Search results for "metallization"

Hits ?▲	Authors	Title	Venue	Year	Link	Author keywords
74	Bo Yang 0004, Shigetoshi Nakatake, Hiroshi Murata	Fast Shape Optimization of Metallization Patterns for DMOS Based Driver.	ISQED	2008	DBLP DOI BibTeX RDF	Metallization pattern, Resistance, DMOS
60	Göran Jerke, Jens Lienig	Hierarchical current-density verification in arbitrarily shaped metallization patterns of analog circuits.	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2004	DBLP DOI BibTeX RDF
60	Goeran Jerke, Jens Lienig	Hierarchical Current Density Verification for Electromigration Analysis in Arbitrary Shaped Metallization Patterns of Analog Circuits.	DATE	2002	DBLP DOI BibTeX RDF
51	Hameed A. Naseem, Ajay P. Malshe, Rajan A. Beera, M. Shahid Haque, William D. Brown, Len W. Schaper	CVD-diamond substrates for multi-chip modules (MCMs).	VLSI Design	1995	DBLP DOI BibTeX RDF	diamond, laser beam machining, metallisation, CVD coatings, elemental semiconductors, chemical vapour deposition, CVD-diamond substrates, 3D MCM, chemical vapor deposition, diamond thin films, laser drilling, via holes, metallization, dielectric coatings, multilayer interconnects, C, planarization, multichip modules, multichip modules, fabrication, polishing, polishing, substrates
46	A. Sozza, Christian Dua, A. Kerlain, C. Brylinski, Enrico Zanoni	Long-term reliability of Ti-Pt-Au metallization system for Schottky contact and first-level metallization on SiC MESFET.	Microelectron. Reliab.	2004	DBLP DOI BibTeX RDF
41	André DeHon, Raphael Rubin	Design of FPGA interconnect for multilevel metallization.	IEEE Trans. Very Large Scale Integr. Syst.	2004	DBLP DOI BibTeX RDF
37	Thomas Pompl, Christian Schlünder, Martina Hommel, Heiko Nielen, Jens Schneider	Practical aspects of reliability analysis for IC designs.	DAC	2006	DBLP DOI BibTeX RDF	ESD, TDDB of intermetal dielectric, design-in reliability, gate oxide integrity, hot carrier stress, stress-induced voiding, NBTI, electromigration
23	Milan Buttberg, Ilia Valov, Stephan Menzel	Simulating the filament morphology in electrochemical metallization cells.	Neuromorph. Comput. Eng.	2023	DBLP DOI BibTeX RDF
23	Lina Liu, Yuhao Qiao, Dongxia Wang, Xiaoguang Tian, Feiyue Qin	A Neural Network-Based Method for Surface Metallization of Polymer Materials.	J. Circuits Syst. Comput.	2023	DBLP DOI BibTeX RDF
23	Renjith Sasikumar, Revathy Padmanabhan	Variability-aware electrochemical metallization based memristive neural network for pattern classification.	PRIME	2023	DBLP DOI BibTeX RDF
23	Jiayi Shen, Chang Liu, Tadaaki Hoshi, Atsushi Sinoda, Hisashi Kino, Tetsu Tanaka, Mariappan Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima	Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last.	3DIC	2023	DBLP DOI BibTeX RDF
23	Jasmine Kaur, Sneh Saurabh, Shubham Sahay	Muller C-Element Exploiting Programmable Metallization Cell for Bayesian Inference.	IEEE J. Emerg. Sel. Topics Circuits Syst.	2022	DBLP DOI BibTeX RDF
23	Juan Andrés Vásquez-Peralvo, Adrian Tamayo-Dominguez, Gerardo Pérez-Palomino, Jose-Manuel Fernandez-Gonzalez, Thomas Wong	3D Inductive Frequency Selective Structures Using Additive Manufacturing and Low-Cost Metallization.	Sensors	2022	DBLP DOI BibTeX RDF
