Search results for "Electromigration"

Hits ?▲	Authors	Title	Venue	Year	Link	Author keywords
125	Cher Ming Tan, Kelvin Ngan Chong Yeo	A Reliability Statistics Perspective on the Pitfalls of Standard Wafer-Level Electromigration Accelerated Test (SWEAT).	J. Electron. Test.	2001	DBLP DOI BibTeX RDF	electromigration testing, accelerated stress testing, reliability statistics, wafer-level reliability, SWEAT
111	Jens Lienig	introduction to electromigration-aware physical design.	ISPD	2006	DBLP DOI BibTeX RDF	interconnect, layout, physical design, electromigration, current density, interconnect reliability
111	Jens Lienig	Interconnect and current density stress: an introduction to electromigration-aware design.	SLIP	2005	DBLP DOI BibTeX RDF	interconnect, layout, physical design, electromigration, current density, interconnect reliability
97	Steffen Rochel, N. S. Nagaraj	Full-Chip Signal Interconnect Analysis for Electromigration Reliability.	ISQED	2000	DBLP DOI BibTeX RDF	Full-chip Analysis, Deep Sub-micron design, Validation, Electromigration
90	Jens Lienig, Göran Jerke	Electromigration-Aware Physical Design of Integrated Circuits.	VLSI Design	2005	DBLP DOI BibTeX RDF
82	Cemal Basaran, Minghui Lin, Shidong Li	Computational simulation of electromigration induced damage in copper interconnects.	SCSC	2007	DBLP BibTeX RDF	copper interconnects, damage mechanics, electronics packaging reliability, thin film, electromigration
75	David T. Blaauw, Chanhee Oh, Vladimir Zolotov, Aurobindo Dasgupta	Static electromigration analysis for on-chip signal interconnects.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2003	DBLP DOI BibTeX RDF
68	Iris Hui-Ru Jiang, Hua-Yu Chang, Chih-Long Chang	Optimal wiring topology for electromigration avoidance considering multiple layers and obstacles.	ISPD	2010	DBLP DOI BibTeX RDF	routing, linear programming, network flow, electromigration
68	Rani S. Ghaida, Payman Zarkesh-Ha	A Layout Sensitivity Model for Estimating Electromigration-vulnerable Narrow Interconnects.	J. Electron. Test.	2009	DBLP DOI BibTeX RDF	Layout sensitivity, Narrow defects, Electromigration, Critical area, Yield prediction, Yield modeling, Spot defects
68	Xiangdong Xuan, Adit D. Singh, Abhijit Chatterjee	Lifetime Prediction and Design-for-Reliability of IC Interconnections with Electromigration Induced Degradation in the Presence of Manufacturing Defects.	J. Electron. Test.	2006	DBLP DOI BibTeX RDF	IC reliability, reliability simulation, design for reliability, interconnect, electromigration, defect modeling
68	Syed M. Alam, Donald E. Troxel, Carl V. Thompson	Thermal aware cell-based full-chip electromigration reliability analysis.	ACM Great Lakes Symposium on VLSI	2005	DBLP DOI BibTeX RDF	IC thermal analysis, full-chip reliability, reliability aware design, reliability characterization, electromigration
68	Goeran Jerke, Jens Lienig, Jürgen Scheible	Reliability-driven layout decompaction for electromigration failure avoidance in complex mixed-signal IC designs.	DAC	2004	DBLP DOI BibTeX RDF	decompaction, layout decomposition, physical design, compaction, electromigration, interconnect reliability
