu Ravichandiran, Lee Wang, Dror Baron, Chau-Wai Wong, Tianfu Wu 0001, Paul D. Franzon |
Thermal Estimation for 3D-ICs Through Generative Networks. |
3DIC |
2023 |
DBLP DOI BibTeX RDF |
|
| 1 | Christophe Dubarry, Lucile Arnaud, Maria-Luisa Calvo-Muñoz, Gaëlle Mauguen, Stéphane Moreau, R. Crochemore, Nicolas Bresson, Bernard Aventurier |
3D interconnection using copper direct hybrid bonding for GaN on silicon wafer. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
| 1 | Ziyue Zhang, Yingtao Ding, Baoyan Yang, Anrun Ren, Zhiming Chen 0001 |
A Low-Cost and Low-Temperature Method to Realize Carbon Nanotube Conductor in Through-Silicon-Via. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
| 1 | Koji Kiyoyama, Yoshihiko Horio, Takafumi Fukushima, Hiroyuki Hashimoto, Takemori Orima, Mitsumasa Koyanagi |
Design for 3-D Stacked Neural Network Circuit with Cyclic Analog Computing. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
| 1 | Yoshihiko Horio, Takemori Orima, Koji Kiyoyama, Mitsumasa Koyanagi |
Implementation of a Chaotic Neural Network Reservoir on a TSV/$\mu\text{Bump}$ Stacked 3D Cyclic Neural Network Integrated Circuit. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
| 1 | Prasanth Prabu Ravichandiran, Paul D. Franzon |
A Review of 3D-Dynamic Random-Access Memory based Near-Memory Computation. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
| 1 | Ankit Kaul, Yandong Luo, Xiaochen Peng, Shimeng Yu, Muhannad S. Bakir |
Thermal Reliability Considerations of Resistive Synaptic Devices for 3D CIM System Performance. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
| 1 | Liangxing Hu, Simon Chun Kiat Goh, Yu Dian Lim, Peng Zhao, Michael Joo Zhong Lim, Chuan Seng Tan |
Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
| 1 | Qianli Zhao, W. Rhett Davis |
A Virtual Platform for Object Detection Systems. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
| 1 | Patrick Krüger, Thomas Voß, Matthias Wietstruck |
Bond Strength Optimization of Plasma Activated Low Temperature Oxide-Oxide Fusion Bonding Through Thermocycling. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
| 1 | Takafumi Fukushima, Shinichi Sakuyama, Masatomo Takahashi, Hiroyuki Hashimoto, Jichoel Bea, Theodorus Marcello, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi, Mariappan Murugesan |
Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
| 1 | Ayano Furue, Satoshi Matsumoto |
Numerical investigations for 3D power supply on chip by coupling of thermal-fluid, circuit, and electromagnetic field simulations. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
| 1 | |
IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021 |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
| 1 | Mariappan Murugesan, E. Sone, A. Simomura, Makoto Motoyoshi, M. Sawa, K. Fukuda, Mitsumasa Koyanagi, Takafumi Fukushima |
Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
| 1 | Shinei Miyasaka, Satoshi Matsumoto |
Numerical predictions of 3D power-supply on chip taking into considerations of proximity effect. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
| 1 | Lee Baker, Robert Patti, Paul D. Franzon |
Multi-ANN embedded system based on a custom 3D-DRAM. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
| 1 | Sreejith Kochupurackal Rajan, Ankit Kaul, Gary S. May, Muhannad S. Bakir |
Electrical and Performance Benefits of Advanced Monolithic Cooling for 2.5D Heterogeneous ICs. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
| 1 | Anthony Mastroianni, Benjamin Kerr, Jawad Nasrullah, Kevin Cameron, Hockshan James Wong, David Ratchkov, Joseph A. Reynick |
Proposed Standardization of Heterogenous Integrated Chiplet Models. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
| 1 | Yuske Ogushi, Satoshi Matsumoto |
Fully integrated transformer less floating gate driver for 3D power supply on chip. |
3DIC |
2021 |
DBLP DOI BibTeX RDF |
|
| 1 | Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka |
Investigation of the Underfill with Negative-Thermal-Expansion Material to Suppress Mechanical Stress in 3D Integration System. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Valeriy Sukharev, Armen Kteyan, Jun-Ho Choy |
An Accurate Assessment of Chip-Package Interaction is a Key Factor for Designing Resilient 3D IC Systems. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Chia-Hsuan Lee 0003, Hsin-Chi Chang, Jui-Han Liu, Hiroyuki Ito, Young-Suk Kim, Kuan-Neng Chen, Takayuki Ohba |
Temperature Cycling Reliability of WOW Bumpless Through Silicon Vias. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Jing Tao, Hongyu Li, Peng Zhao, Yu Dian Lim, Anak Agung Alit Apriyana, Chuan Seng Tan |
