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Venues (Conferences, Journals, ...)
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GrowBag graphs for keyword ? (Num. hits/coverage)
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The graphs summarize 35 occurrences of 29 keywords
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Results
Found 136 publication records. Showing 135 according to the selection in the facets
Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
13 | Grégory Servel, Denis Deschacht, Françoise Saliou, Jean-Luc Mattei, Fabrice Huret |
Impact of Low-K on Crosstalk. |
ISQED |
2002 |
DBLP DOI BibTeX RDF |
Low-k, interconnections, Crosstalk, electromagnetic analysis |
9 | Ru Huang, HanMing Wu, Jinfeng Kang, DeYuan Xiao, XueLong Shi, Xia An, Yu Tian, Runsheng Wang, Liangliang Zhang, Xing Zhang 0002, Yangyuan Wang |
Challenges of 22 nm and beyond CMOS technology. |
Sci. China Ser. F Inf. Sci. |
2009 |
DBLP DOI BibTeX RDF |
22 nm technology node, device architectures, metal gate/high K dielectrics, ultra low K dielectrics, CMOS technology |
8 | Michael Kropfitsch, Philipp Riess, Gerhard Knoblinger, Dieter Draxelmayr |
Dielectric absorption of low-k materials: extraction, modelling and influence on SAR ADCs. |
ISCAS |
2006 |
DBLP DOI BibTeX RDF |
|
8 | N. S. Nagaraj, Tom Bonifield, Abha Singh, Roger Griesmer, Poras T. Balsara |
Interconnect Modeling for Copper/Low-k Technologies. |
VLSI Design |
2004 |
DBLP DOI BibTeX RDF |
|
7 | Teresa Oh |
Correlation between Low Polarization and Roughness in Low-k SiOC Thin Films by Chemical Vapor Deposition. |
FGIT-GDC |
2011 |
DBLP DOI BibTeX RDF |
|
6 | Hoyeol Cho, Kyung-Hoae Koo, Pawan Kapur, Krishna Saraswat |
Modeling of the performance of carbon nanotube bundle, cu/low-k and optical on-chip global interconnects. |
SLIP |
2007 |
DBLP DOI BibTeX RDF |
Cu, bandwidth density, power, latency, optics, carbon nanotube, Global interconnects |
6 | Thierry Devoivre, M. Lunenborg, C. Julien, J.-P. Carrere, P. Ferreira, W. J. Toren, A. VandeGoor, P. Gayet, T. Berger, O. Hinsinger, P. Vannier, Y. Trouiller, Y. Rody, P.-J. Goirand, R. Palla, I. Thomas, F. Guyader, David Roy 0001, B. Borot, Nicolas Planes, Sylvie Naudet, F. Pico, D. Duca, F. Lalanne, D. Heslinga, M. Haond |
Validated 90nm CMOS Technology Platform with Low-k Copper Interconnects for Advanced System-on-Chip (SoC). |
MTDT |
2002 |
DBLP DOI BibTeX RDF |
|
6 | Bipin Rajendran, Pawan Kapur, Krishna Saraswat, R. Fabian W. Pease |
Self-consistent power/performance/reliability analysis for copper interconnects. |
SLIP |
2004 |
DBLP DOI BibTeX RDF |
Joule heating, copper interconnects, rent's rule, electromigration, duty cycle, current density |
6 | Rajiv V. Joshi, Kaushik Roy 0001 |
Design of Deep Sub-Micron CMOS Circuits. |
VLSI Design |
2003 |
DBLP DOI BibTeX RDF |
|
5 | Krishna Saraswat |