23	Fatemeh Gholami, Andy Shih, Alexandre Robichaud, Paul-Vahe Cicek	A Study of Optimizing Lamb Wave Acoustic Mass Sensors' Performance through Adjustment of the Transduction Electrode Metallization Ratio.	Sensors	2022	DBLP DOI BibTeX RDF
23	Houman Zahedmanesh, Ivan Ciofi, Odysseas Zografos, Kristof Croes, Mustafa Badaroglu	System-Level Simulation of Electromigration in a 3 nm CMOS Power Delivery Network: The Effect of Grid Redundancy, Metallization Stack and Standard-Cell Currents.	IRPS	2022	DBLP DOI BibTeX RDF
23	Sanaz Gholampour, Hossein Jalali, Rahele Zhiani, Hassan Rashidi, Alireza Motavalizadehkakhky	Food Quality Monitoring Based on Hydrolysis-Induced Au-Catalyzed Heck Cross-Coupling by Ag Metallization.	J. Sensors	2021	DBLP DOI BibTeX RDF
23	Sumit Bhattacharya, Devanshu Arya, Debjani Bhowmick, Rajat Mani Thomas, Deepak Kumar Gupta	Improving Solar Cell Metallization Designs using Convolutional Neural Networks.	CoRR	2021	DBLP BibTeX RDF
23	Sebastian Tepner, Linda Ney, Marius Singler, Maximilian Pospischil, Kenji Masuri, Florian Clement	Evolutionary algorithm optimizes screen design for solar cell metallization.	J. Comput. Sci.	2021	DBLP DOI BibTeX RDF
23	Julia Reker, Thorsten Meyers, Fábio Fedrizzi Vidor, Trudi-Heleen Joubert, Ulrich Hilleringmann	Influence of electrode metallization on thin-film transistor performance.	AFRICON	2021	DBLP DOI BibTeX RDF
23	Celia Gomez-Molina, Alejandro Pons Abenza, James Do, Fernando Daniel Quesada-Pereira, Xiaoguang Liu 0002, Juan Sebastian Gomez-Diaz, Alejandro Álvarez-Melcón	Wideband Bandpass Filters Using a Novel Thick Metallization Technology.	IEEE Access	2020	DBLP DOI BibTeX RDF
23	Assel Ryspayeva, Thomas David Arthur Jones, Sadeque Reza Khan, Mohammadreza Nekouie Esfahani, Matthew P. Shuttleworth, Russell A. Harris, Robert W. Kay, Marc P. Y. Desmulliez, Jose Marques-Hueso	Selective Metallization of 3D Printable Thermoplastic Polyurethanes.	IEEE Access	2019	DBLP DOI BibTeX RDF
23	Ryo Sakamaki, Masahiro Horibe, Manabu Yoshida	Transmission loss of screen-printed metallization at millimeter-wave frequency.	IEICE Electron. Express	2019	DBLP DOI BibTeX RDF
23	Roberto Bernasconi, Davide Meroni, Andrea Aliverti, Luca Magagnin	Fabrication of a Bioimpedance Sensor via Inkjet Printing and Selective Metallization.	IEEE SENSORS	2019	DBLP DOI BibTeX RDF
23	Shaker Alkaraki, Yue Gao 0001, Max Munoz Torrico, Samuel Stremsdoerfer, Edouard Gayets, Clive Parini	Performance Comparison of Simple and Low Cost Metallization Techniques for 3D Printed Antennas at 10 GHz and 30 GHz.	IEEE Access	2018	DBLP DOI BibTeX RDF
23	Sam Azadi, Ranber Singh, Thomas D. Kühne	Nuclear quantum effects induce metallization of dense solid molecular hydrogen.	J. Comput. Chem.	2018	DBLP DOI BibTeX RDF
23	Jingkui Li, Ruoying Wang, He Tian, Yanan Wang, Dawei Qi	Research on the Gradual Process of the Metallization Structures and Mechanical Properties of Wood Veneer.	Symmetry	2018	DBLP DOI BibTeX RDF
23	Eva Kozic, René Hammer, Jördis Rosc, Bernhard Sartory, Joerg Siegert, Franz Schrank, Roland Brunner	Metallization defect detection in 3D integrated components using scanning acoustic microscopy and acoustic simulations.	Microelectron. Reliab.	2018	DBLP DOI BibTeX RDF
