Search results for "Low-k"

Hits ?▲	Authors	Title	Venue	Year	Link	Author keywords
13	Grégory Servel, Denis Deschacht, Françoise Saliou, Jean-Luc Mattei, Fabrice Huret	Impact of Low-K on Crosstalk.	ISQED	2002	DBLP DOI BibTeX RDF	Low-k, interconnections, Crosstalk, electromagnetic analysis
9	Ru Huang, HanMing Wu, Jinfeng Kang, DeYuan Xiao, XueLong Shi, Xia An, Yu Tian, Runsheng Wang, Liangliang Zhang, Xing Zhang 0002, Yangyuan Wang	Challenges of 22 nm and beyond CMOS technology.	Sci. China Ser. F Inf. Sci.	2009	DBLP DOI BibTeX RDF	22 nm technology node, device architectures, metal gate/high K dielectrics, ultra low K dielectrics, CMOS technology
8	Michael Kropfitsch, Philipp Riess, Gerhard Knoblinger, Dieter Draxelmayr	Dielectric absorption of low-k materials: extraction, modelling and influence on SAR ADCs.	ISCAS	2006	DBLP DOI BibTeX RDF
8	N. S. Nagaraj, Tom Bonifield, Abha Singh, Roger Griesmer, Poras T. Balsara	Interconnect Modeling for Copper/Low-k Technologies.	VLSI Design	2004	DBLP DOI BibTeX RDF
7	Teresa Oh	Correlation between Low Polarization and Roughness in Low-k SiOC Thin Films by Chemical Vapor Deposition.	FGIT-GDC	2011	DBLP DOI BibTeX RDF
6	Hoyeol Cho, Kyung-Hoae Koo, Pawan Kapur, Krishna Saraswat	Modeling of the performance of carbon nanotube bundle, cu/low-k and optical on-chip global interconnects.	SLIP	2007	DBLP DOI BibTeX RDF	Cu, bandwidth density, power, latency, optics, carbon nanotube, Global interconnects
6	Thierry Devoivre, M. Lunenborg, C. Julien, J.-P. Carrere, P. Ferreira, W. J. Toren, A. VandeGoor, P. Gayet, T. Berger, O. Hinsinger, P. Vannier, Y. Trouiller, Y. Rody, P.-J. Goirand, R. Palla, I. Thomas, F. Guyader, David Roy 0001, B. Borot, Nicolas Planes, Sylvie Naudet, F. Pico, D. Duca, F. Lalanne, D. Heslinga, M. Haond	Validated 90nm CMOS Technology Platform with Low-k Copper Interconnects for Advanced System-on-Chip (SoC).	MTDT	2002	DBLP DOI BibTeX RDF
6	Bipin Rajendran, Pawan Kapur, Krishna Saraswat, R. Fabian W. Pease	Self-consistent power/performance/reliability analysis for copper interconnects.	SLIP	2004	DBLP DOI BibTeX RDF	Joule heating, copper interconnects, rent's rule, electromigration, duty cycle, current density
6	Rajiv V. Joshi, Kaushik Roy 0001	Design of Deep Sub-Micron CMOS Circuits.	VLSI Design	2003	DBLP DOI BibTeX RDF
5	Krishna Saraswat	Performance comparison of cu/low-k, carbon nanotube, and optics for on-chip and off-chip interconnects.	SLIP	2009	DBLP DOI BibTeX RDF	copper, energy per bit, power, latency, bandwidth, optical interconnect, carbon nanotube
4	Basab Datta, Wayne P. Burleson	Low power on-chip thermal sensors based on wires.	VLSI-SoC	2007	DBLP DOI BibTeX RDF
4	David J. Frank, Ruchir Puri, Dorel Toma	Design and CAD challenges in 45nm CMOS and beyond.	ICCAD	2006	DBLP DOI BibTeX RDF
3	Yonggyun Park, Pengzhan Liu, Seunghwan Lee, Jinill Cho, Eric Joo, Hyeong-U. Kim, Taesung Kim	Diagnosing Time-Varying Harmonics in Low-k Oxide Thin Film (SiOF) Deposition by Using HDP CVD.	Sensors	2023	DBLP DOI BibTeX RDF