Design Considerations and Fabrication Challenges of Surface Electrode Ion Trap with TSV Integration. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Demin Liu, Po-Chih Chen, Yi-Chieh Tsai, Kuan-Neng Chen |
Low Temperature Cu to Cu Direct Bonding below 150 °C with Au Passivation Layer. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Kei Sumita, Jun Takeyasu, Kimihiko Kato, Kasidit Toprasertpong, Mitsuru Takenaka, Shinichi Takagi |
Fabrication of High Quality InAs-on-Lnsulator Structures by Smart Cut Process with Reuse of InAs Wafers. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Yuuki Araga, Kikuchi Katsuya, Masahiro Aoyagi |
Electrostatic Shield TSVs to Suppress Coupling Among Stacked ICs. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Taro Matsudaira, Shunsuke Shindo, Tomohiro Shimizu, Takeshi Ito, Shoso Shinguhara, Satoru Shimizu |
Cu Diffusion Barrier Properties of Various CoWB Electroless Plated Films on SiO2/Si Substrate for Via-last TSV Application. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Han Kyeol Seo, Hae-Sung Park, Sarah Eunkyung Kim |
Effects of Argon and Nitrogen ion Bombardments on Sputtered and Electroplated Cu Surfaces for Cu Bonding Application. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Sethavut Duangchan, Keisuke Yamamoto, Dong Wang, Hiroshi Nakashima, Akiyoshi Baba |
SiN used as a Stressor in Germanium-On-Insulator Substrate. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Sungho Lee, Yuki Susumago, Zhengyang Qian, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima |
Development of 3D-IC Embedded Flexible Hybrid System. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Hanna Soneda, Masaki Hashizume, Hiroyuki Yotsuyanagi, Shyue-Kung Lu |
Electrical Field Test Method of Resistive Open Defects between Dies by Quiescent Currents through Embedded Diodes. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | |
2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019 |
3DIC |
2019 |
DBLP BibTeX RDF |
|
| 1 | Cheong-Ha Jung, Won Seo, Gu-sung Kim |
Thermal Stress Tracking in Multi-Die 3D Stacking Structure by Finite Element Analysis. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Akira Matsuzawa |
A Universal ADC for Sensor Applications. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Wei Feng, Naoya Watanabe, Haruo Shimamoto, Masahiro Aoyagi, Katsuya Kikuchi |
Thermal Stress Comparison of Annular-Trench-Isolated (ATI) TSV with Cu and Solder Core. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Y. Kagawa, H. Iwamoto |
3D Integration Technologies for the Stacked CMOS Image Sensors. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Makoto Motoyoshi, Kohki Yanagimura, Taikoh Fushimi, Shunta Endo |
Stacked Pixel Sensor/Detector Technology using Au Micro-Bump Junction. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Imed Jani, Didier Lattard, Pascal Vivet, Lucile Arnaud, Edith Beigné |
Misalignment Analysis and Electrical Performance of High Density 3D-IC interconnects. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Giuliano Sisto, Peter Debacker, Rongmei Chen, Geert Van der Plas, Richard Chou, Eric Beyne, Dragomir Milojevic |
Design Enablement of Fine Pitch Face-to-Face 3D System Integration using Die-by-Die Place & Route. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Minami Nakayama, Seiya Abe, Satoshi Matsumoto |
Transformer-Less Floating Gate Driver for 3D Power SoC. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Yuki Miwa, Sungho Lee, Rui Liang, Kousei Kumahara, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka |
Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Robert Fischbach, Tilman Horst, Jens Lienig |
A Graph-Based Model of Micro-Transfer Printing for Cost-Optimized Heterogeneous 2.5D Systems. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Toshiaki Satoh, Hiroyuki Yotsuyanagi, Masaki Hashizume |
On Delay Elements in Boundary Scan Cells for Delay Testing of 3D IC Interconnection. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Masahide Goto, Joeri De Vos, Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi, Eiji Higurashi, Yuki Honda, Takuya Saraya, Masaharu Kobayashi, Hiroshi Toshiyoshi, Toshiro Hiramoto |
Triple-Layering Technology for Pixel-Parallel CMOS Image Sensors Developed by Hybrid Bonding of SOI Wafers. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Fumihiro Inoue, Julien Bertheau, Samuel Suhard, Alain Phommahaxay, Takuya Ohashi, Tetsuro Kinoshita, Yohei Kinoshita, Eric Beyne |
Protective Layer for Collective Die to Wafer Hybrid Bonding. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Srinivasan Gopal, Deukhyoun Heo, Tanay Karnik |