23	Yiming Lei, Hitoshi Wakabayashi, Kazuo Tsutsui, Hiroshi Iwai, Masayuki Furuhashi, Shingo Tomohisa, Satoshi Yamakawa, Kuniyuki Kakushima	Improvement of SiO2/4H-SiC Interface properties by post-metallization annealing.	Microelectron. Reliab.	2018	DBLP DOI BibTeX RDF
23	Sabina Górska, Artur Rydosz, Ewa Brzozowska, Marek Drab, Krzysztof Wincza, Andrzej Gamian, Slawomir Gruszczynski	Effectiveness of Sensors Contact Metallization (Ti, Au, and Ru) and Biofunctionalization for Escherichia coli Detection.	Sensors	2018	DBLP DOI BibTeX RDF
23	Chao-Kun Hu, James J. Kelly, Huai Huang, Koichi Motoyama, Hosadurga Shobha, Yuri Ostrovski, James H.-C. Chen, Raghuveer Patlolla, Brown Peethala, Praneet Adusumilli, Terry A. Spooner, Roger Quon, Lynne M. Gignac, Chris M. Breslin, G. Lian, M. Ali, Jacob Benedict, X. S. Lin, S. Smith, Vimal Kamineni, X. Zhang, Frank Wilhelm Mont, Shariq Siddiqui, Frieder H. Baumann	Future on-chip interconnect metallization and electromigration.	IRPS	2018	DBLP DOI BibTeX RDF
23	Matthias Ritter, Martin Pfost	Aging sensors for on-chip metallization of integrated LDMOS transistors under cyclic thermo-mechanical stress.	Microelectron. Reliab.	2017	DBLP DOI BibTeX RDF
23	Alfred C. T. Quah, Dayanand Nagalingam, Seung Je Moon, Edy Susanto, Ghim Boon Ang, Soh Ping Neo, Jeffrey Lam, Zhihong Mai	Static fault localization of subtle metallization defects using near infrared photon emission microscopy.	Microelectron. Reliab.	2017	DBLP DOI BibTeX RDF
23	Kelvin P. L. Pun, Navdeep S. Dhaka, Chee-wah Cheung, Alan H. S. Chan	Effect of ENEPIG metallization for solid-state gold-gold diffusion bonds.	Microelectron. Reliab.	2017	DBLP DOI BibTeX RDF
23	Patrick Kiele, Paul Cvancara, Matthias Müller 0009, Thomas Stieglitz	Design of experiment evaluation of sputtered thin film platinum surface metallization on alumina substrate for implantable conductive structures.	EMBC	2017	DBLP DOI BibTeX RDF
23	Pilin Junsangsri, Jie Han 0001, Fabrizio Lombardi	Logic-in-Memory With a Nonvolatile Programmable Metallization Cell.	IEEE Trans. Very Large Scale Integr. Syst.	2016	DBLP DOI BibTeX RDF
23	Lutz Nielen, Ondrej Such, Martin Klimo, Rainer Waser, Eike Linn	Memristive Sorting Networks Enabled by Electrochemical Metallization Cells.	Int. J. Unconv. Comput.	2016	DBLP BibTeX RDF
23	Ha-Duong Ngo, Biswajit Mukhopadhyay, Piotr Mackowiak, Kevin Kröhnert, Oswin Ehrmann, Klaus-Dieter Lang	A WSi-WSiN-Pt Metallization Scheme for Silicon Carbide-Based High Temperature Microsystems.	Micromachines	2016	DBLP DOI BibTeX RDF
23	Mads Brincker, Peter Kjær Kristensen, Kristian Bonderup Pedersen, Vladimir N. Popok	Mechanisms of metallization degradation in high power diodes.	Microelectron. Reliab.	2016	DBLP DOI BibTeX RDF
23	Frank Hille, Roman Roth, Carsten Schäffer, Holger Schulze, Nicolas Heuck, Daniel Bolowski, Karsten Guth, Alexander Ciliox, Karina Rott, Frank Umbach, Martin Kerber	Reliability aspects of copper metallization and interconnect technology for power devices.	Microelectron. Reliab.	2016	DBLP DOI BibTeX RDF
23	Adeline B. Y. Lim, Chris B. Boothroyd, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen 0004	Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution.	Microelectron. Reliab.	2016	DBLP DOI BibTeX RDF