3	Seunghwan Lee, Yonggyun Park, Pengzhan Liu, Muyoung Kim, Hyeong-U. Kim, Taesung Kim	Artificial-Neural-Network-Driven Innovations in Time-Varying Process Diagnosis of Low-K Oxide Deposition.	Sensors	2023	DBLP DOI BibTeX RDF
3	Dong Liu, Mingyue Li, Yangjie Ou, Zhong Lan, Maosen Tang, Weibo Wang, Xiarong Hu	1.2 kV 4H-SiC planar power MOSFETs with a low-K dielectric in central gate.	IET Circuits Devices Syst.	2022	DBLP DOI BibTeX RDF
3	Ernest Y. Wu, Baozhen Li	Quantum Mechanical Connection of Schottky Emission Process and Its implications on Breakdown Methodology and Conduction Modeling for BEOL Low-k Dielectrics.	IRPS	2022	DBLP DOI BibTeX RDF
3	Zhenjun Zhang, Matthias Kraatz, Meike Hauschildt, Seungman Choi, André Clausner, Ehrenfried Zschech, Martin Gall	Strategy to Characterize Electromigration Short Length Effects in Cu/low-k Interconnects.	IRPS	2021	DBLP DOI BibTeX RDF
3	Ning Duan, Vignesh Subramanian, Edgar Olthof, Paul Eggenkamp, Michiel van Soestbergen, Richard Braspenning	Moisture diffusion rate in an ultra-low-k dielectric and its effect on the dielectric reliability.	IRPS	2021	DBLP DOI BibTeX RDF
3	Luchao Wu, Lei Wang, Jun Wang	Measuring the fracture toughness of low-k thin films used in advanced packaging.	ICTA	2021	DBLP DOI BibTeX RDF
3	Yangyun Zhang, Yuting Xiang, Xinjie Zhang, Chunqi Shi, Runxi Zhang, Jinghong Chen	A 22-33 GHz Wideband CMOS LNA Using Low-k Non-inverting MCCRs for 5G mmW Communication Applications.	ASICON	2021	DBLP DOI BibTeX RDF
3	Weishen Chu, Laura Spinella, Dwayne R. Shirley, Paul S. Ho	Effects of Wiring Density and Pillar Structure on Chip Package Interaction for Advanced Cu Low-k Chips.	IRPS	2020	DBLP DOI BibTeX RDF
3	Naohito Suzumura, Kazuyuki Omori, Hideaki Tsuchiya, Hideki Aono, Tomohiro Yamashita	Impact of Anode-side Defect Generation on Inter-Level TDDB Degradation in Cu/Low-k Damascene Structures.	IRPS	2020	DBLP DOI BibTeX RDF
3	Betting Wehring, Raik Hoffmann, Lukas Gerlich, Malte Czernohorsky, Benjamin Uhlig, Robert Seidel, Tobias Barchewitz, Frank Schlaphof, Lutz Meinshausen, Christoph Leyens	BEoL Reliability, XPS and REELS Study on low-k Dielectrics to understand Breakdown Mechanisms.	IRPS	2020	DBLP DOI BibTeX RDF
3	Clement Huang, Alex Juan, K. C. Su	Stress Induced Voiding Behavior of Electroplated Copper Thin Films in Highly Scaled Cu/low-k interconnects.	IRPS	2020	DBLP DOI BibTeX RDF
3	Chen Wu, Adrian Vaisman Chasin, Steven Demuynck, Naoto Horiguchi, Kris Croes	Conduction and Breakdown Mechanisms in Low-k Spacer and Nitride Spacer Dielectric Stacks in Middle of Line Interconnects.	IRPS	2020	DBLP DOI BibTeX RDF
3	Mario Kiuchi, Ryoma Miyake, Shinya Yoshida, Shuji Tanaka, Tsuyoshi Takemoto, Yukitaka Yamaguchi, Kenji Komaki	Commercial Production of Low-k PZT film using Sputtering Method.	IEEE SENSORS	2020	DBLP DOI BibTeX RDF
3	Fabio Pareschi, Andrea Celentano, Mauro Mangia, Riccardo Rovatti, Gianluca Setti	Through-The-Barrier Communications in Isolated Class-E Converters Embedding a Low-K Transformer.	ISCAS	2020	DBLP DOI BibTeX RDF