Performance comparison of cu/low-k, carbon nanotube, and optics for on-chip and off-chip interconnects. |
SLIP |
2009 |
DBLP DOI BibTeX RDF |
copper, energy per bit, power, latency, bandwidth, optical interconnect, carbon nanotube |
4 | Basab Datta, Wayne P. Burleson |
Low power on-chip thermal sensors based on wires. |
VLSI-SoC |
2007 |
DBLP DOI BibTeX RDF |
|
4 | David J. Frank, Ruchir Puri, Dorel Toma |
Design and CAD challenges in 45nm CMOS and beyond. |
ICCAD |
2006 |
DBLP DOI BibTeX RDF |
|
3 | Yonggyun Park, Pengzhan Liu, Seunghwan Lee, Jinill Cho, Eric Joo, Hyeong-U. Kim, Taesung Kim |
Diagnosing Time-Varying Harmonics in Low-k Oxide Thin Film (SiOF) Deposition by Using HDP CVD. |
Sensors |
2023 |
DBLP DOI BibTeX RDF |
|
3 | Seunghwan Lee, Yonggyun Park, Pengzhan Liu, Muyoung Kim, Hyeong-U. Kim, Taesung Kim |
Artificial-Neural-Network-Driven Innovations in Time-Varying Process Diagnosis of Low-K Oxide Deposition. |
Sensors |
2023 |
DBLP DOI BibTeX RDF |
|
3 | Dong Liu, Mingyue Li, Yangjie Ou, Zhong Lan, Maosen Tang, Weibo Wang, Xiarong Hu |
1.2 kV 4H-SiC planar power MOSFETs with a low-K dielectric in central gate. |
IET Circuits Devices Syst. |
2022 |
DBLP DOI BibTeX RDF |
|
3 | Ernest Y. Wu, Baozhen Li |
Quantum Mechanical Connection of Schottky Emission Process and Its implications on Breakdown Methodology and Conduction Modeling for BEOL Low-k Dielectrics. |
IRPS |
2022 |
DBLP DOI BibTeX RDF |
|
3 | Zhenjun Zhang, Matthias Kraatz, Meike Hauschildt, Seungman Choi, André Clausner, Ehrenfried Zschech, Martin Gall |
Strategy to Characterize Electromigration Short Length Effects in Cu/low-k Interconnects. |
IRPS |
2021 |
DBLP DOI BibTeX RDF |
|
3 | Ning Duan, Vignesh Subramanian, Edgar Olthof, Paul Eggenkamp, Michiel van Soestbergen, Richard Braspenning |
Moisture diffusion rate in an ultra-low-k dielectric and its effect on the dielectric reliability. |
IRPS |
2021 |
DBLP DOI BibTeX RDF |
|
3 | Luchao Wu, Lei Wang, Jun Wang |
Measuring the fracture toughness of low-k thin films used in advanced packaging. |
ICTA |
2021 |
DBLP DOI BibTeX RDF |
|
3 | Yangyun Zhang, Yuting Xiang, Xinjie Zhang, Chunqi Shi, Runxi Zhang, Jinghong Chen |
A 22-33 GHz Wideband CMOS LNA Using Low-k Non-inverting MCCRs for 5G mmW Communication Applications. |
ASICON |
2021 |
DBLP DOI BibTeX RDF |
|
3 | Weishen Chu, Laura Spinella, Dwayne R. Shirley, Paul S. Ho |
Effects of Wiring Density and Pillar Structure on Chip Package Interaction for Advanced Cu Low-k Chips. |
IRPS |
2020 |
DBLP DOI BibTeX RDF |
|
3 | Naohito Suzumura, Kazuyuki Omori, Hideaki Tsuchiya, Hideki Aono, Tomohiro Yamashita |
Impact of Anode-side Defect Generation on Inter-Level TDDB Degradation in Cu/Low-k Damascene Structures. |
IRPS |
2020 |
DBLP DOI BibTeX RDF |
|
3 | Betting Wehring, Raik Hoffmann, Lukas Gerlich, Malte Czernohorsky, Benjamin Uhlig, Robert Seidel, Tobias Barchewitz, Frank Schlaphof, Lutz Meinshausen, Christoph Leyens |