23	Verena Hein, Marco Erstling, Raj Sekar Sethu, Kirsten Weide-Zaage, Tianlin Bai	Reliability evaluation of tungsten donut-via as an element of the highly robust metallization.	Microelectron. Reliab.	2016	DBLP DOI BibTeX RDF
23	Frank Steinhäußer, Armin Talai, Gabriela Sandulache, Robert Weigel, Alexander Koelpin, Wolfgang Hansal, Achim Bittner, Ulrich Schmid 0002	Pulse plated silver metallization on porosified LTCC substrates for high frequency applications.	Microelectron. Reliab.	2016	DBLP DOI BibTeX RDF
23	Oleksandr Glushko, Megan J. Cordill, Andreas Klug, Emil J. W. List-Kratochvil	The effect of bending loading conditions on the reliability of inkjet printed and evaporated silver metallization on polymer substrates.	Microelectron. Reliab.	2016	DBLP DOI BibTeX RDF
23	Falk Stefan Pappert, Tao Zhang 0044, Oliver Rose, Fabian Suhrke, Jonas Mager, Thomas Frey	Impact of time bound constraints and batching on metallization in an opto-semiconductor fab.	WSC	2016	DBLP DOI BibTeX RDF
23	Heyu Yin, Lin Li 0008, Andrew J. Mason	Screen-printed planar metallization for lab-on-CMOS with epoxy carrier.	ISCAS	2016	DBLP DOI BibTeX RDF
23	Salin Junsangsri, Jie Han 0001, Fabrizio Lombardi	A Design of a Non-Volatile PMC-Based (Programmable Metallization Cell) Register File.	ACM Great Lakes Symposium on VLSI	2016	DBLP DOI BibTeX RDF
23	Hsiu-Min Lin, Cheng-Ying Ho, Wen-Lin Chen, Yi-Hsin Wu, De-Hui Wang, Jun-Ren Lin, Yu-Hui Wu, Huei-Cheng Hong, Zhi-Wei Lin, Jenq-Gong Duh	Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test.	Microelectron. Reliab.	2015	DBLP DOI BibTeX RDF
23	Mads Brincker, Kristian Bonderup Pedersen, Peter Kjær Kristensen, Vladimir N. Popok	Effects of thermal cycling on aluminum metallization of power diodes.	Microelectron. Reliab.	2015	DBLP DOI BibTeX RDF
23	R. Ruffilli, Mounira Berkani, Philippe Dupuy, Stéphane Lefebvre, Y. Weber, Marc Legros	In-depth investigation of metallization aging in power MOSFETs.	Microelectron. Reliab.	2015	DBLP DOI BibTeX RDF
23	Debayan Mahalanabis, Vineeth Bharadwaj, Hugh J. Barnaby, Sarma B. K. Vrudhula, Michael N. Kozicki	A Nonvolatile Sense Amplifier Flip-Flop Using Programmable Metallization Cells.	IEEE J. Emerg. Sel. Topics Circuits Syst.	2015	DBLP DOI BibTeX RDF
23	Jan Ackaert, Tony Colpaert, Aditi Malik, Mario Gonzalez	Metallization scheme optimization of plastic-encapsulated electronic power devices.	ICICDT	2015	DBLP DOI BibTeX RDF
23	Mina Yun, Seongjae Cho, Sae-Kyoung Kang, Sunghun Jung, Byung-Gook Park	Ge-on-Si photodetector with novel metallization schemes for on-chip optical interconnect.	ISCE	2015	DBLP DOI BibTeX RDF
23	Jae Won Do	Selective metallization and electronic self-healing for high performance carbon-based nanoelectronics		2015	RDF
23	Tao Luo, Qiu-lin Tan, Liqiong Ding, Tanyong Wei, Chao Li, Chenyang Xue, Jijun Xiong	A Passive Pressure Sensor Fabricated by Post-Fire Metallization on Zirconia Ceramic for High-Temperature Applications.	Micromachines	2014	DBLP DOI BibTeX RDF
23	S. Ferch, Eike Linn, Rainer Waser, Stephan Menzel	Simulation and comparison of two sequential logic-in-memory approaches using a dynamic electrochemical metallization cell model.	Microelectron. J.	2014	DBLP DOI BibTeX RDF