3	Hiroshi Murata, Hiroto Yokohashi	80-GHz Band Electro-Optic Modulator using Antenna-Coupled Electrode and LiNbO3 Film Stacked on Low-k Substrate for Millimeter-Wave Radar System.	OFC	2020	DBLP BibTeX RDF
3	Norbert Herfurth, Anne Beyreuther, Elham Amini, Christian Boit, Michél Simon-Najasek, Susanne Hübner, Frank Altmann, R. Herfurth, Chen Wu, Ingrid De Wolf, Kris Croes	New Access to Soft Breakdown Parameters of Low-k Dielectrics Through Localisation-Based Analysis.	IRPS	2019	DBLP DOI BibTeX RDF
3	Shaoyi Peng, Han Zhou 0002, Taeyoung Kim 0001, Hai-Bao Chen, Sheldon X.-D. Tan	Physics-Based Compact TDDB Models for Low-k BEOL Copper Interconnects With Time-Varying Voltage Stressing.	IEEE Trans. Very Large Scale Integr. Syst.	2018	DBLP DOI BibTeX RDF
3	Kai Nakamura, Hideyuki Hanawa, Kazushige Horio	Analysis of Breakdown Characteristics of AIGaN/GaN HEMTs with Low-k IHigh-k Double Passivation Layers Paper Title.	BCICTS	2018	DBLP DOI BibTeX RDF
3	D. H. Triyoso, G. R. Mulfinger, K. Hempel, H. Tao, F. Koehler, L. Kang, A. Kumar, T. McArdle, J. Holt, A. L. Child, S. Straub, F. Ludwig, Z. Chen, J. Kluth, Rick Carter	Characterization of atomic layer deposited low-k spacer for FDSOI high-k metal gate transistor.	ICICDT	2017	DBLP DOI BibTeX RDF
3	Michael J. Mutch, Thomas Pomorski, Brad C. Bittel, Corey J. Cochrane, Patrick M. Lenahan, Xin Liu, Robert J. Nemanich, Justin Brockman, Marc French, Markus Kuhn, Benjamin French, Sean W. King	Band diagram for low-k/Cu interconnects: The starting point for understanding back-end-of-line (BEOL) electrical reliability.	Microelectron. Reliab.	2016	DBLP DOI BibTeX RDF
3	Lin Lin, Jun Wang, Lei Wang, Wenqi Zhang	The stress analysis and parametric studies for the low-k layers of a chip in the flip-chip process.	Microelectron. Reliab.	2016	DBLP DOI BibTeX RDF
3	Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Kristof Croes, Jürgen Bömmels, Zsolt Tökei	Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line.	Microelectron. Reliab.	2016	DBLP DOI BibTeX RDF
3	Yusuf Nur Wijayanto, Atsushi Kanno, Hiroshi Murata, Tetsuya Kawanishi, Yasuyuki Okamura	Millimeter-Wave Radar Receiver Using Z-Cut LiNbO3 Optical Modulator with Orthogonal-Gap-Embedded Patch-Antennas on Low-k Dielectric Material.	IEICE Trans. Electron.	2015	DBLP DOI BibTeX RDF
3	Ming Zhou, B. C. Zhang	Porous low k film with multilayer structure used for promoting adhesion to SiCN cap barrier layer.	Microelectron. Reliab.	2015	DBLP DOI BibTeX RDF
3	M. N. Chang, Y.-H. Lee, S. Y. Lee, C. C. Chiu, D. Maji, K. Wu	An investigation of capacitance aging model for extreme low-k and high-k dielectrics.	IRPS	2015	DBLP DOI BibTeX RDF
3	Fen Chen, Carole Graas, Michael A. Shinosky, Chad Burke, Kai D. Feng, Craig Bocash, Ramachandran Muralidhar	A method for rapid screening of various low-k TDDB models.	IRPS	2015	DBLP DOI BibTeX RDF
3	M. H. Lin, A. S. Oates	Mechanisms of electromigration under AC and pulsed-DC stress in Cu/low-k dual damascene interconnects.	IRPS	2015	DBLP DOI BibTeX RDF