68	Jens Lienig, Goeran Jerke, Thorsten Adler	Electromigration Avoidance in Analog Circuits: Two Methodologies for Current-Driven Routing.	ASP-DAC/VLSI Design	2002	DBLP DOI BibTeX RDF	wire width, wire planning, current-driven routing, Design methodology, electromigration, detailed routing, current density, analog circuit design
64	N. Venkateswaran 0002, S. Balaji, V. Sridhar	Fault tolerant bus architecture for deep submicron based processors.	SIGARCH Comput. Archit. News	2005	DBLP DOI BibTeX RDF	deep submicron technology, fault tolerance, interconnect, electromigration
61	Chanhee Oh, David T. Blaauw, Murat R. Becer, Vladimir Zolotov, Rajendran Panda, Aurobindo Dasgupta	Static Electromigration Analysis for Signal Interconnects.	ISQED	2003	DBLP DOI BibTeX RDF
61	J. Joseph Clement, Stefan P. Riege, Radenko Cvijetic, Carl V. Thompson	Methodology for electromigration critical threshold design rule evaluation.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	1999	DBLP DOI BibTeX RDF
61	N. S. Nagaraj, Frank Cano, Haldun Haznedar, Duane Young	A Practical Approach to Static Signal Electromigration Analysis.	DAC	1998	DBLP DOI BibTeX RDF
61	Chin-Chi Teng, Yi-Kan Cheng, Elyse Rosenbaum, Sung-Mo Kang	iTEM: a temperature-dependent electromigration reliability diagnosis tool.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	1997	DBLP DOI BibTeX RDF
54	Aida Todri, Malgorzata Marek-Sadowska	Electromigration study of power-gated grids.	ISLPED	2009	DBLP DOI BibTeX RDF	electromigration, power network
54	Aida Todri, Shih-Chieh Chang, Malgorzata Marek-Sadowska	Electromigration and voltage drop aware power grid optimization for power gated ICs.	ISLPED	2007	DBLP DOI BibTeX RDF	power supply grid, power gating, electromigration
54	Xiangdong Xuan, Abhijit Chatterjee	Sensitivity and Reliability Evaluation for Mixed-Signal ICs under Electromigration and Hot-Carrier Effects.	DFT	2001	DBLP DOI BibTeX RDF	hot-carrier, hierarchical analysis, hot-spot, performance degradation, Electromigration
54	Gilbert Yoh, Farid N. Najm	A Statistical Model for Electromigration Failures.	ISQED	2000	DBLP DOI BibTeX RDF	lognormal distribution multilognormal distribution, electromigration, reliability prediction
54	Zhan Chen, Fook-Luen Heng	A Fast Minimum Layout Perturbation Algorithm for Electromigration Reliability Enhancement.	DFT	1998	DBLP DOI BibTeX RDF	layout compaction, design for reliability, electromigration
50	Bipin Rajendran, Pawan Kapur, Krishna Saraswat, R. Fabian W. Pease	Self-consistent power/performance/reliability analysis for copper interconnects.	SLIP	2004	DBLP DOI BibTeX RDF	Joule heating, copper interconnects, rent's rule, electromigration, duty cycle, current density
50	Tianxu Zhao, Xuchao Duan, Yue Hao, Peijun Ma	Reliability Estimation Model of ICs Interconnect Based on Uniform Distribution of Defects on a Chip.	DFT	2003	DBLP DOI BibTeX RDF	interconnection lifetime, electromigration effect, defect
47	Syed M. Alam, Frank L. Wei, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel	Electromigration Reliability Comparison of Cu and Al Interconnects.	ISQED	2005	DBLP DOI BibTeX RDF
47	Goeran Jerke, Jens Lienig	Hierarchical Current Density Verification for Electromigration Analysis in Arbitrary Shaped Metallization Patterns of Analog Circuits.	DATE	2002	DBLP DOI BibTeX RDF
43	Aida Todri, Malgorzata Marek-Sadowska	A study of reliability issues in clock distribution networks.	ICCD	2008	DBLP DOI BibTeX RDF