BEoL Reliability, XPS and REELS Study on low-k Dielectrics to understand Breakdown Mechanisms. |
IRPS |
2020 |
DBLP DOI BibTeX RDF |
|
3 | Clement Huang, Alex Juan, K. C. Su |
Stress Induced Voiding Behavior of Electroplated Copper Thin Films in Highly Scaled Cu/low-k interconnects. |
IRPS |
2020 |
DBLP DOI BibTeX RDF |
|
3 | Chen Wu, Adrian Vaisman Chasin, Steven Demuynck, Naoto Horiguchi, Kris Croes |
Conduction and Breakdown Mechanisms in Low-k Spacer and Nitride Spacer Dielectric Stacks in Middle of Line Interconnects. |
IRPS |
2020 |
DBLP DOI BibTeX RDF |
|
3 | Mario Kiuchi, Ryoma Miyake, Shinya Yoshida, Shuji Tanaka, Tsuyoshi Takemoto, Yukitaka Yamaguchi, Kenji Komaki |
Commercial Production of Low-k PZT film using Sputtering Method. |
IEEE SENSORS |
2020 |
DBLP DOI BibTeX RDF |
|
3 | Fabio Pareschi, Andrea Celentano, Mauro Mangia, Riccardo Rovatti, Gianluca Setti |
Through-The-Barrier Communications in Isolated Class-E Converters Embedding a Low-K Transformer. |
ISCAS |
2020 |
DBLP DOI BibTeX RDF |
|
3 | Hiroshi Murata, Hiroto Yokohashi |
80-GHz Band Electro-Optic Modulator using Antenna-Coupled Electrode and LiNbO3 Film Stacked on Low-k Substrate for Millimeter-Wave Radar System. |
OFC |
2020 |
DBLP BibTeX RDF |
|
3 | Norbert Herfurth, Anne Beyreuther, Elham Amini, Christian Boit, Michél Simon-Najasek, Susanne Hübner, Frank Altmann, R. Herfurth, Chen Wu, Ingrid De Wolf, Kris Croes |
New Access to Soft Breakdown Parameters of Low-k Dielectrics Through Localisation-Based Analysis. |
IRPS |
2019 |
DBLP DOI BibTeX RDF |
|
3 | Shaoyi Peng, Han Zhou 0002, Taeyoung Kim 0001, Hai-Bao Chen, Sheldon X.-D. Tan |
Physics-Based Compact TDDB Models for Low-k BEOL Copper Interconnects With Time-Varying Voltage Stressing. |
IEEE Trans. Very Large Scale Integr. Syst. |
2018 |
DBLP DOI BibTeX RDF |
|
3 | Kai Nakamura, Hideyuki Hanawa, Kazushige Horio |
Analysis of Breakdown Characteristics of AIGaN/GaN HEMTs with Low-k IHigh-k Double Passivation Layers Paper Title. |
BCICTS |
2018 |
DBLP DOI BibTeX RDF |
|
3 | D. H. Triyoso, G. R. Mulfinger, K. Hempel, H. Tao, F. Koehler, L. Kang, A. Kumar, T. McArdle, J. Holt, A. L. Child, S. Straub, F. Ludwig, Z. Chen, J. Kluth, Rick Carter |
Characterization of atomic layer deposited low-k spacer for FDSOI high-k metal gate transistor. |
ICICDT |
2017 |
DBLP DOI BibTeX RDF |
|
3 | Michael J. Mutch, Thomas Pomorski, Brad C. Bittel, Corey J. Cochrane, Patrick M. Lenahan, Xin Liu, Robert J. Nemanich, Justin Brockman, Marc French, Markus Kuhn, Benjamin French, Sean W. King |
Band diagram for low-k/Cu interconnects: The starting point for understanding back-end-of-line (BEOL) electrical reliability. |
Microelectron. Reliab. |
2016 |
DBLP DOI BibTeX RDF |
|
3 | Lin Lin, Jun Wang, Lei Wang, Wenqi Zhang |
The stress analysis and parametric studies for the low-k layers of a chip in the flip-chip process. |