3	Sean P. Ogden, Juan Borja, Huawei Zhou, Joel L. Plawsky, Toh-Ming Lu, William N. Gill	A moisture-related breakdown mechanism in low-k dielectrics using a multiple I-V ramp test.	IRPS	2015	DBLP DOI BibTeX RDF
3	Shou-Chung Lee, A. S. Oates	On the voltage dependence of copper/low-k dielectric breakdown.	IRPS	2015	DBLP DOI BibTeX RDF
3	Wei-Ting Kary Chien, Atman Yong Zhao, Liwen Zhang, Flora Cheng	The reversed intrinsic curve and voltage dependence for ultra-low k dielectrics.	IRPS	2015	DBLP DOI BibTeX RDF
3	Taro Ikeda, Akira Tanihara, Nobuhiko Yamamoto, Shigeru Kasai, Koji Eriguchi, Kouichi Ono	Plasma-induced photon irradiation damage on low-k dielectrics enhanced by Cu-line layout.	ICICDT	2015	DBLP DOI BibTeX RDF
3	Baojun Tang, Kris Croes, Yohan Barbarin, Yunqi Wang, Robin Degraeve, Yunlong Li, Maria Toledano-Luque, Thomas Kauerauf, Jürgen Bömmels, Zsolt Tökei, Ingrid De Wolf	As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
3	Fen Chen, Michael A. Shinosky	Electron fluence driven, Cu catalyzed, interface breakdown mechanism for BEOL low-k time dependent dielectric breakdown.	Microelectron. Reliab.	2014	DBLP DOI BibTeX RDF
3	Chenglong Liao, Dan Guo, Shizhu Wen, Xinchun Lu, Jianbin Luo	Stress analysis of Cu/low-k interconnect structure during whole Cu-CMP process using finite element method.	Microelectron. Reliab.	2013	DBLP DOI BibTeX RDF
3	Young Moon Kim, Jun Seomun, Hyung-Ock Kim, Kyung Tae Do, Jung Yun Choi, Kee Sup Kim, Matthias Sauer 0002, Bernd Becker 0001, Subhasish Mitra	Detection of early-life failures in high-K metal-gate transistors and ultra low-K inter-metal dielectrics.	CICC	2013	DBLP DOI BibTeX RDF
3	Jingbo Xu 0004, Feng Hui, Wen-Zhong Xu, Xu Wang, Peng-Fei Nan, Yu-Ling Liu, Xin-Ping Qu	Barrier and low k polish with a novel alkaline barrier slurry combining with FA/O chelating agent.	ASICON	2013	DBLP DOI BibTeX RDF
3	Yi-Shao Lai, Meng-Kai Shih, Chang-Chi Lee, Tong Hong Wang	Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
3	A. A. Dakhel	W doping effect on the dielectric properties of amorphous Ga2O3 films grown on Si substrate for low-k applications.	Microelectron. Reliab.	2012	DBLP DOI BibTeX RDF
3	Ming He, Huafang Li, Pei-I Wang, Toh-Ming Lu	Bias-temperature stress of Al on porous low-k dielectrics.	Microelectron. Reliab.	2011	DBLP DOI BibTeX RDF
3	Muhammad Bashir, Linda Milor, Dae Hyun Kim 0004, Sung Kyu Lim	Impact of irregular geometries on low-k dielectric breakdown.	Microelectron. Reliab.	2011	DBLP DOI BibTeX RDF
3	Ming He, C. Gaire, G.-C. Wang, Toh-Ming Lu	Study of metal adhesion on porous low-k dielectric using telephone cord buckling.	Microelectron. Reliab.	2011	DBLP DOI BibTeX RDF
3	Taeshik Yoon, Inhwa Lee, Taek-Soo Kim	Mechanical reliability of Cu/low-k interconnects and underfill.	3DIC	2011	DBLP DOI BibTeX RDF
3	A. Aubert, J. P. Rebrasse, Lionel Dantas de Morais, Nathalie Labat, Hélène Frémont	Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing.	Microelectron. Reliab.	2010	DBLP DOI BibTeX RDF