23	Verena Hein, Jörg Kludt, Kirsten Weide-Zaage	Evaluation new corner stress relief structure layout for high robust metallization.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
23	Z. Pruszowski, M. Ciez	The influence of electroless metallization process parameters on basic electric properties of Ni-P alloy.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
23	Donatien Martineau, Colette Levade, Marc Legros, Philippe Dupuy, Thomas Mazeaud	Universal mechanisms of Al metallization ageing in power MOSFET devices.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
23	Michael Fugger, Mathias Plappert, Carsten Schäffer, Oliver Humbel, Herbert Hutter, Herbert Danninger, Mathias Nowottnick	Comparison of WTi and WTi(N) as diffusion barriers for Al and Cu metallization on Si with respect to thermal stability and diffusion behavior of Ti.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
23	Pilin Junsangsri, Fabrizio Lombardi, Jie Han 0001	HSPICE macromodel of a Programmable Metallization Cell (PMC) and its application to memory design.	NANOARCH	2014	DBLP DOI BibTeX RDF
23	Stephan Menzel	Modeling and simulation of electrochemical metallization memory cells.	ISCAS	2014	DBLP DOI BibTeX RDF
23	Stephen Long, W. Mark Dorsey, André A. Adams, Gregory H. Huff	Metallization of a polymer substrate for microfluidic-cooled RF laminates.	ICICDT	2014	DBLP DOI BibTeX RDF
23	Ulrich Hilleringmann, Marcel Schönhoff, F. Assion	Titanium disilicide as hot side metallization layer for thermoelectric generators.	AFRICON	2013	DBLP DOI BibTeX RDF
23	Sunil Patel, Thomas Guenther, Christopher W. D. Dodds, Sergej Kolke, Karen L. Privat, Paul B. Matteucci, Gregg J. Suaning	Materials design considerations involved in the fabrication of implantable bionics by metallization of ceramic substrates.	EMBC	2013	DBLP DOI BibTeX RDF
23	François Le Henaff, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard, Serge Bontemps, Julien Joguet	A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
23	Mathias Plappert, Oliver Humbel, Angelika Koprowski, Mathias Nowottnick	Characterization of Ti diffusion in PVD deposited WTi/AlCu metallization on monocrystalline Si by means of secondary ion mass spectroscopy.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
23	Peter J. Zampardi, Cristian Cismaru, Hal Banbrook, Bin Li	Measuring seam/crack formation in interconnect metallization.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
23	Takeshi Ito, Isamu Taguchi, Masayasu Soga, Masahiko Mitsuhashi, Toshiro Shinohara, Toshinori Ogashiwa, Takashi Nishimori, Nobuyuki Akiyama	Thermal stability of back side metallization multilayer for power device application.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
23	Petr Pfeifer, Zdenek Plíva	On measurement of impact of the metallization and FPGA design to the changes of slice parameters and generation of delay faults.	FPL	2012	DBLP DOI BibTeX RDF
23	Darshan A. Dimplu, Fei Wang	Behavior Modeling of Programmable Metallization Cell Using Verilog-A.	ITNG	2012	DBLP DOI BibTeX RDF
23	Jay Han-Chieh Chang, Dongyang Kang, Yu-Chong Tai	Dry mechanical liftoff technology for metallization on parylene-C using SU-8.	NEMS	2012	DBLP DOI BibTeX RDF