Microelectron. Reliab. |
2016 |
DBLP DOI BibTeX RDF |
|
3 | Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Kristof Croes, Jürgen Bömmels, Zsolt Tökei |
Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line. |
Microelectron. Reliab. |
2016 |
DBLP DOI BibTeX RDF |
|
3 | Yusuf Nur Wijayanto, Atsushi Kanno, Hiroshi Murata, Tetsuya Kawanishi, Yasuyuki Okamura |
Millimeter-Wave Radar Receiver Using Z-Cut LiNbO3 Optical Modulator with Orthogonal-Gap-Embedded Patch-Antennas on Low-k Dielectric Material. |
IEICE Trans. Electron. |
2015 |
DBLP DOI BibTeX RDF |
|
3 | Ming Zhou, B. C. Zhang |
Porous low k film with multilayer structure used for promoting adhesion to SiCN cap barrier layer. |
Microelectron. Reliab. |
2015 |
DBLP DOI BibTeX RDF |
|
3 | M. N. Chang, Y.-H. Lee, S. Y. Lee, C. C. Chiu, D. Maji, K. Wu |
An investigation of capacitance aging model for extreme low-k and high-k dielectrics. |
IRPS |
2015 |
DBLP DOI BibTeX RDF |
|
3 | Fen Chen, Carole Graas, Michael A. Shinosky, Chad Burke, Kai D. Feng, Craig Bocash, Ramachandran Muralidhar |
A method for rapid screening of various low-k TDDB models. |
IRPS |
2015 |
DBLP DOI BibTeX RDF |
|
3 | M. H. Lin, A. S. Oates |
Mechanisms of electromigration under AC and pulsed-DC stress in Cu/low-k dual damascene interconnects. |
IRPS |
2015 |
DBLP DOI BibTeX RDF |
|
3 | Sean P. Ogden, Juan Borja, Huawei Zhou, Joel L. Plawsky, Toh-Ming Lu, William N. Gill |
A moisture-related breakdown mechanism in low-k dielectrics using a multiple I-V ramp test. |
IRPS |
2015 |
DBLP DOI BibTeX RDF |
|
3 | Shou-Chung Lee, A. S. Oates |
On the voltage dependence of copper/low-k dielectric breakdown. |
IRPS |
2015 |
DBLP DOI BibTeX RDF |
|
3 | Wei-Ting Kary Chien, Atman Yong Zhao, Liwen Zhang, Flora Cheng |
The reversed intrinsic curve and voltage dependence for ultra-low k dielectrics. |
IRPS |
2015 |
DBLP DOI BibTeX RDF |
|
3 | Taro Ikeda, Akira Tanihara, Nobuhiko Yamamoto, Shigeru Kasai, Koji Eriguchi, Kouichi Ono |
Plasma-induced photon irradiation damage on low-k dielectrics enhanced by Cu-line layout. |
ICICDT |
2015 |
DBLP DOI BibTeX RDF |
|
3 | Baojun Tang, Kris Croes, Yohan Barbarin, Yunqi Wang, Robin Degraeve, Yunlong Li, Maria Toledano-Luque, Thomas Kauerauf, Jürgen Bömmels, Zsolt Tökei, Ingrid De Wolf |
As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability. |
Microelectron. Reliab. |
2014 |
DBLP DOI BibTeX RDF |
|
3 | Fen Chen, Michael A. Shinosky |
Electron fluence driven, Cu catalyzed, interface breakdown mechanism for BEOL low-k time dependent dielectric breakdown. |
Microelectron. Reliab. |
2014 |
DBLP DOI BibTeX RDF |
|
3 | Chenglong Liao, Dan Guo, Shizhu Wen, Xinchun Lu, Jianbin Luo |
Stress analysis of Cu/low-k interconnect structure during whole Cu-CMP process using finite element method. |
Microelectron. Reliab. |
2013 |
DBLP DOI BibTeX RDF |
|