3	Muhammad Bashir, Linda S. Milor, Dae Hyun Kim 0004, Sung Kyu Lim	Methodology to determine the impact of linewidth variation on chip scale copper/low-k backend dielectric breakdown.	Microelectron. Reliab.	2010	DBLP DOI BibTeX RDF
3	C. M. Fu, Cher Ming Tan, S. H. Wu, H. B. Yao	Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/Low-k interconnects.	Microelectron. Reliab.	2010	DBLP DOI BibTeX RDF
3	Yue Ying Ong, Soon Wee Ho, Kripesh Vaidyanathan, Vasarla Nagendra Sekhar, Ming Chinq Jong, Samuel Lim Yak Long, Vincent Lee Wen Sheng, Leong Ching Wai, Vempati Srinivasa Rao, Jimmy Ong, Xuefen Ong, Xiaowu Zhang, Yoon Uk Seung, John H. Lau, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Yanfeng Zhang, Juan Boon Tan, Dong Kyun Sohn	Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package.	Microelectron. Reliab.	2010	DBLP DOI BibTeX RDF
3	Feifei He, Cher Ming Tan	Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model.	Microelectron. Reliab.	2010	DBLP DOI BibTeX RDF
3	Muhammad Bashir, Linda S. Milor	Towards a chip level reliability simulator for copper/low-k backend processes.	DATE	2010	DBLP DOI BibTeX RDF
3	Muhammad Bashir, Linda S. Milor	A methodology to extract failure rates for low-k dielectric breakdown with multiple geometries and in the presence of die-to-die linewidth variation.	Microelectron. Reliab.	2009	DBLP DOI BibTeX RDF
3	Xuefen Ong, Soon Wee Ho, Yue Ying Ong, Leong Ching Wai, Kripesh Vaidyanathan, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Juan Boon Tan, Dong Kyun Sohn, Liang Choo Hsia, Zhong Chen 0004	Underfill selection methodology for fine pitch Cu/low-k FCBGA packages.	Microelectron. Reliab.	2009	DBLP DOI BibTeX RDF
3	Muhammad Bashir, Linda Milor	Modeling Low-k Dielectric Breakdown to Determine Lifetime Requirements.	IEEE Des. Test Comput.	2009	DBLP DOI BibTeX RDF
3	A. Whelan, Y. Joshi, W. King	Improved compact thermal model for studying 3-D interconnect structures with low-k dielectrics.	Microelectron. J.	2008	DBLP DOI BibTeX RDF
3	Soodeh Aghli Moghaddam, Nasser Masoumi	Analysis and simulation of a novel gradually low-K dielectric structure for crosstalk reduction in VLSI.	Microelectron. J.	2008	DBLP DOI BibTeX RDF
3	Cadmus A. Yuan, Olaf van der Sluis, Willem D. van Driel, G. Q. (Kouchi) Zhang	The need for multi-scale approaches in Cu/low-k reliability issues.	Microelectron. Reliab.	2008	DBLP DOI BibTeX RDF
3	K. M. Chen, K. H. Tang, J. S. Liu	Reliability evaluation of BOAC and normal pad stacked-chip packaging using low-K wafers.	Microelectron. Reliab.	2008	DBLP DOI BibTeX RDF
3	Fen Chen, O. Bravo, Dave Harmon, Michael A. Shinosky, J. Aitken	Cu/low-k dielectric TDDB reliability issues for advanced CMOS technologies.	Microelectron. Reliab.	2008	DBLP DOI BibTeX RDF
3	Toshiaki Makabe, T. Shimada, Takashi Yagisawa	Plasma etching and feature evolution of organic low-k material by using VicAddress.	Comput. Phys. Commun.	2007	DBLP DOI BibTeX RDF