Hierarchical Design Methodology and Optimization for Proximity Communication based Contactless 3D ThruChip Interface. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Hae-Sung Park, Han Kyeol Seo, Sarah Eunkyung Kim |
Characterization of Nitride Passivated Cu Surface for Low-Temperature Cu-Cu Bonding. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Kwang-Seong Choi, Yong-Sung Eom, Seok Hwan Moon, Jiho Joo, Kwangjoo Lee, Jung Hak Kim, Ju Hyeon Kim |
Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Quy Dinh, Kazuo Kondo, Tetsuji Hirato |
Reduction of TSV Pumping. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Wei-Hsuan Yang, Jin-Fu Li 0001, Chun-Lung Hsu, Chi-Tien Sun, Shih-Hsu Huang |
A Built-in Self-Test Scheme for TSVs of Logic-DRAM Stacked 3D ICs. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Mariappan Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima |
Growth Optimization of Multi-Layer Graphene for Thermal-TSV Application in 3D-LSI. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Tsukasa Miura, Masaki Sakakibara, Hirotsugu Takahashi, Tadayuki Taura, Keiji Tatani, Yusuke Oike, Takayuki Ezaki |
A 6.9 μm Pixel-Pitch 3D Stacked Global Shutter CMOS Image Sensor with 3M Cu-Cu connections. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Yi-Chieh Tsai, Chia-Hsuan Lee 0003, Kuan-Neng Chen |
Investigation of Low Temperature Cu Pillar Eutectic Bonding for 3D Chip Stacking Technology. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Peter Ramm, Armin Klumpp, Christof Landesberger, Josef Weber, Andy Heinig, Peter Schneider, Günter Elst, Manfred Engelhardt |
Fraunhofer's Initial and Ongoing Contributions in 3D IC Integration. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | T. Robert Harris, W. Rhett Davis, Steven Lipa, W. Shepherd Pitts, Paul D. Franzon |
Vertical Stack Thermal Characterization of Heterogeneous Integration and Packages. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Miho Yamada, Shun Ono, Yasuo Arai, Ikuo Kurachi, Toru Tsuboyama, Masayuki Ikebe, Makoto Motoyoshi |
3D Integrated Pixel Sensor with Silicon-on-Insulator Technology for the International Linear Collider Experiment. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Ken Suzuki, Ryota Mizuno, Yutaro Nakoshi, Hideo Miura |
Crystallinity Dependence of Long-Term Reliability of Electroplated Gold Thin-Film Interconnections. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Fan-Hsuan Tang, Hsu-Yu Kao, Shih-Hsu Huang, Jin-Fu Li 0001 |
3D Test Wrapper Chain Optimization with I/O Cells Binding Considered. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Jubee Tada, Kazuto Takahashi, Ryusuke Egawa |
A Design Scheme for 3-D Stacked CNN Accelerators. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Koji Sakui, Takayuki Ohba |
High Bandwidth Memory (HBM) and High Bandwidth NAND (HBN) with the Bumpless TSV Technology. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Koji Kiyoyama, Qian Zhengy, Hiroyuki Hashimoto, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka |
Development of a CDS Circuit for 3-D Stacked Neural Network Chip using CMOS Analog Signal Processing. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Koichi Takemura, Akio Ukita, Yasuhiro Ibusuki, Mitsuru Kurihara, Akihiro Noriki, Takeru Amano, Daisuke Okamoto, Yasuyuki Suzuki, Kazuhiko Kurata |
Vertical Optical and Electrical Interconnection for Chip-Scale-Packaged Si Photonic Transceivers. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Toru Aoki, Katsuyuki Takagi, Toshiyuki Takagi, Hiroki Kase, Akifumi Koike |
X-ray Photon-Counting Imager with CdTe/Si-LSI Stacking. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Hiroto Tanaka, Yoshiyuki Arai, Toshiyuki Jinda, Noboru Asahi, Katsumi Terada |
Collective and Gang Bonding for Three-Dimensional Integrated Circuits in Chip-on-Wafer Process. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Amadine Jouve, Loïc Sanchez, Clément Castan, Nicolas Bresson, Frank Fournel, Nicolas Raynaud, Pascal Metzger |
Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Mariappan Murugesan, Mitsumasa Koyanagi, Hiroyuki Hashimoto, Ji Chel Bea, Takafumi Fukushima |
Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Sreejith Kochupurackal Rajan, Ming Jui Li, Muhannad S. Bakir, Gary S. May |
High Density and Low-Temperature Interconnection Enabled by Mechanical Self-Alignment and Electroless Plating. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Olivier Billoint, Karim Azizi-Mourier, Gerald Cibrario, Didier Lattard, Mehdi Mouhdach, Sébastien Thuries, Pascal Vivet |