3 | Young Moon Kim, Jun Seomun, Hyung-Ock Kim, Kyung Tae Do, Jung Yun Choi, Kee Sup Kim, Matthias Sauer 0002, Bernd Becker 0001, Subhasish Mitra |
Detection of early-life failures in high-K metal-gate transistors and ultra low-K inter-metal dielectrics. |
CICC |
2013 |
DBLP DOI BibTeX RDF |
|
3 | Jingbo Xu 0004, Feng Hui, Wen-Zhong Xu, Xu Wang, Peng-Fei Nan, Yu-Ling Liu, Xin-Ping Qu |
Barrier and low k polish with a novel alkaline barrier slurry combining with FA/O chelating agent. |
ASICON |
2013 |
DBLP DOI BibTeX RDF |
|
3 | Yi-Shao Lai, Meng-Kai Shih, Chang-Chi Lee, Tong Hong Wang |
Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages. |
Microelectron. Reliab. |
2012 |
DBLP DOI BibTeX RDF |
|
3 | A. A. Dakhel |
W doping effect on the dielectric properties of amorphous Ga2O3 films grown on Si substrate for low-k applications. |
Microelectron. Reliab. |
2012 |
DBLP DOI BibTeX RDF |
|
3 | Ming He, Huafang Li, Pei-I Wang, Toh-Ming Lu |
Bias-temperature stress of Al on porous low-k dielectrics. |
Microelectron. Reliab. |
2011 |
DBLP DOI BibTeX RDF |
|
3 | Muhammad Bashir, Linda Milor, Dae Hyun Kim 0004, Sung Kyu Lim |
Impact of irregular geometries on low-k dielectric breakdown. |
Microelectron. Reliab. |
2011 |
DBLP DOI BibTeX RDF |
|
3 | Ming He, C. Gaire, G.-C. Wang, Toh-Ming Lu |
Study of metal adhesion on porous low-k dielectric using telephone cord buckling. |
Microelectron. Reliab. |
2011 |
DBLP DOI BibTeX RDF |
|
3 | Taeshik Yoon, Inhwa Lee, Taek-Soo Kim |
Mechanical reliability of Cu/low-k interconnects and underfill. |
3DIC |
2011 |
DBLP DOI BibTeX RDF |
|
3 | A. Aubert, J. P. Rebrasse, Lionel Dantas de Morais, Nathalie Labat, Hélène Frémont |
Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing. |
Microelectron. Reliab. |
2010 |
DBLP DOI BibTeX RDF |
|
3 | Muhammad Bashir, Linda S. Milor, Dae Hyun Kim 0004, Sung Kyu Lim |
Methodology to determine the impact of linewidth variation on chip scale copper/low-k backend dielectric breakdown. |
Microelectron. Reliab. |
2010 |
DBLP DOI BibTeX RDF |
|
3 | C. M. Fu, Cher Ming Tan, S. H. Wu, H. B. Yao |
Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/Low-k interconnects. |
Microelectron. Reliab. |
2010 |
DBLP DOI BibTeX RDF |
|
3 | Yue Ying Ong, Soon Wee Ho, Kripesh Vaidyanathan, Vasarla Nagendra Sekhar, Ming Chinq Jong, Samuel Lim Yak Long, Vincent Lee Wen Sheng, Leong Ching Wai, Vempati Srinivasa Rao, Jimmy Ong, Xuefen Ong, Xiaowu Zhang, Yoon Uk Seung, John H. Lau, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Yanfeng Zhang, Juan Boon Tan, Dong Kyun Sohn |
Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package. |
Microelectron. Reliab. |
2010 |
DBLP DOI BibTeX RDF |
|
3 | Feifei He, Cher Ming Tan |
Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model. |
Microelectron. Reliab. |
2010 |
DBLP DOI BibTeX RDF |
|
3 | Muhammad Bashir, Linda S. Milor |