3	Cyril Guedj, G. Imbert, E. Martinez, Christophe Licitra, Névine Rochat, V. Arnal	Modification of porous ultra-low K dielectric by electron-beam curing.	Microelectron. Reliab.	2007	DBLP DOI BibTeX RDF
3	Changsoo Hong, Linda Milor	Modeling of the breakdown mechanisms for porous copper/low-k process flows.	Microelectron. Reliab.	2007	DBLP DOI BibTeX RDF
3	Olaf van der Sluis, R. A. B. Engelen, Richard B. R. van Silfhout, W. D. van Driel, Marcel A. J. van Gils	Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion.	Microelectron. Reliab.	2007	DBLP DOI BibTeX RDF
3	C. C. Chiu, H. H. Chang, C. C. Lee, C. C. Hsia, Kuo-Ning Chiang	Reliability of interfacial adhesion in a multi-level copper/low-k interconnect structure.	Microelectron. Reliab.	2007	DBLP DOI BibTeX RDF
3	Marcel A. J. van Gils, Olaf van der Sluis, G. Q. Zhang, J. H. J. Janssen, R. M. J. Voncken	Analysis of Cu/low-k bond pad delamination by using a novel failure index.	Microelectron. Reliab.	2007	DBLP DOI BibTeX RDF
3	W. D. van Driel	Facing the challenge of designing for Cu/low-k reliability.	Microelectron. Reliab.	2007	DBLP DOI BibTeX RDF
3	W. S. Lau, P. W. Qian, Taejoon Han, Nathan P. Sandler, S. T. Che, S. E. Ang, C. H. Tung, T. T. Sheng	Evidence that N2O is a stronger oxidizing agent than O2 for both Ta2O5 and bare Si below 1000degreeC and temperature for minimum low-K interfacial oxide for high-K dielectric on Si.	Microelectron. Reliab.	2007	DBLP DOI BibTeX RDF
3	Olga Cueto, Myriam Assous, François de Crecy, A. Toffoli, David Bouchu, M. Fayolle, Frédéric Boulanger	Development of a permittivity extraction method for ultra low k dielectrics integrated in advanced interconnects.	Microelectron. Reliab.	2007	DBLP DOI BibTeX RDF
3	K. M. Chen, D. S. Jiang, N. H. Kao, J. Y. Lai	Effects of underfill materials on the reliability of low-K flip-chip packaging.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
3	A. S. Oates, Shou-Chung Lee	Electromigration failure distributions of dual damascene Cu /low - k interconnects.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
3	Fen Chen, J. Gill, Dave Harmon, T. Sullivan, A. Strong, B. Li, H. Rathore, Daniel C. Edelstein	Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
3	Cadmus A. Yuan, Willem D. van Driel, Richard B. R. van Silfhout, Olaf van der Sluis, Roy A. B. Engelen, Leo J. Ernst, Fred van Keulen, G. Q. Zhang	Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
3	Robin C. J. Wang, C. C. Lee, L. D. Chen, Kenneth Wu, K. S. Chang-Liao	A study of Cu/Low-k stress-induced voiding at via bottom and its microstructure effect.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
3	Z. W. He, X. Q. Liu, D. Y. Xu, Y. Y. Wang	Effect of annealing on the properties of low-k nanoporous SiO2 films prepared by sol-gel method with catalyst HF.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
3	Hung Son Nguyen, Z. H. Gan, Zhe Chen, V. Chandrasekar 0002, K. Prasad, S. G. Mhaisalkar, Ning Jiang	Reliability studies of barrier layers for Cu/PAE low-k interconnects.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