Merging PDKs to Build a Design Environment for 3D Circuits: Methodology, Challenges and Limitations. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Akihiro Noriki, Isao Tamai, Yasuhiro Ibusuki, Akio Ukita, Satoshi Suda, Daisuke Shimura, Yosuke Onawa, Hiroki Yaegashi, Takeru Amano |
Optical TSV Using Si-Photonics Integrated Curved Micro-Mirror. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Akitsu Shigetou, Tilo H. Yang, C. Robert Kao |
Hydrolysis-Tolerant Hybrid Bonding in Ambient Atmosphere for 3D Integration. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Koji Hamaguchi, Mitsuki Nakata, Kouta Segawa, Naoya Suzuki, Toshihisa Nonaka |
Investigation of the Influence of Material Properties on Warpage and Solder Joint Reliability of 2.5D & FO Package. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Chuei-Tang Wang, Douglas Yu |
Power-Performance Advantages of InFO Technology for Advanced System Integration. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Alit Apriyana Anak Agung, Peng Zhao, Chuan Seng Tan |
TiN Guard Ring Around TSV for Cross-Talk Suppression of Parallel Networking of Data Center. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Masahiro Nomura |
Heat Transfer in Nanostructured Si and Heat Flux Control Technique. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Yoshiaki Hagiwara |
Multichip CMOS Image Sensor Structure for Flash Image Acquisition. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Koutaro Hachiya, Atsushi Kurokawa |
Variability Cancellation to Improve Diagnostic Performance of Testing through Silicon Vias in Power Distribution Network of 3D-IC. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Tadao Nakamura |
An Introduction to Marching Memory (MM). |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Tadatomo Yamada, Ken Takano, Toshiaki Menjo, Shinya Takyu |
Study of Optimizing Stress-Strain Curve of Adhesive for High Expansion Tape. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Takuji Miki, Makoto Nagata, Akihiro Tsukioka, Noriyuki Miura, Takaaki Okidono, Yuuki Araga, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi |
Over-the-top Si Interposer Embedding Backside Buried Metal PDN to Reduce Power Supply Impedance of Large Scale Digital ICs. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Po-Chih Chen, Demin Liu, Kuan-Neng Chen |
Low-Temperature Wafer-Level Metal Bonding with Gold Thin Film at 100 °C. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Dimitrios Velenis, Joeri De Vos, Soon-Wook Kim, Jaber Derakhshandeh, Pieter Bex, Giovanni Capuz, Samuel Suhard, Kenneth June Rebibis, Stefaan Van Huylenbroeck, Erik Jan Marinissen, Alain Phommahaxay, Andy Miller, Gerald Beyer, Geert Van der Plas, Eric Beyne |
Process Complexity and Cost Considerations of Multi-Layer Die Stacks. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Shunji Kurooka, Yoshinori Hotta, Ai Nakamura, Mitsumasa Koyanagi, Takafumi Fukushima |
Cu-Cu Bonding Challenges with 'i-ACF' for Advanced 3D Integration. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Takahiro Nagata, Kazumichi Tsumura, Kenro Nakamura, Kengo Uchida, Jin Kawakita, Toyohiro Chikyow, Kazuyuki Higashi |
Photoelectroscopic Study of Mn Barrier Layer on SiO2 for Si Wafer Bonding Process. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Rui Liang, Sungho Lee, Yuki Miwa, Kousei Kumahara, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka |
Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO2 for Low-Temperature TSV Liner Formation. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
|
| 1 | Shunsuke Hanatani, Takuya Yorioka, Tomohiro Shimizu, Takeshi Ito, Shoso Shingubara |
Study of MacEtch using Additives for Preparation of TSV. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
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| 1 | Emilie Bourjot, Paul Stewart, Christophe Dubarry, E. Lagoutte, E. Rolland, Nicolas Bresson, G. Romano, D. Scevola, Viorel Balan, Jérôme Dechamp, Marc Zussy, Gaëlle Mauguen, Clément Castan, Loïc Sanchez, Amadine Jouve, Frank Fournel, Séverine Cheramy |
Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
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| 1 | Ziyue Zhang, Yingtao Ding, Zhiming Chen 0001, Mingrui Zhou, Lei Xiao, Ziru Cai, Miao Xiong, Xiao Gong |
Design and Evaluation of a Novel and Ultra-Compact Fully-TGV-based Self-Shielding Bandpass Filter for 5G Applications. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
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| 1 | Timothy M. Hancock, Jeffrey C. Demmin |
Heterogeneous and 3D Integration at DARPA. |
3DIC |
2019 |
DBLP DOI BibTeX RDF |
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