Towards a chip level reliability simulator for copper/low-k backend processes. |
DATE |
2010 |
DBLP DOI BibTeX RDF |
|
3 | Muhammad Bashir, Linda S. Milor |
A methodology to extract failure rates for low-k dielectric breakdown with multiple geometries and in the presence of die-to-die linewidth variation. |
Microelectron. Reliab. |
2009 |
DBLP DOI BibTeX RDF |
|
3 | Xuefen Ong, Soon Wee Ho, Yue Ying Ong, Leong Ching Wai, Kripesh Vaidyanathan, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Juan Boon Tan, Dong Kyun Sohn, Liang Choo Hsia, Zhong Chen 0004 |
Underfill selection methodology for fine pitch Cu/low-k FCBGA packages. |
Microelectron. Reliab. |
2009 |
DBLP DOI BibTeX RDF |
|
3 | Muhammad Bashir, Linda Milor |
Modeling Low-k Dielectric Breakdown to Determine Lifetime Requirements. |
IEEE Des. Test Comput. |
2009 |
DBLP DOI BibTeX RDF |
|
3 | A. Whelan, Y. Joshi, W. King |
Improved compact thermal model for studying 3-D interconnect structures with low-k dielectrics. |
Microelectron. J. |
2008 |
DBLP DOI BibTeX RDF |
|
3 | Soodeh Aghli Moghaddam, Nasser Masoumi |
Analysis and simulation of a novel gradually low-K dielectric structure for crosstalk reduction in VLSI. |
Microelectron. J. |
2008 |
DBLP DOI BibTeX RDF |
|
3 | Cadmus A. Yuan, Olaf van der Sluis, Willem D. van Driel, G. Q. (Kouchi) Zhang |
The need for multi-scale approaches in Cu/low-k reliability issues. |
Microelectron. Reliab. |
2008 |
DBLP DOI BibTeX RDF |
|
3 | K. M. Chen, K. H. Tang, J. S. Liu |
Reliability evaluation of BOAC and normal pad stacked-chip packaging using low-K wafers. |
Microelectron. Reliab. |
2008 |
DBLP DOI BibTeX RDF |
|
3 | Fen Chen, O. Bravo, Dave Harmon, Michael A. Shinosky, J. Aitken |
Cu/low-k dielectric TDDB reliability issues for advanced CMOS technologies. |
Microelectron. Reliab. |
2008 |
DBLP DOI BibTeX RDF |
|
3 | Toshiaki Makabe, T. Shimada, Takashi Yagisawa |
Plasma etching and feature evolution of organic low-k material by using VicAddress. |
Comput. Phys. Commun. |
2007 |
DBLP DOI BibTeX RDF |
|
3 | Cyril Guedj, G. Imbert, E. Martinez, Christophe Licitra, Névine Rochat, V. Arnal |
Modification of porous ultra-low K dielectric by electron-beam curing. |
Microelectron. Reliab. |
2007 |
DBLP DOI BibTeX RDF |
|
3 | Changsoo Hong, Linda Milor |
Modeling of the breakdown mechanisms for porous copper/low-k process flows. |
Microelectron. Reliab. |
2007 |
DBLP DOI BibTeX RDF |
|
3 | Olaf van der Sluis, R. A. B. Engelen, Richard B. R. van Silfhout, W. D. van Driel, Marcel A. J. van Gils |
Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion. |
Microelectron. Reliab. |
2007 |
DBLP DOI BibTeX RDF |
|
3 | C. C. Chiu, H. H. Chang, C. C. Lee, C. C. Hsia, Kuo-Ning Chiang |
Reliability of interfacial adhesion in a multi-level copper/low-k interconnect structure. |
Microelectron. Reliab. |
2007 |
DBLP DOI BibTeX RDF |
|