39	Lubomír Bañas, Robert Nürnberg	Finite Element Approximation of a Three Dimensional Phase Field Model for Void Electromigration.	J. Sci. Comput.	2008	DBLP DOI BibTeX RDF	Void electromigration, Phase field model, Degenerate Cahn-Hilliard equation, Fourth order degenerate parabolic system, Finite elements, Multigrid methods, Convergence analysis, Surface diffusion
37	D. Slottke, R. J. Kamaladasa, M. Harmes, Ilan Tsameret, Mauro J. Kobrinsky, Timothy McMullen, John Dunklee	Wafer-level electromigration for reliability monitoring: Quick-turn electromigration stress with correlation to package-level stress.	IRPS	2015	DBLP DOI BibTeX RDF
37	Boukary Ouattara	Prévision des effets de vieillissement par électromigration dans les circuits intégrés CMOS en nœuds technologiques submicroniques. (Forecasting the effects of aging by electromigration in the circuits integrated CMOS submicron technology nodes).		2014	RDF
35	Eric Karl, David T. Blaauw, Dennis Sylvester, Trevor N. Mudge	Reliability modeling and management in dynamic microprocessor-based systems.	DAC	2006	DBLP DOI BibTeX RDF	dynamic reliability management, oxide breakdown, thermal cycling, modeling, electromigration
35	Mariagrazia Graziano, Marco Delaurenti, Guido Masera, Gianluca Piccinini, Maurizio Zamboni	Noise Safety Design Methodologies.	ISQED	2000	DBLP DOI BibTeX RDF	Electromigration Safety, Deep-submicron Design Reliability, Noise, Noise Tolerance, Noise Models
35	Thorsten Adler, Hiltrud Brocke, Lars Hedrich, Erich Barke	A current driven routing and verification methodology for analog applications.	DAC	2000	DBLP DOI BibTeX RDF	multiterminal signal nets, routing, verification, design methodology, Steiner tree, electromigration, current density
35	Alexander Dalal, Lavi Lev, Sundari Mitra	Design of an efficient power distribution network for the UltraSPARC-I microprocessor.	ICCD	1995	DBLP DOI BibTeX RDF	computer power supplies, UltraSPARC-I, simulation method, exact layout locations, excessive voltage drop, floorplanning constraints, power interconnections, reduced time-to-market, circuit analysis computing, circuit layout CAD, microprocessor chips, electromigration, CAD tools, power distribution network
33	Haldun Haznedar, Martin Gall, Vladimir Zolotov, Pon Sung Ku, Chanhee Oh, Rajendran Panda	Impact of stress-induced backflow on full-chip electromigration risk assessment.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2006	DBLP DOI BibTeX RDF
33	Valeriy Sukharev	Physically based simulation of electromigration-induced degradation mechanisms in dual-inlaid copper interconnects.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2005	DBLP DOI BibTeX RDF
33	Valeriy Sukharev	Physically-Based Simulation of Electromigration Induced Failures in Copper Dual-Damascene Interconnect.	ISQED	2004	DBLP DOI BibTeX RDF
33	Chanhee Oh, Haldun Haznedar, Martin Gall, Amir Grinshpon, Vladimir Zolotov, Pon Sung Ku, Rajendran Panda	A Methodology for Chip-Level Electromigration Risk Assessment and Product Qualification.	ISQED	2004	DBLP DOI BibTeX RDF
29	Ilya Levin, Benjamin Abramov, Vladimir Ostrovsky	Reduction of Fault Latency in Sequential Circuits by using Decomposition.	DFT	2007	DBLP DOI BibTeX RDF