23	Toufik Azoui, Patrick Tounsi, Philippe Dupuy, L. Guillot, Jean-Marie Dorkel	3D Electro-thermal modelling of bonding and metallization ageing effects for reliability improvement of power MOSFETs.	Microelectron. Reliab.	2011	DBLP DOI BibTeX RDF
23	Irina Bauer, Kirsten Weide-Zaage, Lutz Meinshausen	Influence of air gaps on the thermal-electrical-mechanical behavior of a copper metallization.	Microelectron. Reliab.	2011	DBLP DOI BibTeX RDF
23	Tien Anh Nguyen, Pierre-Yves Joubert, Stéphane Lefebvre, G. Chaplier, Lionel Rousseau	Study for the non-contact characterization of metallization ageing of power electronic semiconductor devices using the eddy current technique.	Microelectron. Reliab.	2011	DBLP DOI BibTeX RDF
23	S. Pietranico, Stéphane Lefebvre, S. Pommier, M. Berkani Bouaroudj, S. Bontemps	A study of the effect of degradation of the aluminium metallization layer in the case of power semiconductor devices.	Microelectron. Reliab.	2011	DBLP DOI BibTeX RDF
23	Luke England, Siew Tze Eng, Chris Liew, Hock Heng Lim	Cu wire bond parameter optimization on various bond pad metallization and barrier layer material schemes.	Microelectron. Reliab.	2011	DBLP DOI BibTeX RDF
23	A. Podgaynaya, Ralf Rudolf, B. Elattari, Dionyz Pogany, Erich Gornik, Matthias Stecher, Marc Strasser	Single pulse energy capability and failure modes of n- and p-channel LDMOS with thick copper metallization.	Microelectron. Reliab.	2010	DBLP DOI BibTeX RDF
23	Motomi Abe, Yukihiro Tahara, Hideyuki Oh-Hashi, Naofumi Yoneda, Yoshihiko Konishi	A Waveguide-Based Power Divider Using H-Plane Probes Short-Circuited with Substrate Metallization Patterns.	IEICE Trans. Electron.	2009	DBLP DOI BibTeX RDF
23	V. Born, M. Beck, O. Bosholm, D. Dalleau, S. Glenz, I. Haverkamp, G. Kurz, F. Lange, Anja Vest	Extended metallization reliability testing: Combining standard wafer level with product tests to increase test sensitivity.	Microelectron. Reliab.	2009	DBLP DOI BibTeX RDF
23	Jean-Baptiste Sauveplane, Emmanuel Scheid, A. Deram	On the accurate determination of the thermomechanical properties of micro-scale material: Application to AlSi1% chip metallization of a power semiconductor device.	Microelectron. Reliab.	2009	DBLP DOI BibTeX RDF
23	Hyuk Choi, Ki-Hyun Nam, Long-Yun Ju, Hong-Bay Chung	Optical Properties of Copper in Chalcogenide Materials Used in Programmable Metallization Cell Devices.	IEICE Trans. Electron.	2008	DBLP DOI BibTeX RDF
23	Rolf Johannessen, Frøydis Oldervoll, Frode Strisland	High temperature reliability of aluminium wire-bonds to thin film, thick film and low temperature co-fired ceramic (LTCC) substrate metallization.	Microelectron. Reliab.	2008	DBLP DOI BibTeX RDF
23	Ying Wang 0041, Fei Cao, Minghui Ding, Dawei Yang	Investigation of Zr-N thin films for use as diffusion barrier in Cu metallization.	Microelectron. J.	2007	DBLP DOI BibTeX RDF
23	H. Y. Wong, N. F. Mohd Shukor, Nowshad Amin	Prospective development in diffusion barrier layers for copper metallization in LSI.	Microelectron. J.	2007	DBLP DOI BibTeX RDF
23	Kirsten Weide-Zaage, David Dalleau, Yves Danto, Hélène Frémont	Dynamic void formation in a DD-copper-structure with different metallization geometry.	Microelectron. Reliab.	2007	DBLP DOI BibTeX RDF