3 | Marcel A. J. van Gils, Olaf van der Sluis, G. Q. Zhang, J. H. J. Janssen, R. M. J. Voncken |
Analysis of Cu/low-k bond pad delamination by using a novel failure index. |
Microelectron. Reliab. |
2007 |
DBLP DOI BibTeX RDF |
|
3 | W. D. van Driel |
Facing the challenge of designing for Cu/low-k reliability. |
Microelectron. Reliab. |
2007 |
DBLP DOI BibTeX RDF |
|
3 | W. S. Lau, P. W. Qian, Taejoon Han, Nathan P. Sandler, S. T. Che, S. E. Ang, C. H. Tung, T. T. Sheng |
Evidence that N2O is a stronger oxidizing agent than O2 for both Ta2O5 and bare Si below 1000degreeC and temperature for minimum low-K interfacial oxide for high-K dielectric on Si. |
Microelectron. Reliab. |
2007 |
DBLP DOI BibTeX RDF |
|
3 | Olga Cueto, Myriam Assous, François de Crecy, A. Toffoli, David Bouchu, M. Fayolle, Frédéric Boulanger |
Development of a permittivity extraction method for ultra low k dielectrics integrated in advanced interconnects. |
Microelectron. Reliab. |
2007 |
DBLP DOI BibTeX RDF |
|
3 | K. M. Chen, D. S. Jiang, N. H. Kao, J. Y. Lai |
Effects of underfill materials on the reliability of low-K flip-chip packaging. |
Microelectron. Reliab. |
2006 |
DBLP DOI BibTeX RDF |
|
3 | A. S. Oates, Shou-Chung Lee |
Electromigration failure distributions of dual damascene Cu /low - k interconnects. |
Microelectron. Reliab. |
2006 |
DBLP DOI BibTeX RDF |
|
3 | Fen Chen, J. Gill, Dave Harmon, T. Sullivan, A. Strong, B. Li, H. Rathore, Daniel C. Edelstein |
Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures. |
Microelectron. Reliab. |
2006 |
DBLP DOI BibTeX RDF |
|
3 | Cadmus A. Yuan, Willem D. van Driel, Richard B. R. van Silfhout, Olaf van der Sluis, Roy A. B. Engelen, Leo J. Ernst, Fred van Keulen, G. Q. Zhang |
Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. |
Microelectron. Reliab. |
2006 |
DBLP DOI BibTeX RDF |
|
3 | Robin C. J. Wang, C. C. Lee, L. D. Chen, Kenneth Wu, K. S. Chang-Liao |
A study of Cu/Low-k stress-induced voiding at via bottom and its microstructure effect. |
Microelectron. Reliab. |
2006 |
DBLP DOI BibTeX RDF |
|
3 | Z. W. He, X. Q. Liu, D. Y. Xu, Y. Y. Wang |
Effect of annealing on the properties of low-k nanoporous SiO2 films prepared by sol-gel method with catalyst HF. |
Microelectron. Reliab. |
2006 |
DBLP DOI BibTeX RDF |
|
3 | Hung Son Nguyen, Z. H. Gan, Zhe Chen, V. Chandrasekar 0002, K. Prasad, S. G. Mhaisalkar, Ning Jiang |
Reliability studies of barrier layers for Cu/PAE low-k interconnects. |
Microelectron. Reliab. |
2006 |
DBLP DOI BibTeX RDF |
|
3 | J. R. Lloyd, C. E. Murray, S. Ponoth, S. Cohen, E. Liniger |
The effect of Cu diffusion on the TDDB behavior in a low-k interlevel dielectrics. |
Microelectron. Reliab. |
2006 |
DBLP DOI BibTeX RDF |
|
3 | Maria Vasilopoulou, A. M. Douvas, D. Kouvatsos, Panagiotis Argitis, D. Davazoglou |
Characterization of various insulators for possible use as low-k dielectrics deposited at temperatures below 200degreeC. |