29	Göran Jerke, Jens Lienig	Hierarchical current-density verification in arbitrarily shaped metallization patterns of analog circuits.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2004	DBLP DOI BibTeX RDF
29	Roman Barsky, Israel A. Wagner	Reliability and Yield: A Joint Defect-Oriented Approach.	DFT	2004	DBLP DOI BibTeX RDF
29	Aurobindo Dasgupta, Ramesh Karri	High-reliability, low-energy microarchitecture synthesis.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	1998	DBLP DOI BibTeX RDF
29	Farid N. Najm, Richard Burch, Ping Yang 0001, Ibrahim N. Hajj	Probabilistic simulation for reliability analysis of CMOS VLSI circuits.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	1990	DBLP DOI BibTeX RDF
21	Thomas Pompl, Christian Schlünder, Martina Hommel, Heiko Nielen, Jens Schneider	Practical aspects of reliability analysis for IC designs.	DAC	2006	DBLP DOI BibTeX RDF	ESD, TDDB of intermetal dielectric, design-in reliability, gate oxide integrity, hot carrier stress, stress-induced voiding, NBTI, electromigration
21	Suresh Srinivasan, Prasanth Mangalagiri, Yuan Xie 0001, Narayanan Vijaykrishnan, Karthik Sarpatwari	FLAW: FPGA lifetime awareness.	DAC	2006	DBLP DOI BibTeX RDF	hot carrier effects, time dependent dielecric breakdown, FPGA, electromigration
21	Zhijian Lu, John C. Lach, Mircea R. Stan, Kevin Skadron	Improved Thermal Management with Reliability Banking.	IEEE Micro	2005	DBLP DOI BibTeX RDF	Dynamic thermal/reliability management, Analytical and simulation techniques, Modeling, Performability, Electromigration
18	Olympia Axelou, George Floros 0002, Nestor E. Evmorfopoulos, George I. Stamoulis	Fast electromigration stress analysis using Low-Rank Balanced Truncation for general interconnect and power grid structures.	Integr.	2023	DBLP DOI BibTeX RDF
18	Liang Chen 0025, Wentian Jin, Mohammadamir Kavousi, Subed Lamichhane, Sheldon X.-D. Tan	Linear Time Electromigration Analysis Based on Physics-Informed Sparse Regression.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2023	DBLP DOI BibTeX RDF
18	Tianshu Hou, Peining Zhen, Zhigang Ji, Hai-Bao Chen	A Deep Learning Framework for Solving Stress-based Partial Differential Equations in Electromigration Analysis.	ACM Trans. Design Autom. Electr. Syst.	2023	DBLP DOI BibTeX RDF
18	Stéphane Moreau, David Bouchu, J. Jourdon, Bassel Ayoub, S. Lhostis, Hélène Frémont, P. Lamontagne	Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits.	IRPS	2023	DBLP DOI BibTeX RDF
18	Yong Hyeon Yi, Chris H. Kim, Chen Zhou, Armen Kteyan, Valeriy Sukharev	Studying the Impact of Temperature Gradient on Electromigration Lifetime Using a Power Grid Test Structure with On-Chip Heaters.	IRPS	2023	DBLP DOI BibTeX RDF
18	A. S. Saleh, Houman Zahedmanesh, Hajdin Ceric, Ingrid De Wolf, Kris Croes	Impact of via geometry and line extension on via-electromigration in nano-interconnects.	IRPS	2023	DBLP DOI BibTeX RDF
18	Houman Zahedmanesh, Philippe Roussel, Ivan Ciofi, Kristof Croes	A pragmatic network-aware paradigm for system-level electromigration predictions at scale.	IRPS	2023	DBLP DOI BibTeX RDF
18	Brian T. McGowan, Michal Rakowski, Seungman Choi	Nickel Silicide Electromigration on Micro Ring Modulators for Silicon Photonics Technology.	IRPS	2023	DBLP DOI BibTeX RDF
18	Mahta Mayahinia, Hsiao-Hsuan Liu, Subrat Mishra, Zsolt Tokei, Francky Catthoor, Mehdi B. Tahoori	Electromigration-aware design technology co-optimization for SRAM in advanced technology nodes.	DATE	2023	DBLP DOI BibTeX RDF