23	D. Noonan, Patrick J. McNally, Weimin Chen, Aapo Lankinen, L. Knuuttila, Turkka O. Tuomi, Andreas N. Danilewsky, Rolf Simon	The evaluation of mechanical stresses developed in underlying silicon substrates due to electroless nickel under bump metallization using synchrotron X-ray topography.	Microelectron. J.	2006	DBLP DOI BibTeX RDF
23	Laurent Dupont 0002, Zoubir Khatir, Stéphane Lefebvre, S. Bontemps	Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
23	Oliver Aubel, Eberhard Bugiel, Dietmar Krüger, Wolfgang Hasse, Martina Hommel	Investigation of the influence of thermal treatment on interconnect-barrier interfaces in copper metallization systems.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
23	Michael Springer, Jeffrey W. Leon, Tiecheng Qiao, Jon Hammerschmidt, James L. McGrath	Metallization of surface- attached actin networks.	EMBC	2006	DBLP DOI BibTeX RDF
23	Alan C. West, Hariklia Deligianni, Panayotis C. Andricacos	Electrochemical planarization of interconnect metallization.	IBM J. Res. Dev.	2005	DBLP BibTeX RDF
23	Ryszard Kisiel, Janusz Borecki, Grazyna Koziol, Jan Felba	Conductive adhesives for through holes and blind vias metallization.	Microelectron. Reliab.	2005	DBLP DOI BibTeX RDF
23	Michael Nelhiebel, J. Wissenwasser, Thomas Detzel, A. Timmerer, E. Bertagnolli	Hydrogen-related influence of the metallization stack on characteristics and reliability of a trench gate oxide.	Microelectron. Reliab.	2005	DBLP DOI BibTeX RDF
23	C. F. Tsang, C. Y. Li, A. Krishnamoorthy, Y. J. Su, H. Y. Li, L. Y. Wong, W. H. Li, L. J. Tang, K. Y. Ee	Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization.	Microelectron. J.	2004	DBLP DOI BibTeX RDF
23	Thomas Detzel, Michael Glavanovics, Karin Weber	Analysis of wire bond and metallization degradation mechanisms in DMOS power transistors stressed under thermal overload conditions.	Microelectron. Reliab.	2004	DBLP DOI BibTeX RDF
23	Guan Zhang, Cher Ming Tan, Kok Tong Tan, Derek Sim Kwang Ye, W. Y. Zhang	Reliability Improvement in Al Metallization: A Combination of Statistical Prediction and Failure Analytical Methodology.	Microelectron. Reliab.	2004	DBLP DOI BibTeX RDF
23	Teija Uusluoto, Paavo Jalonen, Harri Laaksonen, Aulis Tuominen	Metallization of microvias by sputter-deposition.	Microelectron. Reliab.	2004	DBLP DOI BibTeX RDF
23	J. H. Zhang, Yan Cheong Chan, M. O. Alam, S. Fu	Contact resistance and adhesion performance of ACF interconnections to aluminum metallization.	Microelectron. Reliab.	2003	DBLP DOI BibTeX RDF
23	Adeline Feybesse, Ivana Deram, Jean-Michel Reynes, Eric Moreau	Copper metallization influence on power MOS reliability.	Microelectron. Reliab.	2003	DBLP DOI BibTeX RDF
23	Giuseppe Currò, R. Greco, Antonino Scandurra	Growth process and chemical characterization of an ultrathin phosphate film grafted onto Al-alloy metallization surfaces relevant to microelectronic devices reliability.	Microelectron. Reliab.	2002	DBLP DOI BibTeX RDF
23	Yuan Ji, Ziguo Li, Dong Wang, Yaohai Cheng, Dong Luo, Bin Zong	Scanning thermal microscopy studies of local temperature distribution of micron-sized metallization lines.	Microelectron. Reliab.	2001	DBLP DOI BibTeX RDF