3	J. R. Lloyd, C. E. Murray, S. Ponoth, S. Cohen, E. Liniger	The effect of Cu diffusion on the TDDB behavior in a low-k interlevel dielectrics.	Microelectron. Reliab.	2006	DBLP DOI BibTeX RDF
3	Maria Vasilopoulou, A. M. Douvas, D. Kouvatsos, Panagiotis Argitis, D. Davazoglou	Characterization of various insulators for possible use as low-k dielectrics deposited at temperatures below 200degreeC.	Microelectron. Reliab.	2005	DBLP DOI BibTeX RDF
3	Guotao Wang, Paul S. Ho, Steven Groothuis	Chip-packaging interaction: a critical concern for Cu/low k packaging.	Microelectron. Reliab.	2005	DBLP DOI BibTeX RDF
3	H. Y. Li, Y. J. Su, C. F. Tsang, S. M. Sohan, V. N. Bliznetsov, L. Zhang	Process improvement of 0.13mum Cu/Low K (Black DiamondTM) dual damascene interconnection.	Microelectron. Reliab.	2005	DBLP DOI BibTeX RDF
3	C. F. Tsang, C. K. Chang, A. Krishnamoorthy, K. Y. Ee, Y. J. Su, H. Y. Li, W. H. Li, L. Y. Wong	A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections.	Microelectron. Reliab.	2005	DBLP DOI BibTeX RDF
3	Zsolt Tökei, Yunlong Li, G. P. Beyer	Reliability challenges for copper low-k dielectrics and copper diffusion barriers.	Microelectron. Reliab.	2005	DBLP DOI BibTeX RDF
3	Chang-Lin Yeh, Yi-Shao Lai	Transient analysis of the impact stage of wirebonding on Cu/low-K wafers.	Microelectron. Reliab.	2005	DBLP DOI BibTeX RDF
3	C. F. Tsang, C. Y. Li, A. Krishnamoorthy, Y. J. Su, H. Y. Li, L. Y. Wong, W. H. Li, L. J. Tang, K. Y. Ee	Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization.	Microelectron. J.	2004	DBLP DOI BibTeX RDF
3	H. Zhou, F. G. Shi, B. Zhao, J. Yota	Effect of deposition methods on dielectric breakdown strength of PECVD low-k carbon doped silicon dioxide dielectric thin films.	Microelectron. J.	2004	DBLP DOI BibTeX RDF
3	J. R. Lloyd, M. R. Lane, X.-H. Liu, E. Liniger, T. M. Shaw, C.-K. Hu, R. Rosenberg	Reliability Challenges with Ultra-Low k Interlevel Dielectrics.	Microelectron. Reliab.	2004	DBLP DOI BibTeX RDF
3	J. R. Lloyd, E. Liniger, S. T. Chen	Time dependent dielectric breakdown in a low-k interlevel dielectric.	Microelectron. Reliab.	2004	DBLP DOI BibTeX RDF
3	C. F. Tsang, V. N. Bliznetsov, Y. J. Su	Study and improvement of electrical performance of 130 nm Cu/CVD low k SiOCH interconnect related to via etch process.	Microelectron. J.	2003	DBLP DOI BibTeX RDF
3	H. Zhou, F. G. Shi, B. Zhao	Thickness dependent dielectric breakdown of PECVD low-k carbon doped silicon dioxide dielectric thin films: modeling and experiments.	Microelectron. J.	2003	DBLP DOI BibTeX RDF
3	Y. S. Zheng, Y. J. Su, B. Yu, P. D. Foo	Investigation of defect on copper bond pad surface in copper/low k process integration.	Microelectron. Reliab.	2003	DBLP DOI BibTeX RDF
3	Hasnain Lakdawala, Xu Zhu, Hao Luo, Suresh Santhanam, L. Richard Carley, Gary K. Fedder	Micromachined high-Q inductors in a 0.18-μm copper interconnect low-k dielectric CMOS process.	IEEE J. Solid State Circuits	2002	DBLP DOI BibTeX RDF