18	Mahta Mayahinia, Mehdi Baradaran Tahoori, Grigor Tshagharyan, Gurgen Harutyunyan, Yervant Zorian	On-chip Electromigration Sensor for Silicon Lifecycle Management of Nanoscale VLSI.	ETS	2023	DBLP DOI BibTeX RDF
18	Pavlos Stoikos, George Floros 0002, Dimitrios Garyfallou, Nestor E. Evmorfopoulos, George I. Stamoulis	A Fast Semi-Analytical Approach for Transient Electromigration Analysis of Interconnect Trees Using Matrix Exponential.	ASP-DAC	2023	DBLP DOI BibTeX RDF
18	Nestor E. Evmorfopoulos, Mohammad Abdullah Al Shohel, Olympia Axelou, Pavlos Stoikos, Vidya A. Chhabria, Sachin S. Sapatnekar	Recent Progress in the Analysis of Electromigration and Stress Migration in Large Multisegment Interconnects.	ISPD	2023	DBLP DOI BibTeX RDF
18	Armen Kteyan, Valeriy Sukharev, Alexander Volkov, Jun-Ho Choy, Farid N. Najm, Yong Hyeon Yi, Chris H. Kim, Stéphane Moreau	Electromigration Assessment in Power Grids with Account of Redundancy and Non-Uniform Temperature Distribution.	ISPD	2023	DBLP DOI BibTeX RDF
18	Susann Rothe, Jens Lienig	Combined Modeling of Electromigration, Thermal and Stress Migration in AC Interconnect Lines.	ISPD	2023	DBLP DOI BibTeX RDF
18	Olympia Axelou, Eleni Tselepi, George Floros 0002, Nestor E. Evmorfopoulos, Georgios I. Stamoulis	PROTON - A Python Framework for Physics-Based Electromigration Assessment on Contemporary VLSI Power Grids.	SMACD	2023	DBLP DOI BibTeX RDF
18	Pavlos Stoikos, George Floros 0002, Dimitrios Garyfallou, Nestor E. Evmorfopoulos, Georgios I. Stamoulis	Electromigration Stress Analysis with Rational Krylov-based Approximation of Matrix Exponential.	SMACD	2023	DBLP DOI BibTeX RDF
18	Mohammad Abdullah Al Shohel, Vidya A. Chhabria, Nestoras E. Evmorfopoulos, Sachin S. Sapatnekar	Frequency-Domain Transient Electromigration Analysis Using Circuit Theory.	ICCAD	2023	DBLP DOI BibTeX RDF
18	Subed Lamichhane, Wentian Jin, Liang Chen 0025, Mohammadamir Kavousi, Sheldon X.-D. Tan	PostPINN-EM: Fast Post-Voiding Electromigration Analysis Using Two-Stage Physics-Informed Neural Networks.	ICCAD	2023	DBLP DOI BibTeX RDF
18	Hongchao Zhang, Yunfan Zuo	A 2D Clock Interconnect Electromigration-Thermal Coupling Simulation Method Based on COMSOL.	ASICON	2023	DBLP DOI BibTeX RDF
18	Bijan Shahriari, Farid N. Najm	Fast Electromigration Simulation for Chip Power Grids.	ISQED	2023	DBLP DOI BibTeX RDF
18	Mahta Mayahinia, Mehdi B. Tahoori, Manu Perumkunnil Komalan, Houman Zahedmanesh, Kristof Croes, Tommaso Marinelli, José Ignacio Gómez Pérez, Timon Evenblij, Gouri Sankar Kar, Francky Catthoor	Time-Dependent Electromigration Modeling for Workload-Aware Design-Space Exploration in STT-MRAM.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2022	DBLP DOI BibTeX RDF
18	Valeriy Sukharev, Armen Kteyan, Farid N. Najm, Yong Hyeon Yi, Chris H. Kim, Jun-Ho Choy, Sofya Torosyan, Yu Zhu	Experimental Validation of a Novel Methodology for Electromigration Assessment in On-Chip Power Grids.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2022	DBLP DOI BibTeX RDF
18	Rui Zhang 0048, Taizhi Liu, Kexin Yang 0001, Linda Milor	CacheEM: For Reliability Analysis on Cache Memory Aging Due to Electromigration.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2022	DBLP DOI BibTeX RDF