Microelectron. Reliab. |
2005 |
DBLP DOI BibTeX RDF |
|
3 | Guotao Wang, Paul S. Ho, Steven Groothuis |
Chip-packaging interaction: a critical concern for Cu/low k packaging. |
Microelectron. Reliab. |
2005 |
DBLP DOI BibTeX RDF |
|
3 | H. Y. Li, Y. J. Su, C. F. Tsang, S. M. Sohan, V. N. Bliznetsov, L. Zhang |
Process improvement of 0.13mum Cu/Low K (Black DiamondTM) dual damascene interconnection. |
Microelectron. Reliab. |
2005 |
DBLP DOI BibTeX RDF |
|
3 | C. F. Tsang, C. K. Chang, A. Krishnamoorthy, K. Y. Ee, Y. J. Su, H. Y. Li, W. H. Li, L. Y. Wong |
A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections. |
Microelectron. Reliab. |
2005 |
DBLP DOI BibTeX RDF |
|
3 | Zsolt Tökei, Yunlong Li, G. P. Beyer |
Reliability challenges for copper low-k dielectrics and copper diffusion barriers. |
Microelectron. Reliab. |
2005 |
DBLP DOI BibTeX RDF |
|
3 | Chang-Lin Yeh, Yi-Shao Lai |
Transient analysis of the impact stage of wirebonding on Cu/low-K wafers. |
Microelectron. Reliab. |
2005 |
DBLP DOI BibTeX RDF |
|
3 | C. F. Tsang, C. Y. Li, A. Krishnamoorthy, Y. J. Su, H. Y. Li, L. Y. Wong, W. H. Li, L. J. Tang, K. Y. Ee |
Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization. |
Microelectron. J. |
2004 |
DBLP DOI BibTeX RDF |
|
3 | H. Zhou, F. G. Shi, B. Zhao, J. Yota |
Effect of deposition methods on dielectric breakdown strength of PECVD low-k carbon doped silicon dioxide dielectric thin films. |
Microelectron. J. |
2004 |
DBLP DOI BibTeX RDF |
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3 | J. R. Lloyd, M. R. Lane, X.-H. Liu, E. Liniger, T. M. Shaw, C.-K. Hu, R. Rosenberg |
Reliability Challenges with Ultra-Low k Interlevel Dielectrics. |
Microelectron. Reliab. |
2004 |
DBLP DOI BibTeX RDF |
|
3 | J. R. Lloyd, E. Liniger, S. T. Chen |
Time dependent dielectric breakdown in a low-k interlevel dielectric. |
Microelectron. Reliab. |
2004 |
DBLP DOI BibTeX RDF |
|
3 | C. F. Tsang, V. N. Bliznetsov, Y. J. Su |
Study and improvement of electrical performance of 130 nm Cu/CVD low k SiOCH interconnect related to via etch process. |
Microelectron. J. |
2003 |
DBLP DOI BibTeX RDF |
|
3 | H. Zhou, F. G. Shi, B. Zhao |
Thickness dependent dielectric breakdown of PECVD low-k carbon doped silicon dioxide dielectric thin films: modeling and experiments. |
Microelectron. J. |
2003 |
DBLP DOI BibTeX RDF |
|
3 | Y. S. Zheng, Y. J. Su, B. Yu, P. D. Foo |
Investigation of defect on copper bond pad surface in copper/low k process integration. |
Microelectron. Reliab. |
2003 |
DBLP DOI BibTeX RDF |
|
3 | Hasnain Lakdawala, Xu Zhu, Hao Luo, Suresh Santhanam, L. Richard Carley, Gary K. Fedder |
Micromachined high-Q inductors in a 0.18-μm copper interconnect low-k dielectric CMOS process. |
IEEE J. Solid State Circuits |
2002 |
DBLP DOI BibTeX RDF |
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