18	Xin Gan, Yueying Zhang, Yupeng Hui, Shaoxuan Liu, Lei Wang, Jincheng Zhang, Yue Hao, Haijiao Harsan Ma	Controlling Memristance and Negative Differential Resistance in Point-Contacted Metal-Oxides-Metal Heterojunctions: Role of Oxygen Vacancy Electromigration and Electron Hopping.	Adv. Intell. Syst.	2022	DBLP DOI BibTeX RDF
18	Pavlos Stoikos, George Floros 0002, Dimitrios Garyfallou, Nestor E. Evmorfopoulos, George I. Stamoulis	A Fast Semi-Analytical Approach for Transient Electromigration Analysis of Interconnect Trees using Matrix Exponential.	CoRR	2022	DBLP DOI BibTeX RDF
18	Hajdin Ceric, Roberto Lacerda de Orio, Siegfried Selberherr	Impact of Gold Interconnect Microstructure on Electromigration Failure Time Statistics.	ESSDERC	2022	DBLP DOI BibTeX RDF
18	Armen Kteyan, Valeriy Sukharev, Y. Yi, Chris H. Kim	Novel methodology for temperature-aware electromigration assessment in on-chip power grid: simulations and experimental validation (Invited).	IRPS	2022	DBLP DOI BibTeX RDF
18	Houman Zahedmanesh, Ivan Ciofi, Odysseas Zografos, Kristof Croes, Mustafa Badaroglu	System-Level Simulation of Electromigration in a 3 nm CMOS Power Delivery Network: The Effect of Grid Redundancy, Metallization Stack and Standard-Cell Currents.	IRPS	2022	DBLP DOI BibTeX RDF
18	M. H. Lin, C. I. Lin, Y. C. Wang, Aaron Wang	Redundancy Effect on Electromigration Failure Time in Power Grid Networks.	IRPS	2022	DBLP DOI BibTeX RDF
18	O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, Philippe J. Roussel, Marleen H. van der Veen, Veerle Simons, Emmanuel Chery, Ivan Ciofi, Kris Croes	Assessment of critical Co electromigration parameters.	IRPS	2022	DBLP DOI BibTeX RDF
18	Mohammadamir Kavousi, Liang Chen 0025, Sheldon X.-D. Tan	Fast Electromigration Stress Analysis Considering Spatial Joule Heating Effects.	ASP-DAC	2022	DBLP DOI BibTeX RDF
18	Leila Sharara, Seyedeh Masoumeh Navidi, Hamza Al Maharmeh, Samad Parekh, Ali Wehbi, Mohammad Alhawari, Mohammed Ismail 0001	Analysis and Effects of Aging and Electromigration on Mixed-Signal ICs in 22nm FDSOI Technology.	ICECS 2022	2022	DBLP DOI BibTeX RDF
18	Olympia Axelou, George Floros 0002, Nestor E. Evmorfopoulos, George I. Stamoulis	Accelerating Electromigration Stress Analysis Using Low-Rank Balanced Truncation.	SMACD	2022	DBLP DOI BibTeX RDF
18	Wentian Jin, Liang Chen 0025, Subed Lamichhane, Mohammadamir Kavousi, Sheldon X.-D. Tan	HierPINN-EM: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnects Using Hierarchical Physics-Informed Neural Network.	ICCAD	2022	DBLP DOI BibTeX RDF
18	Olympia Axelou, Nestor E. Evmorfopoulos, George Floros 0002, George I. Stamoulis, Sachin S. Sapatnekar	A Novel Semi-Analytical Approach for Fast Electromigration Stress Analysis in Multi-Segment Interconnects.	ICCAD	2022	DBLP DOI BibTeX RDF
18	Mahta Mayahinia, Mehdi B. Tahoori, Gurgen Harutyunyan, Grigor Tshagharyan, Karen Amirkhanyan	An Efficient Test Strategy for Detection of Electromigration Impact in Advanced FinFET Memories.	ITC	2022	DBLP DOI BibTeX RDF
18	Mahta Mayahinia, Mehdi B. Tahoori, Manu Perumkunnil, Kristof Croes, Francky Catthoor	Analyzing the Electromigration Challenges of Computation in Resistive Memories.	ITC	2022	DBLP DOI BibTeX RDF
18	Jing Wang, Yici Cai, Qiang Zhou 0001	Temperature-Aware Electromigration Analysis with Current-Tracking in Power Grid Networks.	J. Comput. Sci. Technol.	2021	DBLP DOI BibTeX RDF
18	Qian Lin, Hai-Feng Wu, Lin Zhu, Xiao-Ming Zhang, Lin-Sheng Liu	Design and Electromigration Study for a Stacked Distributed Power Amplifier.	J. Circuits Syst. Comput.	2021	DBLP DOI BibTeX RDF
18	Xiaoyi Wang, Shaobin Ma, Sheldon X.-D. Tan, Chase Cook, Liang Chen 0025, Jianlei Yang 0001, Wenjian Yu	Fast Physics-Based Electromigration Analysis for Full-Chip Networks by Efficient Eigenfunction-Based Solution.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2021	DBLP DOI BibTeX RDF
18	Liang Chen 0025, Sheldon X.-D. Tan, Zeyu Sun 0001, Shaoyi Peng, Min Tang, Junfa Mao	A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multisegment Interconnects.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2021	DBLP DOI BibTeX RDF
18	Linlin Cai, Wangyong Chen, Jinfeng Kang, Gang Du, Xiaoyan Liu, Xing Zhang	A physics-based electromigration reliability model for interconnects lifetime prediction.	Sci. China Inf. Sci.	2021	DBLP DOI BibTeX RDF
18	Bobby Bose, Ishan G. Thakkar	Characterization and Mitigation of Electromigration Effects in TSV-Based Power Delivery Network Enabled 3D-Stacked DRAMs.	CoRR	2021	DBLP BibTeX RDF
18	Mohammad Abdullah Al Shohel, Vidya A. Chhabria, Sachin S. Sapatnekar	A Linear-Time Algorithm for Steady-State Analysis of Electromigration in General Interconnects.	CoRR	2021	DBLP BibTeX RDF
18	Allison T. Osmanson, Mohsen Tajedini, Yi Ram Kim, Hossein Madanipour, Choong-Un Kim, Bradley Glasscock, Muhammad Khan	Mechanisms of Contact Formation and Electromigration Reliability in Wirebond Packages.	IRPS	2021	DBLP DOI BibTeX RDF
18	Zhenjun Zhang, Matthias Kraatz, Meike Hauschildt, Seungman Choi, André Clausner, Ehrenfried Zschech, Martin Gall	Strategy to Characterize Electromigration Short Length Effects in Cu/low-k Interconnects.	IRPS	2021	DBLP DOI BibTeX RDF
18	Houman Zahedmanesh, Olalla Varela Pedreira, Zsolt Tokei, Kristof Croes	Electromigration limits of copper nano-interconnects.	IRPS	2021	DBLP DOI BibTeX RDF
18	Mohammad Abdullah Al Shohel, Vidya A. Chhabria, Nestor E. Evmorfopoulos, Sachin S. Sapatnekar	Analytical Modeling of Transient Electromigration Stress based on Boundary Reflections.	ICCAD	2021	DBLP DOI BibTeX RDF
18	Houman Zahedmanesh, Ivan Ciofi, Odysseas Zografos, Mustafa Badaroglu, Kristof Croes	A Novel System-Level Physics-Based Electromigration Modelling Framework: Application to the Power Delivery Network.	SLIP	2021	DBLP DOI BibTeX RDF
18	Jing Wang, Yici Cai, Qiang Zhou 0001	A Power Grids Electromigration Analysis with Via Array Using Current-Tracing Model.	ISCAS	2021	DBLP DOI BibTeX RDF
18	Bobby Bose, Ishan G. Thakkar	Characterization and Mitigation of Electromigration Effects in TSV-Based Power Delivery Network Enabled 3D-Stacked DRAMs.	ACM Great Lakes Symposium on VLSI	2021	DBLP DOI BibTeX RDF
18	Wentian Jin, Liang Chen 0025, Sheriff Sadiqbatcha, Shaoyi Peng, Sheldon X.-D. Tan	EMGraph: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnect Using Graph Convolution Networks.	DAC	2021	DBLP DOI BibTeX RDF
18	Emmanuel Ofori-Attah, Michael Opoku Agyeman	ABENA: An Ageing before Temperature Electromigration-Aware Neighbour Allocation for Many-Core Architectures.	DSDE	2021	DBLP DOI BibTeX RDF